WO2002018101A3 - Chemical mechanical polishing (cmp) head, apparatus, and method and planarized semiconductor wafer produced thereby - Google Patents

Chemical mechanical polishing (cmp) head, apparatus, and method and planarized semiconductor wafer produced thereby Download PDF

Info

Publication number
WO2002018101A3
WO2002018101A3 PCT/US2001/027151 US0127151W WO0218101A3 WO 2002018101 A3 WO2002018101 A3 WO 2002018101A3 US 0127151 W US0127151 W US 0127151W WO 0218101 A3 WO0218101 A3 WO 0218101A3
Authority
WO
WIPO (PCT)
Prior art keywords
cmp
flexible member
substrate
subcarrier
polishing
Prior art date
Application number
PCT/US2001/027151
Other languages
French (fr)
Other versions
WO2002018101A9 (en
WO2002018101A2 (en
Inventor
Jiro Kajiwara
Gerard S Moloney
Huey-Ming Wang
David A Hansen
Original Assignee
Multi Planar Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/652,855 external-priority patent/US6527625B1/en
Priority claimed from US09/652,854 external-priority patent/US6540590B1/en
Application filed by Multi Planar Technologies Inc filed Critical Multi Planar Technologies Inc
Priority to AU2001286972A priority Critical patent/AU2001286972A1/en
Priority to JP2002523058A priority patent/JP2004518270A/en
Priority to KR1020037003077A priority patent/KR100920709B1/en
Publication of WO2002018101A2 publication Critical patent/WO2002018101A2/en
Publication of WO2002018101A3 publication Critical patent/WO2002018101A3/en
Publication of WO2002018101A9 publication Critical patent/WO2002018101A9/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Abstract

Chemical Mechanical Polishing/Planarization (CMP) apparatus, method, and substrate produced thereby. Polishing surface with non-uniform recesses therein. CMP head and method having integral slurry dispensing mechanism. CMP apparatus and method having rotating retaining ring. CMP apparatus and method having soft backed polishing head. CMP providing efficient use of slurry in polishing and planarizing processes. Substrate (semiconductor wafer) produced by CMP apparatus or method. In one embodiment, apparatus (100) includes subcarrier (160) with flexible member (185) attached to lower substrate holding surface (165). Flexible member (185) has hole(s) (195) therein so that pressurized fluid introduced between flexible member and subcarrier (160) directly presses substrate (105) against polishing surface (125). Number and size of holes (195) are selected to provide sufficient friction between flexible member (185) and substrate (105) to cause rotation when drive mechanism rotates subcarrier (160). Subcarrier (160) having port adapted to draw vacuum on cavity (215) between lower surface (165) and flexible member (185). Flexible member and substrate (105) serve as valve (225) to isolate port from cavity when a predetermined vacuum has been achieved.
PCT/US2001/027151 2000-08-31 2001-08-30 Chemical mechanical polishing (cmp) head, apparatus, and method and planarized semiconductor wafer produced thereby WO2002018101A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
AU2001286972A AU2001286972A1 (en) 2000-08-31 2001-08-30 Chemical mechanical polishing (cmp) head, apparatus, and method and planarized semiconductor wafer produced thereby
JP2002523058A JP2004518270A (en) 2000-08-31 2001-08-30 Chemical mechanical polishing (CMP) head, apparatus and method, and planarized semiconductor wafer produced thereby
KR1020037003077A KR100920709B1 (en) 2000-08-31 2001-08-30 Chemical mechanical polishing cmp head, apparatus, and method and planarized semiconductor wafer produced thereby

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
US65296300A 2000-08-31 2000-08-31
US65363600A 2000-08-31 2000-08-31
US09/652,854 2000-08-31
US09/652,855 US6527625B1 (en) 2000-08-31 2000-08-31 Chemical mechanical polishing apparatus and method having a soft backed polishing head
US09/652,963 2000-08-31
US09/653,636 2000-08-31
US09/652,854 US6540590B1 (en) 2000-08-31 2000-08-31 Chemical mechanical polishing apparatus and method having a rotating retaining ring
US09/652,855 2000-08-31

Publications (3)

Publication Number Publication Date
WO2002018101A2 WO2002018101A2 (en) 2002-03-07
WO2002018101A3 true WO2002018101A3 (en) 2003-01-23
WO2002018101A9 WO2002018101A9 (en) 2003-10-30

