WO2002006152A3 - System and method for constraining totally released microcomponents - Google Patents

System and method for constraining totally released microcomponents Download PDF

Info

Publication number
WO2002006152A3
WO2002006152A3 PCT/US2001/021899 US0121899W WO0206152A3 WO 2002006152 A3 WO2002006152 A3 WO 2002006152A3 US 0121899 W US0121899 W US 0121899W WO 0206152 A3 WO0206152 A3 WO 0206152A3
Authority
WO
WIPO (PCT)
Prior art keywords
microcomponent
totally released
constraining
preferred
substrate
Prior art date
Application number
PCT/US2001/021899
Other languages
French (fr)
Other versions
WO2002006152A2 (en
WO2002006152B1 (en
Inventor
Matthew D Ellis
Eric G Parker
George D Skidmore
Original Assignee
Zyvex Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zyvex Corp filed Critical Zyvex Corp
Priority to JP2002512060A priority Critical patent/JP2004504172A/en
Priority to DE60124423T priority patent/DE60124423T2/en
Priority to EP01951048A priority patent/EP1345843B1/en
Priority to AU2001271984A priority patent/AU2001271984A1/en
Priority to KR10-2003-7000550A priority patent/KR100539137B1/en
Publication of WO2002006152A2 publication Critical patent/WO2002006152A2/en
Publication of WO2002006152A3 publication Critical patent/WO2002006152A3/en
Publication of WO2002006152B1 publication Critical patent/WO2002006152B1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0035—Constitution or structural means for controlling the movement of the flexible or deformable elements
    • B81B3/0051—For defining the movement, i.e. structures that guide or limit the movement of an element
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/05—Type of movement
    • B81B2203/053—Translation according to an axis perpendicular to the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/05—Type of movement
    • B81B2203/055—Translation in a plane parallel to the substrate, i.e. enabling movement along any direction in the plane

Abstract

A system and method are disclosed which constrain a microcomponent that is totally released from a substrate for handling of such totally released microcomponent. A preferred embodiment provides constraining members that work to constrain a microcomponent to a substrate as such microcomponent is totally released from such substrate. Accordingly, such constraining members may aid in preserving the microcomponent with its substrate during the release of such microcomponent from its substrate during fabrication. Additionally, a preferred embodiment provides constraining members that are suitable for constraining a totally released microcomponent to a base for post-fabrication handling of the microcomponent. To further aid in post-fabrication handling of totally released microcomponents, a preferred embodiment may be implemented as a 'pallet' having one or more microcomponents constrained thereto. Moreover, constraining members of a preferred embodiment enable the totally released microcomponent to be removed from such constraints when desired, but prevents the totally released microcomponent from inadvertently escaping such constraints.
PCT/US2001/021899 2000-07-14 2001-07-12 System and method for constraining totally released microcomponents WO2002006152A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2002512060A JP2004504172A (en) 2000-07-14 2001-07-12 System and method for restraining completely separated microcomponents
DE60124423T DE60124423T2 (en) 2000-07-14 2001-07-12 DEVICE AND METHOD FOR FIXING FULLY EXTENDED MICROBUILTS
EP01951048A EP1345843B1 (en) 2000-07-14 2001-07-12 System and method for constraining totally released microcomponents
AU2001271984A AU2001271984A1 (en) 2000-07-14 2001-07-12 System and method for constraining totally released microcomponents
KR10-2003-7000550A KR100539137B1 (en) 2000-07-14 2001-07-12 System and method for constraining totally released microcomponents

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/616,500 2000-07-14
US09/616,500 US6677225B1 (en) 2000-07-14 2000-07-14 System and method for constraining totally released microcomponents

Publications (3)

Publication Number Publication Date
WO2002006152A2 WO2002006152A2 (en) 2002-01-24
WO2002006152A3 true WO2002006152A3 (en) 2002-07-11
WO2002006152B1 WO2002006152B1 (en) 2002-08-08

Family

ID=24469729

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/021899 WO2002006152A2 (en) 2000-07-14 2001-07-12 System and method for constraining totally released microcomponents

Country Status (8)

Country Link
US (1) US6677225B1 (en)
EP (1) EP1345843B1 (en)
JP (1) JP2004504172A (en)
KR (1) KR100539137B1 (en)
CN (1) CN1241826C (en)
AT (1) ATE344784T1 (en)
DE (1) DE60124423T2 (en)
WO (1) WO2002006152A2 (en)

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US8933769B2 (en) 2006-12-30 2015-01-13 Nuvotronics, Llc Three-dimensional microstructures having a re-entrant shape aperture and methods of formation

