WO2001066819A3 - Methods for preparing ruthenium metal films - Google Patents

Methods for preparing ruthenium metal films Download PDF

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Publication number
WO2001066819A3
WO2001066819A3 PCT/US2001/007402 US0107402W WO0166819A3 WO 2001066819 A3 WO2001066819 A3 WO 2001066819A3 US 0107402 W US0107402 W US 0107402W WO 0166819 A3 WO0166819 A3 WO 0166819A3
Authority
WO
WIPO (PCT)
Prior art keywords
metal films
methods
ruthenium metal
dienes
preparing ruthenium
Prior art date
Application number
PCT/US2001/007402
Other languages
French (fr)
Other versions
WO2001066819A2 (en
Inventor
Mark R Visokay
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Priority to JP2001565420A priority Critical patent/JP2003526009A/en
Priority to EP01924128A priority patent/EP1261754A2/en
Priority to AU2001250811A priority patent/AU2001250811A1/en
Publication of WO2001066819A2 publication Critical patent/WO2001066819A2/en
Publication of WO2001066819A3 publication Critical patent/WO2001066819A3/en

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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/40Oxides
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/06Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
    • C23C16/16Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metal carbonyl compounds
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/06Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
    • C23C16/18Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

The present invention provides methods for the preparation of ruthenium metal films from liquid ruthenium complexes of the formula (diene)Ru(CO)3, wherein 'diene' refers to linear, branched, or cyclic dienes, bicyclic dienes, tricyclic dienes, fluorinated derivatives thereof, combinations thereof, or derivatives thereof additionally containing heteroatoms such as halide, Si, S, Se, P, As, N, or O, in the presence of an oxidizing gas.
PCT/US2001/007402 2000-03-08 2001-03-08 Methods for preparing ruthenium metal films WO2001066819A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2001565420A JP2003526009A (en) 2000-03-08 2001-03-08 Preparation method of ruthenium metal film
EP01924128A EP1261754A2 (en) 2000-03-08 2001-03-08 Methods for preparing ruthenium metal films
AU2001250811A AU2001250811A1 (en) 2000-03-08 2001-03-08 Methods for preparing ruthenium metal films

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/520,492 2000-03-08
US09/520,492 US6380080B2 (en) 2000-03-08 2000-03-08 Methods for preparing ruthenium metal films

Publications (2)

Publication Number Publication Date
WO2001066819A2 WO2001066819A2 (en) 2001-09-13
WO2001066819A3 true WO2001066819A3 (en) 2002-01-24

Family

ID=24072827

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/007402 WO2001066819A2 (en) 2000-03-08 2001-03-08 Methods for preparing ruthenium metal films

Country Status (7)

Country Link
US (1) US6380080B2 (en)
EP (1) EP1261754A2 (en)
JP (1) JP2003526009A (en)
KR (1) KR100708496B1 (en)
AU (1) AU2001250811A1 (en)
TW (1) TW487972B (en)
WO (1) WO2001066819A2 (en)