Family

ID=27505281

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/027151 WO2002018101A2 (en) 2000-08-31 2001-08-30 Chemical mechanical polishing (cmp) head, apparatus, and method and planarized semiconductor wafer produced thereby

Country Status (5)

Country Link
JP (2) JP2004518270A (en)
KR (1) KR100920709B1 (en)
AU (1) AU2001286972A1 (en)
TW (1) TWI246448B (en)
WO (1) WO2002018101A2 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4490822B2 (en) * 2002-09-27 2010-06-30 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 Polishing apparatus and wafer polishing method
KR100752181B1 (en) * 2005-10-05 2007-08-24 동부일렉트로닉스 주식회사 Chemical Mechanical polishing Apparatus
US7267610B1 (en) * 2006-08-30 2007-09-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP pad having unevenly spaced grooves
US8460067B2 (en) * 2009-05-14 2013-06-11 Applied Materials, Inc. Polishing head zone boundary smoothing
US9610672B2 (en) * 2014-06-27 2017-04-04 Applied Materials, Inc. Configurable pressure design for multizone chemical mechanical planarization polishing head
TWI574778B (en) * 2015-02-11 2017-03-21 國立勤益科技大學 Polishing machine
US10283396B2 (en) * 2016-06-27 2019-05-07 Asm Nexx, Inc. Workpiece holder for a wet processing system
CN107214614A (en) * 2017-07-25 2017-09-29 蒋南 A kind of automatic saw blade polishing machine
JP7113626B2 (en) * 2018-01-12 2022-08-05 ニッタ・デュポン株式会社 polishing pad
US20200055160A1 (en) * 2018-08-14 2020-02-20 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing method and apparatus
WO2020203639A1 (en) * 2019-04-03 2020-10-08 株式会社クラレ Polishing pad
CN114905386A (en) * 2021-02-01 2022-08-16 中国石油化工股份有限公司 Pendant pretreatment device and method suitable for uniform corrosion rate test

Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5297364A (en) * 1990-01-22 1994-03-29 Micron Technology, Inc. Polishing pad with controlled abrasion rate
US5584746A (en) * 1993-10-18 1996-12-17 Shin-Etsu Handotai Co., Ltd. Method of polishing semiconductor wafers and apparatus therefor
JPH0957612A (en) * 1995-08-21 1997-03-04 Nec Corp Polishing apparatus
JPH10156712A (en) * 1996-11-29 1998-06-16 Oki Electric Ind Co Ltd Wafer polishing device
EP0878270A2 (en) * 1997-05-15 1998-11-18 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
EP0922531A1 (en) * 1997-12-11 1999-06-16 Speedfam Co., Ltd. Carrier and CMP apparatus
JPH11165255A (en) * 1997-12-04 1999-06-22 Nec Corp Wafer polishing device and polishing method
WO1999033614A1 (en) * 1997-12-31 1999-07-08 Applied Materials, Inc. A carrier head with a removable retaining ring for a chemical mechanical polishing apparatus
US5931725A (en) * 1996-07-30 1999-08-03 Tokyo Seimitsu Co., Ltd. Wafer polishing machine
JPH11216663A (en) * 1998-02-03 1999-08-10 Sony Corp Grinding pad, grinding apparatus and grinding method
US6007411A (en) * 1997-06-19 1999-12-28 Interantional Business Machines Corporation Wafer carrier for chemical mechanical polishing
EP0992322A1 (en) * 1998-04-06 2000-04-12 Ebara Corporation Polishing device
WO2000021715A2 (en) * 1998-10-09 2000-04-20 Speedfam-Ipec Corporation Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head
JP2000117620A (en) * 1998-10-07 2000-04-25 Samsung Electronics Co Ltd Abrasive pade used in chemical machine polishing for semiconductor substrate
US6093651A (en) * 1997-12-23 2000-07-25 Intel Corporation Polish pad with non-uniform groove depth to improve wafer polish rate uniformity
US6110012A (en) * 1998-12-24 2000-08-29 Lucent Technologies Inc. Chemical-mechanical polishing apparatus and method
EP1053830A2 (en) * 1999-05-19 2000-11-22 Infineon Technologies North America Corp. System for dispensing polishing liquid during chemical mechanical polishing of a semiconductor wafer
US20010039172A1 (en) * 2000-04-17 2001-11-08 Norio Kimura Polishing apparatus
WO2001087541A2 (en) * 2000-05-12 2001-11-22 Multi-Planar Technologies, Inc. Pneumatic diaphragm head having an independent retaining ring and multi-region pressure control, and method to use the same
WO2001091974A1 (en) * 2000-05-31 2001-12-06 Philips Semiconductors, Inc. Method and apparatus for conditioning a polish pad and for dispensing slurry

