WO2002025702A3 - Semiconductor product with a silver and gold alloy - Google Patents
Semiconductor product with a silver and gold alloy Download PDFInfo
- Publication number
- WO2002025702A3 WO2002025702A3 PCT/US2001/027723 US0127723W WO0225702A3 WO 2002025702 A3 WO2002025702 A3 WO 2002025702A3 US 0127723 W US0127723 W US 0127723W WO 0225702 A3 WO0225702 A3 WO 0225702A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- silver
- gold alloy
- layer
- semiconductor product
- underlies
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
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- H01L23/49582—Metallic layers on lead frames
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Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2001294526A AU2001294526A1 (en) | 2000-09-20 | 2001-09-20 | Semiconductor product with a silver and gold alloy |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US66589800A | 2000-09-20 | 2000-09-20 | |
US09/665,898 | 2000-09-20 |
Publications (2)
Publication Number | Publication Date |
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WO2002025702A2 WO2002025702A2 (en) | 2002-03-28 |
WO2002025702A3 true WO2002025702A3 (en) | 2002-08-01 |
Family
ID=24672006
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2001/027723 WO2002025702A2 (en) | 2000-09-20 | 2001-09-20 | Semiconductor product with a silver and gold alloy |
Country Status (2)
Country | Link |
---|---|
AU (1) | AU2001294526A1 (en) |
WO (1) | WO2002025702A2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008091818A (en) * | 2006-10-05 | 2008-04-17 | Matsushita Electric Ind Co Ltd | Lead frame for optical semiconductor device, optical semiconductor device using it, and these manufacturing methods |
Citations (12)
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US3251121A (en) * | 1962-08-07 | 1966-05-17 | Bell Telephone Labor Inc | Method of making reed-type switch contacts |
US3342568A (en) * | 1965-03-16 | 1967-09-19 | Engelhard Ind Inc | Composite material of a ceramic silver gold alloy, and a nickel alloy |
US3568096A (en) * | 1969-08-11 | 1971-03-02 | Bell Telephone Labor Inc | Apparatus for automatically switching high frequency signals |
US3600794A (en) * | 1968-06-18 | 1971-08-24 | Chugai Electric Ind Co Ltd | Method and apparatus for producing electrical contacts |
US3634048A (en) * | 1968-02-14 | 1972-01-11 | Mallory & Co Inc P R | Solderable stainless steel |
US3668355A (en) * | 1971-01-27 | 1972-06-06 | Northern Electric Co | Reed material for sealed contact application |
US5035656A (en) * | 1990-05-15 | 1991-07-30 | E. I. Du Pont De Nemours And Company | Connector, circuit board contact element and retention portion |
JPH05117898A (en) * | 1991-10-29 | 1993-05-14 | Furukawa Electric Co Ltd:The | Lead frame for mounting semiconductor chip and production thereof |
JPH118341A (en) * | 1997-06-18 | 1999-01-12 | Mitsui High Tec Inc | Lead frame for semiconductor device |
US5981090A (en) * | 1996-02-20 | 1999-11-09 | Berkenhoff Gmbh | Pins for electronic assemblies |
US6054761A (en) * | 1998-12-01 | 2000-04-25 | Fujitsu Limited | Multi-layer circuit substrates and electrical assemblies having conductive composition connectors |
US6081310A (en) * | 1997-11-25 | 2000-06-27 | Sharp Kabushiki Kaisha | Reflection-type liquid crystal display having a silver or silver alloy upper electrode layer |
-
2001
- 2001-09-20 AU AU2001294526A patent/AU2001294526A1/en not_active Abandoned
- 2001-09-20 WO PCT/US2001/027723 patent/WO2002025702A2/en active Application Filing
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
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US3251121A (en) * | 1962-08-07 | 1966-05-17 | Bell Telephone Labor Inc | Method of making reed-type switch contacts |
US3342568A (en) * | 1965-03-16 | 1967-09-19 | Engelhard Ind Inc | Composite material of a ceramic silver gold alloy, and a nickel alloy |
US3634048A (en) * | 1968-02-14 | 1972-01-11 | Mallory & Co Inc P R | Solderable stainless steel |
US3600794A (en) * | 1968-06-18 | 1971-08-24 | Chugai Electric Ind Co Ltd | Method and apparatus for producing electrical contacts |
US3568096A (en) * | 1969-08-11 | 1971-03-02 | Bell Telephone Labor Inc | Apparatus for automatically switching high frequency signals |
US3668355A (en) * | 1971-01-27 | 1972-06-06 | Northern Electric Co | Reed material for sealed contact application |
US5035656A (en) * | 1990-05-15 | 1991-07-30 | E. I. Du Pont De Nemours And Company | Connector, circuit board contact element and retention portion |
JPH05117898A (en) * | 1991-10-29 | 1993-05-14 | Furukawa Electric Co Ltd:The | Lead frame for mounting semiconductor chip and production thereof |
US5981090A (en) * | 1996-02-20 | 1999-11-09 | Berkenhoff Gmbh | Pins for electronic assemblies |
JPH118341A (en) * | 1997-06-18 | 1999-01-12 | Mitsui High Tec Inc | Lead frame for semiconductor device |
US6081310A (en) * | 1997-11-25 | 2000-06-27 | Sharp Kabushiki Kaisha | Reflection-type liquid crystal display having a silver or silver alloy upper electrode layer |
US6054761A (en) * | 1998-12-01 | 2000-04-25 | Fujitsu Limited | Multi-layer circuit substrates and electrical assemblies having conductive composition connectors |
Also Published As
Publication number | Publication date |
---|---|
AU2001294526A1 (en) | 2002-04-02 |
WO2002025702A2 (en) | 2002-03-28 |
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