Families Citing this family (58)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4034518B2 (en) * 2000-03-31 2008-01-16 株式会社日立国際電気 Manufacturing method of semiconductor device
US7494927B2 (en) 2000-05-15 2009-02-24 Asm International N.V. Method of growing electrical conductors
US6429127B1 (en) * 2000-06-08 2002-08-06 Micron Technology, Inc. Methods for forming rough ruthenium-containing layers and structures/methods using same
JP3998906B2 (en) * 2000-09-28 2007-10-31 株式会社日立国際電気 Manufacturing method of semiconductor device
JP2002212112A (en) * 2001-01-22 2002-07-31 Tanaka Kikinzoku Kogyo Kk Ruthenium compound for chemical vapor deposition and method for chemical vapor deposition of ruthenium thin film and ruthenium compound thin film
KR100434489B1 (en) * 2001-03-22 2004-06-05 삼성전자주식회사 Method for depositing ruthenium layer having Ru02 seeding layer
KR100727372B1 (en) 2001-09-12 2007-06-12 토소가부시키가이샤 Ruthenium complex, manufacturing process thereof and the method for forming thin-film using the complex
US6824816B2 (en) * 2002-01-29 2004-11-30 Asm International N.V. Process for producing metal thin films by ALD
US7160577B2 (en) 2002-05-02 2007-01-09 Micron Technology, Inc. Methods for atomic-layer deposition of aluminum oxides in integrated circuits
US7589029B2 (en) * 2002-05-02 2009-09-15 Micron Technology, Inc. Atomic layer deposition and conversion
US6794299B1 (en) * 2002-06-03 2004-09-21 Advanced Micro Devices Inc. Various methods of controlling conformal film deposition processes, and a system for accomplishing same
US7135421B2 (en) * 2002-06-05 2006-11-14 Micron Technology, Inc. Atomic layer-deposited hafnium aluminum oxide
US7199023B2 (en) * 2002-08-28 2007-04-03 Micron Technology, Inc. Atomic layer deposited HfSiON dielectric films wherein each precursor is independendently pulsed
US7084078B2 (en) * 2002-08-29 2006-08-01 Micron Technology, Inc. Atomic layer deposited lanthanide doped TiOx dielectric films
US7588988B2 (en) 2004-08-31 2009-09-15 Micron Technology, Inc. Method of forming apparatus having oxide films formed using atomic layer deposition
US7484315B2 (en) * 2004-11-29 2009-02-03 Tokyo Electron Limited Replaceable precursor tray for use in a multi-tray solid precursor delivery system
US7708835B2 (en) * 2004-11-29 2010-05-04 Tokyo Electron Limited Film precursor tray for use in a film precursor evaporation system and method of using
US7488512B2 (en) * 2004-11-29 2009-02-10 Tokyo Electron Limited Method for preparing solid precursor tray for use in solid precursor evaporation system
US7638002B2 (en) * 2004-11-29 2009-12-29 Tokyo Electron Limited Multi-tray film precursor evaporation system and thin film deposition system incorporating same
KR100647318B1 (en) * 2005-02-03 2006-11-23 삼성전자주식회사 Nonvolatile memory device and fabrication method of the same
US7666773B2 (en) * 2005-03-15 2010-02-23 Asm International N.V. Selective deposition of noble metal thin films
US8025922B2 (en) * 2005-03-15 2011-09-27 Asm International N.V. Enhanced deposition of noble metals
US7651570B2 (en) * 2005-03-31 2010-01-26 Tokyo Electron Limited Solid precursor vaporization system for use in chemical vapor deposition
US7390756B2 (en) * 2005-04-28 2008-06-24 Micron Technology, Inc. Atomic layer deposited zirconium silicon oxide films
US7662729B2 (en) * 2005-04-28 2010-02-16 Micron Technology, Inc. Atomic layer deposition of a ruthenium layer to a lanthanide oxide dielectric layer
US7572695B2 (en) * 2005-05-27 2009-08-11 Micron Technology, Inc. Hafnium titanium oxide films
US20070014919A1 (en) * 2005-07-15 2007-01-18 Jani Hamalainen Atomic layer deposition of noble metal oxides
