WO2002017362A8 - Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors and fabricating such devices - Google Patents

Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors and fabricating such devices

Info

Publication number
WO2002017362A8
WO2002017362A8 PCT/US2001/026298 US0126298W WO0217362A8 WO 2002017362 A8 WO2002017362 A8 WO 2002017362A8 US 0126298 W US0126298 W US 0126298W WO 0217362 A8 WO0217362 A8 WO 0217362A8
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor
devices
semiconductors
doped
width
Prior art date
Application number
PCT/US2001/026298
Other languages
French (fr)
Other versions
WO2002017362A2 (en
Inventor
Charles M Lieber
Ying Cui
Xiangfeng Duan
Yung-Sheng Huang
Original Assignee
Harvard College
Charles M Lieber
Ying Cui
Xiangfeng Duan
Yung-Sheng Huang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harvard College, Charles M Lieber, Ying Cui, Xiangfeng Duan, Yung-Sheng Huang filed Critical Harvard College
Priority to EP01966109A priority Critical patent/EP1314189B1/en
Priority to CA2417992A priority patent/CA2417992C/en
Priority to MXPA03001605A priority patent/MXPA03001605A/en
Priority to JP2002521336A priority patent/JP5013650B2/en
Priority to AU2001286649A priority patent/AU2001286649B2/en
Priority to KR1020087015375A priority patent/KR100984585B1/en
Priority to KR1020037002636A priority patent/KR100791732B1/en
Priority to AU8664901A priority patent/AU8664901A/en
Publication of WO2002017362A2 publication Critical patent/WO2002017362A2/en
Publication of WO2002017362A8 publication Critical patent/WO2002017362A8/en
Priority to AU2007202897A priority patent/AU2007202897B2/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0657Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
    • H01L29/0665Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J23/00Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00
    • B01J23/38Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of noble metals
    • B01J23/48Silver or gold
    • B01J23/50Silver
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J23/00Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00
    • B01J23/38Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of noble metals
    • B01J23/48Silver or gold
    • B01J23/52Gold
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J23/00Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00
    • B01J23/70Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of the iron group metals or copper
    • B01J23/72Copper
    • B01J35/23
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J37/00Processes, in general, for preparing catalysts; Processes, in general, for activation of catalysts
    • B01J37/34Irradiation by, or application of, electric, magnetic or wave energy, e.g. ultrasonic waves ; Ionic sputtering; Flame or plasma spraying; Particle radiation
    • B01J37/349Irradiation by, or application of, electric, magnetic or wave energy, e.g. ultrasonic waves ; Ionic sputtering; Flame or plasma spraying; Particle radiation making use of flames, plasmas or lasers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/0019Flexible or deformable structures not provided for in groups B81C1/00142 - B81C1/00182
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00206Processes for functionalising a surface, e.g. provide the surface with specific mechanical, chemical or biological properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B11/00Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/005Growth of whiskers or needles
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/60Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape characterised by shape
    • C30B29/605Products containing multiple oriented crystallites, e.g. columnar crystallites
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/403Cells and electrode assemblies
    • G01N27/414Ion-sensitive or chemical field-effect transistors, i.e. ISFETS or CHEMFETS
    • G01N27/4146Ion-sensitive or chemical field-effect transistors, i.e. ISFETS or CHEMFETS involving nanosized elements, e.g. nanotubes, nanowires
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N33/00Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
    • G01N33/48Biological material, e.g. blood, urine; Haemocytometers
    • G01N33/50Chemical analysis of biological material, e.g. blood, urine; Testing involving biospecific ligand binding methods; Immunological testing
    • G01N33/53Immunoassay; Biospecific binding assay; Materials therefor
    • G01N33/543Immunoassay; Biospecific binding assay; Materials therefor with an insoluble carrier for immobilising immunochemicals
    • G01N33/54366Apparatus specially adapted for solid-phase testing
    • G01N33/54373Apparatus specially adapted for solid-phase testing involving physiochemical end-point determination, e.g. wave-guides, FETS, gratings
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0009RRAM elements whose operation depends upon chemical change
    • G11C13/0014RRAM elements whose operation depends upon chemical change comprising cells based on organic memory material
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0009RRAM elements whose operation depends upon chemical change
    • G11C13/0014RRAM elements whose operation depends upon chemical change comprising cells based on organic memory material
    • G11C13/0019RRAM elements whose operation depends upon chemical change comprising cells based on organic memory material comprising bio-molecules
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/02Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using elements whose operation depends upon chemical change
    • G11C13/025Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using elements whose operation depends upon chemical change using fullerenes, e.g. C60, or nanotubes, e.g. carbon or silicon nanotubes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02524Group 14 semiconducting materials
    • H01L21/02532Silicon, silicon germanium, germanium
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02538Group 13/15 materials
    • H01L21/0254Nitrides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02538Group 13/15 materials
    • H01L21/02543Phosphides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02551Group 12/16 materials
    • H01L21/02557Sulfides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02551Group 12/16 materials
    • H01L21/0256Selenides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/0257Doping during depositing
    • H01L21/02573Conductivity type
    • H01L21/02581Transition metal or rare earth elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02587Structure
    • H01L21/0259Microstructure
    • H01L21/02603Nanowires
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/02623Liquid deposition
    • H01L21/02628Liquid deposition using solutions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/02636Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/02636Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
    • H01L21/02639Preparation of substrate for selective deposition
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/02636Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
    • H01L21/02639Preparation of substrate for selective deposition
    • H01L21/02645Seed materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/02636Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
    • H01L21/02653Vapour-liquid-solid growth
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204Conductive materials
    • H01L23/53276Conductive materials containing carbon, e.g. fullerenes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/04Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes
    • H01L29/045Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes by their particular orientation of crystalline planes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0657Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
    • H01L29/0665Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
    • H01L29/0669Nanowires or nanotubes
    • H01L29/0673Nanowires or nanotubes oriented parallel to a substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0657Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
    • H01L29/0665Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
    • H01L29/0669Nanowires or nanotubes
    • H01L29/068Nanowires or nanotubes comprising a junction
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/16Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/16Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System
    • H01L29/1602Diamond
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/18Selenium or tellurium only, apart from doping materials or other impurities
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/20Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/20Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
    • H01L29/207Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds further characterised by the doping material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/22Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIBVI compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/24Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only semiconductor materials not provided for in groups H01L29/16, H01L29/18, H01L29/20, H01L29/22
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/26Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, elements provided for in two or more of the groups H01L29/16, H01L29/18, H01L29/20, H01L29/22, H01L29/24, e.g. alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/26Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, elements provided for in two or more of the groups H01L29/16, H01L29/18, H01L29/20, H01L29/22, H01L29/24, e.g. alloys
    • H01L29/267Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, elements provided for in two or more of the groups H01L29/16, H01L29/18, H01L29/20, H01L29/22, H01L29/24, e.g. alloys in different semiconductor regions, e.g. heterojunctions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/20Carbon compounds, e.g. carbon nanotubes or fullerenes
    • H10K85/221Carbon nanotubes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y15/00Nanotechnology for interacting, sensing or actuating, e.g. quantum dots as markers in protein assays or molecular motors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00Nanotechnology for materials or surface science, e.g. nanocomposites
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00Manufacture or treatment of nanostructures
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/04Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using optical elements ; using other beam accessed elements, e.g. electron or ion beam
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2213/00Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/70Resistive array aspects
    • G11C2213/77Array wherein the memory element being directly connected to the bit lines and word lines without any access device being used
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2213/00Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/70Resistive array aspects
    • G11C2213/81Array wherein the array conductors, e.g. word lines, bit lines, are made of nanowires
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/0257Doping during depositing
    • H01L21/02573Conductivity type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02587Structure
    • H01L21/0259Microstructure
    • H01L21/02606Nanotubes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/0262Reduction or decomposition of gaseous compounds, e.g. CVD
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/02631Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/04Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
    • H01L33/06Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/16Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous
    • H01L33/18Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous within the light emitting region
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/30Doping active layers, e.g. electron transporting layers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/549Organic PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00Semiconductor device manufacturing: process
    • Y10S438/962Quantum dots and lines
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00Nanotechnology
    • Y10S977/70Nanostructure
    • Y10S977/762Nanowire or quantum wire, i.e. axially elongated structure having two dimensions of 100 nm or less
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00Nanotechnology
    • Y10S977/84Manufacture, treatment, or detection of nanostructure
    • Y10S977/842Manufacture, treatment, or detection of nanostructure for carbon nanotubes or fullerenes
    • Y10S977/847Surface modifications, e.g. functionalization, coating
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00Nanotechnology
    • Y10S977/84Manufacture, treatment, or detection of nanostructure
    • Y10S977/849Manufacture, treatment, or detection of nanostructure with scanning probe
    • Y10S977/855Manufacture, treatment, or detection of nanostructure with scanning probe for manufacture of nanostructure
    • Y10S977/858Manufacture, treatment, or detection of nanostructure with scanning probe for manufacture of nanostructure including positioning/mounting nanostructure
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00Nanotechnology
    • Y10S977/84Manufacture, treatment, or detection of nanostructure
    • Y10S977/882Assembling of separate components, e.g. by attaching
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00Nanotechnology
    • Y10S977/84Manufacture, treatment, or detection of nanostructure
    • Y10S977/882Assembling of separate components, e.g. by attaching
    • Y10S977/883Fluidic self-assembly, FSA
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00Nanotechnology
    • Y10S977/84Manufacture, treatment, or detection of nanostructure
    • Y10S977/89Deposition of materials, e.g. coating, cvd, or ald
    • Y10S977/892Liquid phase deposition
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00Nanotechnology
    • Y10S977/902Specified use of nanostructure
    • Y10S977/932Specified use of nanostructure for electronic or optoelectronic application
    • Y10S977/936Specified use of nanostructure for electronic or optoelectronic application in a transistor or 3-terminal device
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]

Abstract

La présente invention concerne semi-conducteur dopé dans la masse, en l'occurrence, un monocristal, un semi-conducteur dopé dans la masse, de forme allongée et présentant en un point quelconque de son axe longitudinal une plus grande dimension en coupe de moins de 500 nm, ou enfin d'un semi-conducteur autonome dopé dans la masse dont au moins une partie présente une largeur de moins de 500 nm. Ce semi-conducteur peut comprendre un noyau intérieur fait d'un premier matériau semi-conducteur et une enveloppe extérieure en un matériau différent de celui du premier semi-conducteur. Ce semi-conducteur peut être de forme allongée et présenter en coupe en un point quelconque de son axe longitudinal un rapport [longueur]/[plus grande largeur] supérieur à 4:1, à 10:1, à 100:1, ou même à 1000:1. La plus petite largeur sur une partie au moins de ce semi-conducteur peut être inférieure à 200 nm, 150 nm, 100 nm, 80 nm, 70 nm, 60 nm, 40 nm, 20 nm, 10 nm, ou même à 5 nm. Ce semi-conducteur monocristal ou autonome peut être légèrement ou fortement dopé N ou P, le dopage étant réalisé pendant le tirage. Un tel semi-conducteur peut s'intégrer à un dispositif s'incorporant lui-même à divers dispositifs et combinaisons de dispositifs, diverses techniques d'assemblage pouvant être mises en oeuvre pour la fabrication. Ces semi-conducteurs et matrices de semi-conducteurs se prêtent à des combinaisons de dispositifs, par exemple pour former une jonction P-N croisée de dispositifs. Réalisés sous certaines dimensions ces dispositifs peuvent être le siège de phénomènes quantiques et notamment un confinement, la largeur choisie déterminant la longueur d'ondes de la lumière émise. Ces semi-conducteurs et dispositifs conviennent particulièrement à diverses applications.The present invention relates to semiconductor doped in the mass, in this case, a single crystal, a semiconductor doped in the mass, of elongated shape and having at any point of its longitudinal axis a greater dimension in section of less of 500 nm, or finally of an autonomous semiconductor doped in the mass of which at least a part has a width of less than 500 nm. This semiconductor may include an inner core made of a first semiconductor material and an outer shell of a material different from that of the first semiconductor. This semiconductor can be of elongated shape and present in section at any point on its longitudinal axis a ratio [length] / [greatest width] greater than 4: 1, 10: 1, 100: 1, or even at 1000: 1. The smallest width on at least part of this semiconductor can be less than 200 nm, 150 nm, 100 nm, 80 nm, 70 nm, 60 nm, 40 nm, 20 nm, 10 nm, or even 5 nm . This monocrystalline or autonomous semiconductor can be lightly or strongly doped N or P, doping being carried out during the drawing. Such a semiconductor can be integrated into a device which incorporates itself into various devices and combinations of devices, various assembly techniques being able to be used for manufacturing. These semiconductors and semiconductor arrays lend themselves to combinations of devices, for example to form a P-N cross junction of devices. Produced in certain dimensions, these devices can be the site of quantum phenomena and in particular confinement, the width chosen determining the wavelength of the light emitted. These semiconductors and devices are particularly suitable for various applications.

PCT/US2001/026298 2000-08-22 2001-08-22 Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors and fabricating such devices WO2002017362A2 (en)

Priority Applications (9)

Application Number Priority Date Filing Date Title
EP01966109A EP1314189B1 (en) 2000-08-22 2001-08-22 Electrical device comprising doped semiconductor nanowires and method for its production
CA2417992A CA2417992C (en) 2000-08-22 2001-08-22 Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors and fabricating such devices
MXPA03001605A MXPA03001605A (en) 2000-08-22 2001-08-22 Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors and fabricating such devices.
JP2002521336A JP5013650B2 (en) 2000-08-22 2001-08-22 Doped elongated semiconductors, growth of such semiconductors, devices containing such semiconductors, and the manufacture of such devices
AU2001286649A AU2001286649B2 (en) 2000-08-22 2001-08-22 Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors and fabricating such devices
KR1020087015375A KR100984585B1 (en) 2000-08-22 2001-08-22 Nanosensors
KR1020037002636A KR100791732B1 (en) 2000-08-22 2001-08-22 Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors and fabricating such devices
AU8664901A AU8664901A (en) 2000-08-22 2001-08-22 Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors and fabricating such devices
AU2007202897A AU2007202897B2 (en) 2000-08-22 2007-06-22 Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors and fabricating such devices

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
US22683500P 2000-08-22 2000-08-22
US60/226,835 2000-08-22
US25474500P 2000-12-11 2000-12-11
US60/254,745 2000-12-11
US29189601P 2001-05-18 2001-05-18
US29212101P 2001-05-18 2001-05-18
US29204501P 2001-05-18 2001-05-18
US29203501P 2001-05-18 2001-05-18
US60/291,896 2001-05-18
US60/292,035 2001-05-18
US60/292,045 2001-05-18
US60/292,121 2001-05-18

Publications (2)

Publication Number Publication Date
WO2002017362A2 WO2002017362A2 (en) 2002-02-28
WO2002017362A8 true WO2002017362A8 (en) 2002-11-21

Family

ID=27559184

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/026298 WO2002017362A2 (en) 2000-08-22 2001-08-22 Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors and fabricating such devices

Country Status (10)

Country Link
US (10) US20020130311A1 (en)
EP (3) EP1314189B1 (en)
JP (1) JP5013650B2 (en)
KR (4) KR100791732B1 (en)
CN (3) CN100565783C (en)
AU (2) AU2001286649B2 (en)
CA (1) CA2417992C (en)
MX (1) MXPA03001605A (en)
TW (2) TWI294636B (en)
WO (1) WO2002017362A2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8871623B2 (en) 2004-06-08 2014-10-28 Sandisk Corporation Methods and devices for forming nanostructure monolayers and devices including such monolayers
US8981452B2 (en) 2004-06-08 2015-03-17 Sandisk Corporation Methods and devices for forming nanostructure monolayers and devices including such monolayers
US9149836B2 (en) 2004-06-08 2015-10-06 Sandisk Corporation Compositions and methods for modulation of nanostructure energy levels

