WO2001079868A3 - System for measuring signal path resistance for an integrated circuit tester interconnect structure - Google Patents

System for measuring signal path resistance for an integrated circuit tester interconnect structure Download PDF

Info

Publication number
WO2001079868A3
WO2001079868A3 PCT/US2001/009205 US0109205W WO0179868A3 WO 2001079868 A3 WO2001079868 A3 WO 2001079868A3 US 0109205 W US0109205 W US 0109205W WO 0179868 A3 WO0179868 A3 WO 0179868A3
Authority
WO
WIPO (PCT)
Prior art keywords
ports
tester
interconnect structure
integrated circuit
signal paths
Prior art date
Application number
PCT/US2001/009205
Other languages
French (fr)
Other versions
WO2001079868A2 (en
Inventor
John M Long
Original Assignee
Formfactor Inc
John M Long
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Formfactor Inc, John M Long filed Critical Formfactor Inc
Priority to AU2001249350A priority Critical patent/AU2001249350A1/en
Publication of WO2001079868A2 publication Critical patent/WO2001079868A2/en
Publication of WO2001079868A3 publication Critical patent/WO2001079868A3/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2853Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317Testing of digital circuits
    • G01R31/3181Functional testing
    • G01R31/319Tester hardware, i.e. output processing circuits
    • G01R31/31903Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31905Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R35/00Testing or calibrating of apparatus covered by the other groups of this subclass
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
    • G01R27/02Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
    • G01R27/14Measuring resistance by measuring current or voltage obtained from a reference source
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317Testing of digital circuits
    • G01R31/31712Input or output aspects
    • G01R31/31717Interconnect testing
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317Testing of digital circuits
    • G01R31/3181Functional testing
    • G01R31/319Tester hardware, i.e. output processing circuits
    • G01R31/31917Stimuli generation or application of test patterns to the device under test [DUT]
    • G01R31/31924Voltage or current aspects, e.g. driver, receiver

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Measurement Of Resistance Or Impedance (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

Resistances of signal paths within a interconnect structure for linking input/output (I/O) ports of an integrated circuit (IC) tester to test points of an IC are measured by the IC tester itself. To do so the interconnect structure is used to link the tester's I/O ports to a similar arrangement of test points linked to one another through conductors. Drivers within the tester, which normally transmit digital test signals to IC test points via the I/O ports when the IC is under test, are modified so that they may also either transmit a constant current through the I/O ports or link the I/O ports to ground or other reference potential. The tester then transmits known currents through the signal paths interconnecting the tester's I/O ports. Existing comparators within the tester normally used to monitor the state of an IC's digital output signals are employed to measure voltage drops between the I/O ports, thereby to provide data from which resistance of signal paths within the interconnect structure may be computed.
PCT/US2001/009205 2000-04-13 2001-03-23 System for measuring signal path resistance for an integrated circuit tester interconnect structure WO2001079868A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2001249350A AU2001249350A1 (en) 2000-04-13 2001-03-23 System for measuring signal path resistance for an integrated circuit tester interconnect structure

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/548,886 US6677744B1 (en) 2000-04-13 2000-04-13 System for measuring signal path resistance for an integrated circuit tester interconnect structure
US09/548,886 2000-04-13

Publications (2)

Publication Number Publication Date
WO2001079868A2 WO2001079868A2 (en) 2001-10-25
WO2001079868A3 true WO2001079868A3 (en) 2002-02-28

Family

ID=24190786

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/009205 WO2001079868A2 (en) 2000-04-13 2001-03-23 System for measuring signal path resistance for an integrated circuit tester interconnect structure

Country Status (3)

Country Link
US (4) US6677744B1 (en)
AU (1) AU2001249350A1 (en)
WO (1) WO2001079868A2 (en)

