WO2001079868A3 - System for measuring signal path resistance for an integrated circuit tester interconnect structure - Google Patents
System for measuring signal path resistance for an integrated circuit tester interconnect structure Download PDFInfo
- Publication number
- WO2001079868A3 WO2001079868A3 PCT/US2001/009205 US0109205W WO0179868A3 WO 2001079868 A3 WO2001079868 A3 WO 2001079868A3 US 0109205 W US0109205 W US 0109205W WO 0179868 A3 WO0179868 A3 WO 0179868A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- ports
- tester
- interconnect structure
- integrated circuit
- signal paths
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2853—Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/319—Tester hardware, i.e. output processing circuits
- G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
- G01R31/31905—Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
- G01R27/14—Measuring resistance by measuring current or voltage obtained from a reference source
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/31712—Input or output aspects
- G01R31/31717—Interconnect testing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/319—Tester hardware, i.e. output processing circuits
- G01R31/31917—Stimuli generation or application of test patterns to the device under test [DUT]
- G01R31/31924—Voltage or current aspects, e.g. driver, receiver
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Tests Of Electronic Circuits (AREA)
- Measurement Of Resistance Or Impedance (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2001249350A AU2001249350A1 (en) | 2000-04-13 | 2001-03-23 | System for measuring signal path resistance for an integrated circuit tester interconnect structure |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/548,886 US6677744B1 (en) | 2000-04-13 | 2000-04-13 | System for measuring signal path resistance for an integrated circuit tester interconnect structure |
US09/548,886 | 2000-04-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2001079868A2 WO2001079868A2 (en) | 2001-10-25 |
WO2001079868A3 true WO2001079868A3 (en) | 2002-02-28 |
Family
ID=24190786
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2001/009205 WO2001079868A2 (en) | 2000-04-13 | 2001-03-23 | System for measuring signal path resistance for an integrated circuit tester interconnect structure |
Country Status (3)
Country | Link |
---|---|
US (4) | US6677744B1 (en) |
AU (1) | AU2001249350A1 (en) |
WO (1) | WO2001079868A2 (en) |
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US6232789B1 (en) * | 1997-05-28 | 2001-05-15 | Cascade Microtech, Inc. | Probe holder for low current measurements |
US5729150A (en) * | 1995-12-01 | 1998-03-17 | Cascade Microtech, Inc. | Low-current probe card with reduced triboelectric current generating cables |
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US6034533A (en) * | 1997-06-10 | 2000-03-07 | Tervo; Paul A. | Low-current pogo probe card |
US6256882B1 (en) * | 1998-07-14 | 2001-07-10 | Cascade Microtech, Inc. | Membrane probing system |
US6578264B1 (en) * | 1999-06-04 | 2003-06-17 | Cascade Microtech, Inc. | Method for constructing a membrane probe using a depression |
US6838890B2 (en) * | 2000-02-25 | 2005-01-04 | Cascade Microtech, Inc. | Membrane probing system |
US6677744B1 (en) * | 2000-04-13 | 2004-01-13 | Formfactor, Inc. | System for measuring signal path resistance for an integrated circuit tester interconnect structure |
DE20114544U1 (en) * | 2000-12-04 | 2002-02-21 | Cascade Microtech Inc | wafer probe |
US7085977B2 (en) * | 2000-12-19 | 2006-08-01 | Texas Instruments Incorporated | Method and system for detecting an outlying resistance in a plurality of resistive elements |
