WO2001082375A2 - Improved pillar connections for semiconductor chips and method of manufacture - Google Patents
Improved pillar connections for semiconductor chips and method of manufacture Download PDFInfo
- Publication number
- WO2001082375A2 WO2001082375A2 PCT/US2001/013595 US0113595W WO0182375A2 WO 2001082375 A2 WO2001082375 A2 WO 2001082375A2 US 0113595 W US0113595 W US 0113595W WO 0182375 A2 WO0182375 A2 WO 0182375A2
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- WIPO (PCT)
- Prior art keywords
- solder
- pillar
- layer
- microns
- elongated
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
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- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
Definitions
- Tin lead based solders is the preferred interconnect material of choice for flip chip bonding of silicon integrated circuits.
- Lead has three stable isotopes which are formed as the end products of natural radioactive decay chains. These stable isotopes, however, usually contain a small amount of residual ⁇ particle radioactivity. As the dimensions of electronic devices in silicon integrated circuits become smaller, the distances between the lead-based solder and the devices are also reduced so that the ⁇ particle emission from the solder can cause such devices to malfunction.
- One way to reduce the effect of ⁇ particle emission from solder is to provide a passivation layer covering the electronic devices on silicon. Some materials used for the passivation layer are more effective than others for preserving the integrity of the electronic devices from the ⁇ particles. Furthermore, the residual ⁇ particle emission from the solder radiate from essentially point sources in the solder, so that the intensity of ⁇ particle emission experienced by the electronic devices decreases rapidly with the distances separating the devices from the solder. Shown below is a table setting forth five different materials serving as the medium separating electronic devices from the solder.
- the effective thickness of the air medium separating the electronic devices and the solder should be at least 10.83 cm, which is unacceptable for most applications.
- the best barrier layer substance in terms of minimum absorption length for absorption of ⁇ particles from the solder is silicon dioxide, followed by polyimide. Where silicon dioxide or another solid material is used as the passivation layer, only part of the medium separating the electronic devices from the solder is occupied by the material, with the remaining part occupied by air or another material not as effective in absorbing ⁇ particles.
- the electronic devices and the solder be separated by at least 0.0055 cm or 55 microns.
- the separation is preferably at least 84 microns.
- solder bumps for connecting flip chips to substrates.
- the use of lead-based solder bumps is disadvantageous also because it may be difficult to achieve a fine pitch between adjacent interconnects without bridging which causes electrical shorting.
- the solder bump is formed by electroplating, and where the photoresist is not thicker than 60 microns, the bump size in the horizontal plane of a 100 micron high solder ball will be around 120 microns, and the plated solder bump is in the shape of a mushroom.
- the electronic devices may still be adversely affected by ⁇ particle emission by the solder used to attach the copper posts to the substrate.
- the space between the semiconductor flip chip and the substrate is usually filled with an underfill material to provide support and stability to the interconnect structure.
- the process of providing the underfill material is by injection that requires a certain minimum separation between the semiconductor chip and the substrate. For most injection processes, the minimum separation is about 75 microns. Therefore, using the interconnect structure proposed by Love et al.
- an elongated pillar may be advantageously used for connecting a semiconductor chip to a substrate, where the pillar comprises two elongated portions, one portion including a metal material that does not include lead, such as a material including copper, higher reflow temperature solder or gold, and another portion including solder or other wettable material.
- the portion including the non-lead metal material is in contact with the semiconductor chip and has a length not less than about 50 microns.
- the total length of the pillar is not less than about 55 microns.
- the length of the pillar is not less than about 84 microns, with the length of the portion of the pillar including copper not less than about 55 microns.
- the separation between the solder in the pillar or any other solder used in the interconnect on the one hand and electronic devices on the semiconductor chip on the other hand can be made to exceed 55 microns or even 84 microns so that adverse effects caused by ⁇ particle emission from the solder on the electronic devices on the semiconductor chip will be reduced. This is especially the case where silicon dioxide or polyimide is used as the passivation layer.
- all portions of the interconnect can be of made of solder material containing lead in elongated pillar shape. Where the length of the pillar exceeds 75 microns, adequate separation is provided between the semiconductor chip and the substrate for the injection of the underfill material. Furthermore, by providing elongated pillars of adequate length and suitable cross-sectional dimensions connecting the semiconductor chip to the substrate, the stress induced in the connection between the semiconductor chip and the pillar due to warpage is much reduced, which also reduces the chances of chip failure caused by shear stress on account of the warpage.
