WO2001045040A2 - Disposable smart card - Google Patents

Disposable smart card Download PDF

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Publication number
WO2001045040A2
WO2001045040A2 PCT/FR2000/003513 FR0003513W WO0145040A2 WO 2001045040 A2 WO2001045040 A2 WO 2001045040A2 FR 0003513 W FR0003513 W FR 0003513W WO 0145040 A2 WO0145040 A2 WO 0145040A2
Authority
WO
WIPO (PCT)
Prior art keywords
chip
cavity
integrated circuit
circuit chip
support
Prior art date
Application number
PCT/FR2000/003513
Other languages
French (fr)
Other versions
WO2001045040B1 (en
WO2001045040A3 (en
Inventor
Philippe Patrice
Joël TURIN
Jean-Christophe Fidalgo
Original Assignee
Gemplus
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus filed Critical Gemplus
Priority to AU21852/01A priority Critical patent/AU2185201A/en
Publication of WO2001045040A2 publication Critical patent/WO2001045040A2/en
Publication of WO2001045040A3 publication Critical patent/WO2001045040A3/en
Publication of WO2001045040B1 publication Critical patent/WO2001045040B1/en

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
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    • H01L2224/2499—Auxiliary members for HDI interconnects, e.g. spacers, alignment aids
    • H01L2224/24996—Auxiliary members for HDI interconnects, e.g. spacers, alignment aids being formed on an item to be connected not being a semiconductor or solid-state body
    • H01L2224/24998—Reinforcing structures, e.g. ramp-like support
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    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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    • H01L2224/82007—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] involving a permanent auxiliary member being left in the finished device, e.g. aids for holding or protecting a build-up interconnect during or after the bonding process
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Definitions