AU2002327490A1 (en) | 2001-08-21 | 2003-06-30 | Cascade Microtech, Inc. | Membrane probing system |
WO2003100445A2 (en) * | 2002-05-23 | 2003-12-04 | Cascade Microtech, Inc. | Probe for testing a device under test |
GB2394780B (en) * | 2002-10-29 | 2006-06-14 | Ifr Ltd | A method of and apparatus for testing for integrated circuit contact defects |
US6724205B1 (en) * | 2002-11-13 | 2004-04-20 | Cascade Microtech, Inc. | Probe for combined signals |
US7057404B2 (en) * | 2003-05-23 | 2006-06-06 | Sharp Laboratories Of America, Inc. | Shielded probe for testing a device under test |
US6940288B2 (en) * | 2003-06-04 | 2005-09-06 | Hewlett-Packard Development Company, L.P. | Apparatus and method for monitoring and predicting failures in system interconnect |
US6895353B2 (en) * | 2003-06-04 | 2005-05-17 | Hewlett-Packard Development Company, L.P. | Apparatus and method for monitoring high impedance failures in chip interconnects |
US20040246008A1 (en) * | 2003-06-04 | 2004-12-09 | Barr Andrew H. | Apparatus and method for detecting and rejecting high impedance interconnect failures in manufacturing process |
US6933853B2 (en) * | 2003-06-12 | 2005-08-23 | Hewlett-Packard Development Company, L.P. | Apparatus and method for detecting and communicating interconnect failures |
DE202004021093U1 (en) * | 2003-12-24 | 2006-09-28 | Cascade Microtech, Inc., Beaverton | Differential probe for e.g. integrated circuit, has elongate probing units interconnected to respective active circuits that are interconnected to substrate by respective pair of flexible interconnects |
US6972571B2 (en) * | 2004-03-22 | 2005-12-06 | Freescale Semiconductor, Inc. | Load board with embedded relay tracker |
JP4980903B2 (en) * | 2004-07-07 | 2012-07-18 | カスケード マイクロテック インコーポレイテッド | Probe head with membrane suspension probe |
KR20070058522A (en) * | 2004-09-13 | 2007-06-08 | 캐스케이드 마이크로테크 인코포레이티드 | Double sided probing structures |
DE202005021436U1 (en) * | 2004-11-02 | 2008-02-14 | Cascade Microtech, Inc., Beaverton | Optically enhanced digital imaging system |
US7535247B2 (en) * | 2005-01-31 | 2009-05-19 | Cascade Microtech, Inc. | Interface for testing semiconductors |
US7656172B2 (en) | 2005-01-31 | 2010-02-02 | Cascade Microtech, Inc. | System for testing semiconductors |
US7057397B1 (en) * | 2005-03-03 | 2006-06-06 | Lattice Semiconductor Corporation | Output impedance measurement techniques |
US7449899B2 (en) * | 2005-06-08 | 2008-11-11 | Cascade Microtech, Inc. | Probe for high frequency signals |
US7560947B2 (en) * | 2005-09-28 | 2009-07-14 | Teradyne, Inc. | Pin electronics driver |
US20070200571A1 (en) * | 2006-02-16 | 2007-08-30 | Kevin Quinn | Verifying individual probe contact using shared tester channels |
JP2007248385A (en) * | 2006-03-17 | 2007-09-27 | Agilent Technol Inc | Apparatus for measuring semiconductor device characteristics |
US7492181B1 (en) * | 2006-05-31 | 2009-02-17 | Credence Systems Corporation | Method and device for enabling the measurement of device under test voltages using a testing instrument of limited range |
US7764072B2 (en) * | 2006-06-12 | 2010-07-27 | Cascade Microtech, Inc. | Differential signal probing system |
US7723999B2 (en) * | 2006-06-12 | 2010-05-25 | Cascade Microtech, Inc. | Calibration structures for differential signal probing |
US7403028B2 (en) * | 2006-06-12 | 2008-07-22 | Cascade Microtech, Inc. | Test structure and probe for differential signals |
US7443186B2 (en) * | 2006-06-12 | 2008-10-28 | Cascade Microtech, Inc. | On-wafer test structures for differential signals |
