WO2002011501A1 - Tableau de connexions - Google Patents

Tableau de connexions Download PDF

Info

Publication number
WO2002011501A1
WO2002011501A1 PCT/JP2001/006329 JP0106329W WO0211501A1 WO 2002011501 A1 WO2002011501 A1 WO 2002011501A1 JP 0106329 W JP0106329 W JP 0106329W WO 0211501 A1 WO0211501 A1 WO 0211501A1
Authority
WO
WIPO (PCT)
Prior art keywords
wiring board
film
shield film
wiring
surface side
Prior art date
Application number
PCT/JP2001/006329
Other languages
English (en)
French (fr)
Inventor
Yoshifumi Ueno
Yukihiro Takikawa
Original Assignee
Sony Chemicals Corp.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemicals Corp. filed Critical Sony Chemicals Corp.
Priority to KR10-2003-7001128A priority Critical patent/KR20030016428A/ko
Publication of WO2002011501A1 publication Critical patent/WO2002011501A1/ja
Priority to US10/351,725 priority patent/US6777622B2/en
Priority to HK04100717A priority patent/HK1057959A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/08—Flat or ribbon cables
    • H01B7/0861—Flat or ribbon cables comprising one or more screens
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
PCT/JP2001/006329 2000-07-27 2001-07-23 Tableau de connexions WO2002011501A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR10-2003-7001128A KR20030016428A (ko) 2000-07-27 2001-07-23 배선 기판
US10/351,725 US6777622B2 (en) 2000-07-27 2003-01-27 Wiring boards
HK04100717A HK1057959A1 (en) 2000-07-27 2004-02-03 Wiring board

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000226495A JP3565768B2 (ja) 2000-07-27 2000-07-27 配線基板
JP2000-226495 2000-07-27

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US10/351,725 Continuation US6777622B2 (en) 2000-07-27 2003-01-27 Wiring boards

Publications (1)

Publication Number Publication Date
WO2002011501A1 true WO2002011501A1 (fr) 2002-02-07

Family

ID=18720104

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2001/006329 WO2002011501A1 (fr) 2000-07-27 2001-07-23 Tableau de connexions

Country Status (7)

Country Link
US (1) US6777622B2 (ja)
JP (1) JP3565768B2 (ja)
KR (1) KR20030016428A (ja)
CN (2) CN100338978C (ja)
HK (2) HK1080674A1 (ja)
TW (1) TW490681B (ja)
WO (1) WO2002011501A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1305038C (zh) * 2002-04-26 2007-03-14 三洋电机株式会社 光拾取装置

Families Citing this family (38)