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2944176B2 (en) * 1990-09-19 1999-08-30 三菱マテリアル株式会社 Ultra-precision polishing method and polishing apparatus for wafer
US5624299A (en) * 1993-12-27 1997-04-29 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved carrier and method of use
JPH08267357A (en) * 1995-03-31 1996-10-15 Nec Corp Abrasive device of substrate and abrasive method thereof
US6024630A (en) * 1995-06-09 2000-02-15 Applied Materials, Inc. Fluid-pressure regulated wafer polishing head
JP3183204B2 (en) * 1997-01-08 2001-07-09 三菱マテリアル株式会社 Wafer polishing equipment
US5851140A (en) * 1997-02-13 1998-12-22 Integrated Process Equipment Corp. Semiconductor wafer polishing apparatus with a flexible carrier plate
JP2897207B1 (en) * 1997-04-04 1999-05-31 株式会社東京精密 Polishing equipment
JPH10315126A (en) * 1997-05-16 1998-12-02 Tokyo Seimitsu Co Ltd Grinding method and device using distributor ring
US6368189B1 (en) * 1999-03-03 2002-04-09 Mitsubishi Materials Corporation Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
JP2002046061A (en) * 2000-07-31 2002-02-12 Mitsubishi Materials Corp Polishing head

Patent Citations (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5297364A (en) * 1990-01-22 1994-03-29 Micron Technology, Inc. Polishing pad with controlled abrasion rate
US5584746A (en) * 1993-10-18 1996-12-17 Shin-Etsu Handotai Co., Ltd. Method of polishing semiconductor wafers and apparatus therefor
JPH0957612A (en) * 1995-08-21 1997-03-04 Nec Corp Polishing apparatus
US5931725A (en) * 1996-07-30 1999-08-03 Tokyo Seimitsu Co., Ltd. Wafer polishing machine
JPH10156712A (en) * 1996-11-29 1998-06-16 Oki Electric Ind Co Ltd Wafer polishing device
EP0878270A2 (en) * 1997-05-15 1998-11-18 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
US6007411A (en) * 1997-06-19 1999-12-28 Interantional Business Machines Corporation Wafer carrier for chemical mechanical polishing
JPH11165255A (en) * 1997-12-04 1999-06-22 Nec Corp Wafer polishing device and polishing method
US6168684B1 (en) * 1997-12-04 2001-01-02 Nec Corporation Wafer polishing apparatus and polishing method
EP0922531A1 (en) * 1997-12-11 1999-06-16 Speedfam Co., Ltd. Carrier and CMP apparatus
US6093651A (en) * 1997-12-23 2000-07-25 Intel Corporation Polish pad with non-uniform groove depth to improve wafer polish rate uniformity
WO1999033614A1 (en) * 1997-12-31 1999-07-08 Applied Materials, Inc. A carrier head with a removable retaining ring for a chemical mechanical polishing apparatus
US6159088A (en) * 1998-02-03 2000-12-12 Sony Corporation Polishing pad, polishing apparatus and polishing method
JPH11216663A (en) * 1998-02-03 1999-08-10 Sony Corp Grinding pad, grinding apparatus and grinding method
EP0992322A1 (en) * 1998-04-06 2000-04-12 Ebara Corporation Polishing device
JP2000117620A (en) * 1998-10-07 2000-04-25 Samsung Electronics Co Ltd Abrasive pade used in chemical machine polishing for semiconductor substrate
US6165904A (en) * 1998-10-07 2000-12-26 Samsung Electronics Co., Ltd. Polishing pad for use in the chemical/mechanical polishing of a semiconductor substrate and method of polishing the substrate using the pad
WO2000021715A2 (en) * 1998-10-09 2000-04-20 Speedfam-Ipec Corporation Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head
US6110012A (en) * 1998-12-24 2000-08-29 Lucent Technologies Inc. Chemical-mechanical polishing apparatus and method
EP1053830A2 (en) * 1999-05-19 2000-11-22 Infineon Technologies North America Corp. System for dispensing polishing liquid during chemical mechanical polishing of a semiconductor wafer
US20010039172A1 (en) * 2000-04-17 2001-11-08 Norio Kimura Polishing apparatus
WO2001087541A2 (en) * 2000-05-12 2001-11-22 Multi-Planar Technologies, Inc. Pneumatic diaphragm head having an independent retaining ring and multi-region pressure control, and method to use the same
WO2001091974A1 (en) * 2000-05-31 2001-12-06 Philips Semiconductors, Inc. Method and apparatus for conditioning a polish pad and for dispensing slurry

