WO2001063634A3 - Microswitch and process for its production - Google Patents

Microswitch and process for its production Download PDF

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Publication number
WO2001063634A3
WO2001063634A3 PCT/IB2001/000236 IB0100236W WO0163634A3 WO 2001063634 A3 WO2001063634 A3 WO 2001063634A3 IB 0100236 W IB0100236 W IB 0100236W WO 0163634 A3 WO0163634 A3 WO 0163634A3
Authority
WO
WIPO (PCT)
Prior art keywords
microswitch
spring
production
additional layer
contact
Prior art date
Application number
PCT/IB2001/000236
Other languages
French (fr)
Other versions
WO2001063634A2 (en
Inventor
Michael Schwab
Kay Krupka
Original Assignee
Tyco Electronics Amp Gmbh
Michael Schwab
Kay Krupka
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tyco Electronics Amp Gmbh, Michael Schwab, Kay Krupka filed Critical Tyco Electronics Amp Gmbh
Priority to AU2001266244A priority Critical patent/AU2001266244A1/en
Publication of WO2001063634A2 publication Critical patent/WO2001063634A2/en
Publication of WO2001063634A3 publication Critical patent/WO2001063634A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H59/00—Electrostatic relays; Electro-adhesion relays
    • H01H59/0009—Electrostatic relays; Electro-adhesion relays making use of micromechanics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H59/00—Electrostatic relays; Electro-adhesion relays
    • H01H59/0009—Electrostatic relays; Electro-adhesion relays making use of micromechanics
    • H01H2059/0081—Electrostatic relays; Electro-adhesion relays making use of micromechanics with a tapered air-gap between fixed and movable electrodes

Abstract

The invention relates to a microswitch with a substrate (1) and a spring (2). The spring (2) consists of an intrinsically biased material. Therefore, deposition of an additional layer producing the curvature of the spring (2) can be dispensed with. As a result, temperature dependence on contact spacing, contact resistance and contact force is largely avoided. Adhesion problems of the additional layer are also avoided. The invention further relates to the production of the microswitch by surface micromechanical methods and sacrificial layer technology.
PCT/IB2001/000236 2000-02-23 2001-02-23 Microswitch and process for its production WO2001063634A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2001266244A AU2001266244A1 (en) 2000-02-23 2001-02-23 Microswitch and process for its production

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP00103778.7 2000-02-23
EP00103778 2000-02-23

Publications (2)

Publication Number Publication Date
WO2001063634A2 WO2001063634A2 (en) 2001-08-30
WO2001063634A3 true WO2001063634A3 (en) 2002-03-14

Family

ID=8167940

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2001/000236 WO2001063634A2 (en) 2000-02-23 2001-02-23 Microswitch and process for its production

Country Status (2)

Country Link
AU (1) AU2001266244A1 (en)
WO (1) WO2001063634A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003028059A1 (en) * 2001-09-21 2003-04-03 Hrl Laboratories, Llc Mems switches and methods of making same
AU2003901058A0 (en) * 2003-03-10 2003-03-20 Microtechnology Centre Management Limited Electroplating pcb components
GB2563896B (en) * 2017-06-29 2019-07-24 Univ Bristol Electrostatic Actuator

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5233459A (en) * 1991-03-06 1993-08-03 Massachusetts Institute Of Technology Electric display device
US5638946A (en) * 1996-01-11 1997-06-17 Northeastern University Micromechanical switch with insulated switch contact
DE19736674C1 (en) * 1997-08-22 1998-11-26 Siemens Ag Micromechanical electrostatic relay

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5233459A (en) * 1991-03-06 1993-08-03 Massachusetts Institute Of Technology Electric display device
US5638946A (en) * 1996-01-11 1997-06-17 Northeastern University Micromechanical switch with insulated switch contact
DE19736674C1 (en) * 1997-08-22 1998-11-26 Siemens Ag Micromechanical electrostatic relay

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
HYMAN D ET AL: "CONTACT PHYSICS OF GOLD MICROCONTACTS FOR MEMS SWITCHES", FINE WOODWORKING, TAUNTON PRESS, NEWTON, CT, US, 26 October 1998 (1998-10-26), pages 133 - 140, XP000801151, ISSN: 0361-3453 *

Also Published As

Publication number Publication date
AU2001266244A1 (en) 2001-09-03
WO2001063634A2 (en) 2001-08-30

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