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JP4294303B2 (ja) * 2002-11-29 2009-07-08 株式会社日本自動車部品総合研究所 プリント基板およびメータ装置
JP3879682B2 (ja) * 2003-03-10 2007-02-14 株式会社デンソー 回路基板の製造方法
US20040199069A1 (en) * 2003-04-02 2004-10-07 Connelly Patrick R. Device and method for preventing magnetic resonance imaging induced damage
JP2006059962A (ja) * 2004-08-19 2006-03-02 Sumitomo Bakelite Co Ltd リジッドフレックス回路基板およびその製造方法
US7528797B2 (en) * 2005-08-29 2009-05-05 Kyocera Wireless Corp. Electrical connector with frequency-tuned groundplane
JP4596955B2 (ja) * 2005-03-31 2010-12-15 ソニーケミカル＆インフォメーションデバイス株式会社 配線基板
CN1725387B (zh) * 2005-06-21 2011-08-17 番禺得意精密电子工业有限公司 一种线缆组件及这种线缆组件与电路板的连接方法
KR100640659B1 (ko) 2005-08-01 2006-11-01 삼성전자주식회사 가요성 인쇄회로 및 이의 제조방법
JP4566089B2 (ja) * 2005-08-08 2010-10-20 日本電信電話株式会社 フレキシブル基板を使用した双方向光トランシーバ
JP4877791B2 (ja) * 2007-01-26 2012-02-15 日東電工株式会社 配線回路基板
JP4852442B2 (ja) * 2007-02-15 2012-01-11 日本オプネクスト株式会社 光送信モジュール
JP4898564B2 (ja) * 2007-06-06 2012-03-14 ソニーケミカル＆インフォメーションデバイス株式会社 プリント配線板の製造方法及びプリント配線板の製造装置
JP2009064909A (ja) * 2007-09-05 2009-03-26 Alps Electric Co Ltd 多層セラミック配線板およびその製造方法
JP5075568B2 (ja) * 2007-10-17 2012-11-21 株式会社フジクラ シールド付回路配線基板及びその製造方法
JP5151497B2 (ja) * 2008-01-18 2013-02-27 株式会社リコー 電子撮像装置
US8120927B2 (en) * 2008-04-07 2012-02-21 Mediatek Inc. Printed circuit board
EP2129194B1 (en) 2008-05-27 2013-08-07 VIA Technologies, Inc. Electronic apparatus
CN101840704A (zh) * 2009-03-17 2010-09-22 新科实业有限公司 具有附加触点的悬臂件、磁头折片组合及磁盘驱动单元
TWI387407B (zh) * 2009-06-10 2013-02-21 Htc Corp 軟式印刷電路板其及組成方法
US8677617B2 (en) 2010-04-28 2014-03-25 International Business Machines Corporation Printed circuit board edge connector
KR101133732B1 (ko) * 2010-07-06 2012-04-09 (주)기가레인 연질의 신호 전송 기판
CN102355794B (zh) * 2011-09-16 2016-04-06 珠海市超赢电子科技有限公司 一种双层柔性线路板
CN103582280B (zh) * 2012-07-20 2017-10-03 鸿富锦精密工业（深圳）有限公司 电路板装置
CN103582284B (zh) * 2012-07-30 2017-12-01 鸿富锦精密工业（深圳）有限公司 相机模组用的电路板装置
KR101804496B1 (ko) * 2013-07-17 2017-12-04 가부시키가이샤 무라타 세이사쿠쇼 전자부품 및 그 제조방법
TWI573498B (zh) * 2013-07-26 2017-03-01 Adv Flexible Circuits Co Ltd The flattened cladding structure of soft circuit board
FR3011326B1 (fr) * 2013-10-02 2016-04-01 Soc Fr Detecteurs Infrarouges Sofradir Circuit imprime flexible a faible emissivite
JP6409267B2 (ja) * 2013-10-15 2018-10-24 セイコーエプソン株式会社 量子干渉装置、原子発振器、電子機器および移動体
JP6070588B2 (ja) * 2014-01-24 2017-02-01 株式会社村田製作所 多層配線基板
JP6484922B2 (ja) * 2014-03-20 2019-03-20 セイコーエプソン株式会社 原子セル、量子干渉装置、原子発振器および電子機器
WO2016179606A1 (en) * 2015-05-07 2016-11-10 Wilson Electronics, Llc Flat coaxial cable
CN105845206B (zh) * 2016-03-29 2018-05-18 朱悦 用于电脑显示器的扁平线缆
CN209930597U (zh) * 2016-08-26 2020-01-10 株式会社村田制作所 树脂多层基板、传输线路以及模块
EP3297093B1 (de) * 2016-09-16 2019-01-02 Rosenberger Hochfrequenztechnik GmbH & Co. KG Steckverbinder zum verbinden einer optischen faser und eines elektrischen leiters
CN107241853A (zh) * 2017-06-29 2017-10-10 广州兴森快捷电路科技有限公司 一种屏蔽型刚挠结合板及其制造方法
JP6715411B2 (ja) * 2018-07-27 2020-07-01 株式会社テクノ・コア 信号伝送用フラットケーブル及びその製造方法
CN109275263A (zh) * 2018-11-23 2019-01-25 威创集团股份有限公司 一种fpc板的制备方法、及fpc板
JP7224921B2 (ja) 2019-01-09 2023-02-20 日本ルメンタム株式会社 光モジュール及び光モジュールの製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4113164Y1 (ja) * 1964-11-27 1966-06-22
JPH08125380A (ja) * 1994-10-19 1996-05-17 Sumitomo Electric Ind Ltd シールド付きフレキシブル配線板及びその製造方法
JP2000173355A (ja) * 1998-12-07 2000-06-23 Taiko Denki Co Ltd シールドフラットケーブル

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1261481A (en) * 1986-03-13 1989-09-26 Kazumasa Eguchi Printed circuit board capable of preventing electromagnetic interference
JPH04101316A (ja) 1990-08-20 1992-04-02 Meidensha Corp パッファ形ガス遮断器
JPH0693552B2 (ja) * 1990-11-29 1994-11-16 日本メクトロン株式会社 シールド型可撓性回路基板及びその製造法
JPH04101316U (ja) * 1991-02-20 1992-09-01 古河電気工業株式会社 遮蔽付フラツトケーブル
KR960028736A (ko) * 1994-12-07 1996-07-22 오오가 노리오 프린트 기판
US6486394B1 (en) * 1996-07-31 2002-11-26 Dyconex Patente Ag Process for producing connecting conductors
CN1226993A (zh) * 1997-05-16 1999-08-25 古河电气工业株式会社 扁形电缆及其制造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4113164Y1 (ja) * 1964-11-27 1966-06-22
JPH08125380A (ja) * 1994-10-19 1996-05-17 Sumitomo Electric Ind Ltd シールド付きフレキシブル配線板及びその製造方法
JP2000173355A (ja) * 1998-12-07 2000-06-23 Taiko Denki Co Ltd シールドフラットケーブル

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1305038C (zh) * 2002-04-26 2007-03-14 三洋电机株式会社 光拾取装置

Also Published As

Publication number Publication date
TW490681B (en) 2002-06-11
JP2002043708A (ja) 2002-02-08
HK1080674A1 (en) 2006-04-28
CN1674759A (zh) 2005-09-28
CN100338978C (zh) 2007-09-19
CN1251561C (zh) 2006-04-12
US6777622B2 (en) 2004-08-17
HK1057959A1 (en) 2004-04-23
CN1444837A (zh) 2003-09-24
JP3565768B2 (ja) 2004-09-15
KR20030016428A (ko) 2003-02-26
US20030112617A1 (en) 2003-06-19

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