WO2002018100A3 - Method and apparatus for measuring a polishing condition - Google Patents
Method and apparatus for measuring a polishing condition Download PDFInfo
- Publication number
- WO2002018100A3 WO2002018100A3 PCT/IB2001/001532 IB0101532W WO0218100A3 WO 2002018100 A3 WO2002018100 A3 WO 2002018100A3 IB 0101532 W IB0101532 W IB 0101532W WO 0218100 A3 WO0218100 A3 WO 0218100A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wafer
- measuring
- polishing condition
- picture
- measurement site
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2003-7002903A KR20030024920A (en) | 2000-08-31 | 2001-08-27 | Method and apparatus for measuring a polishing condition |
EP01956736A EP1315598A2 (en) | 2000-08-31 | 2001-08-27 | Method and apparatus for measuring a polishing condition |
JP2002523057A JP2004507900A (en) | 2000-08-31 | 2001-08-27 | Method and apparatus for measuring polishing condition |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US65289800A | 2000-08-31 | 2000-08-31 | |
US09/652,898 | 2000-08-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2002018100A2 WO2002018100A2 (en) | 2002-03-07 |
WO2002018100A3 true WO2002018100A3 (en) | 2002-05-16 |
Family
ID=24618652
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IB2001/001532 WO2002018100A2 (en) | 2000-08-31 | 2001-08-27 | Method and apparatus for measuring a polishing condition |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1315598A2 (en) |
JP (1) | JP2004507900A (en) |
KR (1) | KR20030024920A (en) |
TW (1) | TW534854B (en) |
WO (1) | WO2002018100A2 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1302522C (en) * | 2002-05-15 | 2007-02-28 | 旺宏电子股份有限公司 | Terminal detection system for chemical and mechanical polisher |
JP4464642B2 (en) | 2003-09-10 | 2010-05-19 | 株式会社荏原製作所 | Polishing state monitoring apparatus, polishing state monitoring method, polishing apparatus, and polishing method |
US8547538B2 (en) * | 2011-04-21 | 2013-10-01 | Applied Materials, Inc. | Construction of reference spectra with variations in environmental effects |
JP2013122956A (en) * | 2011-12-09 | 2013-06-20 | Disco Abrasive Syst Ltd | Processing device |
WO2021112034A1 (en) * | 2019-12-03 | 2021-06-10 | 株式会社荏原製作所 | Polishing device and polishing method |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11198033A (en) * | 1997-10-31 | 1999-07-27 | Canon Inc | Polishing device and polishing method |
WO1999064205A1 (en) * | 1998-06-08 | 1999-12-16 | Speedfam-Ipec Corporation | Method and apparatus for endpoint detection for chemical mechanical polishing |
JP2000033561A (en) * | 1998-07-21 | 2000-02-02 | Dainippon Screen Mfg Co Ltd | End point detecting device and end point detecting method |
US6102775A (en) * | 1997-04-18 | 2000-08-15 | Nikon Corporation | Film inspection method |
US6142855A (en) * | 1997-10-31 | 2000-11-07 | Canon Kabushiki Kaisha | Polishing apparatus and polishing method |
-
2001
- 2001-08-21 TW TW090120554A patent/TW534854B/en not_active IP Right Cessation
- 2001-08-27 JP JP2002523057A patent/JP2004507900A/en active Pending
- 2001-08-27 WO PCT/IB2001/001532 patent/WO2002018100A2/en not_active Application Discontinuation
- 2001-08-27 KR KR10-2003-7002903A patent/KR20030024920A/en not_active Application Discontinuation
- 2001-08-27 EP EP01956736A patent/EP1315598A2/en not_active Ceased
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6102775A (en) * | 1997-04-18 | 2000-08-15 | Nikon Corporation | Film inspection method |
JPH11198033A (en) * | 1997-10-31 | 1999-07-27 | Canon Inc | Polishing device and polishing method |
US6142855A (en) * | 1997-10-31 | 2000-11-07 | Canon Kabushiki Kaisha | Polishing apparatus and polishing method |
WO1999064205A1 (en) * | 1998-06-08 | 1999-12-16 | Speedfam-Ipec Corporation | Method and apparatus for endpoint detection for chemical mechanical polishing |
JP2000033561A (en) * | 1998-07-21 | 2000-02-02 | Dainippon Screen Mfg Co Ltd | End point detecting device and end point detecting method |
Non-Patent Citations (1)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 05 14 September 2000 (2000-09-14) * |
Also Published As
Publication number | Publication date |
---|---|
TW534854B (en) | 2003-06-01 |
KR20030024920A (en) | 2003-03-26 |
WO2002018100A2 (en) | 2002-03-07 |
EP1315598A2 (en) | 2003-06-04 |
JP2004507900A (en) | 2004-03-11 |
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