Families Citing this family (58)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6232789B1 (en) * 1997-05-28 2001-05-15 Cascade Microtech, Inc. Probe holder for low current measurements
US5729150A (en) * 1995-12-01 1998-03-17 Cascade Microtech, Inc. Low-current probe card with reduced triboelectric current generating cables
US5914613A (en) * 1996-08-08 1999-06-22 Cascade Microtech, Inc. Membrane probing system with local contact scrub
US6034533A (en) * 1997-06-10 2000-03-07 Tervo; Paul A. Low-current pogo probe card
US6256882B1 (en) * 1998-07-14 2001-07-10 Cascade Microtech, Inc. Membrane probing system
US6578264B1 (en) * 1999-06-04 2003-06-17 Cascade Microtech, Inc. Method for constructing a membrane probe using a depression
US6838890B2 (en) * 2000-02-25 2005-01-04 Cascade Microtech, Inc. Membrane probing system
US6677744B1 (en) * 2000-04-13 2004-01-13 Formfactor, Inc. System for measuring signal path resistance for an integrated circuit tester interconnect structure
DE20114544U1 (en) * 2000-12-04 2002-02-21 Cascade Microtech Inc wafer probe
US7085977B2 (en) * 2000-12-19 2006-08-01 Texas Instruments Incorporated Method and system for detecting an outlying resistance in a plurality of resistive elements
AU2002327490A1 (en) 2001-08-21 2003-06-30 Cascade Microtech, Inc. Membrane probing system
WO2003100445A2 (en) * 2002-05-23 2003-12-04 Cascade Microtech, Inc. Probe for testing a device under test
GB2394780B (en) * 2002-10-29 2006-06-14 Ifr Ltd A method of and apparatus for testing for integrated circuit contact defects
US6724205B1 (en) * 2002-11-13 2004-04-20 Cascade Microtech, Inc. Probe for combined signals
US7057404B2 (en) * 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
US6940288B2 (en) * 2003-06-04 2005-09-06 Hewlett-Packard Development Company, L.P. Apparatus and method for monitoring and predicting failures in system interconnect
US6895353B2 (en) * 2003-06-04 2005-05-17 Hewlett-Packard Development Company, L.P. Apparatus and method for monitoring high impedance failures in chip interconnects
US20040246008A1 (en) * 2003-06-04 2004-12-09 Barr Andrew H. Apparatus and method for detecting and rejecting high impedance interconnect failures in manufacturing process
US6933853B2 (en) * 2003-06-12 2005-08-23 Hewlett-Packard Development Company, L.P. Apparatus and method for detecting and communicating interconnect failures
DE202004021093U1 (en) * 2003-12-24 2006-09-28 Cascade Microtech, Inc., Beaverton Differential probe for e.g. integrated circuit, has elongate probing units interconnected to respective active circuits that are interconnected to substrate by respective pair of flexible interconnects
US6972571B2 (en) * 2004-03-22 2005-12-06 Freescale Semiconductor, Inc. Load board with embedded relay tracker
JP4980903B2 (en) * 2004-07-07 2012-07-18 カスケード マイクロテック インコーポレイテッド Probe head with membrane suspension probe
KR20070058522A (en) * 2004-09-13 2007-06-08 캐스케이드 마이크로테크 인코포레이티드 Double sided probing structures
DE202005021436U1 (en) * 2004-11-02 2008-02-14 Cascade Microtech, Inc., Beaverton Optically enhanced digital imaging system
US7535247B2 (en) * 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7057397B1 (en) * 2005-03-03 2006-06-06 Lattice Semiconductor Corporation Output impedance measurement techniques
US7449899B2 (en) * 2005-06-08 2008-11-11 Cascade Microtech, Inc. Probe for high frequency signals
US7560947B2 (en) * 2005-09-28 2009-07-14 Teradyne, Inc. Pin electronics driver
US20070200571A1 (en) * 2006-02-16 2007-08-30 Kevin Quinn Verifying individual probe contact using shared tester channels
