WO2001089987A1 - Method of fabricating devices incorporating microelectromechanical systems using at least one uv curable tape - Google Patents
Method of fabricating devices incorporating microelectromechanical systems using at least one uv curable tape Download PDFInfo
- Publication number
- WO2001089987A1 WO2001089987A1 PCT/AU2000/000583 AU0000583W WO0189987A1 WO 2001089987 A1 WO2001089987 A1 WO 2001089987A1 AU 0000583 W AU0000583 W AU 0000583W WO 0189987 A1 WO0189987 A1 WO 0189987A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- pct
- holding means
- mems
- layer
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 34
- 238000000034 method Methods 0.000 claims description 16
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1635—Manufacturing processes dividing the wafer into individual chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00865—Multistep processes for the separation of wafers into individual elements
- B81C1/00873—Multistep processes for the separation of wafers into individual elements characterised by special arrangements of the devices, allowing an easier separation
Definitions
- This invention relates to the fabrication of devices incorporating microeiectromechanical systems (MEMS)
- the invention relates to a method of fabricating a MEMS device using at least one UV curable tape
- a MEMS device shall be referred to below as a MEMS device and the part of the device comprising the microeiectromechanical system shall be referred to as a MEMS layer
- PCT/AUOO/00589 PCT/AUO0/0O583, PCT/AUOO/00593, PCT/AU00/00590
- PCT/AU00/00591 PCT/AU00/00592, PCT/AU00/00584, PCT/AU00/00585, PCT/AU00/00586, PCT/AU00/00594, PCT/AU00/00595, PCT/AU00/00596, PC 1 /AU00/00597, PCT/AU00/00598, PCT/AU00/00516, PCT/AUOO/00517, PCT/AU00/0051 1 , PCT/AUOO/00501 , PC I /AU00/00502, PCT/AU00/00503, PCT/AU00/00504, PCT/AUOO/00505, PCT/AU00/00506, PC I /AUOO/00507, PCT/AU00/00508,
- a method of fabricating MEMS devices including the steps of providing a substrate with a MEMS layer arranged on one side of the substrate, applying a further layer to said one side of the substrate, performing at least one operation on the substrate from a side of the substrate opposed to the side having the
- the operations performed on the substrate may include separating the substrate into discrete parts, each part carrying said at least one MEMS part
- the operations performed on the further layer may include separating the further layer into discrete parts, one part associated with each part of the substrate
- the method may include performing the operations on the further layer after application of the holding means to the substrate
- the method includes bonding the holding means to the substrate
- a handling means may be applied to the holding means
- the handling means may impart rigidity to the holding means and may facilitate manipulation of a laminate, the laminate comprising the substrate, the MEMS layer and the further layer
- the holding means may be bonded to the layer by means of an adhesive which is curable by exposure to ultraviolet (UV) light.
- curable is meant that the adhesive loses its adhesive properties when exposed to UV light.
- the method may include exposing localised regions of the holding means to UV light to release one chip at a time from the holding means to enable each chip to be removed individually from the holding means.
- the handling means is transparent to UV light so that UV light is transmitted through the handling means to cure the adhesive of the holding means.
- the handling means may be in the form of a glass, quartz, alumina or equivalent wafer.
- the method may finally include removing each chip from the holding means by a transporting means.
- FIGS. 1 to 8 show various stages in a method of fabricating MEMS devices, in accordance with the invention.
- a layer 10 is provided to be applied to a first surface 12 of a silicon substrate or wafer 14.
- the wafer 14 carries a surface macromachined MEMS layer 16 on the first surface 12 of the wafer 14.
- the MEMS layer 16 comprises individual MEMS elements 18.
- the layer 10 is a nozzle guard layer or wafer which is applied to the surface 12 of the silicon substrate 14.
- Each individual MEMS element 18 is in the form of a nozzle assembly.
- Each nozzle assembly 18 comprises an ink ejection nozzle and its associated actuator. The actuator acts on the nozzle for effecting ink ejection, on demand.
- the purpose of the method of manufacture is to form individual MEMS chips 20 ( Figure 8). Hence, after the nozzle guard layer 10 has been applied to the wafer 14, the wafer 14 is turned over to expose a reverse side 22 as shown in Figure 3 of the drawings.
- each part 24 comprises a plurality of MEMS elements 18 and a bond pad 28.
- the layer 10 has a plurality of struts 30 which support a body 32 of the layer 10 in spaced relationship above the surface 12 of the wafer 14 such that the MEMS elements 18 and the bond pads 28 are protected by the body 32.
- the struts 30 define chambers 34 and 36. The chambers 34 overlie the bond pads 28 while the chambers 36 overlie the array of MEMS elements 18 of each part 24.
