WO2002025702A3 - Semiconductor product with a silver and gold alloy - Google Patents

Semiconductor product with a silver and gold alloy Download PDF

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Publication number
WO2002025702A3
WO2002025702A3 PCT/US2001/027723 US0127723W WO0225702A3 WO 2002025702 A3 WO2002025702 A3 WO 2002025702A3 US 0127723 W US0127723 W US 0127723W WO 0225702 A3 WO0225702 A3 WO 0225702A3
Authority
WO
WIPO (PCT)
Prior art keywords
silver
gold alloy
layer
semiconductor product
underlies
Prior art date
Application number
PCT/US2001/027723
Other languages
French (fr)
Other versions
WO2002025702A2 (en
Inventor
Stephen M Kim
Soon Sung Hong
Ji Yong Lee
Byung Jun Park
Hyok Won Kwon
Original Assignee
Stephen M Kim
Soon Sung Hong
Ji Yong Lee
Byung Jun Park
Hyok Won Kwon
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stephen M Kim, Soon Sung Hong, Ji Yong Lee, Byung Jun Park, Hyok Won Kwon filed Critical Stephen M Kim
Priority to AU2001294526A priority Critical patent/AU2001294526A1/en
Publication of WO2002025702A2 publication Critical patent/WO2002025702A2/en
Publication of WO2002025702A3 publication Critical patent/WO2002025702A3/en

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern
    • H05K3/244Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
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    • H01L23/00Details of semiconductor or other solid state devices
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    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49579Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H01L23/49582Metallic layers on lead frames
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    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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Abstract

A semiconductor product (10) comprises a silver and gold alloy layer (11), wherein the silver and gold alloy forms an outside layer of the product (11). In some embodiments, a nickellayer (12) underlies the silver and gold alloy layer (11). In further embodiments, a copper layer (13) underlies the nickel layer (12). Moreover, the present invention pertains to a semiconductor substrate comprising a silver and gold alloy layer, wherein the silver and gold alloy forms an outside layer of the semiconductor substrate. The present invention has a particular application in having a silver and gold alloy form the outside layer of various items, including a lead frame, a board grid array, a header, a printed circuit board, a Reed switch, and a connector.
PCT/US2001/027723 2000-09-20 2001-09-20 Semiconductor product with a silver and gold alloy WO2002025702A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2001294526A AU2001294526A1 (en) 2000-09-20 2001-09-20 Semiconductor product with a silver and gold alloy

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US66589800A 2000-09-20 2000-09-20
US09/665,898 2000-09-20

Publications (2)

Publication Number Publication Date
WO2002025702A2 WO2002025702A2 (en) 2002-03-28
WO2002025702A3 true WO2002025702A3 (en) 2002-08-01

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Application Number Title Priority Date Filing Date
PCT/US2001/027723 WO2002025702A2 (en) 2000-09-20 2001-09-20 Semiconductor product with a silver and gold alloy

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AU (1) AU2001294526A1 (en)
WO (1) WO2002025702A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008091818A (en) * 2006-10-05 2008-04-17 Matsushita Electric Ind Co Ltd Lead frame for optical semiconductor device, optical semiconductor device using it, and these manufacturing methods

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3251121A (en) * 1962-08-07 1966-05-17 Bell Telephone Labor Inc Method of making reed-type switch contacts
US3342568A (en) * 1965-03-16 1967-09-19 Engelhard Ind Inc Composite material of a ceramic silver gold alloy, and a nickel alloy
US3568096A (en) * 1969-08-11 1971-03-02 Bell Telephone Labor Inc Apparatus for automatically switching high frequency signals
US3600794A (en) * 1968-06-18 1971-08-24 Chugai Electric Ind Co Ltd Method and apparatus for producing electrical contacts
US3634048A (en) * 1968-02-14 1972-01-11 Mallory & Co Inc P R Solderable stainless steel
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