US7927948B2 (en) 2005-07-20 2011-04-19 Micron Technology, Inc. Devices with nanocrystals and methods of formation
US7575978B2 (en) * 2005-08-04 2009-08-18 Micron Technology, Inc. Method for making conductive nanoparticle charge storage element
US7410910B2 (en) * 2005-08-31 2008-08-12 Micron Technology, Inc. Lanthanum aluminum oxynitride dielectric films
US20070069383A1 (en) * 2005-09-28 2007-03-29 Tokyo Electron Limited Semiconductor device containing a ruthenium diffusion barrier and method of forming
US7713876B2 (en) * 2005-09-28 2010-05-11 Tokyo Electron Limited Method for integrating a ruthenium layer with bulk copper in copper metallization
US7709402B2 (en) * 2006-02-16 2010-05-04 Micron Technology, Inc. Conductive layers for hafnium silicon oxynitride films
US7435484B2 (en) * 2006-09-01 2008-10-14 Asm Japan K.K. Ruthenium thin film-formed structure
JP5248508B2 (en) 2006-09-22 2013-07-31 レール・リキード−ソシエテ・アノニム・プール・レテュード・エ・レクスプロワタシオン・デ・プロセデ・ジョルジュ・クロード Method for depositing ruthenium-containing films
US20080124484A1 (en) * 2006-11-08 2008-05-29 Asm Japan K.K. Method of forming ru film and metal wiring structure
US7763511B2 (en) * 2006-12-29 2010-07-27 Intel Corporation Dielectric barrier for nanocrystals
US20080171436A1 (en) * 2007-01-11 2008-07-17 Asm Genitech Korea Ltd. Methods of depositing a ruthenium film
US7846256B2 (en) * 2007-02-23 2010-12-07 Tokyo Electron Limited Ampule tray for and method of precursor surface area
US8367506B2 (en) 2007-06-04 2013-02-05 Micron Technology, Inc. High-k dielectrics with gold nano-particles
US20090087339A1 (en) * 2007-09-28 2009-04-02 Asm Japan K.K. METHOD FOR FORMING RUTHENIUM COMPLEX FILM USING Beta-DIKETONE-COORDINATED RUTHENIUM PRECURSOR
KR101544198B1 (en) 2007-10-17 2015-08-12 한국에이에스엠지니텍 주식회사 Method of depositing ruthenium film
US7655564B2 (en) * 2007-12-12 2010-02-02 Asm Japan, K.K. Method for forming Ta-Ru liner layer for Cu wiring
KR20090067505A (en) * 2007-12-21 2009-06-25 에이에스엠지니텍코리아 주식회사 Method of depositing ruthenium film
US7799674B2 (en) * 2008-02-19 2010-09-21 Asm Japan K.K. Ruthenium alloy film for copper interconnects
US8124528B2 (en) * 2008-04-10 2012-02-28 Micron Technology, Inc. Method for forming a ruthenium film
TW200951241A (en) * 2008-05-30 2009-12-16 Sigma Aldrich Co Methods of forming ruthenium-containing films by atomic layer deposition
US8084104B2 (en) * 2008-08-29 2011-12-27 Asm Japan K.K. Atomic composition controlled ruthenium alloy film formed by plasma-enhanced atomic layer deposition
US8133555B2 (en) 2008-10-14 2012-03-13 Asm Japan K.K. Method for forming metal film by ALD using beta-diketone metal complex
US9379011B2 (en) 2008-12-19 2016-06-28 Asm International N.V. Methods for depositing nickel films and for making nickel silicide and nickel germanide
US20110020546A1 (en) * 2009-05-15 2011-01-27 Asm International N.V. Low Temperature ALD of Noble Metals
US8329569B2 (en) * 2009-07-31 2012-12-11 Asm America, Inc. Deposition of ruthenium or ruthenium dioxide
JP5741443B2 (en) * 2009-11-25 2015-07-01 Jsr株式会社 Ruthenium film forming material and ruthenium film forming method
US8357614B2 (en) 2010-04-19 2013-01-22 L'air Liquide Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Ruthenium-containing precursors for CVD and ALD
US8871617B2 (en) 2011-04-22 2014-10-28 Asm Ip Holding B.V. Deposition and reduction of mixed metal oxide thin films
JP2015160963A (en) * 2014-02-26 2015-09-07 東京エレクトロン株式会社 Method and apparatus for depositing ruthenium film, and method for manufacturing semiconductor device
JP6547930B2 (en) * 2014-08-29 2019-07-24 株式会社Flosfia Metal film formation method
US9607842B1 (en) 2015-10-02 2017-03-28 Asm Ip Holding B.V. Methods of forming metal silicides

