WO2002006152B1 - System and method for constraining totally released microcomponents - Google Patents

System and method for constraining totally released microcomponents

Info

Publication number
WO2002006152B1
WO2002006152B1 PCT/US2001/021899 US0121899W WO0206152B1 WO 2002006152 B1 WO2002006152 B1 WO 2002006152B1 US 0121899 W US0121899 W US 0121899W WO 0206152 B1 WO0206152 B1 WO 0206152B1
Authority
WO
WIPO (PCT)
Prior art keywords
microcomponent
constraining
base
released
substrate
Prior art date
Application number
PCT/US2001/021899
Other languages
French (fr)
Other versions
WO2002006152A3 (en
WO2002006152A2 (en
Inventor
Matthew D Ellis
Eric G Parker
George D Skidmore
Original Assignee
Zyvex Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zyvex Corp filed Critical Zyvex Corp
Priority to KR10-2003-7000550A priority Critical patent/KR100539137B1/en
Priority to AU2001271984A priority patent/AU2001271984A1/en
Priority to DE60124423T priority patent/DE60124423T2/en
Priority to JP2002512060A priority patent/JP2004504172A/en
Priority to EP01951048A priority patent/EP1345843B1/en
Publication of WO2002006152A2 publication Critical patent/WO2002006152A2/en
Publication of WO2002006152A3 publication Critical patent/WO2002006152A3/en
Publication of WO2002006152B1 publication Critical patent/WO2002006152B1/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00Microstructural systems; Auxiliary parts of microstructural devices or systems
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0035Constitution or structural means for controlling the movement of the flexible or deformable elements
    • B81B3/0051For defining the movement, i.e. structures that guide or limit the movement of an element
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00Basic microelectromechanical structures
    • B81B2203/05Type of movement
    • B81B2203/053Translation according to an axis perpendicular to the substrate
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00Basic microelectromechanical structures
    • B81B2203/05Type of movement
    • B81B2203/055Translation in a plane parallel to the substrate, i.e. enabling movement along any direction in the plane

Abstract

A system and method are disclosed which constrain a microcomponent that is totally released from a substrate for handling of such totally released microcomponent. A preferred embodiment provides constraining members that work to constrain a microcomponent to a substrate as such microcomponent is totally released from such substrate. Accordingly, such constraining members may aid in preserving the microcomponent with its substrate during the release of such microcomponent from its substrate during fabrication. Additionally, a preferred embodiment provides constraining members that are suitable for constraining a totally released microcomponent to a base for post-fabrication handling of the microcomponent. To further aid in post-fabrication handling of totally released microcomponents, a preferred embodiment may be implemented as a 'pallet' having one or more microcomponents constrained thereto. Moreover, constraining members of a preferred embodiment enable the totally released microcomponent to be removed from such constraints when desired, but prevents the totally released microcomponent from inadvertently escaping such constraints.

Claims

36
AMENDED CLAIMS
[received by the International Bureau on 26 February 2002 (26.02.02); original claims 41 and 49 amended; original claim 48 cancelled; remaining claims unchanged (2 pages)]
41. A system comprising: at least one microcomponent that is released from a substrate; and means for constraining said microcomponent to abase, wherein said constraining means is moveable.
42. The system of claim 41 wherein said means for constraining includes at least one vertical constraining means arranged to restrict vertical movement of said at least one microcomponent relative to said base.
43. The system of claim 41 wherein said means for constraining includes at least one horizontal constraining means arranged to restrict lateral movement of said at least one microcomponent relative to said base.
44. The system of claim 43 wherein said at least one horizontal constraining means restricts lateral translational movement of said at least one microcomponent relative to said base.
45. The system of claim 43 wherein said at least one horizontal constraining means restricts lateral rotational movement of said at least one microcomponent relative to said base.
46. The system of claim 41 wherein said constraining means is arranged to constrain said at least one microcomponent during release of said at least one microcomponent from said substrate.
47. The system of claim 46 wherein said constraining means is arranged to constrain said at least one microcomponent during exposure of said at least one microcomponent to a releasing agent to totally release said microcomponent from said substrate.
48. Please delete claim 48 without prejudice. 37
49. The system of claim 41 wherein said constraining means can be moved to unconstrain said at least one totally released microcomponent from said base.
50. The system of claim 41 wherein said means for constraining is arranged to constrain said at least one released microcomponent to a predefined area.
51. The system of claim 41 wherein said base is a substrate.
52. The system of claim 41 wherein said base is another microcomponent.
53. The system of claim 41 wherein said base is a pallet.
54. The system of claim 41 wherein said means for constraining is arranged to permit an acceptable degree of movement of said at least one released microcomponent relative to said base.
55. The system of claim 54 wherein said means for constraining is arranged to permit said at least one released microcomponent to move approximately 1 μm vertically relative to said base.
56. The system of claim 54 wherein said means for constraining is arranged to permit said at least one released microcomponent to move approximately 1 μ laterally relative to said base.
PCT/US2001/021899 2000-07-14 2001-07-12 System and method for constraining totally released microcomponents WO2002006152A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR10-2003-7000550A KR100539137B1 (en) 2000-07-14 2001-07-12 System and method for constraining totally released microcomponents
AU2001271984A AU2001271984A1 (en) 2000-07-14 2001-07-12 System and method for constraining totally released microcomponents
DE60124423T DE60124423T2 (en) 2000-07-14 2001-07-12 DEVICE AND METHOD FOR FIXING FULLY EXTENDED MICROBUILTS
JP2002512060A JP2004504172A (en) 2000-07-14 2001-07-12 System and method for restraining completely separated microcomponents
EP01951048A EP1345843B1 (en) 2000-07-14 2001-07-12 System and method for constraining totally released microcomponents

