WO2001096972A3 - Methods and apparatus for maintaining a pressure within an environmentally controlled chamber - Google Patents

Methods and apparatus for maintaining a pressure within an environmentally controlled chamber Download PDF

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Publication number
WO2001096972A3
WO2001096972A3 PCT/US2001/018992 US0118992W WO0196972A3 WO 2001096972 A3 WO2001096972 A3 WO 2001096972A3 US 0118992 W US0118992 W US 0118992W WO 0196972 A3 WO0196972 A3 WO 0196972A3
Authority
WO
WIPO (PCT)
Prior art keywords
pressure
chamber
controller
coupled
maintaining
Prior art date
Application number
PCT/US2001/018992
Other languages
French (fr)
Other versions
WO2001096972A2 (en
Inventor
Kenneth E Pfeiffer
Gregory S Verdict
Original Assignee
Applied Materials Inc
Kenneth E Pfeiffer
Gregory S Verdict
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc, Kenneth E Pfeiffer, Gregory S Verdict filed Critical Applied Materials Inc
Priority to US10/311,131 priority Critical patent/US6916397B2/en
Priority to EP01946310A priority patent/EP1297397A2/en
Priority to JP2002511036A priority patent/JP2004510221A/en
Publication of WO2001096972A2 publication Critical patent/WO2001096972A2/en
Publication of WO2001096972A3 publication Critical patent/WO2001096972A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D16/00—Control of fluid pressure
    • G05D16/20—Control of fluid pressure characterised by the use of electric means
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D16/00—Control of fluid pressure
    • G05D16/20—Control of fluid pressure characterised by the use of electric means
    • G05D16/2006—Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means
    • G05D16/2066—Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means using controlling means acting on the pressure source

Abstract

A system including a chamber; (102) a variable speed vacuum pump (204) coupled to the chamber; and a pressure controller (202) coupled to the chamber. The pressure controller (202) compares a set point pressure with a pressure measurement for the chamber and adjusts a flow of gas through the pressure controller based on a difference between the pressure measurement and the set point pressure. The system includes a pressure measurement device coupled (126) to the chamber and to the pressure controller, and a main controller coupled to the variable speed vacuum pump, the pressure controller and the pressure measurement device. The pressure measurement device measures a pressure within the chamber and provides a pressure measurement to the pressure controller and the main controller. The main controller adjusts a speed of the variable speed vacuum pump (204); and provides the set point pressure to the pressure controller.
PCT/US2001/018992 2000-06-14 2001-06-13 Methods and apparatus for maintaining a pressure within an environmentally controlled chamber WO2001096972A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US10/311,131 US6916397B2 (en) 2000-06-14 2001-06-13 Methods and apparatus for maintaining a pressure within an environmentally controlled chamber
EP01946310A EP1297397A2 (en) 2000-06-14 2001-06-13 Methods and apparatus for maintaining a pressure within an environmentally controlled chamber
JP2002511036A JP2004510221A (en) 2000-06-14 2001-06-13 Apparatus and method for maintaining pressure in a controlled environment chamber

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US21140200P 2000-06-14 2000-06-14
US60/211,402 2000-06-14

Publications (2)

Publication Number Publication Date
WO2001096972A2 WO2001096972A2 (en) 2001-12-20
WO2001096972A3 true WO2001096972A3 (en) 2002-04-11

Family

ID=22786776

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/018992 WO2001096972A2 (en) 2000-06-14 2001-06-13 Methods and apparatus for maintaining a pressure within an environmentally controlled chamber

Country Status (5)

Country Link
US (1) US6916397B2 (en)
EP (1) EP1297397A2 (en)
JP (1) JP2004510221A (en)
KR (1) KR20030007938A (en)
WO (1) WO2001096972A2 (en)