Families Citing this family (511)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2773261B1 (en) 1997-12-30 2000-01-28 Commissariat Energie Atomique METHOD FOR THE TRANSFER OF A THIN FILM COMPRISING A STEP OF CREATING INCLUSIONS
AU782000B2 (en) 1999-07-02 2005-06-23 President And Fellows Of Harvard College Nanoscopic wire-based devices, arrays, and methods of their manufacture
US7015546B2 (en) * 2000-02-23 2006-03-21 Semiconductor Research Corporation Deterministically doped field-effect devices and methods of making same
US6919119B2 (en) * 2000-05-30 2005-07-19 The Penn State Research Foundation Electronic and opto-electronic devices fabricated from nanostructured high surface to volume ratio thin films
KR100360476B1 (en) * 2000-06-27 2002-11-08 삼성전자 주식회사 Vertical nano-size transistor using carbon nanotubes and manufacturing method thereof
US7301199B2 (en) * 2000-08-22 2007-11-27 President And Fellows Of Harvard College Nanoscale wires and related devices
EP1314189B1 (en) * 2000-08-22 2013-02-27 President and Fellows of Harvard College Electrical device comprising doped semiconductor nanowires and method for its production
US20060175601A1 (en) * 2000-08-22 2006-08-10 President And Fellows Of Harvard College Nanoscale wires and related devices
WO2002019352A1 (en) * 2000-08-30 2002-03-07 Japan Science And Technology Corporation Magnetic semiconductor material and method for preparation thereof
AU2904602A (en) 2000-12-11 2002-06-24 Harvard College Nanosensors
MXPA03008935A (en) 2001-03-30 2004-06-30 Univ California Methods of fabricating nanostructures and nanowires and devices fabricated therefrom.
AU2008200507B2 (en) * 2001-03-30 2010-04-22 The Regents Of The University Of California Methods of fabricating nanostructures and nanowires and devices fabricated therefrom
CA2447728A1 (en) 2001-05-18 2003-01-16 President And Fellows Of Harvard College Nanoscale wires and related devices
US6706402B2 (en) 2001-07-25 2004-03-16 Nantero, Inc. Nanotube films and articles
US6924538B2 (en) * 2001-07-25 2005-08-02 Nantero, Inc. Devices having vertically-disposed nanofabric articles and methods of making the same
US7259410B2 (en) * 2001-07-25 2007-08-21 Nantero, Inc. Devices having horizontally-disposed nanofabric articles and methods of making the same
US6835591B2 (en) * 2001-07-25 2004-12-28 Nantero, Inc. Methods of nanotube films and articles
WO2003010143A1 (en) * 2001-07-26 2003-02-06 Samsung Electronics Co., Ltd. Dialkylhydroxybenzoic acid derivatives containing metal chelating groups and their therapeutic uses
US7385262B2 (en) * 2001-11-27 2008-06-10 The Board Of Trustees Of The Leland Stanford Junior University Band-structure modulation of nano-structures in an electric field
US6882767B2 (en) * 2001-12-27 2005-04-19 The Regents Of The University Of California Nanowire optoelectric switching device and method
US7279718B2 (en) * 2002-01-28 2007-10-09 Philips Lumileds Lighting Company, Llc LED including photonic crystal structure
EP1341183B1 (en) * 2002-02-25 2008-12-03 STMicroelectronics S.r.l. Optically readable molecular memory obtained using carbon nanotubes, and method for storing information in said molecular memory
WO2003083902A2 (en) * 2002-03-22 2003-10-09 Penn State Research Foundation Thermal production of nanowires
US6872645B2 (en) * 2002-04-02 2005-03-29 Nanosys, Inc. Methods of positioning and/or orienting nanostructures
US20040026684A1 (en) * 2002-04-02 2004-02-12 Nanosys, Inc. Nanowire heterostructures for encoding information
US7335395B2 (en) * 2002-04-23 2008-02-26 Nantero, Inc. Methods of using pre-formed nanotubes to make carbon nanotube films, layers, fabrics, ribbons, elements and articles
US20040067530A1 (en) * 2002-05-08 2004-04-08 The Regents Of The University Of California Electronic sensing of biomolecular processes
US8377683B2 (en) 2002-06-06 2013-02-19 Rutgers, The State University Of New Jersey Zinc oxide-based nanostructure modified QCM for dynamic monitoring of cell adhesion and proliferation
WO2003104789A1 (en) * 2002-06-06 2003-12-18 Rutgers, The State University Of New Jersey MULTIFUNCTIONAL BIOSENSOR BASED ON ZnO NANOSTRUCTURES
EP1376606B1 (en) * 2002-06-20 2008-12-03 STMicroelectronics S.r.l. A molecular memory obtained using DNA strand molecular switches and carbon nanotubes, and manufacturing method thereof
US7335908B2 (en) 2002-07-08 2008-02-26 Qunano Ab Nanostructures and methods for manufacturing the same
AU2003261205A1 (en) * 2002-07-19 2004-02-09 President And Fellows Of Harvard College Nanoscale coherent optical components
WO2004027822A2 (en) 2002-09-05 2004-04-01 Nanosys, Inc. Oriented nanostructures and methods of preparing
US7572393B2 (en) 2002-09-05 2009-08-11 Nanosys Inc. Organic species that facilitate charge transfer to or from nanostructures
US20050126628A1 (en) * 2002-09-05 2005-06-16 Nanosys, Inc. Nanostructure and nanocomposite based compositions and photovoltaic devices
EP2399970A3 (en) 2002-09-05 2012-04-18 Nanosys, Inc. Nanocomposites
WO2004022714A2 (en) 2002-09-05 2004-03-18 Nanosys, Inc. Organic species that facilitate charge transfer to or from nanostructures
WO2004023527A2 (en) * 2002-09-05 2004-03-18 Nanosys, Inc. Nanostructure and nanocomposite based compositions and photovoltaic devices
WO2004027336A1 (en) * 2002-09-17 2004-04-01 Midwest Research Institute Carbon nanotube heat-exchange systems
US7619562B2 (en) * 2002-09-30 2009-11-17 Nanosys, Inc. Phased array systems
US7067867B2 (en) * 2002-09-30 2006-06-27 Nanosys, Inc. Large-area nonenabled macroelectronic substrates and uses therefor
US7135728B2 (en) 2002-09-30 2006-11-14 Nanosys, Inc. Large-area nanoenabled macroelectronic substrates and uses therefor
US7051945B2 (en) 2002-09-30 2006-05-30 Nanosys, Inc Applications of nano-enabled large area macroelectronic substrates incorporating nanowires and nanowire composites
EP1563555A4 (en) * 2002-09-30 2009-08-26 Nanosys Inc Applications of nano-enabled large area macroelectronic substrates incorporating nanowires and nanowire composites
CA2499965C (en) 2002-09-30 2013-03-19 Nanosys, Inc. Large-area nanoenabled macroelectronic substrates and uses therefor
CA2499944A1 (en) * 2002-09-30 2004-04-15 Nanosys, Inc. Integrated displays using nanowire transistors
US6841235B2 (en) * 2002-10-11 2005-01-11 General Motors Corporation Metallic nanowire and method of making the same
DE10250829B4 (en) * 2002-10-31 2006-11-02 Infineon Technologies Ag Nonvolatile memory cell, memory cell array, and method of making a nonvolatile memory cell
KR101089123B1 (en) * 2002-11-05 2011-12-05 코닌클리케 필립스 일렉트로닉스 엔.브이. Nanostructure of an inorganic semiconductor material, electronic device, method of preparing nanostructures of a compound semiconductor material, and method of manufacturing an electronic device
KR100790859B1 (en) * 2002-11-15 2008-01-03 삼성전자주식회사 Nonvolatile memory device utilizing vertical nanotube
US7898005B2 (en) * 2002-12-09 2011-03-01 The Regents Of The University Of California Inorganic nanotubes and electro-fluidic devices fabricated therefrom
US7211143B2 (en) * 2002-12-09 2007-05-01 The Regents Of The University Of California Sacrificial template method of fabricating a nanotube
US7355216B2 (en) * 2002-12-09 2008-04-08 The Regents Of The University Of California Fluidic nanotubes and devices
JP4428921B2 (en) * 2002-12-13 2010-03-10 キヤノン株式会社 Nanostructure, electronic device, and manufacturing method thereof
JP4434575B2 (en) * 2002-12-13 2010-03-17 キヤノン株式会社 Thermoelectric conversion element and manufacturing method thereof
US20040200734A1 (en) * 2002-12-19 2004-10-14 Co Man Sung Nanotube-based sensors for biomolecules
KR20040059300A (en) * 2002-12-28 2004-07-05 학교법인 포항공과대학교 Nanostructure comprising magnetic material and nanomaterial and method for manufacturing thereof
US7535019B1 (en) 2003-02-18 2009-05-19 Nanosolar, Inc. Optoelectronic fiber
US6944054B2 (en) * 2003-03-28 2005-09-13 Nantero, Inc. NRAM bit selectable two-device nanotube array
US7294877B2 (en) * 2003-03-28 2007-11-13 Nantero, Inc. Nanotube-on-gate FET structures and applications
US7113426B2 (en) * 2003-03-28 2006-09-26 Nantero, Inc. Non-volatile RAM cell and array using nanotube switch position for information state
US7075141B2 (en) * 2003-03-28 2006-07-11 Nantero, Inc. Four terminal non-volatile transistor device
EP1634334A1 (en) 2003-04-04 2006-03-15 Startskottet 22286 AB Nanowhiskers with pn junctions and methods of fabricating thereof
WO2004087564A1 (en) * 2003-04-04 2004-10-14 Startskottet 22286 Ab Precisely positioned nanowhiskers and nanowhisker arrays and method for preparing them
US7579077B2 (en) * 2003-05-05 2009-08-25 Nanosys, Inc. Nanofiber surfaces for use in enhanced surface area applications
US20050221072A1 (en) * 2003-04-17 2005-10-06 Nanosys, Inc. Medical device applications of nanostructured surfaces
US20060122596A1 (en) * 2003-04-17 2006-06-08 Nanosys, Inc. Structures, systems and methods for joining articles and materials and uses therefor
US7056409B2 (en) 2003-04-17 2006-06-06 Nanosys, Inc. Structures, systems and methods for joining articles and materials and uses therefor
US7074294B2 (en) 2003-04-17 2006-07-11 Nanosys, Inc. Structures, systems and methods for joining articles and materials and uses therefor
US7972616B2 (en) * 2003-04-17 2011-07-05 Nanosys, Inc. Medical device applications of nanostructured surfaces
US20050038498A1 (en) * 2003-04-17 2005-02-17 Nanosys, Inc. Medical device applications of nanostructured surfaces
US7045421B2 (en) * 2003-04-22 2006-05-16 Nantero, Inc. Process for making bit selectable devices having elements made with nanotubes
US6995046B2 (en) 2003-04-22 2006-02-07 Nantero, Inc. Process for making byte erasable devices having elements made with nanotubes
CA2522866A1 (en) * 2003-04-28 2005-01-20 Nanosys, Inc. Super-hydrophobic surfaces, methods of their construction and uses therefor
TWI427709B (en) * 2003-05-05 2014-02-21 Nanosys Inc Nanofiber surfaces for use in enhanced surface area applications
US7803574B2 (en) 2003-05-05 2010-09-28 Nanosys, Inc. Medical device applications of nanostructured surfaces
US7780918B2 (en) 2003-05-14 2010-08-24 Nantero, Inc. Sensor platform using a horizontally oriented nanotube element
US7910064B2 (en) 2003-06-03 2011-03-22 Nanosys, Inc. Nanowire-based sensor configurations
JP2007500606A (en) * 2003-07-28 2007-01-18 ザ リージェンツ オブ ザ ユニヴァーシティー オブ カリフォルニア Langmuir-Blodgett nanostructure monolayer
CN1863954B (en) * 2003-08-04 2013-07-31 纳米系统公司 System and process for producing nanowire composites and electronic substrates therefrom
WO2005048296A2 (en) * 2003-08-13 2005-05-26 Nantero, Inc. Nanotube-based switching elements with multiple controls and circuits made from same
WO2005017967A2 (en) * 2003-08-13 2005-02-24 Nantero, Inc. Nanotube device structure and methods of fabrication
US7235421B2 (en) * 2003-09-16 2007-06-26 Nasreen Chopra System and method for developing production nano-material
US20050214197A1 (en) * 2003-09-17 2005-09-29 Molecular Nanosystems, Inc. Methods for producing and using catalytic substrates for carbon nanotube growth
US7235159B2 (en) * 2003-09-17 2007-06-26 Molecular Nanosystems, Inc. Methods for producing and using catalytic substrates for carbon nanotube growth
WO2005029591A1 (en) * 2003-09-23 2005-03-31 The Furukawa Electric Co., Ltd. Linear semiconductor substrate, device using the linear semiconductor substrate, device array, and module
US7067328B2 (en) 2003-09-25 2006-06-27 Nanosys, Inc. Methods, devices and compositions for depositing and orienting nanostructures
DE10345157B4 (en) * 2003-09-29 2009-01-08 Qimonda Ag Thermally conductive packaging of electronic circuit units
US7012279B2 (en) * 2003-10-21 2006-03-14 Lumileds Lighting U.S., Llc Photonic crystal light emitting device
FR2861497B1 (en) * 2003-10-28 2006-02-10 Soitec Silicon On Insulator METHOD FOR CATASTROPHIC TRANSFER OF A FINE LAYER AFTER CO-IMPLANTATION
KR20050055456A (en) * 2003-12-08 2005-06-13 학교법인 포항공과대학교 Biosensor using zinc oxide nanorod and preparation thereof
JP2007520409A (en) * 2003-12-12 2007-07-26 イエール ユニバーシティ Controlled growth of nitrided nanostructures
US7421173B2 (en) * 2003-12-16 2008-09-02 President And Fellows Of Harvard College Subwavelength-diameter silica wires for low-loss optical waveguiding
US7208094B2 (en) * 2003-12-17 2007-04-24 Hewlett-Packard Development Company, L.P. Methods of bridging lateral nanowires and device using same
US7112525B1 (en) * 2003-12-22 2006-09-26 University Of South Florida Method for the assembly of nanowire interconnects
EP1700329A2 (en) * 2003-12-22 2006-09-13 Koninklijke Philips Electronics N.V. Fabricating a set of semiconducting nanowires, and electric device comprising a set of nanowires
JP2007516620A (en) * 2003-12-23 2007-06-21 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Semiconductor device having PN heterojunction
US7018549B2 (en) * 2003-12-29 2006-03-28 Intel Corporation Method of fabricating multiple nanowires of uniform length from a single catalytic nanoparticle
WO2005110057A2 (en) * 2004-01-06 2005-11-24 The Regents Of The University Of California Crystallographic alignment of high-density nanowire arrays
WO2005067547A2 (en) * 2004-01-14 2005-07-28 The Regents Of The University Of California Diluted magnetic semiconductor nanowires exhibiting magnetoresistance
EP1733077B1 (en) * 2004-01-15 2018-04-18 Samsung Electronics Co., Ltd. Nanocrystal doped matrixes
US7645397B2 (en) 2004-01-15 2010-01-12 Nanosys, Inc. Nanocrystal doped matrixes
US20110039690A1 (en) * 2004-02-02 2011-02-17 Nanosys, Inc. Porous substrates, articles, systems and compositions comprising nanofibers and methods of their use and production
US7553371B2 (en) * 2004-02-02 2009-06-30 Nanosys, Inc. Porous substrates, articles, systems and compositions comprising nanofibers and methods of their use and production
US8025960B2 (en) * 2004-02-02 2011-09-27 Nanosys, Inc. Porous substrates, articles, systems and compositions comprising nanofibers and methods of their use and production
US7354850B2 (en) 2004-02-06 2008-04-08 Qunano Ab Directionally controlled growth of nanowhiskers
TW200537143A (en) * 2004-02-11 2005-11-16 Koninkl Philips Electronics Nv Integrated optical wave guide for light generated by a bipolar transistor
US20090227107A9 (en) * 2004-02-13 2009-09-10 President And Fellows Of Havard College Nanostructures Containing Metal Semiconductor Compounds
US7381579B2 (en) * 2004-02-26 2008-06-03 Samsung Sdi Co., Ltd. Donor sheet, method of manufacturing the same, method of manufacturing TFT using the donor sheet, and method of manufacturing flat panel display device using the donor sheet
KR100625999B1 (en) 2004-02-26 2006-09-20 삼성에스디아이 주식회사 Donor sheet, manufacturing method of the donor sheet, manufacturing method of TFT using the donor sheet, and manufacturing method of flat panel display using the donor sheet
US7253431B2 (en) * 2004-03-02 2007-08-07 International Business Machines Corporation Method and apparatus for solution processed doping of carbon nanotube
EP1723676A4 (en) 2004-03-10 2009-04-15 Nanosys Inc Nano-enabled memory devices and anisotropic charge carrying arrays
US7595528B2 (en) 2004-03-10 2009-09-29 Nanosys, Inc. Nano-enabled memory devices and anisotropic charge carrying arrays
KR100534204B1 (en) * 2004-03-17 2005-12-07 한국과학기술연구원 Nanowire assisted laser desorption/ionization mass spectrometric analysis
WO2005094440A2 (en) 2004-03-18 2005-10-13 Nanosys Inc. Nanofiber surface based capacitors
US20050205883A1 (en) * 2004-03-19 2005-09-22 Wierer Jonathan J Jr Photonic crystal light emitting device
FR2868201B1 (en) * 2004-03-23 2007-06-29 Ecole Polytechnique Dgar METHOD FOR MANUFACTURING ELECTRONIC COMPONENTS AND ELECTRONIC COMPONENTS OBTAINED THEREBY
US20050212531A1 (en) * 2004-03-23 2005-09-29 Hewlett-Packard Development Company, L.P. Intellectual Property Administration Fluid sensor and methods
US7115971B2 (en) 2004-03-23 2006-10-03 Nanosys, Inc. Nanowire varactor diode and methods of making same
US7305869B1 (en) * 2004-04-12 2007-12-11 U. S. Department Of Energy Spin microscope based on optically detected magnetic resonance
CA2564220A1 (en) 2004-04-30 2005-12-15 Nanosys, Inc. Systems and methods for nanowire growth and harvesting
US20050279274A1 (en) 2004-04-30 2005-12-22 Chunming Niu Systems and methods for nanowire growth and manufacturing
US7785922B2 (en) 2004-04-30 2010-08-31 Nanosys, Inc. Methods for oriented growth of nanowires on patterned substrates
TWI380342B (en) * 2004-06-01 2012-12-21 Nikon Corp Method for fabricating an electronic device and electronic device
