WO2002029890A3 - Semiconductor stacked die devices and methods of forming semiconductor stacked die devices - Google Patents
Semiconductor stacked die devices and methods of forming semiconductor stacked die devices Download PDFInfo
- Publication number
- WO2002029890A3 WO2002029890A3 PCT/US2001/029578 US0129578W WO0229890A3 WO 2002029890 A3 WO2002029890 A3 WO 2002029890A3 US 0129578 W US0129578 W US 0129578W WO 0229890 A3 WO0229890 A3 WO 0229890A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- semiconductor stacked
- stacked die
- die devices
- methods
- conductive
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0657—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06513—Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06541—Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06572—Auxiliary carrier between devices, the carrier having an electrical connection structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06582—Housing for the assembly, e.g. chip scale package [CSP]
- H01L2225/06586—Housing with external bump or bump-like connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2001291177A AU2001291177A1 (en) | 2000-10-03 | 2001-09-19 | Semiconductor stacked die devices and methods of forming semiconductor stacked die devices |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/679,143 | 2000-10-03 | ||
US09/679,143 US6674161B1 (en) | 2000-10-03 | 2000-10-03 | Semiconductor stacked die devices |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2002029890A2 WO2002029890A2 (en) | 2002-04-11 |
WO2002029890A3 true WO2002029890A3 (en) | 2003-08-07 |
Family
ID=24725738
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2001/029578 WO2002029890A2 (en) | 2000-10-03 | 2001-09-19 | Semiconductor stacked die devices and methods of forming semiconductor stacked die devices |
Country Status (3)
Country | Link |
---|---|
US (3) | US6674161B1 (en) |
AU (1) | AU2001291177A1 (en) |
WO (1) | WO2002029890A2 (en) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6674161B1 (en) * | 2000-10-03 | 2004-01-06 | Rambus Inc. | Semiconductor stacked die devices |
JP2002184934A (en) * | 2000-12-13 | 2002-06-28 | Shinko Electric Ind Co Ltd | Semiconductor device and manufacturing method thereof |
US7777321B2 (en) * | 2002-04-22 | 2010-08-17 | Gann Keith D | Stacked microelectronic layer and module with three-axis channel T-connects |
US6806559B2 (en) * | 2002-04-22 | 2004-10-19 | Irvine Sensors Corporation | Method and apparatus for connecting vertically stacked integrated circuit chips |
US6936913B2 (en) * | 2002-12-11 | 2005-08-30 | Northrop Grumman Corporation | High performance vias for vertical IC packaging |
US7244671B2 (en) * | 2003-07-25 | 2007-07-17 | Unitive International Limited | Methods of forming conductive structures including titanium-tungsten base layers and related structures |
US20070109756A1 (en) * | 2005-02-10 | 2007-05-17 | Stats Chippac Ltd. | Stacked integrated circuits package system |
WO2006095703A1 (en) * | 2005-03-09 | 2006-09-14 | Matsushita Electric Industrial Co., Ltd. | Structure and method for mounting bare chip |
US7829989B2 (en) * | 2005-09-07 | 2010-11-09 | Alpha & Omega Semiconductor, Ltd. | Vertical packaged IC device modules with interconnected 3D laminates directly contacts wafer backside |
US8093717B2 (en) * | 2005-12-09 | 2012-01-10 | Intel Corporation | Microstrip spacer for stacked chip scale packages, methods of making same, methods of operating same, and systems containing same |
US7781877B2 (en) | 2007-08-07 | 2010-08-24 | Micron Technology, Inc. | Packaged integrated circuit devices with through-body conductive vias, and methods of making same |
US8017451B2 (en) * | 2008-04-04 | 2011-09-13 | The Charles Stark Draper Laboratory, Inc. | Electronic modules and methods for forming the same |
US8273603B2 (en) | 2008-04-04 | 2012-09-25 | The Charles Stark Draper Laboratory, Inc. | Interposers, electronic modules, and methods for forming the same |
DE102008018982A1 (en) | 2008-04-14 | 2009-11-05 | Merz, Hartmut, Prof. Dr. med. | Automatic device for carrying out detection reactions and method for dispensing reagents on microscope slides |
US7821107B2 (en) * | 2008-04-22 | 2010-10-26 | Micron Technology, Inc. | Die stacking with an annular via having a recessed socket |
US20110034045A1 (en) * | 2009-08-06 | 2011-02-10 | Qimonda Ag | Stacking Technique for Circuit Devices |
US9398700B2 (en) * | 2013-06-21 | 2016-07-19 | Invensas Corporation | Method of forming a reliable microelectronic assembly |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5434745A (en) * | 1994-07-26 | 1995-07-18 | White Microelectronics Div. Of Bowmar Instrument Corp. | Stacked silicon die carrier assembly |