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 07 31 July 1997 (1997-07-31) *
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 11 30 September 1998 (1998-09-30) *
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 11 30 September 1999 (1999-09-30) *
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 13 30 November 1999 (1999-11-30) *
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 07 29 September 2000 (2000-09-29) *

Also Published As

Publication number Publication date
JP5562370B2 (en) 2014-07-30
WO2002018101A9 (en) 2003-10-30
TWI246448B (en) 2006-01-01
JP2004518270A (en) 2004-06-17
WO2002018101A2 (en) 2002-03-07
KR100920709B1 (en) 2009-10-07
JP2012151501A (en) 2012-08-09
KR20030064393A (en) 2003-07-31
AU2001286972A1 (en) 2002-03-13

Similar Documents

Publication Publication Date Title
US6106378A (en) Carrier head with a flexible membrane for a chemical mechanical polishing system
US7988537B2 (en) Substrate holding apparatus and polishing apparatus
WO2002018101A3 (en) Chemical mechanical polishing (cmp) head, apparatus, and method and planarized semiconductor wafer produced thereby
KR100973766B1 (en) Elastic pad and top ring
US5993302A (en) Carrier head with a removable retaining ring for a chemical mechanical polishing apparatus
US6431968B1 (en) Carrier head with a compressible film
US7108592B2 (en) Substrate holding apparatus and polishing apparatus
WO2003022518A3 (en) Chemical mechanical polishing tool, apparatus and method
US20060079092A1 (en) Polishing method
KR100814069B1 (en) A wafer polishing head of an air-bag type
JP2016515303A (en) Substrate precession mechanism for CMP polishing head
EP1726402B1 (en) Wafer polishing apparatus and method for polishing wafers
US6719619B2 (en) Quick coupler for mounting a rotational disk
ATE350194T1 (en) MULTIPLE POLISHING PAD CONSTRUCTION FOR CHEMICAL-MECHANICAL POLISHING PROCESS
US6099387A (en) CMP of a circlet wafer using disc-like brake polish pads
JPH08229807A (en) Polishing machine for wafer
KR100517147B1 (en) Polishing platen of a chemical-mechanical polisher
US6368186B1 (en) Apparatus for mounting a rotational disk
KR100529434B1 (en) Pad conditioner of a polishing apparatus for use in a semiconductor substrate
KR20050069210A (en) Polishing head for use in a cemical-mechanical polisher
KR100576822B1 (en) Chemical mechanical polishing apparatus
JP2009255184A (en) Wafer polishing device
KR200280354Y1 (en) Polishing housing of a chemical mechanical polishing apparatus
US6217419B1 (en) Chemical-mechanical polisher
JP2002170794A (en) Wafer polishing apparatus

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PH PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
WWE Wipo information: entry into national phase

Ref document number: 1020037003077

Country of ref document: KR

Ref document number: 2002523058

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 018180620

Country of ref document: CN

REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

WWP Wipo information: published in national office

Ref document number: 1020037003077

Country of ref document: KR

122 Ep: pct application non-entry in european phase
COP Corrected version of pamphlet

Free format text: PAGES 1/10-10/10, DRAWINGS, REPLACED BY NEW PAGES 1/10-10/10; DUE TO LATE TRANSMITTAL BY THE RECEIVING OFFICE

DPE2 Request for preliminary examination filed before expiration of 19th month from priority date (pct application filed from 20040101)