KR101746412B1 (en) 2004-06-04 2017-06-14 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 Methods and devices for fabricating and assembling printable semiconductor elements
CA2567930A1 (en) 2004-06-08 2005-12-22 Nanosys, Inc. Methods and devices for forming nanostructure monolayers and devices including such monolayers
US8088483B1 (en) 2004-06-08 2012-01-03 Nanosys, Inc. Process for group 10 metal nanostructure synthesis and compositions made using same
TW201341440A (en) 2004-06-08 2013-10-16 Sandisk Corp Post-deposition encapsulation of nanostructures: compositions, devices and systems incorporating same
WO2006107312A1 (en) * 2004-06-15 2006-10-12 President And Fellows Of Harvard College Nanosensors
US7164744B2 (en) 2004-06-18 2007-01-16 Nantero, Inc. Nanotube-based logic driver circuits
US7288970B2 (en) * 2004-06-18 2007-10-30 Nantero, Inc. Integrated nanotube and field effect switching device
US7161403B2 (en) 2004-06-18 2007-01-09 Nantero, Inc. Storage elements using nanotube switching elements
WO2006000790A1 (en) 2004-06-25 2006-01-05 Btg International Limited Formation of nanowhiskers on a substrate of dissimilar material
WO2006001332A1 (en) * 2004-06-25 2006-01-05 Japan Science And Technology Agency Method of spin recording and apparatus
WO2006016914A2 (en) * 2004-07-07 2006-02-16 Nanosys, Inc. Methods for nanowire growth
CN100505298C (en) * 2004-07-20 2009-06-24 Nxp股份有限公司 Semiconductor device and method of manufacturing the same
US7442964B2 (en) * 2004-08-04 2008-10-28 Philips Lumileds Lighting Company, Llc Photonic crystal light emitting device with multiple lattices
US8309843B2 (en) * 2004-08-19 2012-11-13 Banpil Photonics, Inc. Photovoltaic cells based on nanoscale structures
US7365395B2 (en) 2004-09-16 2008-04-29 Nanosys, Inc. Artificial dielectrics using nanostructures
TWI399864B (en) 2004-09-16 2013-06-21 Nantero Inc Light emitters using nanotubes and methods of making same
US8558311B2 (en) 2004-09-16 2013-10-15 Nanosys, Inc. Dielectrics using substantially longitudinally oriented insulated conductive wires
US20060084128A1 (en) * 2004-09-22 2006-04-20 Hongye Sun Enzyme assay with nanowire sensor
CN100490180C (en) 2004-10-04 2009-05-20 松下电器产业株式会社 Vertical field effect transistor and method for fabricating the same
WO2006124055A2 (en) * 2004-10-12 2006-11-23 Nanosys, Inc. Fully integrated organic layered processes for making plastic electronics based on conductive polymers and semiconductor nanowires
US7473943B2 (en) * 2004-10-15 2009-01-06 Nanosys, Inc. Gate configuration for nanowire electronic devices
US7400665B2 (en) * 2004-11-05 2008-07-15 Hewlett-Packard Developement Company, L.P. Nano-VCSEL device and fabrication thereof using nano-colonnades
US7307271B2 (en) * 2004-11-05 2007-12-11 Hewlett-Packard Development Company, L.P. Nanowire interconnection and nano-scale device applications
US20080009002A1 (en) * 2004-11-09 2008-01-10 The Regents Of The University Of California Analyte Identification Using Electronic Devices
WO2006073562A2 (en) * 2004-11-17 2006-07-13 Nanosys, Inc. Photoactive devices and components with enhanced efficiency
US7582534B2 (en) * 2004-11-18 2009-09-01 International Business Machines Corporation Chemical doping of nano-components
US7405129B2 (en) * 2004-11-18 2008-07-29 International Business Machines Corporation Device comprising doped nano-component and method of forming the device
AU2005309906B2 (en) * 2004-11-24 2010-12-09 Nanosys, Inc. Contact doping and annealing systems and processes for nanowire thin films
US7560366B1 (en) 2004-12-02 2009-07-14 Nanosys, Inc. Nanowire horizontal growth and substrate removal
KR20070101857A (en) 2004-12-06 2007-10-17 더 프레지던트 앤드 펠로우즈 오브 하바드 칼리지 Nanoscale wire-based data storage
WO2006062947A2 (en) * 2004-12-09 2006-06-15 Nanosys, Inc. Nanowire-based membrane electrode assemblies for fuel cells
US8278011B2 (en) 2004-12-09 2012-10-02 Nanosys, Inc. Nanostructured catalyst supports
US7939218B2 (en) * 2004-12-09 2011-05-10 Nanosys, Inc. Nanowire structures comprising carbon
US7842432B2 (en) 2004-12-09 2010-11-30 Nanosys, Inc. Nanowire structures comprising carbon
CN100376906C (en) * 2004-12-11 2008-03-26 鸿富锦精密工业(深圳)有限公司 Colour optical filter
CN100487879C (en) 2004-12-28 2009-05-13 松下电器产业株式会社 Semiconductor nano-wire, making method thereof and semiconductor device provided with that nano-wire
WO2007084114A2 (en) * 2005-01-12 2007-07-26 New York University System and method for processing nanowires with holographic optical tweezers
US7122461B2 (en) * 2005-02-10 2006-10-17 Intel Corporation Method to assemble structures from nano-materials
KR101181097B1 (en) 2005-02-10 2012-09-07 파나소닉 주식회사 Structure for holding fine structure, semiconductor device, tft driving circuit, panel, display, sensor and their manufacturing methods
KR100661696B1 (en) * 2005-02-22 2006-12-26 삼성전자주식회사 Semiconductor Nanowire of Heterostructure and Method for Producing the same
KR100624461B1 (en) * 2005-02-25 2006-09-19 삼성전자주식회사 Nano wire and manfacturing methof for the same
EP1696473A3 (en) * 2005-02-25 2009-06-10 Samsung Electronics Co.,Ltd. Silicon nano wires, semiconductor device including the same, and method of manufacturing the silicon nano wires
US7504014B2 (en) * 2005-03-15 2009-03-17 Fujitsu Limited High density interconnections with nanowiring
US20060207647A1 (en) * 2005-03-16 2006-09-21 General Electric Company High efficiency inorganic nanorod-enhanced photovoltaic devices
KR101100887B1 (en) 2005-03-17 2012-01-02 삼성전자주식회사 Thin film transistor, thin film transistor array panel, and manufacturing method thereof
US20070238186A1 (en) 2005-03-29 2007-10-11 Hongye Sun Nanowire-based system for analysis of nucleic acids
JP2008538728A (en) * 2005-04-13 2008-11-06 ナノシス・インク. Nanowire dispersion composition and use thereof
US20060240218A1 (en) * 2005-04-26 2006-10-26 Nanosys, Inc. Paintable nonofiber coatings
US7479654B2 (en) 2005-05-09 2009-01-20 Nantero, Inc. Memory arrays using nanotube articles with reprogrammable resistance
US20070044295A1 (en) * 2005-05-12 2007-03-01 Nanosys, Inc. Use of nanoparticles in film formation and as solder
US7510951B2 (en) * 2005-05-12 2009-03-31 Lg Chem, Ltd. Method for forming high-resolution pattern with direct writing means
KR100833017B1 (en) * 2005-05-12 2008-05-27 주식회사 엘지화학 Method for preparing a high resolution pattern with direct writing means
US20100227382A1 (en) * 2005-05-25 2010-09-09 President And Fellows Of Harvard College Nanoscale sensors
CA2609042A1 (en) * 2005-06-02 2006-12-07 Nanosys, Inc. Light emitting nanowires for macroelectronics
WO2006129367A1 (en) * 2005-06-02 2006-12-07 Misuzu R & D Ltd. Nonvolatile memory
WO2006132659A2 (en) 2005-06-06 2006-12-14 President And Fellows Of Harvard College Nanowire heterostructures
US7685530B2 (en) * 2005-06-10 2010-03-23 T-Mobile Usa, Inc. Preferred contact group centric interface
US8370770B2 (en) 2005-06-10 2013-02-05 T-Mobile Usa, Inc. Variable path management of user contacts
US8359548B2 (en) 2005-06-10 2013-01-22 T-Mobile Usa, Inc. Managing subset of user contacts
US8370769B2 (en) 2005-06-10 2013-02-05 T-Mobile Usa, Inc. Variable path management of user contacts
US8163575B2 (en) * 2005-06-17 2012-04-24 Philips Lumileds Lighting Company Llc Grown photonic crystals in semiconductor light emitting devices
US20090050204A1 (en) * 2007-08-03 2009-02-26 Illuminex Corporation. Photovoltaic device using nanostructured material
US20100193768A1 (en) * 2005-06-20 2010-08-05 Illuminex Corporation Semiconducting nanowire arrays for photovoltaic applications
US7394016B2 (en) * 2005-10-11 2008-07-01 Solyndra, Inc. Bifacial elongated solar cell devices with internal reflectors
US7196262B2 (en) * 2005-06-20 2007-03-27 Solyndra, Inc. Bifacial elongated solar cell devices
US8344238B2 (en) * 2005-07-19 2013-01-01 Solyndra Llc Self-cleaning protective coatings for use with photovoltaic cells
EP1938391A4 (en) 2005-08-22 2016-06-29 Q1 Nanosystems Inc Nanostructure and photovoltaic cell implementing same
KR101386268B1 (en) 2005-08-26 2014-04-17 스몰텍 에이비 Interconnects and heat dissipators based on nanostructures
JP2009513368A (en) 2005-09-23 2009-04-02 ナノシス・インコーポレイテッド Method for doping nanostructures
KR20070040129A (en) * 2005-10-11 2007-04-16 삼성에스디아이 주식회사 Carbon naanotubes structure and vertical alignement method of the carbon nanotubes
US20070110639A1 (en) * 2005-10-14 2007-05-17 Pennsylvania State University System and method for positioning and synthesizing of nanostructures
KR100845704B1 (en) * 2005-10-19 2008-07-11 주식회사 엘지화학 Method for manufacturing nanowires and substrate on which nanowires are grown
US8314327B2 (en) * 2005-11-06 2012-11-20 Banpil Photonics, Inc. Photovoltaic cells based on nano or micro-scale structures
KR101390619B1 (en) 2005-11-21 2014-04-30 나노시스, 인크. Nanowire structures comprising carbon
WO2007062268A2 (en) * 2005-11-28 2007-05-31 University Of Florida Research Foundation, Inc. Method and structure for magnetically-directed, self-assembly of three-dimensional structures
US8816191B2 (en) * 2005-11-29 2014-08-26 Banpil Photonics, Inc. High efficiency photovoltaic cells and manufacturing thereof
US7394094B2 (en) * 2005-12-29 2008-07-01 Massachusetts Institute Of Technology Semiconductor nanocrystal heterostructures
CN101331590B (en) * 2005-12-29 2011-04-20 纳米系统公司 Methods for oriented growth of nanowires on patterned substrates
US7741197B1 (en) 2005-12-29 2010-06-22 Nanosys, Inc. Systems and methods for harvesting and reducing contamination in nanowires
TWI342866B (en) * 2005-12-30 2011-06-01 Ind Tech Res Inst Nanowires and a method of the same
US7259322B2 (en) * 2006-01-09 2007-08-21 Solyndra, Inc. Interconnects for solar cell devices
US8791359B2 (en) * 2006-01-28 2014-07-29 Banpil Photonics, Inc. High efficiency photovoltaic cells
US7893513B2 (en) 2006-02-02 2011-02-22 William Marsh Rice University Nanoparticle/nanotube-based nanoelectronic devices and chemically-directed assembly thereof
US20070186629A1 (en) * 2006-02-10 2007-08-16 Ying-Lan Chang Functionalizable nanowire-based AFM probe
US7826336B2 (en) * 2006-02-23 2010-11-02 Qunano Ab Data storage nanostructures
US20090299213A1 (en) * 2006-03-15 2009-12-03 President And Fellows Of Harvard College Nanobioelectronics
US20090014055A1 (en) * 2006-03-18 2009-01-15 Solyndra, Inc. Photovoltaic Modules Having a Filling Material
US20070215197A1 (en) * 2006-03-18 2007-09-20 Benyamin Buller Elongated photovoltaic cells in casings
US8183458B2 (en) 2007-03-13 2012-05-22 Solyndra Llc Photovoltaic apparatus having a filler layer and method for making the same
US20070215195A1 (en) * 2006-03-18 2007-09-20 Benyamin Buller Elongated photovoltaic cells in tubular casings
US20080302418A1 (en) * 2006-03-18 2008-12-11 Benyamin Buller Elongated Photovoltaic Devices in Casings
JP4970997B2 (en) 2006-03-30 2012-07-11 パナソニック株式会社 Manufacturing method of nanowire transistor
US8017860B2 (en) 2006-05-15 2011-09-13 Stion Corporation Method and structure for thin film photovoltaic materials using bulk semiconductor materials
US9105776B2 (en) * 2006-05-15 2015-08-11 Stion Corporation Method and structure for thin film photovoltaic materials using semiconductor materials
US8255281B2 (en) * 2006-06-07 2012-08-28 T-Mobile Usa, Inc. Service management system that enables subscriber-driven changes to service plans
US7714386B2 (en) * 2006-06-09 2010-05-11 Northrop Grumman Systems Corporation Carbon nanotube field effect transistor
JP2009540333A (en) 2006-06-12 2009-11-19 プレジデント アンド フェロウズ オブ ハーバード カレッジ Nanosensors and related technologies
FR2904304B1 (en) 2006-07-27 2008-10-17 Commissariat Energie Atomique METHOD FOR MANUFACTURING NANOSTRUCTURE ON A PRE-GRAVE SUBSTRATE
US7998788B2 (en) * 2006-07-27 2011-08-16 International Business Machines Corporation Techniques for use of nanotechnology in photovoltaics
US7888753B2 (en) * 2006-07-31 2011-02-15 International Business Machines Corporation Ultra-sensitive detection techniques
US7879685B2 (en) * 2006-08-04 2011-02-01 Solyndra, Inc. System and method for creating electric isolation between layers comprising solar cells
US20080029152A1 (en) * 2006-08-04 2008-02-07 Erel Milshtein Laser scribing apparatus, systems, and methods
US20080292835A1 (en) * 2006-08-30 2008-11-27 Lawrence Pan Methods for forming freestanding nanotube objects and objects so formed
US8323789B2 (en) 2006-08-31 2012-12-04 Cambridge Enterprise Limited Nanomaterial polymer compositions and uses thereof
WO2008033303A2 (en) 2006-09-11 2008-03-20 President And Fellows Of Harvard College Branched nanoscale wires
US7834424B2 (en) * 2006-09-12 2010-11-16 The Board Of Trustees Of The Leland Stanford Junior University Extendable connector and network
EP2074641B1 (en) * 2006-10-04 2012-02-01 Nxp B.V. Mim capacitor and method of manufacturing a mim capacitor
US8044379B2 (en) * 2006-10-05 2011-10-25 Hitachi Chemical Co., Ltd. Well-aligned, high aspect-ratio, high-density silicon nanowires and methods of making the same
WO2008045433A1 (en) 2006-10-10 2008-04-17 Massachusetts Institute Of Technology Absorbant superhydrophobic materials, and methods of preparation and use thereof
US7388200B2 (en) * 2006-10-19 2008-06-17 Hewlett-Packard Development Company, L.P. Sensing method and nanosensing device for performing the same
US8624108B1 (en) * 2006-11-01 2014-01-07 Banpil Photonics, Inc. Photovoltaic cells based on nano or micro-scale structures
US7776760B2 (en) 2006-11-07 2010-08-17 Nanosys, Inc. Systems and methods for nanowire growth
WO2008127410A2 (en) 2006-11-07 2008-10-23 New York University Holographic microfabrication and characterization system for soft matter and biological systems
JP5009993B2 (en) 2006-11-09 2012-08-29 ナノシス・インク. Nanowire arrangement method and deposition method
US20080110486A1 (en) * 2006-11-15 2008-05-15 General Electric Company Amorphous-crystalline tandem nanostructured solar cells
WO2008127314A1 (en) 2006-11-22 2008-10-23 President And Fellows Of Harvard College High-sensitivity nanoscale wire sensors
KR100829579B1 (en) * 2006-11-27 2008-05-14 삼성전자주식회사 Field effect transistor using a nano tube and method for manufacturing the transistor
US7786024B2 (en) 2006-11-29 2010-08-31 Nanosys, Inc. Selective processing of semiconductor nanowires by polarized visible radiation
US8258047B2 (en) 2006-12-04 2012-09-04 General Electric Company Nanostructures, methods of depositing nanostructures and devices incorporating the same
US20080150003A1 (en) * 2006-12-20 2008-06-26 Jian Chen Electron blocking layers for electronic devices
US20080150009A1 (en) * 2006-12-20 2008-06-26 Nanosys, Inc. Electron Blocking Layers for Electronic Devices
US8686490B2 (en) * 2006-12-20 2014-04-01 Sandisk Corporation Electron blocking layers for electronic devices
US7847341B2 (en) 2006-12-20 2010-12-07 Nanosys, Inc. Electron blocking layers for electronic devices
US20080150004A1 (en) * 2006-12-20 2008-06-26 Nanosys, Inc. Electron Blocking Layers for Electronic Devices
EP2091862B1 (en) * 2006-12-22 2019-12-11 QuNano AB Elevated led and method of producing such
US8049203B2 (en) * 2006-12-22 2011-11-01 Qunano Ab Nanoelectronic structure and method of producing such
US8183587B2 (en) 2006-12-22 2012-05-22 Qunano Ab LED with upstanding nanowire structure and method of producing such
KR20090096704A (en) * 2006-12-22 2009-09-14 큐나노 에이비 Led with upstanding nanowire structure and method of producing such
US20080178927A1 (en) * 2007-01-30 2008-07-31 Thomas Brezoczky Photovoltaic apparatus having an elongated photovoltaic device using an involute-based concentrator
US7851784B2 (en) * 2007-02-13 2010-12-14 Nano-Electronic And Photonic Devices And Circuits, Llc Nanotube array electronic devices
US20080196759A1 (en) * 2007-02-16 2008-08-21 Thomas Brezoczky Photovoltaic assembly with elongated photovoltaic devices and integrated involute-based reflectors
US8440997B2 (en) * 2007-02-27 2013-05-14 The Regents Of The University Of California Nanowire photodetector and image sensor with internal gain
US7728333B2 (en) * 2007-03-09 2010-06-01 Nano-Electronic And Photonic Devices And Circuits, Llc Nanotube array ballistic light emitting devices
KR101345440B1 (en) * 2007-03-15 2013-12-27 삼성전자주식회사 Method for Mass Producing Nanostructure Using Mesoporous Template and Nanostructure Made Thereof
US8212235B2 (en) 2007-04-25 2012-07-03 Hewlett-Packard Development Company, L.P. Nanowire-based opto-electronic device
KR101365411B1 (en) 2007-04-25 2014-02-20 엘지디스플레이 주식회사 Fabricating Method of Thin Film Transistor, and Manufacturing Method of Liquid Crystal Display Device