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5372849A (en) * 1992-07-28 1994-12-13 Minnesota Mining And Manufacturing Company Chemical vapor deposition of iron, ruthenium, and osmium
US5962716A (en) * 1998-08-27 1999-10-05 Micron Technology, Inc. Methods for preparing ruthenium and osmium compounds
WO2000012779A1 (en) * 1998-08-27 2000-03-09 Micron Technology, Inc. Methods for preparing ruthenium oxide films
WO2000012776A1 (en) * 1998-08-27 2000-03-09 Micron Technology, Inc. Precursor chemistries for chemical vapor deposition of ruthenium and ruthenium oxide

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5130172A (en) 1988-10-21 1992-07-14 The Regents Of The University Of California Low temperature organometallic deposition of metals
JP3351856B2 (en) 1992-04-20 2002-12-03 テキサス インスツルメンツ インコーポレイテツド Method of manufacturing structure and capacitor
JP3407204B2 (en) 1992-07-23 2003-05-19 オリンパス光学工業株式会社 Ferroelectric integrated circuit and method of manufacturing the same
US5392189A (en) 1993-04-02 1995-02-21 Micron Semiconductor, Inc. Capacitor compatible with high dielectric constant materials having two independent insulative layers and the method for forming same
US5352488A (en) 1993-05-14 1994-10-04 Syracuse University Chemical vapor deposition process employing metal pentadienyl complexes
US5407855A (en) 1993-06-07 1995-04-18 Motorola, Inc. Process for forming a semiconductor device having a reducing/oxidizing conductive material
US5566045A (en) 1994-08-01 1996-10-15 Texas Instruments, Inc. High-dielectric-constant material electrodes comprising thin platinum layers
US5555486A (en) 1994-12-29 1996-09-10 North Carolina State University Hybrid metal/metal oxide electrodes for ferroelectric capacitors
US5874364A (en) 1995-03-27 1999-02-23 Fujitsu Limited Thin film deposition method, capacitor device and method for fabricating the same, and semiconductor device and method for fabricating the same
US5695815A (en) 1996-05-29 1997-12-09 Micron Technology, Inc. Metal carboxylate complexes for formation of metal-containing films on semiconductor devices
US5935648A (en) 1997-03-28 1999-08-10 The United States Of America As Represented By The Secretary Of The Air Force High surface area molybdenum nitride electrodes
US5980983A (en) 1997-04-17 1999-11-09 The President And Fellows Of Harvard University Liquid precursors for formation of metal oxides
US6074945A (en) * 1998-08-27 2000-06-13 Micron Technology, Inc. Methods for preparing ruthenium metal films

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5372849A (en) * 1992-07-28 1994-12-13 Minnesota Mining And Manufacturing Company Chemical vapor deposition of iron, ruthenium, and osmium
US5962716A (en) * 1998-08-27 1999-10-05 Micron Technology, Inc. Methods for preparing ruthenium and osmium compounds
WO2000012779A1 (en) * 1998-08-27 2000-03-09 Micron Technology, Inc. Methods for preparing ruthenium oxide films
WO2000012776A1 (en) * 1998-08-27 2000-03-09 Micron Technology, Inc. Precursor chemistries for chemical vapor deposition of ruthenium and ruthenium oxide

Also Published As

Publication number Publication date
KR20020089381A (en) 2002-11-29
WO2001066819A2 (en) 2001-09-13
JP2003526009A (en) 2003-09-02
US20020013052A1 (en) 2002-01-31
EP1261754A2 (en) 2002-12-04
US6380080B2 (en) 2002-04-30
KR100708496B1 (en) 2007-04-16
TW487972B (en) 2002-05-21
AU2001250811A1 (en) 2001-09-17

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