WO2001071067A3 - An energy enhanced process for treating a conductive surface and products formed thereby - Google Patents

An energy enhanced process for treating a conductive surface and products formed thereby Download PDF

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Publication number
WO2001071067A3
WO2001071067A3 PCT/US2001/009293 US0109293W WO0171067A3 WO 2001071067 A3 WO2001071067 A3 WO 2001071067A3 US 0109293 W US0109293 W US 0109293W WO 0171067 A3 WO0171067 A3 WO 0171067A3
Authority
WO
WIPO (PCT)
Prior art keywords
conductive surface
treating
products formed
enhanced process
energy enhanced
Prior art date
Application number
PCT/US2001/009293
Other languages
French (fr)
Other versions
WO2001071067A2 (en
Inventor
Robert L Heimann
William M Dalton
John Hahn
David M Price
Wayne L Soucie
Chandran Ravi
Original Assignee
Elisha Technologies Co Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/532,982 external-priority patent/US6322687B1/en
Application filed by Elisha Technologies Co Llc filed Critical Elisha Technologies Co Llc
Priority to AU52948/01A priority Critical patent/AU780174B2/en
Priority to JP2001569444A priority patent/JP2003528220A/en
Priority to BR0109472-6A priority patent/BR0109472A/en
Priority to MXPA02003563A priority patent/MXPA02003563A/en
Priority to CA2387813A priority patent/CA2387813C/en
Priority to EP01926411A priority patent/EP1307608A2/en
Publication of WO2001071067A2 publication Critical patent/WO2001071067A2/en
Publication of WO2001071067A3 publication Critical patent/WO2001071067A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D9/00—Electrolytic coating other than with metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D9/00—Electrolytic coating other than with metals
    • C25D9/04—Electrolytic coating other than with metals with inorganic materials
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D9/00—Electrolytic coating other than with metals
    • C25D9/04—Electrolytic coating other than with metals with inorganic materials
    • C25D9/08—Electrolytic coating other than with metals with inorganic materials by cathodic processes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability

Abstract

The disclosure relates to a process for forming a deposit on the surface of a metallic or conductive surface. The process employs an energy enhanced process to deposit a silicate containing coating or film upon a metallic or conductive surface.
PCT/US2001/009293 2000-03-22 2001-03-22 An energy enhanced process for treating a conductive surface and products formed thereby WO2001071067A2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
AU52948/01A AU780174B2 (en) 2000-03-22 2001-03-22 An energy enhanced process for treating a conductive surface and products formed thereby
JP2001569444A JP2003528220A (en) 2000-03-22 2001-03-22 Energy forcing method for treating conductive surfaces and products prepared thereby
BR0109472-6A BR0109472A (en) 2000-03-22 2001-03-22 Methods for treating a substrate having an electrically conductive surface and for treating a metallic or electrically conductive surface, aqueous medium for use in the electrical treatment of a conductive surface, article, product, and substrate
MXPA02003563A MXPA02003563A (en) 2000-03-22 2001-03-22 An energy enhanced process for treating a conductive surface and products formed thereby.
CA2387813A CA2387813C (en) 2000-03-22 2001-03-22 An energy enhanced process for treating a conductive surface and products formed thereby
EP01926411A EP1307608A2 (en) 2000-03-22 2001-03-22 An energy enhanced process for treating a conductive surface and products formed thereby

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US09/532,982 US6322687B1 (en) 1997-01-31 2000-03-22 Electrolytic process for forming a mineral
US09/532,982 2000-03-22
US09/775,072 US6592738B2 (en) 1997-01-31 2001-02-01 Electrolytic process for treating a conductive surface and products formed thereby
US09/775,072 2001-02-01

Publications (2)

Publication Number Publication Date
WO2001071067A2 WO2001071067A2 (en) 2001-09-27
WO2001071067A3 true WO2001071067A3 (en) 2003-02-06

Family

ID=27064015

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/009293 WO2001071067A2 (en) 2000-03-22 2001-03-22 An energy enhanced process for treating a conductive surface and products formed thereby

Country Status (10)

Country Link
US (1) US6592738B2 (en)
EP (1) EP1307608A2 (en)
JP (1) JP2003528220A (en)
KR (1) KR100768565B1 (en)
CN (1) CN1284886C (en)
AU (1) AU780174B2 (en)
BR (1) BR0109472A (en)
CA (1) CA2387813C (en)
MX (1) MXPA02003563A (en)
WO (1) WO2001071067A2 (en)

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CA2387813A1 (en) 2001-09-27
US6592738B2 (en) 2003-07-15
KR20020091152A (en) 2002-12-05
EP1307608A2 (en) 2003-05-07
KR100768565B1 (en) 2007-10-19
WO2001071067A2 (en) 2001-09-27
AU5294801A (en) 2001-10-03
CN1284886C (en) 2006-11-15
MXPA02003563A (en) 2003-05-23
US20020012804A1 (en) 2002-01-31
AU780174B2 (en) 2005-03-03
BR0109472A (en) 2004-01-13
CN1476493A (en) 2004-02-18
JP2003528220A (en) 2003-09-24
CA2387813C (en) 2014-08-12

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