US7880318B1 (en) 2007-04-27 2011-02-01 Hewlett-Packard Development Company, L.P. Sensing system and method of making the same
US7892610B2 (en) 2007-05-07 2011-02-22 Nanosys, Inc. Method and system for printing aligned nanowires and other electrical devices
EP2156471A2 (en) * 2007-05-07 2010-02-24 Nxp B.V. A photosensitive device and a method of manufacturing a photosensitive device
KR101356694B1 (en) * 2007-05-10 2014-01-29 삼성전자주식회사 Light emitting diode using Si-nanowire and method of fabricating the same
KR20080100057A (en) * 2007-05-11 2008-11-14 주성엔지니어링(주) Manufacturing method of crystalline silicon solar cell and manufacturing apparatus and system for the same
US7939346B2 (en) * 2007-05-25 2011-05-10 Wisconsin Alumni Research Foundation Nanomembranes for remote sensing
FR2916902B1 (en) * 2007-05-31 2009-07-17 Commissariat Energie Atomique FIELD EFFECT TRANSISTOR WITH CARBON NANOTUBES
US7663202B2 (en) * 2007-06-26 2010-02-16 Hewlett-Packard Development Company, L.P. Nanowire photodiodes and methods of making nanowire photodiodes
US8071179B2 (en) 2007-06-29 2011-12-06 Stion Corporation Methods for infusing one or more materials into nano-voids if nanoporous or nanostructured materials
DE102007031600B4 (en) * 2007-07-06 2015-10-15 Helmholtz-Zentrum Berlin Für Materialien Und Energie Gmbh Array of vertical UV light-emitting diodes and method for its production
EP2168147A4 (en) * 2007-07-10 2012-07-11 Univ California Composite nanorods
CN101842909A (en) * 2007-07-19 2010-09-22 加利福尼亚技术学院 Structures of ordered arrays of semiconductors
US7833504B2 (en) * 2007-08-27 2010-11-16 The Research Foundation Of State University Of New York Silylated carbon nanotubes and methods of making same
KR20100067088A (en) * 2007-08-28 2010-06-18 캘리포니아 인스티튜트 오브 테크놀로지 Method for reuse of wafers for growth of vertically- aligned wire arrays
KR101345456B1 (en) 2007-08-29 2013-12-27 재단법인서울대학교산학협력재단 Horizontal nanowire growth method at selective location, nanowire prepared therefrom and nano device comprising the same
JP5347377B2 (en) * 2007-08-31 2013-11-20 大日本印刷株式会社 Vertical organic transistor, manufacturing method thereof, and light emitting device
US20090078303A1 (en) * 2007-09-24 2009-03-26 Solyndra, Inc. Encapsulated Photovoltaic Device Used With A Reflector And A Method of Use for the Same
US8759671B2 (en) 2007-09-28 2014-06-24 Stion Corporation Thin film metal oxide bearing semiconductor material for single junction solar cell devices
US8287942B1 (en) 2007-09-28 2012-10-16 Stion Corporation Method for manufacture of semiconductor bearing thin film material
US7745315B1 (en) 2007-10-03 2010-06-29 Sandia Corporation Highly aligned vertical GaN nanowires using submonolayer metal catalysts
US7915146B2 (en) 2007-10-23 2011-03-29 International Business Machines Corporation Controlled doping of semiconductor nanowires
US7998762B1 (en) 2007-11-14 2011-08-16 Stion Corporation Method and system for large scale manufacture of thin film photovoltaic devices using multi-chamber configuration
US8142890B1 (en) * 2007-12-05 2012-03-27 University Of Central Florida Research Foundation, Inc. Fabrication of high aspect ratio core-shell CdS-Mn/ZnS nanowires
US8319002B2 (en) * 2007-12-06 2012-11-27 Nanosys, Inc. Nanostructure-enhanced platelet binding and hemostatic structures
WO2009073854A1 (en) * 2007-12-06 2009-06-11 Nanosys, Inc. Resorbable nanoenhanced hemostatic structures and bandage materials
SG153674A1 (en) * 2007-12-11 2009-07-29 Nanyang Polytechnic A method of doping and apparatus for doping
FR2925221B1 (en) * 2007-12-17 2010-02-19 Commissariat Energie Atomique METHOD FOR TRANSFERRING A THIN LAYER
US8610104B2 (en) 2008-01-24 2013-12-17 Nano-Electronic And Photonic Devices And Circuits, Llc Nanotube array injection lasers
US8610125B2 (en) * 2008-01-24 2013-12-17 Nano-Electronic And Photonic Devices And Circuits, Llc Nanotube array light emitting diodes
US8624224B2 (en) * 2008-01-24 2014-01-07 Nano-Electronic And Photonic Devices And Circuits, Llc Nanotube array bipolar transistors
US8440994B2 (en) * 2008-01-24 2013-05-14 Nano-Electronic And Photonic Devices And Circuits, Llc Nanotube array electronic and opto-electronic devices
US8492249B2 (en) * 2008-01-24 2013-07-23 Nano-Electronic And Photonic Devices And Circuits, Llc Methods of forming catalytic nanopads
US8603246B2 (en) 2008-01-30 2013-12-10 Palo Alto Research Center Incorporated Growth reactor systems and methods for low-temperature synthesis of nanowires
CN101971360A (en) * 2008-02-08 2011-02-09 清洁电池国际股份有限公司 Composite nanorod-based structures for generating electricity
US8440903B1 (en) 2008-02-21 2013-05-14 Stion Corporation Method and structure for forming module using a powder coating and thermal treatment process
TWI485642B (en) * 2008-02-26 2015-05-21 Epistar Corp A customized manufacturing method for an optoelectrical device
US8075723B1 (en) 2008-03-03 2011-12-13 Stion Corporation Laser separation method for manufacture of unit cells for thin film photovoltaic materials
US8772078B1 (en) 2008-03-03 2014-07-08 Stion Corporation Method and system for laser separation for exclusion region of multi-junction photovoltaic materials
CN101552295A (en) * 2008-04-03 2009-10-07 清华大学 Solar cell
CN101562204B (en) * 2008-04-18 2011-03-23 鸿富锦精密工业(深圳)有限公司 Solar energy battery
CN101552297B (en) * 2008-04-03 2012-11-21 清华大学 Solar cell
CN101527327B (en) * 2008-03-07 2012-09-19 清华大学 Solar cell
CN101562203B (en) * 2008-04-18 2014-07-09 清华大学 Solar energy battery
US8094023B1 (en) * 2008-03-10 2012-01-10 Sandia Corporation Phononic crystal devices
US8174742B2 (en) 2008-03-14 2012-05-08 New York University System for applying optical forces from phase gradients
US8810009B2 (en) * 2008-04-27 2014-08-19 The Board Of Trustees Of The University Of Illinois Method of fabricating a planar semiconductor nanowire
WO2009134367A1 (en) 2008-04-30 2009-11-05 Nanosys, Inc. Non-fouling surfaces for reflective spheres
CN101582450B (en) * 2008-05-16 2012-03-28 清华大学 Thin film transistor
US7939454B1 (en) 2008-05-31 2011-05-10 Stion Corporation Module and lamination process for multijunction cells
US8642138B2 (en) 2008-06-11 2014-02-04 Stion Corporation Processing method for cleaning sulfur entities of contact regions
US8003432B2 (en) 2008-06-25 2011-08-23 Stion Corporation Consumable adhesive layer for thin film photovoltaic material
US9087943B2 (en) 2008-06-25 2015-07-21 Stion Corporation High efficiency photovoltaic cell and manufacturing method free of metal disulfide barrier material
US7960653B2 (en) * 2008-07-25 2011-06-14 Hewlett-Packard Development Company, L.P. Conductive nanowires for electrical interconnect
US8207008B1 (en) 2008-08-01 2012-06-26 Stion Corporation Affixing method and solar decal device using a thin film photovoltaic
US20100051932A1 (en) * 2008-08-28 2010-03-04 Seo-Yong Cho Nanostructure and uses thereof
US9343490B2 (en) 2013-08-09 2016-05-17 Zena Technologies, Inc. Nanowire structured color filter arrays and fabrication method of the same
US9515218B2 (en) 2008-09-04 2016-12-06 Zena Technologies, Inc. Vertical pillar structured photovoltaic devices with mirrors and optical claddings
US8229255B2 (en) * 2008-09-04 2012-07-24 Zena Technologies, Inc. Optical waveguides in image sensors
US8866065B2 (en) 2010-12-13 2014-10-21 Zena Technologies, Inc. Nanowire arrays comprising fluorescent nanowires
US8546742B2 (en) 2009-06-04 2013-10-01 Zena Technologies, Inc. Array of nanowires in a single cavity with anti-reflective coating on substrate
US9000353B2 (en) 2010-06-22 2015-04-07 President And Fellows Of Harvard College Light absorption and filtering properties of vertically oriented semiconductor nano wires
US8519379B2 (en) 2009-12-08 2013-08-27 Zena Technologies, Inc. Nanowire structured photodiode with a surrounding epitaxially grown P or N layer
US8835831B2 (en) * 2010-06-22 2014-09-16 Zena Technologies, Inc. Polarized light detecting device and fabrication methods of the same
US9478685B2 (en) 2014-06-23 2016-10-25 Zena Technologies, Inc. Vertical pillar structured infrared detector and fabrication method for the same
US8748799B2 (en) 2010-12-14 2014-06-10 Zena Technologies, Inc. Full color single pixel including doublet or quadruplet si nanowires for image sensors
US9299866B2 (en) 2010-12-30 2016-03-29 Zena Technologies, Inc. Nanowire array based solar energy harvesting device
US8269985B2 (en) 2009-05-26 2012-09-18 Zena Technologies, Inc. Determination of optimal diameters for nanowires
US8735797B2 (en) 2009-12-08 2014-05-27 Zena Technologies, Inc. Nanowire photo-detector grown on a back-side illuminated image sensor
US9406709B2 (en) 2010-06-22 2016-08-02 President And Fellows Of Harvard College Methods for fabricating and using nanowires
US8299472B2 (en) 2009-12-08 2012-10-30 Young-June Yu Active pixel sensor with nanowire structured photodetectors
US8791470B2 (en) 2009-10-05 2014-07-29 Zena Technologies, Inc. Nano structured LEDs
US9082673B2 (en) 2009-10-05 2015-07-14 Zena Technologies, Inc. Passivated upstanding nanostructures and methods of making the same
US8274039B2 (en) 2008-11-13 2012-09-25 Zena Technologies, Inc. Vertical waveguides with various functionality on integrated circuits
US8890271B2 (en) 2010-06-30 2014-11-18 Zena Technologies, Inc. Silicon nitride light pipes for image sensors
US8889455B2 (en) 2009-12-08 2014-11-18 Zena Technologies, Inc. Manufacturing nanowire photo-detector grown on a back-side illuminated image sensor
US7855089B2 (en) 2008-09-10 2010-12-21 Stion Corporation Application specific solar cell and method for manufacture using thin film photovoltaic materials
US8153482B2 (en) * 2008-09-22 2012-04-10 Sharp Laboratories Of America, Inc. Well-structure anti-punch-through microwire device
US8394662B1 (en) 2008-09-29 2013-03-12 Stion Corporation Chloride species surface treatment of thin film photovoltaic cell and manufacturing method
US8008112B1 (en) 2008-09-29 2011-08-30 Stion Corporation Bulk chloride species treatment of thin film photovoltaic cell and manufacturing method
US8026122B1 (en) 2008-09-29 2011-09-27 Stion Corporation Metal species surface treatment of thin film photovoltaic cell and manufacturing method
US8236597B1 (en) 2008-09-29 2012-08-07 Stion Corporation Bulk metal species treatment of thin film photovoltaic cell and manufacturing method
US8008110B1 (en) 2008-09-29 2011-08-30 Stion Corporation Bulk sodium species treatment of thin film photovoltaic cell and manufacturing method
US8476104B1 (en) 2008-09-29 2013-07-02 Stion Corporation Sodium species surface treatment of thin film photovoltaic cell and manufacturing method
US8501521B1 (en) 2008-09-29 2013-08-06 Stion Corporation Copper species surface treatment of thin film photovoltaic cell and manufacturing method
US8383450B2 (en) 2008-09-30 2013-02-26 Stion Corporation Large scale chemical bath system and method for cadmium sulfide processing of thin film photovoltaic materials
US8425739B1 (en) 2008-09-30 2013-04-23 Stion Corporation In chamber sodium doping process and system for large scale cigs based thin film photovoltaic materials
US7863074B2 (en) 2008-09-30 2011-01-04 Stion Corporation Patterning electrode materials free from berm structures for thin film photovoltaic cells
US7910399B1 (en) 2008-09-30 2011-03-22 Stion Corporation Thermal management and method for large scale processing of CIS and/or CIGS based thin films overlying glass substrates
US7947524B2 (en) 2008-09-30 2011-05-24 Stion Corporation Humidity control and method for thin film photovoltaic materials
US8741689B2 (en) 2008-10-01 2014-06-03 Stion Corporation Thermal pre-treatment process for soda lime glass substrate for thin film photovoltaic materials
US20110018103A1 (en) 2008-10-02 2011-01-27 Stion Corporation System and method for transferring substrates in large scale processing of cigs and/or cis devices
US8003430B1 (en) 2008-10-06 2011-08-23 Stion Corporation Sulfide species treatment of thin film photovoltaic cell and manufacturing method
US8435826B1 (en) 2008-10-06 2013-05-07 Stion Corporation Bulk sulfide species treatment of thin film photovoltaic cell and manufacturing method
US8168463B2 (en) 2008-10-17 2012-05-01 Stion Corporation Zinc oxide film method and structure for CIGS cell
US9006133B2 (en) 2008-10-24 2015-04-14 Oned Material Llc Electrochemical catalysts for fuel cells
WO2010054231A1 (en) * 2008-11-06 2010-05-14 Arizona Board of Regents, a body corporate acting for and on behalf of Arizona State University Laterally varying ii-vi alloys and uses thereof
US8540889B1 (en) 2008-11-19 2013-09-24 Nanosys, Inc. Methods of generating liquidphobic surfaces
US8344243B2 (en) 2008-11-20 2013-01-01 Stion Corporation Method and structure for thin film photovoltaic cell using similar material junction
US8354291B2 (en) 2008-11-24 2013-01-15 University Of Southern California Integrated circuits based on aligned nanotubes
US8169006B2 (en) * 2008-11-29 2012-05-01 Electronics And Telecommunications Research Institute Bio-sensor chip for detecting target material
US20100148213A1 (en) * 2008-12-12 2010-06-17 Yen-Wei Hsu Tunnel device
KR101539669B1 (en) * 2008-12-16 2015-07-27 삼성전자주식회사 Method of forming core-shell type structure and method of manufacturing transistor using the same
US7884004B2 (en) * 2009-02-04 2011-02-08 International Business Machines Corporation Maskless process for suspending and thinning nanowires
FR2943450B1 (en) * 2009-03-17 2011-03-18 Commissariat Energie Atomique HIGH RESOLUTION READING HEAD FOR OPTICAL DISK
US9210247B2 (en) * 2009-03-27 2015-12-08 T-Mobile Usa, Inc. Managing contact groups from subset of user contacts
US9369542B2 (en) 2009-03-27 2016-06-14 T-Mobile Usa, Inc. Network-based processing of data requests for contact information
USD631889S1 (en) 2009-03-27 2011-02-01 T-Mobile Usa, Inc. Portion of a display screen with a user interface
US9355382B2 (en) 2009-03-27 2016-05-31 T-Mobile Usa, Inc. Group based information displays
USD631890S1 (en) 2009-03-27 2011-02-01 T-Mobile Usa, Inc. Portion of a display screen with a user interface
USD631887S1 (en) 2009-03-27 2011-02-01 T-Mobile Usa, Inc. Portion of a display screen with a user interface
US9195966B2 (en) * 2009-03-27 2015-11-24 T-Mobile Usa, Inc. Managing contact groups from subset of user contacts
USD631891S1 (en) 2009-03-27 2011-02-01 T-Mobile Usa, Inc. Portion of a display screen with a user interface
US8577350B2 (en) 2009-03-27 2013-11-05 T-Mobile Usa, Inc. Managing communications utilizing communication categories
USD631888S1 (en) 2009-03-27 2011-02-01 T-Mobile Usa, Inc. Portion of a display screen with a user interface
US8013324B2 (en) * 2009-04-03 2011-09-06 International Business Machines Corporation Structurally stabilized semiconductor nanowire
US7902541B2 (en) * 2009-04-03 2011-03-08 International Business Machines Corporation Semiconductor nanowire with built-in stress
US8237150B2 (en) * 2009-04-03 2012-08-07 International Business Machines Corporation Nanowire devices for enhancing mobility through stress engineering
US7943530B2 (en) * 2009-04-03 2011-05-17 International Business Machines Corporation Semiconductor nanowires having mobility-optimized orientations
US20110089402A1 (en) * 2009-04-10 2011-04-21 Pengfei Qi Composite Nanorod-Based Structures for Generating Electricity
WO2010126606A2 (en) * 2009-05-01 2010-11-04 Nanosys, Inc. Functionalized matrixes for dispersion of nanostructures
JP5686988B2 (en) 2009-05-04 2015-03-18 シャープ株式会社 Catalyst layer used for membrane electrode assembly for fuel cell, membrane electrode assembly for fuel cell using the same, fuel cell, and production method thereof
US10490817B2 (en) 2009-05-19 2019-11-26 Oned Material Llc Nanostructured materials for battery applications
US20120135158A1 (en) 2009-05-26 2012-05-31 Sharp Kabushiki Kaisha Methods and systems for electric field deposition of nanowires and other devices
JP5299105B2 (en) * 2009-06-16 2013-09-25 ソニー株式会社 Vanadium dioxide nanowire and method for producing the same, and nanowire device using vanadium dioxide nanowire
FR2947098A1 (en) * 2009-06-18 2010-12-24 Commissariat Energie Atomique METHOD OF TRANSFERRING A THIN LAYER TO A TARGET SUBSTRATE HAVING A THERMAL EXPANSION COEFFICIENT DIFFERENT FROM THAT OF THE THIN LAYER
US8507786B1 (en) 2009-06-27 2013-08-13 Stion Corporation Manufacturing method for patterning CIGS/CIS solar cells
US8623288B1 (en) 2009-06-29 2014-01-07 Nanosys, Inc. Apparatus and methods for high density nanowire growth
US8368125B2 (en) 2009-07-20 2013-02-05 International Business Machines Corporation Multiple orientation nanowires with gate stack stressors