JP2007248385A (en) * 2006-03-17 2007-09-27 Agilent Technol Inc Apparatus for measuring semiconductor device characteristics
US7492181B1 (en) * 2006-05-31 2009-02-17 Credence Systems Corporation Method and device for enabling the measurement of device under test voltages using a testing instrument of limited range
US7764072B2 (en) * 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7723999B2 (en) * 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7403028B2 (en) * 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7443186B2 (en) * 2006-06-12 2008-10-28 Cascade Microtech, Inc. On-wafer test structures for differential signals
US7956628B2 (en) * 2006-11-03 2011-06-07 International Business Machines Corporation Chip-based prober for high frequency measurements and methods of measuring
US7876114B2 (en) * 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
JP5461394B2 (en) * 2008-05-21 2014-04-02 株式会社アドバンテスト Test wafer unit and test system
US7944225B2 (en) * 2008-09-26 2011-05-17 Formfactor, Inc. Method and apparatus for providing a tester integrated circuit for testing a semiconductor device under test
US7888957B2 (en) * 2008-10-06 2011-02-15 Cascade Microtech, Inc. Probing apparatus with impedance optimized interface
WO2010059247A2 (en) 2008-11-21 2010-05-27 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus
US8400179B1 (en) * 2009-07-20 2013-03-19 Keithley Instruments, Inc. Method for load-line correction of pulsed measurements
JP2012059328A (en) * 2010-09-10 2012-03-22 Renesas Electronics Corp Test circuit and semiconductor integrated circuit including the same
CN102567150A (en) * 2010-12-15 2012-07-11 鸿富锦精密工业(深圳)有限公司 Main board interface testing device
CN103135022B (en) * 2011-11-23 2016-01-20 上海华虹宏力半导体制造有限公司 The method of automatic detector probe card contact performance in test program
US8933715B2 (en) * 2012-04-08 2015-01-13 Elm Technology Corporation Configurable vertical integration
CN103472347A (en) * 2012-06-08 2013-12-25 富泰华工业(深圳)有限公司 Auxiliary testing circuit, chip with auxiliary testing circuit and circuit board with auxiliary testing circuit
RU2561337C1 (en) * 2014-03-14 2015-08-27 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Ульяновский государственный технический университет" Method of measurement of heat resistance of cmos of digital integrated chips
US9768780B2 (en) * 2014-05-30 2017-09-19 Intel Corporation Apparatus for providing shared reference device with metal line formed from metal layer with lower resistivity compared to other metal layers in processor
US9945888B2 (en) * 2015-12-08 2018-04-17 Sandisk Technologies Llc On-die measurement technique for I/O DC parameters VOL and VOH
RU169621U1 (en) * 2016-04-22 2017-03-24 Федеральное государственное бюджетное образовательное учреждение высшего образования Московский авиационный институт (национальный исследовательский университет) (МАИ) DEVICE FOR CONTROL OF TECHNOLOGICAL ERROR WIDTH OF THE CONDUCTORS OF THE PCB
CN107885606B (en) * 2016-09-30 2020-12-01 中芯国际集成电路制造(北京)有限公司 Reliability evaluation method of interlayer interconnection component
KR102387464B1 (en) * 2017-10-12 2022-04-15 삼성전자주식회사 Apparatus and method for testing interconnect circuit, and method for manufacturing semiconductor device comprising the method
DE102018217406B4 (en) * 2018-06-18 2020-07-23 ATEip GmbH Method and device for electrically testing an electrical assembly
US11187746B2 (en) * 2019-03-26 2021-11-30 Nuvoton Technology Corporation Contact quality testing
US11353496B2 (en) * 2019-05-08 2022-06-07 Hamilton Sundstrand Corporation Frequency-based built-in-test for discrete outputs
US20210211210A1 (en) * 2020-01-08 2021-07-08 Formfactor, Inc. Beamforming Device Testing