  • the present invention relates to an integrated circuit chip device comprising a support carrying a communication interface with antenna and / or contact pads connected to an integrated circuit chip by connection elements and a method of manufacturing such a device.
  • Integrated circuit chip devices generally include smart cards, electronic labels, tickets and can have contact and / or remote operation via a communication interface, in particular with antenna or capacity. Dimensions of the device can be diverse and varied, greater than the smart card format defined in the ISO 7810 standard or less like the "Edmundson" format
  • These devices are used in various applications including banking transaction, identification, authentication, loyalty, electronic wallet, telephony, transport or access applications, etc.
  • patent application FR 2 736 452 which relates to a low cost device for single use. It describes a smart card comprising a body made of fibrous material provided with a cavity defining a side wall on which protrude. fibers The cavity is of appropriate dimensions to retain an integrated circuit chip by the fibers The chip is mounted with its active face outwards from the cavity, contact pads and elements interconnection connecting the contact pads to the studs of the chip are made by printing and a protective varnish covers the integrated circuit and the interconnection elements.
  • Such a construction has the disadvantage of presenting risks of rupture of the interconnection elements during the manipulation of the device, in particular by bending or by pressure on the varnish, taking into account the low mechanical resistance of the fiber support and the low retention of the chip by fibers.
  • Patent application EP-A-0 803 839 relates to a device which also aims to lower the manufacturing cost. It describes an integrated circuit card comprising a polymer body in which an integrated circuit chip is fixed by hot pressing so that its contact pads are flush with the surface of the card. Antenna turns are deposited in particular by screen printing and a layer of protective resin covers the chip and at least a part of the card body immediately adjacent to the chip.
  • the method described does not allow high production rates which could lead to significantly lowering the cost of the device.
  • the present invention aims to solve the problems set out above.
  • the objective of the present invention is to provide a reliable device structure which can be manufactured by technologies capable of transferring and interconnecting chips to the communication interface very precisely and at very high speed on a low cost substrate or weak mechanical resistance like paper.
  • the subject of the present invention is an integrated circuit chip device comprising a support having a general plane and into which opens a rim of a cavity, a communication interface with antenna and / or with contact pads carried by said plan, at least one chip an integrated circuit disposed in said active face cavity towards the outside and connected to said interface by interconnection elements, said chip having an active face provided with connection pads and delimited by a peripheral edge. It is distinguished in that said peripheral edge of the chip is distant from said edge of the cavity and in that each interconnection element is constituted by a continuous cord of electrically conductive material extending from the studs of the chip to the plane of the support . According to a first embodiment, said active face is arranged below the general plane of the support.
  • the device has a space around the chip. According to other characteristics: - the chip is covered with protective material;
  • connection elements are made of the same homogeneous electrically conductive material; - interface connection points are placed around the cavity;
  • the chip is fixed in the cavity by an electrically insulating adhesive material
  • the support comprises fibrous material
  • the present invention also relates to a method for manufacturing an integrated circuit chip device comprising an integrated circuit chip connected to a contact communication interface and / or to antenna. It is distinguished in that it comprises the following stages according to which:
  • a cavity is produced in the support so that the available volume of the cavity is significantly greater than the size of the chip
  • the chip is transferred to the cavity, so that the edge of its active face is distant from the support plane;
  • FIG. 1 is a sectional diagram of the invention according to a first embodiment
  • FIG. 2 shows a section of the support body and the chip
  • - Figure 3 is a sectional diagram of the invention according to a second embodiment
  • - Figure 4 is a sectional diagram of the invention according to a third embodiment.
  • a device 10 with an integrated circuit chip comprises an integrated circuit chip 1 1 connected to a communication interface 13.
  • the device can be any according to the application, in particular an electronic label or a smart card or a transport ticket.
  • the support 14 defining a general plane 1 5 into which opens a cavity 16.
  • the cavity has a bottom 17 and a side wall
  • the device is a metro ticket type transport in paper or with cellulose or polymer fibers Its thickness is around 1 mm
  • the cavity has a depth of 0.6 mm and a width of 1.5 mm It can be round, oval , square
  • the chip 11 (FIG. 3) generally has an active face 20 provided with connection pads 21, a rear face 22 and a wafer 23 The active face is delimited by a peripheral edge 24 resulting from the intersection of the wafer with the active face It is for example of the order of 0.5 mm on a side with a thickness which can range in particular from 10 ⁇ m to 400 ⁇ m
  • the volume offered by the cavity must be significantly greater than the size of the chip, unlike the prior art, for example greater than 1.10, preferably 1.25 times
  • the communication interface 13 is arranged on the plane 15 of its support 14 to communicate with an appropriate reader by ohmic contact or by electromagnetic waves.
  • the interface can therefore be in particular an antenna and / or a smart card contact terminal or a capacity
  • the chip is placed in the active face cavity towards the outside, that is to say directed away from the bottom of the cavity
  • the chip is fixed to the bottom of the cavity by its rear face using an insulating adhesive material 12
  • peripheral edge of chip 24 is distant from said cavity rim.
  • remote is illustrated successively with reference to the examples and subsequently with reference to the method.
  • the edge 24 is distant because it is arranged below the general plane of the support.
  • the level difference is in particular of the order of 0.25 mm.