- a holding means in the form of an adhesive tape 38 is bonded to the surface 22 of the layer 14 as illustrated in Figure 5 of the drawings.
- the tape 38 is bonded to the layer 14 by means of a curable adhesive.
- the adhesive is curable in the sense that it loses its adhesive properties or "tackiness" when exposed to ultraviolet (UV) light.
- a handling means in the form of a glass, quartz, alumina or other transparent handle wafer 40 is secured to an opposite surface of the tape 38.
- the wafer 40, the tape 38, the silicon wafer 14 and the nozzle guard layer 10 define a laminate 42.
- the laminate 42 is then turned over, as shown in Figure 7 of the drawings.
- Predetermined operations are carried out on the layer 10. More particularly, passages 44 are etched through the layer 10 from an outer surface 46 towards the chambers 36.
- individual nozzle guards 48 are formed by 3 etching to remove material as shown at 50 in Figure 7 of the drawings. The removal of this material exposes the bond pads 28 of each chip 20. Upon completion of this operation, the individual chips 20 are formed.
- each chip 20 has a plurality of MEMS elements 18 in an array formed thereon.
- the laminate 42 is placed on an xy wafer stage (not shown) which is reciprocated, as illustrated by arrow 52 in
- FIG. 8 of the drawings Each MEMS chip 20, when it is desired to remove it, is exposed to UV light as indicated by arrows 54 through a mask 56. This cures the adhesive of the tape 40 locally in a region beneath one particular MEMS chip 20 at a time to enable that MEMS chip 20 to be removed from the tape 38.
- the MEMS chip 20 is removed from the tape 38 by means of a transporting means including a vacuum pickup 58.
- a method of fabrication is provided which facilitates the performing of various operations to fabricate the individual MEMS chip 20 and which facilitates removal of the MEMS chips 20 for packaging.
- devices of the kind in question are measured in micron dimensions. Accordingly, the MEMS elements 18 on such devices are extremely fragile.
- the provision of the nozzle guard layer 10 and the use of the UV curable tape 38 facilitates that the MEMS elements 18 are not touched by solids or liquids after they are released by the release etch.
Abstract
Description
Claims
Priority Applications (12)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/575,158 US6383833B1 (en) | 2000-05-23 | 2000-05-23 | Method of fabricating devices incorporating microelectromechanical systems using at least one UV curable tape |
AU2000247318A AU2000247318B2 (en) | 2000-05-24 | 2000-05-24 | Method of fabricating devices incorporating microelectromechanical systems using at least one UV curable tape |
PCT/AU2000/000583 WO2001089987A1 (en) | 2000-05-23 | 2000-05-24 | Method of fabricating devices incorporating microelectromechanical systems using at least one uv curable tape |
EP00929095A EP1294636B1 (en) | 2000-05-24 | 2000-05-24 | Method of fabricating devices incorporating microelectromechanical systems using at least one uv curable tape |
DE60032521T DE60032521T2 (en) | 2000-05-24 | 2000-05-24 | METHOD FOR PRODUCING MICROELECTROMECHANICAL DEVICES CONTAINING COMPONENTS BY USING AT LEAST ONE UV-HARDENABLE BAND |
US10/296,660 US7063993B1 (en) | 2000-05-24 | 2000-05-24 | Method of fabricating devices incorporating microelectromechanical systems using at least one UV curable tape |
AU4731800A AU4731800A (en) | 2000-05-23 | 2000-05-24 | Method of fabricating devices incorporating microelectromechanical systems using at least one UV curable tape |
IL15302600A IL153026A0 (en) | 2000-05-24 | 2000-05-24 | Method of fabricating devices incorporating microelectromechanical systems using at least one uv curable tape |
IL153026A IL153026A (en) | 2000-05-24 | 2002-11-22 | Method of fabricating devices incorporating microelectromechanical systems using at least one uv curable tape |
US11/450,431 US7465405B2 (en) | 2000-05-24 | 2006-06-12 | Method of fabricating printheads having multiple nozzle assemblies |
US12/268,966 US8070969B2 (en) | 2000-05-24 | 2008-11-11 | Method of fabricating microelectromechanical systems devices |