US7956628B2 (en) * | 2006-11-03 | 2011-06-07 | International Business Machines Corporation | Chip-based prober for high frequency measurements and methods of measuring |
US7876114B2 (en) * | 2007-08-08 | 2011-01-25 | Cascade Microtech, Inc. | Differential waveguide probe |
JP5461394B2 (en) * | 2008-05-21 | 2014-04-02 | 株式会社アドバンテスト | Test wafer unit and test system |
US7944225B2 (en) * | 2008-09-26 | 2011-05-17 | Formfactor, Inc. | Method and apparatus for providing a tester integrated circuit for testing a semiconductor device under test |
US7888957B2 (en) * | 2008-10-06 | 2011-02-15 | Cascade Microtech, Inc. | Probing apparatus with impedance optimized interface |
WO2010059247A2 (en) | 2008-11-21 | 2010-05-27 | Cascade Microtech, Inc. | Replaceable coupon for a probing apparatus |
US8400179B1 (en) * | 2009-07-20 | 2013-03-19 | Keithley Instruments, Inc. | Method for load-line correction of pulsed measurements |
JP2012059328A (en) * | 2010-09-10 | 2012-03-22 | Renesas Electronics Corp | Test circuit and semiconductor integrated circuit including the same |
CN102567150A (en) * | 2010-12-15 | 2012-07-11 | 鸿富锦精密工业(深圳)有限公司 | Main board interface testing device |
CN103135022B (en) * | 2011-11-23 | 2016-01-20 | 上海华虹宏力半导体制造有限公司 | The method of automatic detector probe card contact performance in test program |
US8933715B2 (en) * | 2012-04-08 | 2015-01-13 | Elm Technology Corporation | Configurable vertical integration |
CN103472347A (en) * | 2012-06-08 | 2013-12-25 | 富泰华工业(深圳)有限公司 | Auxiliary testing circuit, chip with auxiliary testing circuit and circuit board with auxiliary testing circuit |
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US9768780B2 (en) * | 2014-05-30 | 2017-09-19 | Intel Corporation | Apparatus for providing shared reference device with metal line formed from metal layer with lower resistivity compared to other metal layers in processor |
US9945888B2 (en) * | 2015-12-08 | 2018-04-17 | Sandisk Technologies Llc | On-die measurement technique for I/O DC parameters VOL and VOH |
RU169621U1 (en) * | 2016-04-22 | 2017-03-24 | Федеральное государственное бюджетное образовательное учреждение высшего образования Московский авиационный институт (национальный исследовательский университет) (МАИ) | DEVICE FOR CONTROL OF TECHNOLOGICAL ERROR WIDTH OF THE CONDUCTORS OF THE PCB |
CN107885606B (en) * | 2016-09-30 | 2020-12-01 | 中芯国际集成电路制造(北京)有限公司 | Reliability evaluation method of interlayer interconnection component |
KR102387464B1 (en) * | 2017-10-12 | 2022-04-15 | 삼성전자주식회사 | Apparatus and method for testing interconnect circuit, and method for manufacturing semiconductor device comprising the method |
DE102018217406B4 (en) * | 2018-06-18 | 2020-07-23 | ATEip GmbH | Method and device for electrically testing an electrical assembly |
US11187746B2 (en) * | 2019-03-26 | 2021-11-30 | Nuvoton Technology Corporation | Contact quality testing |
US11353496B2 (en) * | 2019-05-08 | 2022-06-07 | Hamilton Sundstrand Corporation | Frequency-based built-in-test for discrete outputs |
US20210211210A1 (en) * | 2020-01-08 | 2021-07-08 | Formfactor, Inc. | Beamforming Device Testing |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5101153A (en) * | 1991-01-09 | 1992-03-31 | National Semiconductor Corporation | Pin electronics test circuit for IC device testing |
JPH04129417A (en) * | 1990-09-20 | 1992-04-30 | Mitsubishi Electric Corp | Semiconductor integrated circuit |
US5414351A (en) * | 1993-10-22 | 1995-05-09 | United Microelectronics Corporation | Method and apparatus for testing the reliability of semiconductor terminals |
