WO2001064395A3 - A modular control system and method for a cmp tool - Google Patents

A modular control system and method for a cmp tool Download PDF

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Publication number
WO2001064395A3
WO2001064395A3 PCT/US2001/006658 US0106658W WO0164395A3 WO 2001064395 A3 WO2001064395 A3 WO 2001064395A3 US 0106658 W US0106658 W US 0106658W WO 0164395 A3 WO0164395 A3 WO 0164395A3
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
control system
cmp
modular control
cmp tool
Prior art date
Application number
PCT/US2001/006658
Other languages
French (fr)
Other versions
WO2001064395A2 (en
Inventor
Jack Nimtz
Gary Rickords
Mark Freseman
Randy Smith
Original Assignee
Speedfam Ipec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Speedfam Ipec Corp filed Critical Speedfam Ipec Corp
Publication of WO2001064395A2 publication Critical patent/WO2001064395A2/en
Publication of WO2001064395A3 publication Critical patent/WO2001064395A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • General Factory Administration (AREA)

Abstract

A system and method for an automated chemical mechanical planarization (CMP) machine. The system comprises a plurality of interchangeable CMP process modules. Each module is a compilation of grouped software codes called 'objects'. Process modules may be added or deleted from the system as needed, whether during the machine's assembly or during actual use. The system is configured to allow users to input a process 'recipe' for each wafer of a wafer cassette which will guide the system to process the wafer in a desired way.
PCT/US2001/006658 2000-03-01 2001-02-27 A modular control system and method for a cmp tool WO2001064395A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US51643200A 2000-03-01 2000-03-01
US09/516,432 2000-03-01

Publications (2)

Publication Number Publication Date
WO2001064395A2 WO2001064395A2 (en) 2001-09-07
WO2001064395A3 true WO2001064395A3 (en) 2002-08-29

Family

ID=24055562

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/006658 WO2001064395A2 (en) 2000-03-01 2001-02-27 A modular control system and method for a cmp tool

Country Status (2)

Country Link
TW (1) TW503156B (en)
WO (1) WO2001064395A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101065218B (en) * 2004-09-27 2011-08-17 Nxp股份有限公司 Flexible rinsing step in a CMP process
JP6310260B2 (en) 2014-01-20 2018-04-11 株式会社荏原製作所 Adjusting apparatus for adjusting a plurality of processing units in a substrate processing apparatus, and a substrate processing apparatus provided with the adjusting apparatus

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5420796A (en) * 1993-12-23 1995-05-30 Vlsi Technology, Inc. Method of inspecting planarity of wafer surface after etchback step in integrated circuit fabrication
US5453933A (en) * 1993-09-08 1995-09-26 Hurco Companies, Inc. CNC control system
US5812394A (en) * 1995-07-21 1998-09-22 Control Systems International Object-oriented computer program, system, and method for developing control schemes for facilities
WO1999064940A1 (en) * 1998-06-11 1999-12-16 Speedfam-Ipec Corp. Distributed control system for a semiconductor wafer processing machine

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5453933A (en) * 1993-09-08 1995-09-26 Hurco Companies, Inc. CNC control system
US5420796A (en) * 1993-12-23 1995-05-30 Vlsi Technology, Inc. Method of inspecting planarity of wafer surface after etchback step in integrated circuit fabrication
US5812394A (en) * 1995-07-21 1998-09-22 Control Systems International Object-oriented computer program, system, and method for developing control schemes for facilities
WO1999064940A1 (en) * 1998-06-11 1999-12-16 Speedfam-Ipec Corp. Distributed control system for a semiconductor wafer processing machine

Also Published As

Publication number Publication date
TW503156B (en) 2002-09-21
WO2001064395A2 (en) 2001-09-07

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