US13/301,598 US20120064647A1 (en) | 2000-05-24 | 2011-11-21 | Method of fabricating microelectromechanical systems devices |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/575,158 US6383833B1 (en) | 2000-05-23 | 2000-05-23 | Method of fabricating devices incorporating microelectromechanical systems using at least one UV curable tape |
PCT/AU2000/000583 WO2001089987A1 (en) | 2000-05-23 | 2000-05-24 | Method of fabricating devices incorporating microelectromechanical systems using at least one uv curable tape |
Related Child Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/296,660 A-371-Of-International US7063993B1 (en) | 2000-05-24 | 2000-05-24 | Method of fabricating devices incorporating microelectromechanical systems using at least one UV curable tape |
US10296660 A-371-Of-International | 2000-05-24 | ||
US11/450,431 Continuation US7465405B2 (en) | 2000-05-24 | 2006-06-12 | Method of fabricating printheads having multiple nozzle assemblies |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2001089987A1 true WO2001089987A1 (en) | 2001-11-29 |
Family
ID=3700808
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/AU2000/000583 WO2001089987A1 (en) | 2000-05-23 | 2000-05-24 | Method of fabricating devices incorporating microelectromechanical systems using at least one uv curable tape |
Country Status (6)
Country | Link |
---|---|
US (4) | US7063993B1 (en) |
EP (1) | EP1294636B1 (en) |
AU (1) | AU2000247318B2 (en) |
DE (1) | DE60032521T2 (en) |
IL (2) | IL153026A0 (en) |
WO (1) | WO2001089987A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1388890A1 (en) * | 2002-01-25 | 2004-02-11 | Matsushita Electric Industrial Co., Ltd. | Method for manufacturing electronic component |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE60032521T2 (en) * | 2000-05-24 | 2007-11-22 | Silverbrook Research Pty. Ltd., Balmain | METHOD FOR PRODUCING MICROELECTROMECHANICAL DEVICES CONTAINING COMPONENTS BY USING AT LEAST ONE UV-HARDENABLE BAND |
US6982184B2 (en) * | 2001-05-02 | 2006-01-03 | Silverbrook Research Pty Ltd | Method of fabricating MEMS devices on a silicon wafer |
US7268005B2 (en) * | 2002-10-30 | 2007-09-11 | Finisar Corporation | Apparatus and method for stacking laser bars for uniform facet coating |
TW200717519A (en) * | 2005-10-28 | 2007-05-01 | Univ Nat Chiao Tung | Asynchronous first-in-first-out cell |
KR102369934B1 (en) | 2017-06-23 | 2022-03-03 | 삼성전자주식회사 | Chip mounting apparatus and method using the same |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
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EP0359373A2 (en) * | 1988-07-21 | 1990-03-21 | LINTEC Corporation | Adhesive tape and use thereof |
US5273615A (en) * | 1992-04-06 | 1993-12-28 | Motorola, Inc. | Apparatus and method for handling fragile semiconductor wafers |
DE4223215A1 (en) * | 1992-07-15 | 1994-01-20 | Bosch Gmbh Robert | Processing silicon@ wafer having deformable micro mechanical structure - comprising adhering foil to lower side of wafer and removing foil after processing |
CA2119505A1 (en) * | 1993-03-29 | 1994-09-30 | Rafael Cesar Alfaro | Grid array masking tape process |
US5476566A (en) * | 1992-09-02 | 1995-12-19 | Motorola, Inc. | Method for thinning a semiconductor wafer |
US5882532A (en) * | 1996-05-31 | 1999-03-16 | Hewlett-Packard Company | Fabrication of single-crystal silicon structures using sacrificial-layer wafer bonding |
JPH11204551A (en) * | 1998-01-19 | 1999-07-30 | Sony Corp | Manufacture of semiconductor device |
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US5000811A (en) | 1989-11-22 | 1991-03-19 | Xerox Corporation | Precision buttable subunits via dicing |
US5445559A (en) | 1993-06-24 | 1995-08-29 | Texas Instruments Incorporated | Wafer-like processing after sawing DMDs |
US5680702A (en) * | 1994-09-19 | 1997-10-28 | Fuji Xerox Co., Ltd. | Method for manufacturing ink jet heads |
US5900892A (en) * | 1997-03-05 | 1999-05-04 | Xerox Corporation | Nozzle plates for ink jet cartridges |
US5923995A (en) | 1997-04-18 | 1999-07-13 | National Semiconductor Corporation | Methods and apparatuses for singulation of microelectromechanical systems |
JP3955659B2 (en) | 1997-06-12 | 2007-08-08 | リンテック株式会社 | Electronic component die bonding method and die bonding apparatus used therefor |