US8269257B2 (en) * 2009-07-29 2012-09-18 Massachusetts Institute Of Technology Nanowire synthesis
US8389393B2 (en) * 2009-07-29 2013-03-05 Massachusetts Institute Of Technology Nanoparticle synthesis
US8398772B1 (en) 2009-08-18 2013-03-19 Stion Corporation Method and structure for processing thin film PV cells with improved temperature uniformity
KR101016437B1 (en) * 2009-08-21 2011-02-21 한국과학기술연구원 Reconfigurable logic device using spin accumulation and diffusion
WO2011038228A1 (en) 2009-09-24 2011-03-31 President And Fellows Of Harvard College Bent nanowires and related probing of species
US8524527B2 (en) * 2009-09-25 2013-09-03 University Of Southern California High-performance single-crystalline N-type dopant-doped metal oxide nanowires for transparent thin film transistors and active matrix organic light-emitting diode displays
US20120199812A1 (en) * 2009-10-07 2012-08-09 University Of Florida Research Foundation, Incorporated Strain tunable silicon and germanium nanowire optoelectronic devices
US8980656B2 (en) 2009-10-21 2015-03-17 The Board Of Trustees Of The University Of Illinois Method of forming an array of high aspect ratio semiconductor nanostructures
US8809096B1 (en) 2009-10-22 2014-08-19 Stion Corporation Bell jar extraction tool method and apparatus for thin film photovoltaic materials
US8390705B2 (en) * 2009-10-27 2013-03-05 Hewlett-Packard Develoment Company, L.P. Nanowire photodiodes
US20110101302A1 (en) * 2009-11-05 2011-05-05 University Of Southern California Wafer-scale fabrication of separated carbon nanotube thin-film transistors
CN102050424B (en) * 2009-11-06 2013-11-06 清华大学 Method for preparing carbon nanotube thin film and method for preparing thin film transistor
EP2507842A2 (en) * 2009-11-30 2012-10-10 California Institute of Technology Three-dimensional patterning methods and related devices
US8563395B2 (en) * 2009-11-30 2013-10-22 The Royal Institute For The Advancement Of Learning/Mcgill University Method of growing uniform semiconductor nanowires without foreign metal catalyst and devices thereof
US8008146B2 (en) * 2009-12-04 2011-08-30 International Business Machines Corporation Different thickness oxide silicon nanowire field effect transistors
US20120256166A1 (en) 2009-12-17 2012-10-11 Merck Patent Gesellschaft Mit Beschrankter Haftung Deposition of nanoparticles
JP5753192B2 (en) * 2009-12-22 2015-07-22 クナノ・アーベー Method for manufacturing a nanowire structure
KR101132273B1 (en) 2009-12-28 2012-04-02 재단법인대구경북과학기술원 Hybrid solar cell and method for fabricating the same
US8859880B2 (en) 2010-01-22 2014-10-14 Stion Corporation Method and structure for tiling industrial thin-film solar devices
US8263494B2 (en) 2010-01-25 2012-09-11 Stion Corporation Method for improved patterning accuracy for thin film photovoltaic panels
US9202954B2 (en) * 2010-03-03 2015-12-01 Q1 Nanosystems Corporation Nanostructure and photovoltaic cell implementing same
CN101807606B (en) * 2010-03-04 2011-05-25 吉林大学 n-type zinc oxide/p-type diamond heterojunction tunnel diode and manufacturing method thereof
JP5127856B2 (en) * 2010-03-15 2013-01-23 株式会社東芝 Semiconductor memory device
WO2011156042A2 (en) 2010-03-23 2011-12-15 California Institute Of Technology Heterojunction wire array solar cells
US9096930B2 (en) 2010-03-29 2015-08-04 Stion Corporation Apparatus for manufacturing thin film photovoltaic devices
US20110267436A1 (en) * 2010-04-30 2011-11-03 Nauganeedles Llc Nanowire Bonding Method and Apparatus
US9447520B2 (en) 2010-05-11 2016-09-20 Qunano Ab Gas-phase synthesis method for forming semiconductor nanowires
US8445337B2 (en) 2010-05-12 2013-05-21 International Business Machines Corporation Generation of multiple diameter nanowire field effect transistors
US8420455B2 (en) 2010-05-12 2013-04-16 International Business Machines Corporation Generation of multiple diameter nanowire field effect transistors
US8519479B2 (en) 2010-05-12 2013-08-27 International Business Machines Corporation Generation of multiple diameter nanowire field effect transistors
US8461061B2 (en) 2010-07-23 2013-06-11 Stion Corporation Quartz boat method and apparatus for thin film thermal treatment
US8628997B2 (en) 2010-10-01 2014-01-14 Stion Corporation Method and device for cadmium-free solar cells
KR101223233B1 (en) * 2010-10-13 2013-01-21 서울대학교산학협력단 An integrated direct-band semiconductor nanowire on mechanical structures to facilitate measurement of structures displacement
US8462333B2 (en) * 2010-10-15 2013-06-11 Hewlett-Packard Development Company, L.P. Apparatus for performing SERS
US8728200B1 (en) 2011-01-14 2014-05-20 Stion Corporation Method and system for recycling processing gas for selenization of thin film photovoltaic materials
US8998606B2 (en) 2011-01-14 2015-04-07 Stion Corporation Apparatus and method utilizing forced convection for uniform thermal treatment of thin film devices
US8593629B2 (en) 2011-02-17 2013-11-26 Hewlett-Packard Development Company, L.P. Apparatus for performing SERS
US8692230B2 (en) 2011-03-29 2014-04-08 University Of Southern California High performance field-effect transistors
FR2973936B1 (en) * 2011-04-05 2014-01-31 Commissariat Energie Atomique METHOD OF SELECTIVE GROWTH ON SEMICONDUCTOR STRUCTURE
CN102259833B (en) * 2011-05-24 2014-11-05 黄辉 Preparation method of nano wire device based on nano wire cross connection
US8860137B2 (en) 2011-06-08 2014-10-14 University Of Southern California Radio frequency devices based on carbon nanomaterials
US9595685B2 (en) 2011-06-10 2017-03-14 President And Fellows Of Harvard College Nanoscale wires, nanoscale wire FET devices, and nanotube-electronic hybrid devices for sensing and other applications
KR20130010344A (en) * 2011-07-18 2013-01-28 삼성전자주식회사 Metal nanowire formed with gold nanocluster on the surface for binding a target material and method for binding the metal nanowire with the target material
US8848183B2 (en) 2011-07-22 2014-09-30 Hewlett-Packard Development Company, L.P. Apparatus having nano-fingers of different physical characteristics
CN103764544A (en) 2011-07-26 2014-04-30 1D材料有限责任公司 Nanostructured battery active materials and methods of producing same
US9377409B2 (en) 2011-07-29 2016-06-28 Hewlett-Packard Development Company, L.P. Fabricating an apparatus for use in a sensing application
US8436445B2 (en) 2011-08-15 2013-05-07 Stion Corporation Method of manufacture of sodium doped CIGS/CIGSS absorber layers for high efficiency photovoltaic devices
US9202867B2 (en) * 2011-10-04 2015-12-01 Arizona Board Of Regents Nanocrystals containing CdTe core with CdS and ZnS coatings
US8895417B2 (en) 2011-11-29 2014-11-25 International Business Machines Corporation Reducing contact resistance for field-effect transistor devices
US8772910B2 (en) 2011-11-29 2014-07-08 International Business Machines Corporation Doping carbon nanotubes and graphene for improving electronic mobility
TWI472069B (en) 2011-12-19 2015-02-01 Ind Tech Res Inst Thermoelectric composite material
TWI559561B (en) * 2011-12-28 2016-11-21 國立台北科技大學 Array electrospinning for dye sensitized solar cells
AU2011384617A1 (en) 2012-01-01 2014-07-10 Tracense Systems Ltd. Nanostructure and process of fabricating same
WO2013106793A1 (en) 2012-01-13 2013-07-18 California Institute Of Technology Solar fuel generators
US9476129B2 (en) 2012-04-02 2016-10-25 California Institute Of Technology Solar fuels generator
US10026560B2 (en) 2012-01-13 2018-07-17 The California Institute Of Technology Solar fuels generator
WO2013114218A2 (en) * 2012-02-03 2013-08-08 Qunano Ab High-throughput continuous gas-phase synthesis of nanowires with tunable properties
US10090425B2 (en) 2012-02-21 2018-10-02 California Institute Of Technology Axially-integrated epitaxially-grown tandem wire arrays
US9947816B2 (en) 2012-04-03 2018-04-17 California Institute Of Technology Semiconductor structures for fuel generation
WO2013154490A2 (en) * 2012-04-12 2013-10-17 Sol Voltaics Ab Methods of nanowire functionalization, dispersion and attachment
JP2013239690A (en) * 2012-04-16 2013-11-28 Sharp Corp Superlattice structure, semiconductor device and semiconductor light emitting device including the superlattice structure, and method of making the superlattice structure
AU2013252525B2 (en) 2012-04-23 2017-11-23 Siemens Healthcare Diagnostics Inc. Sensor array
US9638717B2 (en) 2012-05-03 2017-05-02 President And Fellows Of Harvard College Nanoscale sensors for intracellular and other applications
DE202012102039U1 (en) * 2012-06-04 2013-02-08 Ramot At Tel Aviv University Ltd. nanostructure
US9139770B2 (en) 2012-06-22 2015-09-22 Nanosys, Inc. Silicone ligands for stabilizing quantum dot films
TWI596188B (en) 2012-07-02 2017-08-21 奈米系統股份有限公司 Highly luminescent nanostructures and methods of producing same
FR2993509B1 (en) * 2012-07-17 2015-03-20 Airbus ELECTRONIC DEVICE FOR PROTECTION AGAINST LIGHTENING OF A PILOT OR DRIVER.
US9457128B2 (en) 2012-09-07 2016-10-04 President And Fellows Of Harvard College Scaffolds comprising nanoelectronic components for cells, tissues, and other applications
US9786850B2 (en) 2012-09-07 2017-10-10 President And Fellows Of Harvard College Methods and systems for scaffolds comprising nanoelectronic components
BR112015005592B1 (en) 2012-09-12 2022-06-21 Fabricio Vilela COELHO System and method of collaborative sharing of digital photo albums
FR3000292B1 (en) * 2012-12-20 2015-02-27 Commissariat Energie Atomique PROCESS FOR OBTAINING AT LEAST ONE SILICON-BASED NANOELEMENT IN A SILICON OXIDE WAFER, METHOD FOR MANUFACTURING A DEVICE USING THE PROCESS FOR OBTAINING THE SAME
US9553223B2 (en) 2013-01-24 2017-01-24 California Institute Of Technology Method for alignment of microwires
US9082911B2 (en) 2013-01-28 2015-07-14 Q1 Nanosystems Corporation Three-dimensional metamaterial device with photovoltaic bristles
US10049871B2 (en) 2013-02-06 2018-08-14 President And Fellows Of Harvard College Anisotropic deposition in nanoscale wires
US20140264998A1 (en) 2013-03-14 2014-09-18 Q1 Nanosystems Corporation Methods for manufacturing three-dimensional metamaterial devices with photovoltaic bristles
US9005480B2 (en) 2013-03-14 2015-04-14 Nanosys, Inc. Method for solventless quantum dot exchange
US9954126B2 (en) 2013-03-14 2018-04-24 Q1 Nanosystems Corporation Three-dimensional photovoltaic devices including cavity-containing cores and methods of manufacture
FR3004000B1 (en) * 2013-03-28 2016-07-15 Aledia ELECTROLUMINESCENT DEVICE WITH INTEGRATED SENSOR AND METHOD FOR CONTROLLING THE TRANSMISSION OF THE DEVICE
CN103840080B (en) * 2013-12-05 2016-08-17 南昌大学 Control of Voltage memorizer based on one-dimensional cadmium doped zinc oxide nano-wire and preparation method
JP6514231B2 (en) * 2014-01-06 2019-05-15 ナノコ テクノロジーズ リミテッド Cadmium-free quantum dot nanoparticles
US10315191B2 (en) * 2014-03-24 2019-06-11 Hong Kong Polytechnic University Photocatalyst
CN103869103B (en) * 2014-03-27 2016-04-06 上海华力微电子有限公司 Probe unit of microscope with atomic force
US9287516B2 (en) * 2014-04-07 2016-03-15 International Business Machines Corporation Forming pn junction contacts by different dielectrics
WO2015171699A1 (en) 2014-05-07 2015-11-12 President And Fellows Of Harvard College Controlled growth of nanoscale wires
US10167193B2 (en) 2014-09-23 2019-01-01 Vanderbilt University Ferroelectric agglomerates and methods and uses related thereto
US20170352542A1 (en) 2014-10-30 2017-12-07 President And Fellows Of Harvard College Nanoscale wires with tip-localized junctions
US9379327B1 (en) 2014-12-16 2016-06-28 Carbonics Inc. Photolithography based fabrication of 3D structures
CN104538457A (en) * 2015-01-15 2015-04-22 京东方科技集团股份有限公司 Thin film transistor, manufacturing method of thin film transistor, array substrate and display device
US10477354B2 (en) 2015-02-20 2019-11-12 Mc10, Inc. Automated detection and configuration of wearable devices based on on-body status, location, and/or orientation
US20180088079A1 (en) * 2015-04-03 2018-03-29 President And Fellows Of Harvard College Nanoscale wires with external layers for sensors and other applications
CN104779275B (en) * 2015-04-30 2017-11-28 湖北工业大学 Autoexcitation spin single electron Electromagnetic Environmental Effect transistor, preparation method and application
CN105088346B (en) * 2015-08-19 2016-06-22 宁波工程学院 A kind of P doping SiC nanowire with superelevation draw ratio and preparation method thereof
KR101742073B1 (en) * 2015-12-01 2017-06-01 주식회사 페타룩스 Electronic device based on copper halide semiconductor, and memory device and logic device having the same
KR101845139B1 (en) * 2015-12-29 2018-05-18 전자부품연구원 Avalanche photodiode using silicon nanowire and silicon nanowire photomultiplier using the same
US10277386B2 (en) 2016-02-22 2019-04-30 Mc10, Inc. System, devices, and method for on-body data and power transmission
CN105862122B (en) * 2016-05-09 2018-08-03 北京大学 Indium antimonide nano wire based on multistep Glancing angledeposition is prepared and additive Mn method
FI3484810T3 (en) 2016-07-15 2023-11-09 Oned Mat Inc Manufacturing apparatus and method for making silicon nanowires on carbon based powders for use in batteries
DE102016010764A1 (en) * 2016-09-08 2018-03-08 Forschungszentrum Jülich GmbH Device for measuring small potentials of a sample, method for producing the device and use of the device
US11111399B2 (en) 2016-10-21 2021-09-07 Quirklogic, Inc. Materials and methods for conductive thin films
US9881835B1 (en) * 2016-10-21 2018-01-30 Uvic Industry Partnerships Inc. Nanowire devices, systems, and methods of production
US10737938B2 (en) 2016-10-21 2020-08-11 UVic Industry Partnership Inc. Nanowire chain devices, systems, and methods of production
US10782014B2 (en) 2016-11-11 2020-09-22 Habib Technologies LLC Plasmonic energy conversion device for vapor generation
CN106783809B (en) * 2016-11-23 2019-03-01 华东师范大学 A kind of coaxial capacitor and preparation method of spinning
RU178317U1 (en) * 2017-02-17 2018-03-29 Федеральное государственное бюджетное образовательное учреждение высшего образования "Московский государственный университет имени М.В. Ломоносова" (МГУ) FIELD TRANSISTOR FOR DETERMINING BIOLOGICALLY ACTIVE COMPOUNDS
US10243156B2 (en) 2017-03-16 2019-03-26 International Business Machines Corporation Placement of carbon nanotube guided by DSA patterning
CN107119323B (en) * 2017-04-27 2019-08-06 云南北方驰宏光电有限公司 A kind of doping modification method of CVDZnS crystalline material
KR101940067B1 (en) * 2017-08-24 2019-01-18 건국대학교 산학협력단 Preparation Method for Wire with hollow structure
KR101950114B1 (en) 2017-10-27 2019-02-19 고려대학교 산학협력단 Semiconductor Nanowire Photoelectric Device
KR102015278B1 (en) * 2017-10-30 2019-08-28 한국생산기술연구원 A method for forming a nanowire pattern using a mold having a channel
TWI638452B (en) * 2017-12-22 2018-10-11 林嘉洤 Room temperature oscillator
CN108914086B (en) * 2018-07-17 2020-05-22 武汉工程大学 Iron-doped diamond diluted magnetic semiconductor and preparation method thereof
WO2020154511A1 (en) * 2019-01-23 2020-07-30 University Of Washington Indium phosphorus quantum dots, clusters, and related methods
WO2020263772A1 (en) 2019-06-24 2020-12-30 President And Fellows Of Harvard College Cell scaffold comprising an electronic circuit
CN112410933B (en) * 2019-08-20 2023-01-06 Tcl科技集团股份有限公司 Nano material and preparation method thereof and quantum dot light-emitting diode
CN110320195B (en) * 2019-08-21 2021-12-28 合肥工业大学 Colorimetric fluorescent probe and preparation method and application thereof
CN111101192B (en) * 2020-01-09 2021-05-07 西北工业大学 Method for preparing single crystal black phosphorus nanowire by using template method
JP2023522357A (en) * 2020-04-19 2023-05-30 ジョン・ジェイ・ダニエルズ Mask-based diagnostic system using exhaled breath condensate
CN111477560B (en) * 2020-05-14 2023-03-03 包头美科硅能源有限公司 Rapid detection method for distinguishing gallium-boron-doped single crystal silicon rods for solar cell
CN111663167A (en) * 2020-06-16 2020-09-15 合肥工业大学 Metal wire preparation method based on BPE technology
CN111952322B (en) * 2020-08-14 2022-06-03 电子科技大学 Flexible semiconductor film with periodically adjustable buckling structure and preparation method thereof
CN112216772B (en) * 2020-09-07 2022-03-08 深圳远芯光路科技有限公司 III-group nitride nanowire flexible light-emitting diode and preparation method thereof
CN113066869B (en) * 2021-03-16 2021-12-10 扬州国宇电子有限公司 Fast recovery diode chip and preparation method thereof
CN113096749B (en) * 2021-06-10 2021-11-05 武汉大学深圳研究院 Multi-scale coupling simulation method for preparing n-type co-doped diamond semiconductor material