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/616,500 2000-07-14
US09/616,500 US6677225B1 (en) 2000-07-14 2000-07-14 System and method for constraining totally released microcomponents

Publications (3)

Publication Number Publication Date
WO2002006152A2 WO2002006152A2 (en) 2002-01-24
WO2002006152A3 WO2002006152A3 (en) 2002-07-11
WO2002006152B1 true WO2002006152B1 (en) 2002-08-08

Family

ID=24469729

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/021899 WO2002006152A2 (en) 2000-07-14 2001-07-12 System and method for constraining totally released microcomponents

Country Status (8)

Country Link
US (1) US6677225B1 (en)
EP (1) EP1345843B1 (en)
JP (1) JP2004504172A (en)
KR (1) KR100539137B1 (en)
CN (1) CN1241826C (en)
AT (1) ATE344784T1 (en)
DE (1) DE60124423T2 (en)
WO (1) WO2002006152A2 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8866300B1 (en) 2011-06-05 2014-10-21 Nuvotronics, Llc Devices and methods for solder flow control in three-dimensional microstructures
US9000863B2 (en) 2007-03-20 2015-04-07 Nuvotronics, Llc. Coaxial transmission line microstructure with a portion of increased transverse dimension and method of formation thereof
US9024417B2 (en) 2007-03-20 2015-05-05 Nuvotronics, Llc Integrated electronic components and methods of formation thereof
US9306255B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other
US9306254B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration
US9312589B2 (en) 2003-03-04 2016-04-12 Nuvotronics, Inc. Coaxial waveguide microstructure having center and outer conductors configured in a rectangular cross-section
US9325044B2 (en) 2013-01-26 2016-04-26 Nuvotronics, Inc. Multi-layer digital elliptic filter and method