US6159385A (en) | 1998-05-08 | 2000-12-12 | Rockwell Technologies, Llc | Process for manufacture of micro electromechanical devices having high electrical isolation |
JP2000223446A (en) * | 1998-11-27 | 2000-08-11 | Denso Corp | Semiconductor device and manufacture thereof |
US6060336A (en) | 1998-12-11 | 2000-05-09 | C.F. Wan Incorporated | Micro-electro mechanical device made from mono-crystalline silicon and method of manufacture therefore |
JP3816253B2 (en) * | 1999-01-19 | 2006-08-30 | 富士通株式会社 | Manufacturing method of semiconductor device |
US6213587B1 (en) * | 1999-07-19 | 2001-04-10 | Lexmark International, Inc. | Ink jet printhead having improved reliability |
US6290331B1 (en) * | 1999-09-09 | 2001-09-18 | Hewlett-Packard Company | High efficiency orifice plate structure and printhead using the same |
DE60032521T2 (en) * | 2000-05-24 | 2007-11-22 | Silverbrook Research Pty. Ltd., Balmain | METHOD FOR PRODUCING MICROELECTROMECHANICAL DEVICES CONTAINING COMPONENTS BY USING AT LEAST ONE UV-HARDENABLE BAND |
US6946366B2 (en) * | 2000-12-05 | 2005-09-20 | Analog Devices, Inc. | Method and device for protecting micro electromechanical systems structures during dicing of a wafer |
JP4591019B2 (en) * | 2004-05-24 | 2010-12-01 | セイコーエプソン株式会社 | Method for manufacturing liquid jet head |
-
2000
- 2000-05-24 DE DE60032521T patent/DE60032521T2/en not_active Expired - Lifetime
- 2000-05-24 IL IL15302600A patent/IL153026A0/en active IP Right Grant
- 2000-05-24 WO PCT/AU2000/000583 patent/WO2001089987A1/en active IP Right Grant
- 2000-05-24 EP EP00929095A patent/EP1294636B1/en not_active Expired - Lifetime
- 2000-05-24 AU AU2000247318A patent/AU2000247318B2/en not_active Ceased
- 2000-05-24 US US10/296,660 patent/US7063993B1/en not_active Expired - Fee Related
-
2002
- 2002-11-22 IL IL153026A patent/IL153026A/en not_active IP Right Cessation
-
2006
- 2006-06-12 US US11/450,431 patent/US7465405B2/en not_active Expired - Fee Related
-
2008
- 2008-11-11 US US12/268,966 patent/US8070969B2/en not_active Expired - Fee Related
-
2011
- 2011-11-21 US US13/301,598 patent/US20120064647A1/en not_active Abandoned
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EP0359373A2 (en) * | 1988-07-21 | 1990-03-21 | LINTEC Corporation | Adhesive tape and use thereof |
US5273615A (en) * | 1992-04-06 | 1993-12-28 | Motorola, Inc. | Apparatus and method for handling fragile semiconductor wafers |
DE4223215A1 (en) * | 1992-07-15 | 1994-01-20 | Bosch Gmbh Robert | Processing silicon@ wafer having deformable micro mechanical structure - comprising adhering foil to lower side of wafer and removing foil after processing |
US5476566A (en) * | 1992-09-02 | 1995-12-19 | Motorola, Inc. | Method for thinning a semiconductor wafer |
CA2119505A1 (en) * | 1993-03-29 | 1994-09-30 | Rafael Cesar Alfaro | Grid array masking tape process |
US5882532A (en) * | 1996-05-31 | 1999-03-16 | Hewlett-Packard Company | Fabrication of single-crystal silicon structures using sacrificial-layer wafer bonding |
JPH11204551A (en) * | 1998-01-19 | 1999-07-30 | Sony Corp | Manufacture of semiconductor device |
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Title |
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DATABASE WPI Week 199941, Derwent World Patents Index; Class A85, AN 1999-484799, XP002981179 * |
See also references of EP1294636A4 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1388890A1 (en) * | 2002-01-25 | 2004-02-11 | Matsushita Electric Industrial Co., Ltd. | Method for manufacturing electronic component |
EP1388890A4 (en) * | 2002-01-25 | 2007-10-31 | Matsushita Electric Ind Co Ltd | Method for manufacturing electronic component |
Also Published As
Publication number | Publication date |
---|---|
US8070969B2 (en) | 2011-12-06 |
US20060261423A1 (en) | 2006-11-23 |
EP1294636B1 (en) | 2006-12-20 |
US20120064647A1 (en) | 2012-03-15 |
US20090061562A1 (en) | 2009-03-05 |
EP1294636A4 (en) | 2004-11-10 |
DE60032521T2 (en) | 2007-11-22 |
IL153026A0 (en) | 2003-06-24 |
AU2000247318B2 (en) | 2005-05-05 |
US7465405B2 (en) | 2008-12-16 |
EP1294636A1 (en) | 2003-03-26 |
DE60032521D1 (en) | 2007-02-01 |
IL153026A (en) | 2006-10-31 |
US7063993B1 (en) | 2006-06-20 |
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