- the elongated pillar may be formed by first depositing a layer of metal for plating purposes and followed by forming a layer of photosensitive material on the chip and exposing to radiation the layer of photosensitive material at predetermined areas. Portions of the layer that are exposed to radiation are removed to form through holes in the layer. Portions of the holes are filled with a material containing a metal to form an elongated column in contact with the chip. The metal material is different from top layer metal (and preferably does not include lead.) Portions of the holes are then filled with a material containing any wettable metal to form an elongated column of metal in contact with the bottom portion material, thereby forming a composite pillar, a portion of which includes the metal material and another portion of which includes a_wettable metal.
- the photosensitive layer and deposited layer of metal for plating purposes are then removed to form the elongated pillars.
- the pillars may or may not be reflowed prior to being connected to the substrate.
- the filling of the holes of the photosensitive material layer with copper, gold, non lead or solder is done by electroplating.
- the thickness of the photosensitive layer and the depth of the holes therein are such that they are adequate to form the pillars of sufficient height, such as the ones described above.
- the metal material is different from solder and preferably does not include lead.
- this may be achieved by forming a layer of copper oxide on the sidewall surface of such portion of at least one of the pillars.
- the copper oxide will also reduce wetting of the sidewall surface during solder reflow, thereby facilitating control of the height of the solder portion of the at least one pillar during solder reflow.
- Another aspect of the invention is directed to a flip chip interconnect system for use with a semiconductor chip.
- Two elongated portions may be employed: a first portion including solder, non lead solder or a wettable material including nickel and gold, and a second portion containing a material with higher reflow temperature than that of the first portion, said second portion in contact with the semiconductor chip.
- the second portion may or may not contain lead.
- Yet another aspect of the invention is directed to a flip chip interconnect system for use with a semiconductor chip, comprising an elongated portion in contact with semiconductor chip and a ball-shaped portion, said elongated portion including copper, or a solder metal with higher reflow temperature than the ball-shaped portion, said ball shaped portion include a solder material.
- the elongated portion may or may not contain lead.
- Fig 1 A is a cross-sectional view of a flip chip connected to a substrate using the elongated pillars of this invention to illustrate the invention.
- Fig. IB is an exploded view of a portion IB of the system of Fig. 1A showing in more detail the interconnection between the elongated pillar, the silicon die and the substrate.
- Figs. 2A-2G are cross-sectional views of a portion of a semiconductor die and various layers associated with the die at various stages of fabrication to illustrate a process for making the elongated pillars attached to the die and the attachment of such pillars to a substrate to illustrate an embodiment of the invention.
- Fig. 3 A is a perspective view of a flip chip with elongated pillars on one side of the chip to illustrate an embodiment of the invention.
- Fig. 3B is a cross-sectional view of a portion 3B of the chip of Fig. 3A to illustrate the embodiment of the invention.
- Fig. 3C is a cross-sectional view of a portion of the flip chip and the substrate after the flip chip has been attached to the substrate and the underfill material injected to illustrate an embodiment of the invention.
- Fig. 4A is a cross-sectional view of a flip chip connected to a substrate where both the flip chip and the substrate are warped to illustrate the shear stress in the chip.
- Fig. 4B is a top view of the flip chip of Fig. 4A.
- Figs. 5 A and 5B are graphical illustrations of shear stress distribution for a 20 mm die where the die is connected to a substrate using elongated pillars of this invention of 100 microns in height and bump diameter of 60 and 100 microns, and at a bump pitch of 100/120/160/225 microns to illustrate the invention.
- Fig. 6 A and 6B are graphical illustrations of the shear stress in the semiconductor die similar to that shown in Figs. 5A and 5B except that the height of the elongated pillar is 125 microns instead of 100 microns.
- Fig. 1 A is a cross-sectional view of a semiconductor die in the form of a flip chip 12 connected to a substrate 14 by means of elongated pillars 16 to illustrate an embodiment of the invention.
- the space between the die 12 and substrate 14 is filled with an underfill material 18 such as one known to those of skill in the art to provide support and stability to the die and interconnect structure formed by the elongated pillars 16.
- Fig. IB is an exploded view of a portion IB of the system of Fig. 1A showing in more detail an elongated pillar connecting a portion of the silicon die to the substrate.