Family Cites Families (227)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3444100A (en) * 1963-10-30 1969-05-13 Trancoa Chem Corp Radiation resistant semiconductor grade silicon containing a metal oxide
US3900614A (en) * 1971-11-26 1975-08-19 Western Electric Co Method of depositing a metal on a surface of a substrate
US3873359A (en) * 1971-11-26 1975-03-25 Western Electric Co Method of depositing a metal on a surface of a substrate
US3873360A (en) * 1971-11-26 1975-03-25 Western Electric Co Method of depositing a metal on a surface of a substrate
US4190631A (en) * 1978-09-21 1980-02-26 Western Electric Company, Incorporated Double crucible crystal growing apparatus
JPS6194042A (en) 1984-10-16 1986-05-12 Matsushita Electric Ind Co Ltd Molecular construction and its manufacture
US4939556A (en) 1986-07-10 1990-07-03 Canon Kabushiki Kaisha Conductor device
CA1336110C (en) * 1989-02-03 1995-06-27 Robert Gregory Swisher Polymeric-containing compositions with improved oxidative stability
US5089545A (en) 1989-02-12 1992-02-18 Biotech International, Inc. Switching and memory elements from polyamino acids and the method of their assembly
US5023139A (en) * 1989-04-04 1991-06-11 Research Corporation Technologies, Inc. Nonlinear optical materials
EP0605408A1 (en) 1989-10-18 1994-07-13 Research Corporation Technologies, Inc. Coated particles and methods of coating particles
US5196212A (en) * 1990-05-08 1993-03-23 Knoblach Gerald M Electric alignment of fibers for the manufacture of composite materials
US5225366A (en) * 1990-06-22 1993-07-06 The United States Of America As Represented By The Secretary Of The Navy Apparatus for and a method of growing thin films of elemental semiconductors
US5332910A (en) 1991-03-22 1994-07-26 Hitachi, Ltd. Semiconductor optical device with nanowhiskers
US5274602A (en) 1991-10-22 1993-12-28 Florida Atlantic University Large capacity solid-state memory
JP3243303B2 (en) * 1991-10-28 2002-01-07 ゼロックス・コーポレーション Quantum confined semiconductor light emitting device and method of manufacturing the same
DE69231398T2 (en) * 1991-11-22 2001-02-22 Canon Kk Photoelectric converter and control method therefor
JP2697474B2 (en) * 1992-04-30 1998-01-14 松下電器産業株式会社 Manufacturing method of microstructure
US5475341A (en) 1992-06-01 1995-12-12 Yale University Sub-nanoscale electronic systems and devices
US5252835A (en) 1992-07-17 1993-10-12 President And Trustees Of Harvard College Machining oxide thin-films with an atomic force microscope: pattern and object formation on the nanometer scale
US5453970A (en) 1993-07-13 1995-09-26 Rust; Thomas F. Molecular memory medium and molecular memory disk drive for storing information using a tunnelling probe
AU8070294A (en) 1993-07-15 1995-02-13 President And Fellows Of Harvard College Extended nitride material comprising beta -c3n4
IT1271141B (en) * 1993-07-29 1997-05-27 Promox S R L PROCEDURE FOR THE POTABILIZATION OF WATER INTENDED FOR HUMAN CONSUMPTION
US5962863A (en) * 1993-09-09 1999-10-05 The United States Of America As Represented By The Secretary Of The Navy Laterally disposed nanostructures of silicon on an insulating substrate
US5900160A (en) * 1993-10-04 1999-05-04 President And Fellows Of Harvard College Methods of etching articles via microcontact printing
US6180239B1 (en) * 1993-10-04 2001-01-30 President And Fellows Of Harvard College Microcontact printing on surfaces and derivative articles
US5512131A (en) 1993-10-04 1996-04-30 President And Fellows Of Harvard College Formation of microstamped patterns on surfaces and derivative articles
US5776748A (en) * 1993-10-04 1998-07-07 President And Fellows Of Harvard College Method of formation of microstamped patterns on plates for adhesion of cells and other biological materials, devices and uses therefor
US5936703A (en) * 1993-10-13 1999-08-10 Nof Corporation Alkoxysilane compound, surface processing solution and contact lens
JP3254865B2 (en) * 1993-12-17 2002-02-12 ソニー株式会社 Camera device
EP0659911A1 (en) 1993-12-23 1995-06-28 International Business Machines Corporation Method to form a polycrystalline film on a substrate
CN1040043C (en) 1994-04-29 1998-09-30 武汉大学 Ultramicro nm electrode and ultramicro sensor
JP3332130B2 (en) * 1994-05-16 2002-10-07 シャープ株式会社 Image display device
US5620850A (en) 1994-09-26 1997-04-15 President And Fellows Of Harvard College Molecular recognition at surfaces derivatized with self-assembled monolayers
WO1996014206A1 (en) * 1994-11-08 1996-05-17 Spectra Science Corporation Semiconductor nanocrystal display materials and display apparatus employing same
US5581091A (en) * 1994-12-01 1996-12-03 Moskovits; Martin Nanoelectric devices
US5866434A (en) * 1994-12-08 1999-02-02 Meso Scale Technology Graphitic nanotubes in luminescence assays
US5449627A (en) 1994-12-14 1995-09-12 United Microelectronics Corporation Lateral bipolar transistor and FET compatible process for making it
US5539214A (en) * 1995-02-06 1996-07-23 Regents Of The University Of California Quantum bridges fabricated by selective etching of superlattice structures
US5524092A (en) * 1995-02-17 1996-06-04 Park; Jea K. Multilayered ferroelectric-semiconductor memory-device
EP0812434B1 (en) 1995-03-01 2013-09-18 President and Fellows of Harvard College Microcontact printing on surfaces and derivative articles
CN1192097C (en) 1995-03-10 2005-03-09 梅索磅秤技术有限公司 Multi-array, multi-specific electrochemiluminescence testing
US5747180A (en) 1995-05-19 1998-05-05 University Of Notre Dame Du Lac Electrochemical synthesis of quasi-periodic quantum dot and nanostructure arrays
US5824470A (en) 1995-05-30 1998-10-20 California Institute Of Technology Method of preparing probes for sensing and manipulating microscopic environments and structures
JP2953996B2 (en) * 1995-05-31 1999-09-27 日本電気株式会社 Metal-coated carbon nanotube and method for producing the same
US6190634B1 (en) * 1995-06-07 2001-02-20 President And Fellows Of Harvard College Carbide nanomaterials
US5751156A (en) 1995-06-07 1998-05-12 Yale University Mechanically controllable break transducer
US5757038A (en) 1995-11-06 1998-05-26 International Business Machines Corporation Self-aligned dual gate MOSFET with an ultranarrow channel
WO1997019208A1 (en) * 1995-11-22 1997-05-29 Northwestern University Method of encapsulating a material in a carbon nanotube
JP3469392B2 (en) * 1995-11-22 2003-11-25 富士ゼロックス株式会社 Reproducible image recording medium
US6445006B1 (en) * 1995-12-20 2002-09-03 Advanced Technology Materials, Inc. Microelectronic and microelectromechanical devices comprising carbon nanotube components, and methods of making same
US6538262B1 (en) * 1996-02-02 2003-03-25 The Regents Of The University Of California Nanotube junctions
US5897945A (en) 1996-02-26 1999-04-27 President And Fellows Of Harvard College Metal oxide nanorods
US6036774A (en) 1996-02-26 2000-03-14 President And Fellows Of Harvard College Method of producing metal oxide nanorods
KR100469868B1 (en) 1996-03-06 2005-07-08 하이페리온 커탤리시스 인터내셔널 인코포레이티드 Functionalized Nanotubes
DE19610115C2 (en) 1996-03-14 2000-11-23 Fraunhofer Ges Forschung Detection of molecules and molecular complexes
ES2166987T3 (en) 1996-03-15 2002-05-01 Harvard College METHOD OF FORMING ARTICLES AND MODELED SURFACES THROUGH CAPILLARY MICROMOLDING.
US6355198B1 (en) * 1996-03-15 2002-03-12 President And Fellows Of Harvard College Method of forming articles including waveguides via capillary micromolding and microtransfer molding
US6060121A (en) * 1996-03-15 2000-05-09 President And Fellows Of Harvard College Microcontact printing of catalytic colloids
US5640343A (en) 1996-03-18 1997-06-17 International Business Machines Corporation Magnetic memory array using magnetic tunnel junction devices in the memory cells
RU2099808C1 (en) 1996-04-01 1997-12-20 Евгений Инвиевич Гиваргизов Process of growing of oriented systems of whiskers and gear for its implementation ( versions )
US5942443A (en) 1996-06-28 1999-08-24 Caliper Technologies Corporation High throughput screening assay systems in microscale fluidic devices
US6187214B1 (en) * 1996-05-13 2001-02-13 Universidad De Seville Method and device for production of components for microfabrication
US5726524A (en) * 1996-05-31 1998-03-10 Minnesota Mining And Manufacturing Company Field emission device having nanostructured emitters
EP0927331B1 (en) * 1996-08-08 2004-03-31 William Marsh Rice University Macroscopically manipulable nanoscale devices made from nanotube assemblies
JPH10106960A (en) * 1996-09-25 1998-04-24 Sony Corp Manufacture of quantum thin line
IL119719A0 (en) * 1996-11-29 1997-02-18 Yeda Res & Dev Inorganic fullerene-like structures of metal chalcogenides
US6038060A (en) 1997-01-16 2000-03-14 Crowley; Robert Joseph Optical antenna array for harmonic generation, mixing and signal amplification
US5908692A (en) * 1997-01-23 1999-06-01 Wisconsin Alumni Research Foundation Ordered organic monolayers and methods of preparation thereof
US5997832A (en) * 1997-03-07 1999-12-07 President And Fellows Of Harvard College Preparation of carbide nanorods
US6683783B1 (en) * 1997-03-07 2004-01-27 William Marsh Rice University Carbon fibers formed from single-wall carbon nanotubes
AU6545698A (en) 1997-03-07 1998-09-22 William Marsh Rice University Carbon fibers formed from single-wall carbon nanotubes
JP3183845B2 (en) 1997-03-21 2001-07-09 財団法人ファインセラミックスセンター Method for producing carbon nanotube and carbon nanotube film
US5847565A (en) 1997-03-31 1998-12-08 Council Of Scientific And Industrial Research Logic device
US6231744B1 (en) * 1997-04-24 2001-05-15 Massachusetts Institute Of Technology Process for fabricating an array of nanowires
US5864823A (en) * 1997-06-25 1999-01-26 Virtel Corporation Integrated virtual telecommunication system for E-commerce
US6069380A (en) 1997-07-25 2000-05-30 Regents Of The University Of Minnesota Single-electron floating-gate MOS memory
US7001996B1 (en) * 1997-08-21 2006-02-21 The United States Of America As Represented By The Secretary Of The Army Enzymatic template polymerization
US6187165B1 (en) * 1997-10-02 2001-02-13 The John Hopkins University Arrays of semi-metallic bismuth nanowires and fabrication techniques therefor
US5903010A (en) 1997-10-29 1999-05-11 Hewlett-Packard Company Quantum wire switch and switching method
JP3740295B2 (en) 1997-10-30 2006-02-01 キヤノン株式会社 Carbon nanotube device, manufacturing method thereof, and electron-emitting device
US6004444A (en) 1997-11-05 1999-12-21 The Trustees Of Princeton University Biomimetic pathways for assembling inorganic thin films and oriented mesoscopic silicate patterns through guided growth
US6762056B1 (en) * 1997-11-12 2004-07-13 Protiveris, Inc. Rapid method for determining potential binding sites of a protein
US20030135971A1 (en) * 1997-11-12 2003-07-24 Michael Liberman Bundle draw based processing of nanofibers and method of making
US6123819A (en) 1997-11-12 2000-09-26 Protiveris, Inc. Nanoelectrode arrays
US6207392B1 (en) 1997-11-25 2001-03-27 The Regents Of The University Of California Semiconductor nanocrystal probes for biological applications and process for making and using such probes
JP3902883B2 (en) * 1998-03-27 2007-04-11 キヤノン株式会社 Nanostructure and manufacturing method thereof
JP2000041320A (en) 1998-05-20 2000-02-08 Yazaki Corp Grommet
US6287765B1 (en) * 1998-05-20 2001-09-11 Molecular Machines, Inc. Methods for detecting and identifying single molecules
EP0962773A1 (en) 1998-06-03 1999-12-08 Mark Howard Jones Electrochemical based assay processes instrument and labels
US6159742A (en) 1998-06-05 2000-12-12 President And Fellows Of Harvard College Nanometer-scale microscopy probes
US6203864B1 (en) 1998-06-08 2001-03-20 Nec Corporation Method of forming a heterojunction of a carbon nanotube and a different material, method of working a filament of a nanotube
US7416699B2 (en) 1998-08-14 2008-08-26 The Board Of Trustees Of The Leland Stanford Junior University Carbon nanotube devices
US6346189B1 (en) 1998-08-14 2002-02-12 The Board Of Trustees Of The Leland Stanford Junior University Carbon nanotube structures made using catalyst islands
KR100775878B1 (en) 1998-09-18 2007-11-13 윌리엄 마쉬 라이스 유니버시티 Chemical derivatization of single-wall carbon nanotubes to facilitate solvation thereof and use of derivatized nanotubes
WO2000029617A2 (en) 1998-09-24 2000-05-25 Advanced Research And Technology Institute, Inc. Water-soluble luminescent quantum dots and bioconjugates thereof
AU6267299A (en) 1998-09-28 2000-04-17 Xidex Corporation Method for manufacturing carbon nanotubes as functional elements of mems devices
DE19849196A1 (en) * 1998-10-26 2000-04-27 Degussa Process for neutralizing and reducing residual halogen content in alkoxysilanes or alkoxysilane-based compositions
US6705152B2 (en) 2000-10-24 2004-03-16 Nanoproducts Corporation Nanostructured ceramic platform for micromachined devices and device arrays
US6468657B1 (en) 1998-12-04 2002-10-22 The Regents Of The University Of California Controllable ion-exchange membranes
JP3754568B2 (en) 1999-01-29 2006-03-15 シャープ株式会社 Quantum wire manufacturing method
US20020013031A1 (en) * 1999-02-09 2002-01-31 Kuen-Jian Chen Method of improving the reliability of gate oxide layer
US6624420B1 (en) 1999-02-18 2003-09-23 University Of Central Florida Lutetium yttrium orthosilicate single crystal scintillator detector
US6149819A (en) 1999-03-02 2000-11-21 United States Filter Corporation Air and water purification using continuous breakpoint halogenation and peroxygenation
US6143184A (en) 1999-03-02 2000-11-07 United States Filter Corporation Air and water purification using continuous breakpoint halogenation
US6256767B1 (en) 1999-03-29 2001-07-03 Hewlett-Packard Company Demultiplexer for a molecular wire crossbar network (MWCN DEMUX)
US6314019B1 (en) 1999-03-29 2001-11-06 Hewlett-Packard Company Molecular-wire crossbar interconnect (MWCI) for signal routing and communications
US6128214A (en) 1999-03-29 2000-10-03 Hewlett-Packard Molecular wire crossbar memory
US6459095B1 (en) 1999-03-29 2002-10-01 Hewlett-Packard Company Chemically synthesized and assembled electronics devices
US6559468B1 (en) * 1999-03-29 2003-05-06 Hewlett-Packard Development Company Lp Molecular wire transistor (MWT)
US6270074B1 (en) * 1999-04-14 2001-08-07 Hewlett-Packard Company Print media vacuum holddown
US7112315B2 (en) 1999-04-14 2006-09-26 The Regents Of The University Of California Molecular nanowires from single walled carbon nanotubes
AUPP976499A0 (en) 1999-04-16 1999-05-06 Commonwealth Scientific And Industrial Research Organisation Multilayer carbon nanotube films
US20030124509A1 (en) * 1999-06-03 2003-07-03 Kenis Paul J.A. Laminar flow patterning and articles made thereby
