WO2001082375A3 - Improved pillar connections for semiconductor chips and method of manufacture - Google Patents

Improved pillar connections for semiconductor chips and method of manufacture Download PDF

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Publication number
WO2001082375A3
WO2001082375A3 PCT/US2001/013595 US0113595W WO0182375A3 WO 2001082375 A3 WO2001082375 A3 WO 2001082375A3 US 0113595 W US0113595 W US 0113595W WO 0182375 A3 WO0182375 A3 WO 0182375A3
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WO
WIPO (PCT)
Prior art keywords
manufacture
semiconductor chips
improved pillar
microns
pillar connections
Prior art date
Application number
PCT/US2001/013595
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French (fr)
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WO2001082375A2 (en
Inventor
Francisca Tung
Original Assignee
Focus Interconnect Technology
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Publication date
Application filed by Focus Interconnect Technology filed Critical Focus Interconnect Technology
Priority to AU2001259194A priority Critical patent/AU2001259194A1/en
Publication of WO2001082375A2 publication Critical patent/WO2001082375A2/en
Publication of WO2001082375A3 publication Critical patent/WO2001082375A3/en

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    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
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Abstract

A flip chip interconnect system comprises an elongated pillar comprising two elongated portions, a first portion including solder with or without lead and a second portion including copper or gold or other material having higher reflow temperature than the first portion. The second portion is to be connected to the semiconductor chip and has a length preferably of more than 55 microns to reduce the effect of α particles from the solder from affecting electronic devices on the chip. The total length of the pillar is preferably in the range of 80 to 120 microns.
PCT/US2001/013595 2000-04-27 2001-04-26 Improved pillar connections for semiconductor chips and method of manufacture WO2001082375A2 (en)

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AU2001259194A AU2001259194A1 (en) 2000-04-27 2001-04-26 Improved pillar connections for semiconductor chips and method of manufacture

Applications Claiming Priority (2)

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US09/564,382 2000-04-27
US09/564,382 US6578754B1 (en) 2000-04-27 2000-04-27 Pillar connections for semiconductor chips and method of manufacture

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WO2001082375A3 true WO2001082375A3 (en) 2002-04-04

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AU (1) AU2001259194A1 (en)
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