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7297471B1 (en) * 2003-04-15 2007-11-20 Idc, Llc Method for manufacturing an array of interferometric modulators
US6677225B1 (en) * 2000-07-14 2004-01-13 Zyvex Corporation System and method for constraining totally released microcomponents
TW593126B (en) * 2003-09-30 2004-06-21 Prime View Int Co Ltd A structure of a micro electro mechanical system and manufacturing the same
US7078337B2 (en) * 2003-09-30 2006-07-18 Agere Systems Inc. Selective isotropic etch for titanium-based materials
WO2007014022A1 (en) * 2005-07-22 2007-02-01 Qualcomm Incorporated Mems devices having support structures and methods of fabricating the same
WO2007013992A1 (en) * 2005-07-22 2007-02-01 Qualcomm Incorporated Support structure for mems device and methods therefor
WO2007013939A1 (en) * 2005-07-22 2007-02-01 Qualcomm Incorporated Support structure for mems device and methods therefor
EP2495212A3 (en) * 2005-07-22 2012-10-31 QUALCOMM MEMS Technologies, Inc. Mems devices having support structures and methods of fabricating the same
US7647848B2 (en) * 2005-11-29 2010-01-19 Drexel University Integrated system for simultaneous inspection and manipulation
US7405863B2 (en) * 2006-06-01 2008-07-29 Qualcomm Mems Technologies, Inc. Patterning of mechanical layer in MEMS to reduce stresses at supports
JP4327183B2 (en) * 2006-07-31 2009-09-09 株式会社日立製作所 High pressure fuel pump control device for internal combustion engine
US7545552B2 (en) * 2006-10-19 2009-06-09 Qualcomm Mems Technologies, Inc. Sacrificial spacer process and resultant structure for MEMS support structure
US7656256B2 (en) 2006-12-30 2010-02-02 Nuvotronics, PLLC Three-dimensional microstructures having an embedded support member with an aperture therein and method of formation thereof
US7719752B2 (en) * 2007-05-11 2010-05-18 Qualcomm Mems Technologies, Inc. MEMS structures, methods of fabricating MEMS components on separate substrates and assembly of same
US8068268B2 (en) * 2007-07-03 2011-11-29 Qualcomm Mems Technologies, Inc. MEMS devices having improved uniformity and methods for making them
WO2009067635A1 (en) * 2007-11-20 2009-05-28 Board Of Regents, The University Of Texas System Method and apparatus for detethering mesoscale, microscale, and nanoscale components and devices
KR101104641B1 (en) * 2008-11-17 2012-01-12 풍원공업 주식회사 Device of hinge for bidet
US8706243B2 (en) 2009-02-09 2014-04-22 Rainbow Medical Ltd. Retinal prosthesis techniques
US8150526B2 (en) * 2009-02-09 2012-04-03 Nano-Retina, Inc. Retinal prosthesis
US8428740B2 (en) 2010-08-06 2013-04-23 Nano-Retina, Inc. Retinal prosthesis techniques
US8442641B2 (en) 2010-08-06 2013-05-14 Nano-Retina, Inc. Retinal prosthesis techniques
US8718784B2 (en) * 2010-01-14 2014-05-06 Nano-Retina, Inc. Penetrating electrodes for retinal stimulation
US8659371B2 (en) 2009-03-03 2014-02-25 Bae Systems Information And Electronic Systems Integration Inc. Three-dimensional matrix structure for defining a coaxial transmission line channel
US20110123783A1 (en) 2009-11-23 2011-05-26 David Sherrer Multilayer build processses and devices thereof
US8917150B2 (en) 2010-01-22 2014-12-23 Nuvotronics, Llc Waveguide balun having waveguide structures disposed over a ground plane and having probes located in channels
US8368153B2 (en) * 2010-04-08 2013-02-05 United Microelectronics Corp. Wafer level package of MEMS microphone and manufacturing method thereof
US8571669B2 (en) 2011-02-24 2013-10-29 Nano-Retina, Inc. Retinal prosthesis with efficient processing circuits
US8659816B2 (en) 2011-04-25 2014-02-25 Qualcomm Mems Technologies, Inc. Mechanical layer and methods of making the same
US8814601B1 (en) 2011-06-06 2014-08-26 Nuvotronics, Llc Batch fabricated microconnectors
KR101982887B1 (en) 2011-07-13 2019-05-27 누보트로닉스, 인크. Methods of fabricating electronic and mechanical structures
US9166114B2 (en) * 2012-12-11 2015-10-20 LuxVue Technology Corporation Stabilization structure including sacrificial release layer and staging cavity
US9370417B2 (en) 2013-03-14 2016-06-21 Nano-Retina, Inc. Foveated retinal prosthesis
US9474902B2 (en) 2013-12-31 2016-10-25 Nano Retina Ltd. Wearable apparatus for delivery of power to a retinal prosthesis
US10310009B2 (en) 2014-01-17 2019-06-04 Nuvotronics, Inc Wafer scale test interface unit and contactors
US9331791B2 (en) 2014-01-21 2016-05-03 Nano Retina Ltd. Transfer of power and data
US10847469B2 (en) 2016-04-26 2020-11-24 Cubic Corporation CTE compensation for wafer-level and chip-scale packages and assemblies
US10511073B2 (en) 2014-12-03 2019-12-17 Cubic Corporation Systems and methods for manufacturing stacked circuits and transmission lines
US10319654B1 (en) 2017-12-01 2019-06-11 Cubic Corporation Integrated chip scale packages
CN112087696B (en) * 2020-06-30 2022-01-07 歌尔微电子有限公司 Miniature microphone dust keeper and MEMS microphone
CN112492478B (en) * 2020-12-02 2022-08-19 潍坊歌尔微电子有限公司 Miniature microphone dust keeper and MEMS microphone