- pillar 16 comprises two parts: an upper elongated portion 16a comprising copper of height HI and a second elongated portion of height H2 comprising a lead-based solder.
- the junction between the two portions 16a, 16b is at 16c.
- the bottom part of portion 16b is enlarged compared to its upper part and has a substantially conical shape where the bottom part of the solder portion of 16b is the result of a reflow process as described below to make physical and electrical contact with the copper contact layer 22 on top of substrate 14.
- portion 16a is in attached to a copper contact 24 on the silicon die 12.
- circuits on the silicon die 12 are electrically connected through pillar 16 to a copper contact 22 on the substrate 14.
- the space between the semiconductor die 12 and substrate 14 is filled with an underfill material 18.
- circuits (not shown) on the silicon die 12 are spaced apart from the solder portion 16b by the length or height of portion 16a containing copper.
- the surface of the silicon die 12 facing the substrate is coated with a passivation layer (not shown) made of a suitable material such as silicon dioxide or polyimide. Therefore, if the length or height HI of portion 16a exceeds the effective thickness shown in the table above, then the circuits on die 12 will not be significantly adversely affected by the ⁇ particle emission from solder 16b.
- the height HI of the portion 16a is not less than 55 microns, where silicon dioxide is used as the passivation layer, and more preferably, more than 84 microns where polyimide is used as the passivation layer.
- the total height H of pillar 16 between die 12 and the substrate 14 is at least 75 microns, such as in the range of about 80 -100 microns. For reasons discussed below, a larger value for H would reduce the shear stress experienced by the silicon die and the connection between the die 12 and pillar 16.
- the total height H of the pillar it may be preferable for the total height H of the pillar to be at least 100 microns, and more preferably 120 microns or more, such as 125 microns. It may be preferable for the ratio HI to H2 to be about 3 to 1.
- Figs. 2A-2G are cross-sectional views of a semiconductor die and the various layers associated therewith to illustrate the process for making the elongated pillar interconnect shown in Figs. 1A, IB and of process for connecting the pillar to a substrate to illustrate the invention.
- a photosensitive layer 32 is formed on the die 12. To simplify the drawing, only portions of the die and of the various layers are shown in Figs. 2A-2G. Various designated areas of the photosensitive layer are exposed to radiation, and the portions that are exposed to radiation are then removed to yield layer 32' with a pattern of through holes 34 therein as shown in Fig. 2B, where the through holes reach all the way to die 12. Portions of the through holes 34 are filled with a material including copper, such as by placing the entire structure in a copper bath. An electric current is passed there through to perform electroplating of the copper material to fill at least a portion of each hole 34 as shown in Fig. 2C. As shown in Fig.
- the portions 16b' containing solder are then heated in a manner known to those skilled in the art to reflow the solder 16b' to form the solder portions 16b and pillars 16 as shown in Figs. IB and 2G.
- An underfill material 18 is then injected to fill the space between die 12 and substrate 14. Contacts 24 on die 12 are, therefore, physically and electrically connected and attached to contacts 22 on . the substrate 14. The resulting structure is illustrated in Fig. 2G.
- an underbump metalization layer (typically composed of a material including Titanium (Ti), titanium-tungsten (TiW), or chromium (Cr) and copper function as an adhesion layer during the above-described process.
- This layer also serves as the conducting, metal contact for the copper portions of the pillars for the above-described electroplating process.
- the spacing or pitch P between adjacent elongated pillars 16 is as illustrated in Fig. 1A and 2E, Using the process described above, fine pitch of not more than 100 microns is achievable; preferably, the pitch or spacing between adjacent pillars is in the range of about 80 to about 100 microns. Since solder forms a portion of the pillar, no extra process of placing solder on the substrate is required, and the connection between the pillar and the substrate can be simply formed by reflowing the solder portion of the pillar. Furthermore, through this process, no mushroom solder bump is formed so that finer pitch can be achieved.
- the solder composition is flexible and can be 63/37 or 5/95 SnPb ratio, or a non-lead solder.
- the copper material and solder material used in the above-described electroplating processes may simply be copper metal and solder.
- Fig. 3 A is a perspective view of a flip chip with elongated pillars on one side of the chip to illustrate an embodiment of the invention.
- Fig. 3B is a cross-sectional view of a portion 3B of the chip of Fig. 3A to illustrate the embodiment of the invention.
