WO2002011188A3 - A mem sensor and a method of making same - Google Patents

A mem sensor and a method of making same Download PDF

Info

Publication number
WO2002011188A3
WO2002011188A3 PCT/US2001/023797 US0123797W WO0211188A3 WO 2002011188 A3 WO2002011188 A3 WO 2002011188A3 US 0123797 W US0123797 W US 0123797W WO 0211188 A3 WO0211188 A3 WO 0211188A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
wafer
mating
mating structure
making same
Prior art date
Application number
PCT/US2001/023797
Other languages
French (fr)
Other versions
WO2002011188A2 (en
Inventor
Randall L Kubena
Michael J Little
Leroy H Hackett
Original Assignee
Hrl Lab Llc
Hughes Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hrl Lab Llc, Hughes Electronics Corp filed Critical Hrl Lab Llc
Priority to AU2001278067A priority Critical patent/AU2001278067A1/en
Priority to JP2002516816A priority patent/JP2004504951A/en
Priority to EP01956027A priority patent/EP1305640A2/en
Publication of WO2002011188A2 publication Critical patent/WO2002011188A2/en
Publication of WO2002011188A3 publication Critical patent/WO2002011188A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/0015—Cantilevers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0292—Sensors not provided for in B81B2201/0207 - B81B2201/0285
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/033—Thermal bonding
    • B81C2203/036—Fusion bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H59/00—Electrostatic relays; Electro-adhesion relays
    • H01H59/0009—Electrostatic relays; Electro-adhesion relays making use of micromechanics

Abstract

A method of making a micro electro-mechanical switch or tunneling sensor. A cantilevered beamstructure and a mating structure are defined on a first substrate or wafer; and at least one contactstructure and a mating structure are defined on a second substrate or wafer, the mating structureon the second substrate or wafer being of a complementary shape to the mating structure on thefirst substrate or wafer. A bonding layer, preferably a eutectic bonding layer, is provided on at least one of the mating structures. The mating structure of the first substrate is moved into aconfronting relationship with the mating structure of the second substrate or wafer. Pressure isapplied between the two substrates so as to cause a bond to occur between the two mating structures at the bonding or eutectic layer. Then the first substrate or wafer is removed to free thecantilevered beam structure for movement relative to the second substrate or wafer.
PCT/US2001/023797 2000-08-01 2001-07-27 A mem sensor and a method of making same WO2002011188A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
AU2001278067A AU2001278067A1 (en) 2000-08-01 2001-07-27 A mem sensor and a method of making same
JP2002516816A JP2004504951A (en) 2000-08-01 2001-07-27 Micro electro mechanical sensor and method of manufacturing the same
EP01956027A EP1305640A2 (en) 2000-08-01 2001-07-27 A mem sensor and a method of making same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/629,684 2000-08-01
US09/629,684 US6630367B1 (en) 2000-08-01 2000-08-01 Single crystal dual wafer, tunneling sensor and a method of making same

Publications (2)

Publication Number Publication Date
WO2002011188A2 WO2002011188A2 (en) 2002-02-07
WO2002011188A3 true WO2002011188A3 (en) 2002-05-02

Family

ID=24524052

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/023797 WO2002011188A2 (en) 2000-08-01 2001-07-27 A mem sensor and a method of making same

Country Status (6)

Country Link
US (2) US6630367B1 (en)
EP (1) EP1305640A2 (en)
JP (1) JP2004504951A (en)
AU (1) AU2001278067A1 (en)
TW (1) TW504488B (en)
WO (1) WO2002011188A2 (en)