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4740410A (en) 1987-05-28 1988-04-26 The Regents Of The University Of California Micromechanical elements and methods for their fabrication
US5111693A (en) 1988-01-13 1992-05-12 The Charles Stark Draper Laboratory, Inc. Motion restraints for micromechanical devices
US5393375A (en) * 1992-02-03 1995-02-28 Cornell Research Foundation, Inc. Process for fabricating submicron single crystal electromechanical structures
JPH07508856A (en) * 1992-04-08 1995-09-28 ジョージア テック リサーチ コーポレイション Process for lifting off thin film materials from growth substrates
CA2154357C (en) * 1993-02-04 2004-03-02 Kevin A. Shaw Microstructures and single-mask, single-crystal process for fabrication thereof
US5492596A (en) * 1994-02-04 1996-02-20 The Charles Stark Draper Laboratory, Inc. Method of making a micromechanical silicon-on-glass tuning fork gyroscope
US5660680A (en) 1994-03-07 1997-08-26 The Regents Of The University Of California Method for fabrication of high vertical aspect ratio thin film structures
US5645684A (en) 1994-03-07 1997-07-08 The Regents Of The University Of California Multilayer high vertical aspect ratio thin film structures
JP3192887B2 (en) * 1994-09-21 2001-07-30 キヤノン株式会社 Probe, scanning probe microscope using the probe, and recording / reproducing apparatus using the probe
SE9500849D0 (en) * 1995-03-10 1995-03-10 Pharmacia Ab Methods for the manufacture of micromachined structures and micromachined structures manufactured using such methods
WO1997004283A2 (en) * 1995-07-20 1997-02-06 Cornell Research Foundation, Inc. Microfabricated torsional cantilevers for sensitive force detection
US5882532A (en) 1996-05-31 1999-03-16 Hewlett-Packard Company Fabrication of single-crystal silicon structures using sacrificial-layer wafer bonding
US5914801A (en) * 1996-09-27 1999-06-22 Mcnc Microelectromechanical devices including rotating plates and related methods
US5914521A (en) 1997-07-30 1999-06-22 Motorola, Inc. Sensor devices having a movable structure
US5955659A (en) * 1998-01-13 1999-09-21 Massachusetts Institute Of Technology Electrostatically-actuated structures for fluid property measurements and related methods
US5995688A (en) * 1998-06-01 1999-11-30 Lucent Technologies, Inc. Micro-opto-electromechanical devices and method therefor
US5949571A (en) * 1998-07-30 1999-09-07 Lucent Technologies Mars optical modulators
US6173105B1 (en) * 1998-11-20 2001-01-09 Lucent Technologies Optical attenuator
US6379989B1 (en) * 1998-12-23 2002-04-30 Xerox Corporation Process for manufacture of microoptomechanical structures
US6246504B1 (en) * 1999-06-30 2001-06-12 The Regents Of The University Of Caifornia Apparatus and method for optical raster-scanning in a micromechanical system
US6262464B1 (en) * 2000-06-19 2001-07-17 International Business Machines Corporation Encapsulated MEMS brand-pass filter for integrated circuits
US6677225B1 (en) * 2000-07-14 2004-01-13 Zyvex Corporation System and method for constraining totally released microcomponents

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9312589B2 (en) 2003-03-04 2016-04-12 Nuvotronics, Inc. Coaxial waveguide microstructure having center and outer conductors configured in a rectangular cross-section
US9000863B2 (en) 2007-03-20 2015-04-07 Nuvotronics, Llc. Coaxial transmission line microstructure with a portion of increased transverse dimension and method of formation thereof
US9024417B2 (en) 2007-03-20 2015-05-05 Nuvotronics, Llc Integrated electronic components and methods of formation thereof
US8866300B1 (en) 2011-06-05 2014-10-21 Nuvotronics, Llc Devices and methods for solder flow control in three-dimensional microstructures
US9325044B2 (en) 2013-01-26 2016-04-26 Nuvotronics, Inc. Multi-layer digital elliptic filter and method
US9306255B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other
US9306254B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration

Also Published As

Publication number Publication date
DE60124423T2 (en) 2007-10-04
EP1345843A2 (en) 2003-09-24
KR20030067657A (en) 2003-08-14
ATE344784T1 (en) 2006-11-15
WO2002006152A3 (en) 2002-07-11
KR100539137B1 (en) 2005-12-26
JP2004504172A (en) 2004-02-12
EP1345843B1 (en) 2006-11-08
DE60124423D1 (en) 2006-12-21
CN1241826C (en) 2006-02-15
WO2002006152A2 (en) 2002-01-24
CN1441749A (en) 2003-09-10
US6677225B1 (en) 2004-01-13

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