WO2002015237A3 - Changing local compressibility of a wafer support member - Google Patents
Changing local compressibility of a wafer support member Download PDFInfo
- Publication number
- WO2002015237A3 WO2002015237A3 PCT/US2001/024904 US0124904W WO0215237A3 WO 2002015237 A3 WO2002015237 A3 WO 2002015237A3 US 0124904 W US0124904 W US 0124904W WO 0215237 A3 WO0215237 A3 WO 0215237A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- support member
- wafer support
- sealant material
- pores
- wager
- Prior art date
Links
- 239000012812 sealant material Substances 0.000 abstract 4
- 239000011148 porous material Substances 0.000 abstract 3
- 239000012530 fluid Substances 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
Abstract
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US22431900P | 2000-08-11 | 2000-08-11 | |
US60/224,319 | 2000-08-11 |
Publications (3)
Publication Number | Publication Date |
---|---|
WO2002015237A2 WO2002015237A2 (en) | 2002-02-21 |
WO2002015237A3 true WO2002015237A3 (en) | 2002-04-11 |
WO2002015237B1 WO2002015237B1 (en) | 2002-06-27 |
Family
ID=22840138
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2001/024904 WO2002015237A2 (en) | 2000-08-11 | 2001-08-08 | Changing local compressibility of a wafer support member |
Country Status (3)
Country | Link |
---|---|
US (1) | US20020022082A1 (en) |
TW (1) | TW506038B (en) |
WO (1) | WO2002015237A2 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7055229B2 (en) * | 2003-12-31 | 2006-06-06 | Intel Corporation | Support system for semiconductor wafers and methods thereof |
CN104076619A (en) * | 2014-07-03 | 2014-10-01 | 无锡宏纳科技有限公司 | Contact type photoetching machine sucking disc |
CN109887877B (en) * | 2019-01-02 | 2021-09-14 | 长江存储科技有限责任公司 | Wafer fixing table and wafer bonding equipment |
CN113471135B (en) * | 2021-07-06 | 2022-07-29 | 华海清科股份有限公司 | Wafer clamping device and wafer cleaning device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0776730A1 (en) * | 1995-11-30 | 1997-06-04 | Rodel Nitta Company | Workpiece retaining device and method for producing the same |
-
2001
- 2001-08-08 WO PCT/US2001/024904 patent/WO2002015237A2/en active Application Filing
- 2001-08-08 US US09/924,825 patent/US20020022082A1/en not_active Abandoned
- 2001-08-10 TW TW090119627A patent/TW506038B/en not_active IP Right Cessation
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0776730A1 (en) * | 1995-11-30 | 1997-06-04 | Rodel Nitta Company | Workpiece retaining device and method for producing the same |
Also Published As
Publication number | Publication date |
---|---|
WO2002015237A2 (en) | 2002-02-21 |
US20020022082A1 (en) | 2002-02-21 |
TW506038B (en) | 2002-10-11 |
WO2002015237B1 (en) | 2002-06-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2004092833A3 (en) | Environmental system including a transport region for an immersion lithography apparatus | |
WO2006113496A3 (en) | Valve apparatus, system and method | |
CA2261869A1 (en) | Integrated microfluidic devices | |
SE9904517D0 (en) | Device and method of fabrication of structures | |
WO2003032957A3 (en) | Methods for hermetically sealing microchip reservoir devices | |
WO2003029705A3 (en) | Cylindrical gate valve | |
AU2001289443A1 (en) | Seal assembly with two sealing mechanisms for providing static and dynamic sealing | |
NO20012092D0 (en) | Differential pressure valve for gasket annulus | |
WO2001067087A3 (en) | Fluid handling devices with diamond-like films | |
EP1766663A4 (en) | Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates | |
CA2380114A1 (en) | Imprint method and device | |
WO2004058425A3 (en) | Micro electromechanical systems for delivering high purity fluids in a chemical delivery system | |
AU2367001A (en) | Device for storing and dispensing a free-flowing substance | |
EP1102286A4 (en) | Hole sealing plate and pressure regulating mechanism for the hole sealing plate | |
AU1753601A (en) | Apparatus for maintaining a fluid seal with a moving substrate | |
WO2003093674A3 (en) | Electroosmotic flow systems | |
WO2002048050A3 (en) | Fluid treatment system and radiation source module for use therein | |
WO2002015237A3 (en) | Changing local compressibility of a wafer support member | |
TW200707633A (en) | Isolation layer for semiconductor devices and method for forming the same | |
WO2003032374A3 (en) | Workpiece carrier with adjustable pressure zones and barriers | |
EP1486655A3 (en) | Valve device and multiport regulating assembly comprising a plurality of such devices | |
DK0991887T3 (en) | Differential valve for undersea flexible piping | |
WO2004073029A3 (en) | Vacuum chuck utilizing sintered material and method of providing | |
SE9802123D0 (en) | directional valve | |
AU2003221953A1 (en) | A fluid metering system for preventing flood damage or fluid leakage |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A2 Designated state(s): JP KR |
|
AL | Designated countries for regional patents |
Kind code of ref document: A2 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR |
|
AK | Designated states |
Kind code of ref document: A3 Designated state(s): JP KR |
|
AL | Designated countries for regional patents |
Kind code of ref document: A3 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR |
|
DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
AK | Designated states |
Kind code of ref document: B1 Designated state(s): JP KR |
|
AL | Designated countries for regional patents |
Kind code of ref document: B1 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR |
|
122 | Ep: pct application non-entry in european phase | ||
NENP | Non-entry into the national phase |
Ref country code: JP |