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US20040069742A1 (en) * 2002-06-19 2004-04-15 Pan Shaoher X. Fabrication of a reflective spatial light modulator
US20030234994A1 (en) * 2002-06-19 2003-12-25 Pan Shaoher X. Reflective spatial light modulator
US6992810B2 (en) * 2002-06-19 2006-01-31 Miradia Inc. High fill ratio reflective spatial light modulator with hidden hinge
US7206110B2 (en) * 2002-06-19 2007-04-17 Miradia Inc. Memory cell dual protection
US7034984B2 (en) * 2002-06-19 2006-04-25 Miradia Inc. Fabrication of a high fill ratio reflective spatial light modulator with hidden hinge
US6908201B2 (en) * 2002-06-28 2005-06-21 Silicon Light Machines Corporation Micro-support structures
US6955745B1 (en) * 2002-08-01 2005-10-18 University Of Florida Research Foundation, Inc. Method of spark-processing silicon and resulting materials
US7551048B2 (en) * 2002-08-08 2009-06-23 Fujitsu Component Limited Micro-relay and method of fabricating the same
US6647809B1 (en) * 2002-08-29 2003-11-18 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Silicon carbide high temperature anemometer and method for assembling the same
AU2003901914A0 (en) * 2003-04-22 2003-05-08 Quantum Precision Instruments Pty Ltd Quantum tunnelling transducer device
US7026695B2 (en) * 2003-11-19 2006-04-11 Miradia Inc. Method and apparatus to reduce parasitic forces in electro-mechanical systems
US20050255666A1 (en) * 2004-05-11 2005-11-17 Miradia Inc. Method and structure for aligning mechanical based device to integrated circuits
US7449284B2 (en) * 2004-05-11 2008-11-11 Miradia Inc. Method and structure for fabricating mechanical mirror structures using backside alignment techniques
US7042619B1 (en) * 2004-06-18 2006-05-09 Miradia Inc. Mirror structure with single crystal silicon cross-member
US7068417B2 (en) * 2004-07-28 2006-06-27 Miradia Inc. Method and apparatus for a reflective spatial light modulator with a flexible pedestal
US7199918B2 (en) * 2005-01-07 2007-04-03 Miradia Inc. Electrical contact method and structure for deflection devices formed in an array configuration
US7202989B2 (en) 2005-06-01 2007-04-10 Miradia Inc. Method and device for fabricating a release structure to facilitate bonding of mirror devices onto a substrate
US7298539B2 (en) * 2005-06-01 2007-11-20 Miradia Inc. Co-planar surface and torsion device mirror structure and method of manufacture for optical displays
US7184195B2 (en) 2005-06-15 2007-02-27 Miradia Inc. Method and structure reducing parasitic influences of deflection devices in an integrated spatial light modulator
US7190508B2 (en) 2005-06-15 2007-03-13 Miradia Inc. Method and structure of patterning landing pad structures for spatial light modulators
US7382513B2 (en) * 2005-10-13 2008-06-03 Miradia Inc. Spatial light modulator with multi-layer landing structures
US7502158B2 (en) 2005-10-13 2009-03-10 Miradia Inc. Method and structure for high fill factor spatial light modulator with integrated spacer layer
EP2002511A4 (en) * 2006-03-08 2012-02-29 Wispry Inc Tunable impedance matching networks and tunable diplexer matching systems
US8635765B2 (en) * 2011-06-15 2014-01-28 International Business Machines Corporation Method of forming micro-electrical-mechanical structure (MEMS)
US8916407B1 (en) 2012-03-29 2014-12-23 Sitime Corporation MEMS device and method of manufacturing same
US10160638B2 (en) * 2013-01-04 2018-12-25 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for a semiconductor structure
US9038269B2 (en) * 2013-04-02 2015-05-26 Xerox Corporation Printhead with nanotips for nanoscale printing and manufacturing
WO2015149331A1 (en) 2014-04-03 2015-10-08 台湾超微光学股份有限公司 Spectrometer, manufacturing method for waveguide of spectrometer and structure thereof
US11078075B2 (en) 2015-12-31 2021-08-03 Taiwan Semiconductor Manufacturing Company Ltd. Packaging method and associated packaging structure
US10850976B2 (en) * 2018-09-21 2020-12-01 Taiwan Semiconductor Manufacturing Co., Ltd. Method of making ohmic contact on low doped bulk silicon for optical alignment

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Also Published As

Publication number Publication date
WO2002011188A2 (en) 2002-02-07
US6730978B2 (en) 2004-05-04
US20030207487A1 (en) 2003-11-06
US6630367B1 (en) 2003-10-07
EP1305640A2 (en) 2003-05-02
AU2001278067A1 (en) 2002-02-13
TW504488B (en) 2002-10-01
JP2004504951A (en) 2004-02-19

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