US6313015B1 (en) * 1999-06-08 2001-11-06 City University Of Hong Kong Growth method for silicon nanowires and nanoparticle chains from silicon monoxide
US6361861B2 (en) * 1999-06-14 2002-03-26 Battelle Memorial Institute Carbon nanotubes on a substrate
WO2001001475A1 (en) * 1999-06-30 2001-01-04 The Penn State Research Foundation Electrofluidic assembly of devices and components for micro- and nano-scale integration
AU782000B2 (en) * 1999-07-02 2005-06-23 President And Fellows Of Harvard College Nanoscopic wire-based devices, arrays, and methods of their manufacture
US6538367B1 (en) * 1999-07-15 2003-03-25 Agere Systems Inc. Field emitting device comprising field-concentrating nanoconductor assembly and method for making the same
US6322713B1 (en) 1999-07-15 2001-11-27 Agere Systems Guardian Corp. Nanoscale conductive connectors and method for making same
US6465132B1 (en) 1999-07-22 2002-10-15 Agere Systems Guardian Corp. Article comprising small diameter nanowires and method for making the same
US6286226B1 (en) * 1999-09-24 2001-09-11 Agere Systems Guardian Corp. Tactile sensor comprising nanowires and method for making the same
US6340822B1 (en) * 1999-10-05 2002-01-22 Agere Systems Guardian Corp. Article comprising vertically nano-interconnected circuit devices and method for making the same
US6741019B1 (en) * 1999-10-18 2004-05-25 Agere Systems, Inc. Article comprising aligned nanowires
US6437329B1 (en) * 1999-10-27 2002-08-20 Advanced Micro Devices, Inc. Use of carbon nanotubes as chemical sensors by incorporation of fluorescent molecules within the tube
US20050037374A1 (en) * 1999-11-08 2005-02-17 Melker Richard J. Combined nanotechnology and sensor technologies for simultaneous diagnosis and treatment
US6974706B1 (en) 2003-01-16 2005-12-13 University Of Florida Research Foundation, Inc. Application of biosensors for diagnosis and treatment of disease
US6248674B1 (en) * 2000-02-02 2001-06-19 Hewlett-Packard Company Method of aligning nanowires
EP1263887A1 (en) * 2000-02-04 2002-12-11 Massachusetts Institute Of Technology Insulated nanoscopic pathways, compositions and devices of the same
US7335603B2 (en) * 2000-02-07 2008-02-26 Vladimir Mancevski System and method for fabricating logic devices comprising carbon nanotube transistors
US6503375B1 (en) * 2000-02-11 2003-01-07 Applied Materials, Inc Electroplating apparatus using a perforated phosphorus doped consumable anode
US6294450B1 (en) 2000-03-01 2001-09-25 Hewlett-Packard Company Nanoscale patterning for the formation of extensive wires
WO2001070873A2 (en) * 2000-03-22 2001-09-27 University Of Massachusetts Nanocylinder arrays
US6720240B2 (en) * 2000-03-29 2004-04-13 Georgia Tech Research Corporation Silicon based nanospheres and nanowires
JP4089122B2 (en) 2000-03-31 2008-05-28 株式会社リコー Contact charger manufacturing method, contact charger obtained by the method, charging method and image recording apparatus
US6479028B1 (en) 2000-04-03 2002-11-12 The Regents Of The University Of California Rapid synthesis of carbon nanotubes and carbon encapsulated metal nanoparticles by a displacement reaction
US7323143B2 (en) * 2000-05-25 2008-01-29 President And Fellows Of Harvard College Microfluidic systems including three-dimensionally arrayed channel networks
US6440637B1 (en) 2000-06-28 2002-08-27 The Aerospace Corporation Electron beam lithography method forming nanocrystal shadowmasks and nanometer etch masks
EP1170799A3 (en) 2000-07-04 2009-04-01 Infineon Technologies AG Electronic device and method of manufacture of an electronic device
US6468677B1 (en) 2000-08-01 2002-10-22 Premark Rwp Holdings Inc. Electroluminescent high pressure laminate
US20060175601A1 (en) 2000-08-22 2006-08-10 President And Fellows Of Harvard College Nanoscale wires and related devices
US7301199B2 (en) 2000-08-22 2007-11-27 President And Fellows Of Harvard College Nanoscale wires and related devices
EP1314189B1 (en) * 2000-08-22 2013-02-27 President and Fellows of Harvard College Electrical device comprising doped semiconductor nanowires and method for its production
AU2002211807A1 (en) 2000-09-11 2002-03-26 Massachusetts Institute Of Technology Direct haplotyping using carbon nanotube probes
US6716409B2 (en) * 2000-09-18 2004-04-06 President And Fellows Of The Harvard College Fabrication of nanotube microscopy tips
AU2001294876A1 (en) * 2000-09-29 2002-04-08 President And Fellows Of Harvard College Direct growth of nanotubes, and their use in nanotweezers
CA2425412A1 (en) 2000-10-10 2002-04-18 Bioforce Nanosciences, Inc. Nanoscale sensor
JP3811004B2 (en) * 2000-11-26 2006-08-16 喜萬 中山 Conductive scanning microscope probe
AU2904602A (en) * 2000-12-11 2002-06-24 Harvard College Nanosensors
AU2002241568A1 (en) * 2000-12-12 2002-06-24 Corning Incorporated Optical fiber with very high negative dispersion slope
US20020084502A1 (en) * 2000-12-29 2002-07-04 Jin Jang Carbon nanotip and fabricating method thereof
US6958216B2 (en) 2001-01-10 2005-10-25 The Trustees Of Boston College DNA-bridged carbon nanotube arrays
US6586095B2 (en) * 2001-01-12 2003-07-01 Georgia Tech Research Corp. Semiconducting oxide nanostructures
WO2002093738A2 (en) * 2001-01-19 2002-11-21 California Institute Of Technology Carbon nanobimorph actuator and sensor
US7189435B2 (en) 2001-03-14 2007-03-13 University Of Massachusetts Nanofabrication
US8029734B2 (en) * 2001-03-29 2011-10-04 The Board Of Trustees Of The Leland Stanford Junior University Noncovalent sidewall functionalization of carbon nanotubes
US6803840B2 (en) 2001-03-30 2004-10-12 California Institute Of Technology Pattern-aligned carbon nanotube growth and tunable resonator apparatus
MXPA03008935A (en) 2001-03-30 2004-06-30 Univ California Methods of fabricating nanostructures and nanowires and devices fabricated therefrom.
WO2002086480A1 (en) 2001-04-18 2002-10-31 Stanford University Photodesorption in carbon nanotubes
US7232460B2 (en) * 2001-04-25 2007-06-19 Xillus, Inc. Nanodevices, microdevices and sensors on in-vivo structures and method for the same
US6902720B2 (en) * 2001-05-10 2005-06-07 Worcester Polytechnic Institute Cyclic peptide structures for molecular scale electronic and photonic devices
WO2002093140A1 (en) 2001-05-14 2002-11-21 Johns Hopkins University Multifunctional magnetic nanowires
CA2447728A1 (en) 2001-05-18 2003-01-16 President And Fellows Of Harvard College Nanoscale wires and related devices
US20030048619A1 (en) * 2001-06-15 2003-03-13 Kaler Eric W. Dielectrophoretic assembling of electrically functional microwires
US6846565B2 (en) * 2001-07-02 2005-01-25 Board Of Regents, The University Of Texas System Light-emitting nanoparticles and method of making same
WO2003007881A2 (en) * 2001-07-16 2003-01-30 The Trustees Of Columbia University In The City Of New York Antibodies specific for nanotubes and related methods and compositions
WO2003053851A2 (en) 2001-07-20 2003-07-03 President And Fellows Of Harvard College Transition metal oxide nanowires
KR100455284B1 (en) 2001-08-14 2004-11-12 삼성전자주식회사 High-throughput sensor for detecting biomolecules using carbon nanotubes
EP2405019A1 (en) * 2001-09-10 2012-01-11 Meso Scale Technologies LLC Methods, reagents, kits and apparatus for protein function analysis
US7482168B2 (en) * 2001-09-15 2009-01-27 The Regents Of The University Of California Photoluminescent polymetalloles as chemical sensors
US20030073071A1 (en) * 2001-10-12 2003-04-17 Jurgen Fritz Solid state sensing system and method for measuring the binding or hybridization of biomolecules
JP4435569B2 (en) * 2001-11-26 2010-03-17 ソニー ドイチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング Use of semiconductor materials as chemical sensing materials that are manufactured and operate at temperatures close to room temperature
US20030124717A1 (en) * 2001-11-26 2003-07-03 Yuji Awano Method of manufacturing carbon cylindrical structures and biopolymer detection device
US7385262B2 (en) * 2001-11-27 2008-06-10 The Board Of Trustees Of The Leland Stanford Junior University Band-structure modulation of nano-structures in an electric field
AU2002360593A1 (en) 2001-12-12 2003-07-09 Jorma Virtanen Method and apparatus for nano-sensing
US6882767B2 (en) * 2001-12-27 2005-04-19 The Regents Of The University Of California Nanowire optoelectric switching device and method
US20030134433A1 (en) * 2002-01-16 2003-07-17 Nanomix, Inc. Electronic sensing of chemical and biological agents using functionalized nanostructures
WO2003063208A2 (en) 2002-01-18 2003-07-31 California Institute Of Technology Array-based architecture for molecular electronics
CN1444259A (en) 2002-03-12 2003-09-24 株式会社东芝 Method for mfg. semiconductor device
US20040026684A1 (en) * 2002-04-02 2004-02-12 Nanosys, Inc. Nanowire heterostructures for encoding information
US6872645B2 (en) * 2002-04-02 2005-03-29 Nanosys, Inc. Methods of positioning and/or orienting nanostructures
US20030189202A1 (en) 2002-04-05 2003-10-09 Jun Li Nanowire devices and methods of fabrication
US20040067530A1 (en) * 2002-05-08 2004-04-08 The Regents Of The University Of California Electronic sensing of biomolecular processes
WO2004003535A1 (en) 2002-06-27 2004-01-08 Nanosys Inc. Planar nanowire based sensor elements, devices, systems and methods for using and making same
US7335908B2 (en) * 2002-07-08 2008-02-26 Qunano Ab Nanostructures and methods for manufacturing the same
AU2003261205A1 (en) * 2002-07-19 2004-02-09 President And Fellows Of Harvard College Nanoscale coherent optical components
JP2005539404A (en) * 2002-07-25 2005-12-22 カリフォルニア インスティテュート オヴ テクノロジー Sub-pattern transfer nanoscale memory structure
WO2004027822A2 (en) * 2002-09-05 2004-04-01 Nanosys, Inc. Oriented nanostructures and methods of preparing
EP2399970A3 (en) * 2002-09-05 2012-04-18 Nanosys, Inc. Nanocomposites
WO2004023527A2 (en) * 2002-09-05 2004-03-18 Nanosys, Inc. Nanostructure and nanocomposite based compositions and photovoltaic devices
US7572393B2 (en) * 2002-09-05 2009-08-11 Nanosys Inc. Organic species that facilitate charge transfer to or from nanostructures
US7135728B2 (en) * 2002-09-30 2006-11-14 Nanosys, Inc. Large-area nanoenabled macroelectronic substrates and uses therefor
CA2499944A1 (en) 2002-09-30 2004-04-15 Nanosys, Inc. Integrated displays using nanowire transistors
CA2499965C (en) 2002-09-30 2013-03-19 Nanosys, Inc. Large-area nanoenabled macroelectronic substrates and uses therefor
US7051945B2 (en) * 2002-09-30 2006-05-30 Nanosys, Inc Applications of nano-enabled large area macroelectronic substrates incorporating nanowires and nanowire composites
US7067867B2 (en) * 2002-09-30 2006-06-27 Nanosys, Inc. Large-area nonenabled macroelectronic substrates and uses therefor
AU2003282548A1 (en) 2002-10-10 2004-05-04 Nanosys, Inc. Nano-chem-fet based biosensors
US7163659B2 (en) * 2002-12-03 2007-01-16 Hewlett-Packard Development Company, L.P. Free-standing nanowire sensor and method for detecting an analyte in a fluid
US6815706B2 (en) 2002-12-17 2004-11-09 Hewlett-Packard Development Company, L.P. Nano optical sensors via molecular self-assembly
US20040191517A1 (en) * 2003-03-26 2004-09-30 Industrial Technology Research Institute Self-assembling nanowires
US7274208B2 (en) * 2003-06-02 2007-09-25 California Institute Of Technology Nanoscale wire-based sublithographic programmable logic arrays
CN1863954B (en) * 2003-08-04 2013-07-31 纳米系统公司 System and process for producing nanowire composites and electronic substrates therefrom
US7067328B2 (en) * 2003-09-25 2006-06-27 Nanosys, Inc. Methods, devices and compositions for depositing and orienting nanostructures
US20050253137A1 (en) 2003-11-20 2005-11-17 President And Fellows Of Harvard College Nanoscale arrays, robust nanostructures, and related devices
US7662706B2 (en) * 2003-11-26 2010-02-16 Qunano Ab Nanostructures formed of branched nanowhiskers and methods of producing the same
WO2005093831A1 (en) 2004-02-13 2005-10-06 President And Fellows Of Harvard College Nanostructures containing metal-semiconductor compounds
US20090227107A9 (en) * 2004-02-13 2009-09-10 President And Fellows Of Havard College Nanostructures Containing Metal Semiconductor Compounds
US7595528B2 (en) 2004-03-10 2009-09-29 Nanosys, Inc. Nano-enabled memory devices and anisotropic charge carrying arrays
EP1723676A4 (en) 2004-03-10 2009-04-15 Nanosys Inc Nano-enabled memory devices and anisotropic charge carrying arrays
US20050202615A1 (en) 2004-03-10 2005-09-15 Nanosys, Inc. Nano-enabled memory devices and anisotropic charge carrying arrays
WO2005094440A2 (en) 2004-03-18 2005-10-13 Nanosys Inc. Nanofiber surface based capacitors
US7115971B2 (en) 2004-03-23 2006-10-03 Nanosys, Inc. Nanowire varactor diode and methods of making same
CA2564220A1 (en) 2004-04-30 2005-12-15 Nanosys, Inc. Systems and methods for nanowire growth and harvesting
JP2007538274A (en) 2004-05-13 2007-12-27 ザ リージェンツ オブ ザ ユニヴァーシティ オブ カリフォルニア Nanowires and nanoribbons as subwavelength optical waveguides, and use of these nanostructures in optical circuits and optical element components
US7129154B2 (en) 2004-05-28 2006-10-31 Agilent Technologies, Inc Method of growing semiconductor nanowires with uniform cross-sectional area using chemical vapor deposition
CA2567930A1 (en) 2004-06-08 2005-12-22 Nanosys, Inc. Methods and devices for forming nanostructure monolayers and devices including such monolayers
WO2006016914A2 (en) * 2004-07-07 2006-02-16 Nanosys, Inc. Methods for nanowire growth
WO2006084128A2 (en) * 2005-02-04 2006-08-10 Brown University Apparatus, method and computer program product providing radial addressing of nanowires
US20070048482A1 (en) * 2005-03-21 2007-03-01 Kadlec Gary F Disposable protective sheeting for decks and floors
US20060269927A1 (en) 2005-05-25 2006-11-30 Lieber Charles M Nanoscale sensors
WO2006132659A2 (en) 2005-06-06 2006-12-14 President And Fellows Of Harvard College Nanowire heterostructures
US7481930B2 (en) * 2005-07-29 2009-01-27 Rg Delaware, Inc. Filter having a filter layer that forms a protective barrier to prevent clogging of a gravel-less underdrain and method of making the same
US20090299213A1 (en) 2006-03-15 2009-12-03 President And Fellows Of Harvard College Nanobioelectronics
WO2007145701A2 (en) 2006-04-07 2007-12-21 President And Fellows Of Harvard College Nanoscale wire methods and devices
WO2008033303A2 (en) 2006-09-11 2008-03-20 President And Fellows Of Harvard College Branched nanoscale wires
WO2008123869A2 (en) 2006-11-21 2008-10-16 President And Fellows Of Harvard College Millimeter-long nanowires
WO2008127314A1 (en) 2006-11-22 2008-10-23 President And Fellows Of Harvard College High-sensitivity nanoscale wire sensors