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5101153A (en) * 1991-01-09 1992-03-31 National Semiconductor Corporation Pin electronics test circuit for IC device testing
JPH04129417A (en) * 1990-09-20 1992-04-30 Mitsubishi Electric Corp Semiconductor integrated circuit
US5414351A (en) * 1993-10-22 1995-05-09 United Microelectronics Corporation Method and apparatus for testing the reliability of semiconductor terminals
US5617035A (en) * 1993-11-01 1997-04-01 Motorola, Inc. Method for testing integrated devices
DE19756466A1 (en) * 1996-12-26 1998-07-30 Ando Electric Test head for integrated circuit testing device

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3609537A (en) * 1969-04-01 1971-09-28 Ibm Resistance standard
US5221905A (en) * 1992-02-28 1993-06-22 International Business Machines Corporation Test system with reduced test contact interface resistance
JPH07130817A (en) * 1993-10-30 1995-05-19 Sony Corp Method and apparatus for evaluating reliability of metal wiring
US6055661A (en) * 1994-06-13 2000-04-25 Luk; Fong System configuration and methods for on-the-fly testing of integrated circuits
JP3233559B2 (en) * 1995-08-14 2001-11-26 シャープ株式会社 Method and apparatus for testing semiconductor integrated circuit
US5736850A (en) * 1995-09-11 1998-04-07 Teradyne, Inc. Configurable probe card for automatic test equipment
US5838161A (en) 1996-05-01 1998-11-17 Micron Technology, Inc. Semiconductor interconnect having test structures for evaluating electrical characteristics of the interconnect
US6087843A (en) * 1997-07-14 2000-07-11 Credence Systems Corporation Integrated circuit tester with test head including regulating capacitor
US6181144B1 (en) * 1998-02-25 2001-01-30 Micron Technology, Inc. Semiconductor probe card having resistance measuring circuitry and method fabrication
DE19817763C2 (en) 1998-04-21 2001-02-15 Texas Instruments Deutschland Method for calibrating a measuring device
US6339338B1 (en) * 2000-01-18 2002-01-15 Formfactor, Inc. Apparatus for reducing power supply noise in an integrated circuit
US6677744B1 (en) * 2000-04-13 2004-01-13 Formfactor, Inc. System for measuring signal path resistance for an integrated circuit tester interconnect structure

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04129417A (en) * 1990-09-20 1992-04-30 Mitsubishi Electric Corp Semiconductor integrated circuit
US5101153A (en) * 1991-01-09 1992-03-31 National Semiconductor Corporation Pin electronics test circuit for IC device testing
US5414351A (en) * 1993-10-22 1995-05-09 United Microelectronics Corporation Method and apparatus for testing the reliability of semiconductor terminals
US5617035A (en) * 1993-11-01 1997-04-01 Motorola, Inc. Method for testing integrated devices
DE19756466A1 (en) * 1996-12-26 1998-07-30 Ando Electric Test head for integrated circuit testing device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 016, no. 397 (E - 1252) 24 August 1992 (1992-08-24) *

Also Published As

Publication number Publication date
WO2001079868A2 (en) 2001-10-25
US20070007989A1 (en) 2007-01-11
US20050035774A1 (en) 2005-02-17
US7486095B2 (en) 2009-02-03
AU2001249350A1 (en) 2001-10-30
US6677744B1 (en) 2004-01-13
US7109736B2 (en) 2006-09-19
US20090134905A1 (en) 2009-05-28
US7609082B2 (en) 2009-10-27

Similar Documents

Publication Publication Date Title
WO2001079868A3 (en) System for measuring signal path resistance for an integrated circuit tester interconnect structure
US5617035A (en) Method for testing integrated devices
US6323654B1 (en) Method and apparatus for remotely changing signal characteristics of a signal generator
GB2281403B (en) Detecting faults on a printed circuit board
CN102016614B (en) Methods and apparatus that selectively use or bypass a remote pin electronics block to test at least one device under test
CN101084445A (en) Method and system for testing semiconductor device
EP0650069A2 (en) Analog multi-channel probe system
US20080191709A1 (en) Cable compensation for pulsed I-V measurements
US4278931A (en) Location of contact faults on electrically conductive cables
CN101452048A (en) Integrated circuit chip temperature test device and method
CN106707213B (en) A kind of digital integrated electronic circuit standard sample of photo
KR20100116547A (en) Driver comparator circuit and test apparatus using thesame
JP4582999B2 (en) Measuring equipment and measuring method
Whetsel Proposal to simplify development of a mixed signal test standard
CN106597248A (en) Spliced plate detection device
US20190128971A1 (en) Modification of test measurement signals for protective devices for electric power networks
JP2006189352A (en) Impedance conversion circuit, input and output circuit, and semi-conductor testing device
JPH0752622Y2 (en) Voltage applied current measuring instrument
US6624721B1 (en) Apparatus for acquiring a signal from an intermediate point on a series impedance source terminated unidirectional transmission line
KR20100103456A (en) Test apparatus and measurement device
US6320390B1 (en) Probe for fault actuation devices
JPH06222093A (en) Method for measuring grounding resistance
JPH0634705Y2 (en) IC test equipment
CN108775972A (en) The fault detection circuit of thermistor temperature detecting circuit
KR20030015887A (en) Simple chip identification

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CR CU CZ DE DK DM DZ EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
AK Designated states

Kind code of ref document: A3

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CR CU CZ DE DK DM DZ EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A3

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG

122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: JP