US5864177A (en) * | 1996-12-12 | 1999-01-26 | Honeywell Inc. | Bypass capacitors for chip and wire circuit assembly |
US5973396A (en) * | 1996-02-16 | 1999-10-26 | Micron Technology, Inc. | Surface mount IC using silicon vias in an area array format or same size as die array |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4394712A (en) * | 1981-03-18 | 1983-07-19 | General Electric Company | Alignment-enhancing feed-through conductors for stackable silicon-on-sapphire wafers |
US4954875A (en) * | 1986-07-17 | 1990-09-04 | Laser Dynamics, Inc. | Semiconductor wafer array with electrically conductive compliant material |
US5229647A (en) * | 1991-03-27 | 1993-07-20 | Micron Technology, Inc. | High density data storage using stacked wafers |
US5270261A (en) * | 1991-09-13 | 1993-12-14 | International Business Machines Corporation | Three dimensional multichip package methods of fabrication |
US5397916A (en) | 1991-12-10 | 1995-03-14 | Normington; Peter J. C. | Semiconductor device including stacked die |
JP3544974B2 (en) * | 1992-05-15 | 2004-07-21 | イルビン センサーズ コーポレーション | Integrated laminate |
US5291061A (en) | 1993-04-06 | 1994-03-01 | Micron Semiconductor, Inc. | Multi-chip stacked devices |
DE4433845A1 (en) * | 1994-09-22 | 1996-03-28 | Fraunhofer Ges Forschung | Method of manufacturing a three-dimensional integrated circuit |
US5682062A (en) * | 1995-06-05 | 1997-10-28 | Harris Corporation | System for interconnecting stacked integrated circuits |
US5691248A (en) * | 1995-07-26 | 1997-11-25 | International Business Machines Corporation | Methods for precise definition of integrated circuit chip edges |
US5874781A (en) | 1995-08-16 | 1999-02-23 | Micron Technology, Inc. | Angularly offset stacked die multichip device and method of manufacture |
EP2270846A3 (en) * | 1996-10-29 | 2011-12-21 | ALLVIA, Inc. | Integrated circuits and methods for their fabrication |
US5869895A (en) * | 1997-12-15 | 1999-02-09 | Micron Technology, Inc. | Embedded memory assembly |
US6104082A (en) * | 1998-04-24 | 2000-08-15 | International Business Machines Corporation | Metallization structure for altering connections |
JP3563604B2 (en) * | 1998-07-29 | 2004-09-08 | 株式会社東芝 | Multi-chip semiconductor device and memory card |
US6109929A (en) * | 1998-07-29 | 2000-08-29 | Agilent Technologies, Inc. | High speed stackable memory system and device |
US6381141B2 (en) * | 1998-10-15 | 2002-04-30 | Micron Technology, Inc. | Integrated device and method for routing a signal through the device |
US6093938A (en) | 1999-05-25 | 2000-07-25 | Intel Corporation | Stacked die integrated circuit device |
KR100333388B1 (en) * | 1999-06-29 | 2002-04-18 | 박종섭 | chip size stack package and method of fabricating the same |
US6271587B1 (en) * | 1999-09-15 | 2001-08-07 | Robert Patti | Connection arrangement for enbaling the use of identical chips in 3-dimensional stacks of chips requiring address specific to each chip |
US6350633B1 (en) * | 2000-08-22 | 2002-02-26 | Charles W. C. Lin | Semiconductor chip assembly with simultaneously electroplated contact terminal and connection joint |
US6355501B1 (en) * | 2000-09-21 | 2002-03-12 | International Business Machines Corporation | Three-dimensional chip stacking assembly |
US6674161B1 (en) * | 2000-10-03 | 2004-01-06 | Rambus Inc. | Semiconductor stacked die devices |
-
2000
- 2000-10-03 US US09/679,143 patent/US6674161B1/en not_active Expired - Lifetime
-
2001
- 2001-09-19 WO PCT/US2001/029578 patent/WO2002029890A2/en active Application Filing
- 2001-09-19 AU AU2001291177A patent/AU2001291177A1/en not_active Abandoned
-
2003
- 2003-11-13 US US10/706,897 patent/US6902953B2/en not_active Expired - Fee Related
-
2005
- 2005-05-06 US US11/123,641 patent/US7078790B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5434745A (en) * | 1994-07-26 | 1995-07-18 | White Microelectronics Div. Of Bowmar Instrument Corp. | Stacked silicon die carrier assembly |
US5973396A (en) * | 1996-02-16 | 1999-10-26 | Micron Technology, Inc. | Surface mount IC using silicon vias in an area array format or same size as die array |
US5864177A (en) * | 1996-12-12 | 1999-01-26 | Honeywell Inc. | Bypass capacitors for chip and wire circuit assembly |
Also Published As
Publication number | Publication date |
---|---|
US6902953B2 (en) | 2005-06-07 |
AU2001291177A1 (en) | 2002-04-15 |
US20050202592A1 (en) | 2005-09-15 |
WO2002029890A2 (en) | 2002-04-11 |
US20040097010A1 (en) | 2004-05-20 |
US7078790B2 (en) | 2006-07-18 |
US6674161B1 (en) | 2004-01-06 |
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