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8871623B2 (en) 2004-06-08 2014-10-28 Sandisk Corporation Methods and devices for forming nanostructure monolayers and devices including such monolayers
US8981452B2 (en) 2004-06-08 2015-03-17 Sandisk Corporation Methods and devices for forming nanostructure monolayers and devices including such monolayers
US9149836B2 (en) 2004-06-08 2015-10-06 Sandisk Corporation Compositions and methods for modulation of nanostructure energy levels

Also Published As

Publication number Publication date
CN1550030A (en) 2004-11-24
CN101887935B (en) 2013-09-11
KR20070093461A (en) 2007-09-18
CN101798057A (en) 2010-08-11
US20070032051A1 (en) 2007-02-08
KR100995457B1 (en) 2010-11-18
US20120329251A1 (en) 2012-12-27
TW200616020A (en) 2006-05-16
JP2004507104A (en) 2004-03-04
KR100862131B1 (en) 2008-10-09
EP2298968A3 (en) 2011-10-05
TWI292583B (en) 2008-01-11
EP2298968A2 (en) 2011-03-23
US7211464B2 (en) 2007-05-01
US20070032023A1 (en) 2007-02-08
US20100093158A1 (en) 2010-04-15
US20070026645A1 (en) 2007-02-01
US20050164432A1 (en) 2005-07-28
AU2001286649C1 (en) 2002-03-04
US8153470B2 (en) 2012-04-10
US7666708B2 (en) 2010-02-23
KR20080070774A (en) 2008-07-30
EP2360298A3 (en) 2011-10-05
AU8664901A (en) 2002-03-04
CA2417992C (en) 2010-10-19
JP5013650B2 (en) 2012-08-29
US7915151B2 (en) 2011-03-29
WO2002017362A2 (en) 2002-02-28
US20070252136A1 (en) 2007-11-01
KR20030043938A (en) 2003-06-02
KR20080005613A (en) 2008-01-14
AU2001286649B2 (en) 2007-04-05
CN100565783C (en) 2009-12-02
KR100791732B1 (en) 2008-01-04
KR100984585B1 (en) 2010-09-30
MXPA03001605A (en) 2005-06-20
US7476596B2 (en) 2009-01-13
US20070032052A1 (en) 2007-02-08
EP2360298A2 (en) 2011-08-24
US7595260B2 (en) 2009-09-29
CA2417992A1 (en) 2002-02-28
EP1314189A2 (en) 2003-05-28
CN101887935A (en) 2010-11-17
TWI294636B (en) 2008-03-11
US20020130311A1 (en) 2002-09-19
EP1314189B1 (en) 2013-02-27
US20070048492A1 (en) 2007-03-01

Similar Documents

Publication Publication Date Title
WO2002017362A8 (en) Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors and fabricating such devices
US5953361A (en) DFB laser diode structure having complex optical grating coupling
KR970018759A (en) Semiconductor light emitting device and manufacturing method thereof
FR2734097A1 (en) SEMICONDUCTOR LASER
FR2684823A1 (en) SEMICONDUCTOR OPTICAL COMPONENT WITH ENLARGED OUTPUT MODE AND MANUFACTURING METHOD THEREOF.
FR2660439A1 (en) INTEGRATED GUIDING STRUCTURE IN THREE DIMENSIONS AND METHOD FOR PRODUCING THE SAME
US6317445B1 (en) Flared and tapered rib waveguide semiconductor laser and method for making same
KR960036160A (en) Compound semiconductor light emitting device and manufacturing method thereof
KR960030452A (en) Compound semiconductor light receiving element and manufacturing method thereof
EP3447549B1 (en) Semiconductor structure with suspended membrane under stress comprising an optical cavity
FR2492168A1 (en) SEMICONDUCTOR PHOTODIODE
EP1071180A4 (en) n-TYPE MODULATION DOPE MULTIPLE QUANTUM WELL SEMICONDUCTOR LASER
EP1024566A3 (en) Semiconductor laser device and method of manufacturing same
DE60106742D1 (en) HIGH-PERFORMANCE SUPER-LIGHTING DIODE WITH A CROPPED MULTI-SPEED WAVEGUIDE
EP0014116B1 (en) Heterojunction semiconductor device
FR2618947A1 (en) INTEGRATED SEMICONDUCTOR CIRCUIT COMPRISING FIELD EFFECT TRANSISTORS
FR3038689A1 (en) DEVICE COMPRISING A FLEXIBLE CRADLE
DE60204848T2 (en) APPLICATION OF AN OPTICAL COMPONENT TO A REFRIGERATOR
FR2681146A1 (en) OPTOELECTRONIC DEVICE WITH INTEGRATED OPTICAL GUIDE AND PHOTODETECTOR AND METHOD OF MAKING SAME.
KR970072507A (en) Method for manufacturing a horizontal semiconductor PN junction array
EP0354084A1 (en) Concrete cornice elements
Huang et al. Photoluminescence from SiGe/Si quantum dots with wavelength in the visible range
Berseth et al. Mode confinement in VCSEL-based photonic heterostructures
FR2787067A1 (en) VEHICLE SUN VISOR
Kim et al. Al free active region high power laser diode array on misoriented wafers

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PH PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
AK Designated states

Kind code of ref document: C1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PH PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: C1

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

WWE Wipo information: entry into national phase

Ref document number: 2001286649

Country of ref document: AU

WWE Wipo information: entry into national phase

Ref document number: 2417992

Country of ref document: CA

WWE Wipo information: entry into national phase

Ref document number: PA/a/2003/001605

Country of ref document: MX

WWE Wipo information: entry into national phase

Ref document number: 1020037002636

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 2002521336

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 2001966109

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 018161685

Country of ref document: CN

WWP Wipo information: published in national office

Ref document number: 2001966109

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 1020037002636

Country of ref document: KR

REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

WWG Wipo information: grant in national office

Ref document number: 2001286649

Country of ref document: AU