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EP2495212A3 (en) * 2005-07-22 2012-10-31 QUALCOMM MEMS Technologies, Inc. Mems devices having support structures and methods of fabricating the same
JP2009503564A (en) * 2005-07-22 2009-01-29 クアルコム，インコーポレイテッド Support structure for MEMS device and method thereof
US7647848B2 (en) * 2005-11-29 2010-01-19 Drexel University Integrated system for simultaneous inspection and manipulation
US7405863B2 (en) * 2006-06-01 2008-07-29 Qualcomm Mems Technologies, Inc. Patterning of mechanical layer in MEMS to reduce stresses at supports
JP4327183B2 (en) * 2006-07-31 2009-09-09 株式会社日立製作所 High pressure fuel pump control device for internal combustion engine
US7545552B2 (en) * 2006-10-19 2009-06-09 Qualcomm Mems Technologies, Inc. Sacrificial spacer process and resultant structure for MEMS support structure
EP1973189B1 (en) 2007-03-20 2012-12-05 Nuvotronics, LLC Coaxial transmission line microstructures and methods of formation thereof
KR101593686B1 (en) 2007-03-20 2016-02-12 누보트로닉스, 엘.엘.씨 Integrated electronic components and methods of formation thereof
US7719752B2 (en) * 2007-05-11 2010-05-18 Qualcomm Mems Technologies, Inc. MEMS structures, methods of fabricating MEMS components on separate substrates and assembly of same
US8068268B2 (en) * 2007-07-03 2011-11-29 Qualcomm Mems Technologies, Inc. MEMS devices having improved uniformity and methods for making them
WO2009067635A1 (en) * 2007-11-20 2009-05-28 Board Of Regents, The University Of Texas System Method and apparatus for detethering mesoscale, microscale, and nanoscale components and devices
KR101104641B1 (en) * 2008-11-17 2012-01-12 풍원공업 주식회사 Device of hinge for bidet
US8706243B2 (en) 2009-02-09 2014-04-22 Rainbow Medical Ltd. Retinal prosthesis techniques
US8718784B2 (en) * 2010-01-14 2014-05-06 Nano-Retina, Inc. Penetrating electrodes for retinal stimulation
US8150526B2 (en) 2009-02-09 2012-04-03 Nano-Retina, Inc. Retinal prosthesis
US8428740B2 (en) 2010-08-06 2013-04-23 Nano-Retina, Inc. Retinal prosthesis techniques
US8442641B2 (en) 2010-08-06 2013-05-14 Nano-Retina, Inc. Retinal prosthesis techniques
US8659371B2 (en) 2009-03-03 2014-02-25 Bae Systems Information And Electronic Systems Integration Inc. Three-dimensional matrix structure for defining a coaxial transmission line channel
US20110123783A1 (en) 2009-11-23 2011-05-26 David Sherrer Multilayer build processses and devices thereof
US8368153B2 (en) * 2010-04-08 2013-02-05 United Microelectronics Corp. Wafer level package of MEMS microphone and manufacturing method thereof
US8571669B2 (en) 2011-02-24 2013-10-29 Nano-Retina, Inc. Retinal prosthesis with efficient processing circuits
US8659816B2 (en) 2011-04-25 2014-02-25 Qualcomm Mems Technologies, Inc. Mechanical layer and methods of making the same
US8866300B1 (en) 2011-06-05 2014-10-21 Nuvotronics, Llc Devices and methods for solder flow control in three-dimensional microstructures
US8814601B1 (en) 2011-06-06 2014-08-26 Nuvotronics, Llc Batch fabricated microconnectors
EP2731783A4 (en) 2011-07-13 2016-03-09 Nuvotronics Llc Methods of fabricating electronic and mechanical structures
US9166114B2 (en) * 2012-12-11 2015-10-20 LuxVue Technology Corporation Stabilization structure including sacrificial release layer and staging cavity
US9325044B2 (en) 2013-01-26 2016-04-26 Nuvotronics, Inc. Multi-layer digital elliptic filter and method
US9370417B2 (en) 2013-03-14 2016-06-21 Nano-Retina, Inc. Foveated retinal prosthesis
US9306255B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other
US9306254B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration
US9474902B2 (en) 2013-12-31 2016-10-25 Nano Retina Ltd. Wearable apparatus for delivery of power to a retinal prosthesis
US10310009B2 (en) 2014-01-17 2019-06-04 Nuvotronics, Inc Wafer scale test interface unit and contactors
US9331791B2 (en) 2014-01-21 2016-05-03 Nano Retina Ltd. Transfer of power and data
US10847469B2 (en) 2016-04-26 2020-11-24 Cubic Corporation CTE compensation for wafer-level and chip-scale packages and assemblies
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US10319654B1 (en) 2017-12-01 2019-06-11 Cubic Corporation Integrated chip scale packages
CN112087696B (en) * 2020-06-30 2022-01-07 歌尔微电子有限公司 Miniature microphone dust keeper and MEMS microphone
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Publication number Priority date Publication date Assignee Title
US8933769B2 (en) 2006-12-30 2015-01-13 Nuvotronics, Llc Three-dimensional microstructures having a re-entrant shape aperture and methods of formation
US8917150B2 (en) 2010-01-22 2014-12-23 Nuvotronics, Llc Waveguide balun having waveguide structures disposed over a ground plane and having probes located in channels

Also Published As

Publication number Publication date
CN1241826C (en) 2006-02-15
US6677225B1 (en) 2004-01-13
DE60124423T2 (en) 2007-10-04
ATE344784T1 (en) 2006-11-15
WO2002006152A2 (en) 2002-01-24
KR100539137B1 (en) 2005-12-26
WO2002006152B1 (en) 2002-08-08
DE60124423D1 (en) 2006-12-21
JP2004504172A (en) 2004-02-12
EP1345843A2 (en) 2003-09-24
KR20030067657A (en) 2003-08-14
CN1441749A (en) 2003-09-10
EP1345843B1 (en) 2006-11-08

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