WO2002023962A3 - Method for the formation of a pattern on an insulating substrate - Google Patents

Method for the formation of a pattern on an insulating substrate Download PDF

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Publication number
WO2002023962A3
WO2002023962A3 PCT/IL2001/000869 IL0100869W WO0223962A3 WO 2002023962 A3 WO2002023962 A3 WO 2002023962A3 IL 0100869 W IL0100869 W IL 0100869W WO 0223962 A3 WO0223962 A3 WO 0223962A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
pattern
insulating substrate
formation
laser
Prior art date
Application number
PCT/IL2001/000869
Other languages
French (fr)
Other versions
WO2002023962A2 (en
Inventor
Edward Brook-Levinson
Michael Kogan
Original Assignee
A L T Advanced Laser Technolog
Brook Levinson Edward
Michael Kogan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by A L T Advanced Laser Technolog, Brook Levinson Edward, Michael Kogan filed Critical A L T Advanced Laser Technolog
Priority to AU2001292199A priority Critical patent/AU2001292199A1/en
Publication of WO2002023962A2 publication Critical patent/WO2002023962A2/en
Publication of WO2002023962A3 publication Critical patent/WO2002023962A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging

Abstract

The present invention provides a method of forming a pattern on an insulating substrate, the method comprising the steps of: providing an insulating substrate (10) made of organic polymer; and treating the substrate (10) with a laser beam so as to irradiate selective portions (20) of the substrate in accordance with the pattern to be formed. Upon laser treatment, the irradiated portions (20) of the substrate (10) undergo a modification, for example undergo ablation and/or become conductive due to carbonization and/or graphitization of the substrate material. The method of the invention may be used in the manufacture of printed circuit boards. In such cases, the laser treated substrate is further exposed to an electroless metal plating step and/or to a galvanic deposition step for the selective deposition of metal (30) on the irradiated areas (20).
PCT/IL2001/000869 2000-09-18 2001-09-13 Method for the formation of a pattern on an insulating substrate WO2002023962A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2001292199A AU2001292199A1 (en) 2000-09-18 2001-09-13 Method for the formation of a pattern on an insulating substrate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IL13853000A IL138530A0 (en) 2000-09-18 2000-09-18 Method for the formation of a pattern on an insulating substrate
IL138530 2000-09-18

Publications (2)

Publication Number Publication Date
WO2002023962A2 WO2002023962A2 (en) 2002-03-21
WO2002023962A3 true WO2002023962A3 (en) 2002-06-13

Family

ID=11074650

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IL2001/000869 WO2002023962A2 (en) 2000-09-18 2001-09-13 Method for the formation of a pattern on an insulating substrate

Country Status (3)

Country Link
AU (1) AU2001292199A1 (en)
IL (1) IL138530A0 (en)
WO (1) WO2002023962A2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9467668B2 (en) 2007-06-27 2016-10-11 Prysm, Inc. Feedback control of display systems with light-emitting screens having excitation light source and phosphor layer
US9525850B2 (en) 2007-03-20 2016-12-20 Prysm, Inc. Delivering and displaying advertisement or other application data to display systems

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10329143B4 (en) * 2003-06-27 2005-09-01 Infineon Technologies Ag Electronic module and method of making the same
DE602005012937D1 (en) 2004-04-13 2009-04-09 Coloplast As METHOD FOR PROVIDING A PRODUCT OF A LASER WELDED POLYETHYLENE PRODUCT AND LASER WELDED POLYETHYLENE PRODUCT
US7791561B2 (en) 2005-04-01 2010-09-07 Prysm, Inc. Display systems having screens with optical fluorescent materials
EP2448383B1 (en) 2010-10-26 2013-09-11 C.R.F. Società Consortile Per Azioni Process for producing conductive and/or piezoresistive traces on a polymeric substrate
KR20150018368A (en) 2013-08-09 2015-02-23 주식회사 엘지화학 Method for forming conductive pattern by direct radiation of electromagnetic wave, and resin structure having conductive pattern thereon
LT6518B (en) 2016-09-13 2018-04-25 Valstybinis mokslinių tyrimų institutas Fizinių ir technologijos mokslų centras Method for formation of electro-conductive traces on polymeric article surface
EP3551366B1 (en) * 2017-04-10 2024-04-03 Hewlett-Packard Development Company, L.P. Reducing stresses in metal layers
US10440830B2 (en) * 2017-09-08 2019-10-08 Robert Bosch Gmbh Laser carbonization of polymer coatings in an open-air environment
CN111246684A (en) * 2018-11-28 2020-06-05 庆鼎精密电子（淮安）有限公司 Circuit board and manufacturing method thereof
CN112795206A (en) * 2021-03-08 2021-05-14 昆山睿翔讯通通信技术有限公司 Laser direct forming part and manufacturing method thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1262395B (en) * 1966-03-30 1968-03-07 Siemens Ag Process for producing metallized holes in printed circuits
GB1194112A (en) * 1967-05-29 1970-06-10 Ibm Improvements in Methods of Manufacturing Printed Circuits
US4691091A (en) * 1985-12-31 1987-09-01 At&T Technologies Direct writing of conductive patterns
US4900581A (en) * 1987-08-17 1990-02-13 Asea Brown Boveri Aktiengesellschaft Method for producing metal films
WO1991018489A1 (en) * 1990-05-16 1991-11-28 Olin Corporation Gtab manufacturing process and the product produced thereby

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1262395B (en) * 1966-03-30 1968-03-07 Siemens Ag Process for producing metallized holes in printed circuits
GB1194112A (en) * 1967-05-29 1970-06-10 Ibm Improvements in Methods of Manufacturing Printed Circuits
US4691091A (en) * 1985-12-31 1987-09-01 At&T Technologies Direct writing of conductive patterns
US4900581A (en) * 1987-08-17 1990-02-13 Asea Brown Boveri Aktiengesellschaft Method for producing metal films
WO1991018489A1 (en) * 1990-05-16 1991-11-28 Olin Corporation Gtab manufacturing process and the product produced thereby

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
ANONYMOUS: "Laser Generated Conductive Lines. August 1976.", IBM TECHNICAL DISCLOSURE BULLETIN, vol. 19, no. 3, 1 August 1976 (1976-08-01), New York, US, pages 1014, XP002187264 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9525850B2 (en) 2007-03-20 2016-12-20 Prysm, Inc. Delivering and displaying advertisement or other application data to display systems
US9467668B2 (en) 2007-06-27 2016-10-11 Prysm, Inc. Feedback control of display systems with light-emitting screens having excitation light source and phosphor layer

Also Published As

Publication number Publication date
WO2002023962A2 (en) 2002-03-21
AU2001292199A1 (en) 2002-03-26
IL138530A0 (en) 2003-02-12

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