WO2002029137A3 - Method and associated apparatus for tilting a substrate upon entry for metal deposition - Google Patents

Method and associated apparatus for tilting a substrate upon entry for metal deposition Download PDF

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Publication number
WO2002029137A3
WO2002029137A3 PCT/US2001/030058 US0130058W WO0229137A3 WO 2002029137 A3 WO2002029137 A3 WO 2002029137A3 US 0130058 W US0130058 W US 0130058W WO 0229137 A3 WO0229137 A3 WO 0229137A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
electrolyte solution
tilting
immersed
entry
Prior art date
Application number
PCT/US2001/030058
Other languages
French (fr)
Other versions
WO2002029137A2 (en
WO2002029137A9 (en
Inventor
Yezdi N Dordi
Joseph J Stevens
Michael N Sugarman
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/678,947 external-priority patent/US6582578B1/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to EP20010979288 priority Critical patent/EP1470268A2/en
Priority to JP2002532699A priority patent/JP2004536217A/en
Publication of WO2002029137A2 publication Critical patent/WO2002029137A2/en
Publication of WO2002029137A3 publication Critical patent/WO2002029137A3/en
Publication of WO2002029137A9 publication Critical patent/WO2002029137A9/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/04—Removal of gases or vapours ; Gas or pressure control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Abstract

An electro-chemical plating system is described. A method is performed by the electro-chemical plating system in which a seed layer formed on a substrate is immersed into an electrolyte solution. In one aspect, a substrate is immersed in the electrochemical plating system by tilting the substrate as it enters the electrolyte solution to limit the trapping or formation of air bubbles in the electrolyte solution between the substrate and the substrate holder. In another aspect, an apparatus is provided for electroplating that comprises a cell, a substrate holder, and an actuator. The actuator can displace the substrate holder assembly in the x and z directions and also tilt the substrate. In another aspect, a method is provided of driving a meniscus formed by electrolyte solution across a surface of a substrate. The method comprises enhancing the interaction between the electrolyte solution meniscus and the surface as the substrate is immersed into the electrolyte solution.
PCT/US2001/030058 2000-10-03 2001-09-26 Method and associated apparatus for tilting a substrate upon entry for metal deposition WO2002029137A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP20010979288 EP1470268A2 (en) 2000-10-03 2001-09-26 Method and associated apparatus for tilting a substrate upon entry for metal deposition
JP2002532699A JP2004536217A (en) 2000-10-03 2001-09-26 Method and related apparatus for tilting a semiconductor substrate upon entry for metal deposition

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/678,947 US6582578B1 (en) 1999-04-08 2000-10-03 Method and associated apparatus for tilting a substrate upon entry for metal deposition
US09/678,947 2000-10-03

Publications (3)

Publication Number Publication Date
WO2002029137A2 WO2002029137A2 (en) 2002-04-11
WO2002029137A3 true WO2002029137A3 (en) 2004-08-05
WO2002029137A9 WO2002029137A9 (en) 2007-03-08

Family

ID=24724984

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/030058 WO2002029137A2 (en) 2000-10-03 2001-09-26 Method and associated apparatus for tilting a substrate upon entry for metal deposition

Country Status (6)

Country Link
US (1) US20030201184A1 (en)
EP (1) EP1470268A2 (en)
JP (1) JP2004536217A (en)
CN (1) CN100469948C (en)
TW (1) TW531770B (en)
WO (1) WO2002029137A2 (en)

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Also Published As

Publication number Publication date
CN1623012A (en) 2005-06-01
TW531770B (en) 2003-05-11
JP2004536217A (en) 2004-12-02
WO2002029137A2 (en) 2002-04-11
WO2002029137A9 (en) 2007-03-08
CN100469948C (en) 2009-03-18
EP1470268A2 (en) 2004-10-27
US20030201184A1 (en) 2003-10-30

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