- Fig. 3C is a cross-sectional view of a portion of the flip chip and the substrate after the flip chip has been attached to the substrate and the underfill material injected to illustrate an embodiment of the invention, as indicated by arrow 100.
- FIG. 4A is a cross-sectional view of a flip chip connected to a substrate where both the flip chip and the substrate are warped to illustrate the shear stress in the chip.
- Fig. 4B is a top view of the flip chip of Fig. 4 A.
- the silicon die 12' and substrate 14' may become warped for a number of reasons, such as due to thermal effects. Warpage is calculated as Y displacement from center 12a' to the corner 12b' of the die as shown in Fig. 4A.
- Figs. 5A and 5B are graphical plots illustrating shear stress distribution in a die of size 20 mm, where elongated pillars of 100 microns in length and diameters of 60 and 100 microns and at bump pitches of 100,120, 160, 225 microns.
- pitch is represented as P
- diameter is represented by D.
- the peak shear stress at the edge of the die is less than the shear strength of copper so that the elongated pillars of this invention should not fail with the given geometry illustrated, or similar geometries, due to shear stress.
- Figs. 6A and 6B illustrate similar data to those shown in Figs.
- FIG. 5A and 5B but where the pillar height or length is 120 microns instead of 100 microns.
- a comparison of Figs. 6A and 6B to those of Figs. 5 A and 5B will illustrate that the longer the pillars, the less will be the shear stress experienced at the edge of the die and the interconnects connected to the die.
- a layer 50 shown in Fig. IB of either organic or metal material may be used to cover the copper portion 16a. This will reduce reliability problems.
- the material used may be Entek or palladium, and may be formed by simply dipping the entire structure (i.e. die 12 and pillar 16) into a bath of such material, where the material will only adhere to the copper portion 16a.
- the sidewall surface of the copper portion 16a may become wetted by solder.
- the solder portion may change in height or even collapse so that the reflow and comiection process is more difficult to control.
- the sidewall surface of the copper portion 16a of pillar 16 is oxidized, thereby forming a layer of copper oxide on the sidewall surface. This reduces the chances that the sidewall surface of portion 16a will become wetted by solder during reflow.
- the layer of copper oxide can be formed by placing the pillars and the die, such as the components shown in Fig.
- the portion 16b may take the shape of an elongated column.
- This column may be reflowed to form a ball-shape (shown in dotted lines 16b" in Fig. IB) prior to being placed in contact with the substrate system. Then the ball-shaped material is reflowed to form the shape shown in Fig. IB.
- portion 16a may contain copper or a solder material with such higher reflow temperature. Where ⁇ particle emission is not a concern, portion 16a may also contain lead.
- portion 16b may contain a solder material with or without lead. It may also comprise a wettable material that includes nickel and gold. Any one of such features may be advantageously combined with the above described features.
Abstract
Description
Claims
Priority Applications (1)
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AU2001259194A AU2001259194A1 (en) | 2000-04-27 | 2001-04-26 | Improved pillar connections for semiconductor chips and method of manufacture |
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US09/564,382 | 2000-04-27 | ||
US09/564,382 US6578754B1 (en) | 2000-04-27 | 2000-04-27 | Pillar connections for semiconductor chips and method of manufacture |
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WO2001082375A2 true WO2001082375A2 (en) | 2001-11-01 |
WO2001082375A3 WO2001082375A3 (en) | 2002-04-04 |
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US (2) | US6578754B1 (en) |
AU (1) | AU2001259194A1 (en) |
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EP1239514A2 (en) * | 2001-03-05 | 2002-09-11 | Megic Corporation | Low fabrication cost, fine pitch and high reliability solder bump |
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CN103887276A (en) * | 2014-04-04 | 2014-06-25 | 华进半导体封装先导技术研发中心有限公司 | Salient point structure for preventing salient point lateral etching and forming method |
CN103887276B (en) * | 2014-04-04 | 2016-06-01 | 华进半导体封装先导技术研发中心有限公司 | Prevent bump structure and the forming method of convex some side direction etching |
Also Published As
Publication number | Publication date |
---|---|
WO2001082375A3 (en) | 2002-04-04 |
US6681982B2 (en) | 2004-01-27 |
US6578754B1 (en) | 2003-06-17 |
TW510031B (en) | 2002-11-11 |
AU2001259194A1 (en) | 2001-11-07 |
US20020179689A1 (en) | 2002-12-05 |
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