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US6739840B2 (en) 2002-05-22 2004-05-25 Applied Materials Inc Speed control of variable speed pump
US7906441B2 (en) 2003-05-13 2011-03-15 Texas Instruments Incorporated System and method for mitigating oxide growth in a gate dielectric
JP4331539B2 (en) * 2003-07-31 2009-09-16 株式会社フジキン Gas supply device to chamber and chamber internal pressure control method using the same
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US8639489B2 (en) 2003-11-10 2014-01-28 Brooks Automation, Inc. Methods and systems for controlling a semiconductor fabrication process
US8639365B2 (en) * 2003-11-10 2014-01-28 Brooks Automation, Inc. Methods and systems for controlling a semiconductor fabrication process
US20070282480A1 (en) 2003-11-10 2007-12-06 Pannese Patrick D Methods and systems for controlling a semiconductor fabrication process
US7203563B2 (en) * 2004-04-08 2007-04-10 Taiwan Semiconductor Manufacturing Company, Ltd. Automatic N2 purge system for 300 mm full automation fab
GB0413554D0 (en) * 2004-06-17 2004-07-21 Point 35 Microstructures Ltd Improved method and apparartus for the etching of microstructures
CN100552641C (en) * 2004-12-17 2009-10-21 韩国标准科学研究院 The trend monitoring of vacuum pump and diagnostic analysis method and trend monitoring thereof and diagnostic analysis system and the calculating readable storage medium storing program for executing that comprises the computer program of carrying out this method
US20060162658A1 (en) * 2005-01-27 2006-07-27 Applied Materials, Inc. Ruthenium layer deposition apparatus and method
KR100725098B1 (en) * 2005-11-17 2007-06-04 삼성전자주식회사 Method and appratus for sensing error operation of mass flow controller in semiconductor production device
US7720655B2 (en) * 2005-12-20 2010-05-18 Applied Materials, Inc. Extended mainframe designs for semiconductor device manufacturing equipment
JP2007186757A (en) * 2006-01-13 2007-07-26 Tokyo Electron Ltd Vacuum treatment apparatus and vacuum treatment method
KR100665855B1 (en) * 2006-02-01 2007-01-09 삼성전자주식회사 Vacuum apparatus of semiconductor device manufacturing equipment and vacuum method the same
US8936702B2 (en) * 2006-03-07 2015-01-20 Micron Technology, Inc. System and method for sputtering a tensile silicon nitride film
US7970483B2 (en) * 2006-03-16 2011-06-28 Applied Materials, Inc. Methods and apparatus for improving operation of an electronic device manufacturing system
CN101460659B (en) * 2006-06-02 2011-12-07 应用材料股份有限公司 Gas flow control by differential pressure measurements
WO2009055507A1 (en) * 2007-10-26 2009-04-30 Applied Materials, Inc. Methods and apparatus for sealing a slit valve door
US8246284B2 (en) * 2009-03-05 2012-08-21 Applied Materials, Inc. Stacked load-lock apparatus and method for high throughput solar cell manufacturing
US8657584B2 (en) * 2010-02-16 2014-02-25 Edwards Limited Apparatus and method for tuning pump speed
CN103046029B (en) * 2011-10-13 2015-09-09 中国科学院微电子研究所 Based on the atomic layer deposition apparatus that the self-adaptive pressure of simulated annealing controls
DE102012010522A1 (en) * 2012-05-25 2013-11-28 Hydac Fluidtechnik Gmbh Valve for valve arrangement
WO2014163791A1 (en) 2013-03-12 2014-10-09 Applied Materials, Inc Semiconductor device manufacturing platform with single and twinned processing chambers
WO2014150260A1 (en) 2013-03-15 2014-09-25 Applied Materials, Inc Process load lock apparatus, lift assemblies, electronic device processing systems, and methods of processing substrates in load lock locations
KR101734821B1 (en) 2013-03-15 2017-05-12 어플라이드 머티어리얼스, 인코포레이티드 Processing systems, apparatus, and methods adapted to process substrates in electronic device manufacturing
US9435025B2 (en) 2013-09-25 2016-09-06 Applied Materials, Inc. Gas apparatus, systems, and methods for chamber ports
KR20160064177A (en) 2013-09-26 2016-06-07 어플라이드 머티어리얼스, 인코포레이티드 Mixed-platform apparatus, systems, and methods for substrate processing
US20150090295A1 (en) 2013-09-28 2015-04-02 Applied Materials, Inc. Apparatus and methods for a mask inverter
KR101770970B1 (en) 2013-09-30 2017-08-24 어플라이드 머티어리얼스, 인코포레이티드 Transfer chamber gas purge apparatus, electronic device processing systems, and purge methods
WO2015066624A1 (en) 2013-11-04 2015-05-07 Applied Materials, Inc Transfer chambers with an increased number of sides, semiconductor device manufacturing processing tools, and processing methods
US9575494B2 (en) * 2013-11-14 2017-02-21 Taiwan Semiconductor Manufacturing Co., Ltd. Mechanisms for processing wafer
US10520371B2 (en) 2015-10-22 2019-12-31 Applied Materials, Inc. Optical fiber temperature sensors, temperature monitoring apparatus, and manufacturing methods
CN105676902B (en) * 2016-03-15 2019-11-26 广州达意隆包装机械股份有限公司 The adjusting method and device of water butt internal pressure
US10119191B2 (en) 2016-06-08 2018-11-06 Applied Materials, Inc. High flow gas diffuser assemblies, systems, and methods
US10684159B2 (en) 2016-06-27 2020-06-16 Applied Materials, Inc. Methods, systems, and apparatus for mass flow verification based on choked flow
US10361099B2 (en) 2017-06-23 2019-07-23 Applied Materials, Inc. Systems and methods of gap calibration via direct component contact in electronic device manufacturing systems
EP3764883A4 (en) * 2018-03-12 2021-12-15 North Carolina State University Vascular development monitoring systems and uses thereof
US11107709B2 (en) 2019-01-30 2021-08-31 Applied Materials, Inc. Temperature-controllable process chambers, electronic device processing systems, and manufacturing methods
CN113838731B (en) * 2020-06-08 2023-02-28 长鑫存储技术有限公司 Semiconductor etching equipment

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WO1985002888A1 (en) * 1983-12-27 1985-07-04 Kabushiki Kaisha Tokuda Seisakusho Method of and apparatus for controlling gas pressure
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Patent Citations (7)

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WO1985002888A1 (en) * 1983-12-27 1985-07-04 Kabushiki Kaisha Tokuda Seisakusho Method of and apparatus for controlling gas pressure
US5626679A (en) * 1991-09-02 1997-05-06 Fuji Electric Co., Ltd. Method and apparatus for preparing a silicon oxide film
US5795328A (en) * 1994-10-28 1998-08-18 Iolab Corporation Vacuum system and a method of operating a vacuum system
US6066358A (en) * 1995-11-21 2000-05-23 Applied Materials, Inc. Blanket-selective chemical vapor deposition using an ultra-thin nucleation layer
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US6041817A (en) * 1998-08-21 2000-03-28 Fairchild Semiconductor Corp. Processing system having vacuum manifold isolation

Also Published As

Publication number Publication date
US6916397B2 (en) 2005-07-12
WO2001096972A2 (en) 2001-12-20
KR20030007938A (en) 2003-01-23
US20030209322A1 (en) 2003-11-13
EP1297397A2 (en) 2003-04-02
JP2004510221A (en) 2004-04-02

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