US5617035A (en) * | 1993-11-01 | 1997-04-01 | Motorola, Inc. | Method for testing integrated devices |
DE19756466A1 (en) * | 1996-12-26 | 1998-07-30 | Ando Electric | Test head for integrated circuit testing device |
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US3609537A (en) * | 1969-04-01 | 1971-09-28 | Ibm | Resistance standard |
US5221905A (en) * | 1992-02-28 | 1993-06-22 | International Business Machines Corporation | Test system with reduced test contact interface resistance |
JPH07130817A (en) * | 1993-10-30 | 1995-05-19 | Sony Corp | Method and apparatus for evaluating reliability of metal wiring |
US6055661A (en) * | 1994-06-13 | 2000-04-25 | Luk; Fong | System configuration and methods for on-the-fly testing of integrated circuits |
JP3233559B2 (en) * | 1995-08-14 | 2001-11-26 | シャープ株式会社 | Method and apparatus for testing semiconductor integrated circuit |
US5736850A (en) * | 1995-09-11 | 1998-04-07 | Teradyne, Inc. | Configurable probe card for automatic test equipment |
US5838161A (en) | 1996-05-01 | 1998-11-17 | Micron Technology, Inc. | Semiconductor interconnect having test structures for evaluating electrical characteristics of the interconnect |
US6087843A (en) * | 1997-07-14 | 2000-07-11 | Credence Systems Corporation | Integrated circuit tester with test head including regulating capacitor |
US6181144B1 (en) * | 1998-02-25 | 2001-01-30 | Micron Technology, Inc. | Semiconductor probe card having resistance measuring circuitry and method fabrication |
DE19817763C2 (en) | 1998-04-21 | 2001-02-15 | Texas Instruments Deutschland | Method for calibrating a measuring device |
US6339338B1 (en) * | 2000-01-18 | 2002-01-15 | Formfactor, Inc. | Apparatus for reducing power supply noise in an integrated circuit |
US6677744B1 (en) * | 2000-04-13 | 2004-01-13 | Formfactor, Inc. | System for measuring signal path resistance for an integrated circuit tester interconnect structure |
-
2000
- 2000-04-13 US US09/548,886 patent/US6677744B1/en not_active Expired - Fee Related
-
2001
- 2001-03-23 WO PCT/US2001/009205 patent/WO2001079868A2/en active Application Filing
- 2001-03-23 AU AU2001249350A patent/AU2001249350A1/en not_active Abandoned
-
2003
- 2003-12-29 US US10/750,611 patent/US7109736B2/en not_active Expired - Fee Related
-
2006
- 2006-09-18 US US11/532,877 patent/US7486095B2/en not_active Expired - Fee Related
-
2009
- 2009-02-03 US US12/364,725 patent/US7609082B2/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04129417A (en) * | 1990-09-20 | 1992-04-30 | Mitsubishi Electric Corp | Semiconductor integrated circuit |
US5101153A (en) * | 1991-01-09 | 1992-03-31 | National Semiconductor Corporation | Pin electronics test circuit for IC device testing |
US5414351A (en) * | 1993-10-22 | 1995-05-09 | United Microelectronics Corporation | Method and apparatus for testing the reliability of semiconductor terminals |
US5617035A (en) * | 1993-11-01 | 1997-04-01 | Motorola, Inc. | Method for testing integrated devices |
DE19756466A1 (en) * | 1996-12-26 | 1998-07-30 | Ando Electric | Test head for integrated circuit testing device |
Non-Patent Citations (1)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 016, no. 397 (E - 1252) 24 August 1992 (1992-08-24) * |
Also Published As
Publication number | Publication date |
---|---|
WO2001079868A2 (en) | 2001-10-25 |
US20070007989A1 (en) | 2007-01-11 |
US20050035774A1 (en) | 2005-02-17 |
US7486095B2 (en) | 2009-02-03 |
AU2001249350A1 (en) | 2001-10-30 |
US6677744B1 (en) | 2004-01-13 |
US7109736B2 (en) | 2006-09-19 |
US20090134905A1 (en) | 2009-05-28 |
US7609082B2 (en) | 2009-10-27 |
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