  • the device may have a space 25 around the chip between the edge thereof and the wall of the cavity. This space is at least partially free of any fibers in the case where the support is made of fibrous material as in the cited prior art
  • the studs of the chip are connected to the interface by interconnection elements each consisting of a cord of electrically conductive material 9
  • the material of the cord is homogeneous in the sense that it is the same continuous cord in the same material which extends from the studs of the chip to the edge of the cavity or even beyond on the plane of the support until meeting connection points of the interface placed near the cavity or up to forming the communication interface on the plane 15
  • the chip can be covered with protective material 26, for example a coating resin commonly used in the field of the smart card
  • the protective material has for effect of reinforcing the assembly constituted by the chip and the interconnection to the studs inside the cavity
  • the protective material can also or alternatively to the above function fill or come to complete the space 25 aut our chip
  • the material can adhere to the wall 18 of the cavity and thus have in particular the function of hanging on the wall and of preventing a displacement of the chip in the cavity when it is subjected to a force resulting from a possible pressure transverse to plane 15 This function above can be
  • said material 12, 26 is preferably included in the cavity, that is to say that it does not extend beyond the plane of the support nor onto the antenna ends; its height is preferably kept below the upper level of the interface, the advantage being to avoid having unnecessary extra thicknesses which could hinder the introduction of the devices into readers.
  • the device according to the second embodiment comprises an integrated circuit chip 1 1 whose active surface 20 is located substantially at the same level as the plane 1 5 of the support.
  • said peripheral edge 24 of the chip is distant from said cavity rim due to the space provided around the chip.
  • the space is of the order of 0.25 mm.
  • the advantage of such a space is to promote the transfer of the chip by a conventional chip transfer operation called "die attach".
  • the rate of the transfer is all the more important as the tolerance of positioning and / or indexing of the chips relative to the cavity is not very restrictive.
  • the advantage is also to facilitate the introduction of a material into the unoccupied space
  • the chip includes an adhesive material at the bottom of the cavity for fixing the chip.
  • the material also largely fills the space around the chip, which promotes its attachment to the wall of the cavity.
  • An optional protective material preferably covers the active face of the chip and on the interconnection cords to the pads 21 while preferably remaining within the perimeter formed by the edge 19 of the cavity.
  • This disposable product described above, can if necessary have a small thickness of the order of 200 to 400 ⁇ m.
  • the use of low cost substrates is HERE conceivable.
  • the chip has substantially the width of the cavity. It is distant from the edge of the cavity because its active face is located at a level below that of the plane of the support.
  • the chip is fixed to the bottom by an adhesive and is protected by coating material
  • the interconnection elements 9 extend from the studs to the plane where they are extended by an antenna communication interface
  • the method comprises a step according to which a cavity is produced in the support so that the available volume is significantly greater than the bulk. of the chip, This can mean having a much wider cavity than the dimensions of the chip, for example 1, 5 to 4 times wider, and / or deeper so as to offer a difference in level on the active face of the chip and the plane of the support greater than 50 ⁇ m, preferably equal to approximately 100 ⁇ m
  • This case can however present a handicap of requiring a high precision of transfer which can reduce the production rate
  • a third preferred case, illustrated in FIG. 1, corresponding to an intermediate configuration between the above variants offers a good compromise.
  • construction variants also have the advantage of allowing the use of chips having slightly conductive wafers insofar as they do not short-circuit with the interconnection elements, of the insulating material (coating resin or adhesive) covering the edge of the chip.
  • the support can be produced by laminating sheets, the upper sheet being perforated.
  • the cavity can also be produced by embossing, machining, cutting or obtained directly by injection of the support if the latter is made of polymeric material.
  • the method includes a step of producing communication interfaces on the support plane.
  • the interface can be obtained in any known manner such as for example printing of electrically conductive ink, by depositing an electrically conductive substance, by lamination of a precut grid and laminated to the support or by chemical etching if the nature support allows it.
  • the interface is obtained by printing by having its ends or connection point near the edge of the cavity.
  • cords of conductive material are deposited between the chip and the plane of the support to form an interconnection element with the interface.
  • the deposition process used consists in distributing the conductive material or resin in accordance with the process described in French patent application No. 2,761,497 or else by jet of conductive material.
  • This conductive resin may for example be a polymerizable adhesive loaded with conductive particles such as silver particles.
  • the device may include, if appropriate, a second additional chip. It could be connected in parallel to the first by other interconnection elements. This second chip could, for example, carry a tuning capacity of a resonant circuit of the device consisting of the first chip and antenna

Abstract

The invention concerns an integrated circuit chip device comprising a support (14) having a global plane (15) wherein emerges an edge (19) of a cavity (16), a communication interface (13) with antenna and/or contact pads borne by said plane, at least an integrated circuit chip (11) arranged in said cavity with its active surface facing outwards and connected to said interface by interconnecting elements (9), said chip having an active surface (20) provided with connection pins (21) and delimited by a peripheral ridge (24). The invention is characterised in that said chip peripheral ridge (24) is spaced away from said cavity edge (19) and each interconnecting element consists of a continuous bead (9) of electrically conductive material extending from the chip pins (21) up to the support plane. The invention also concerns a method for making said device.

Description

DISPOSITIF A PUCE DE CIRCUIT INTEGRE JETABLE ET PROCEDE DE FABRICATION D'UN TEL DISPOSITIF DISPOSABLE INTEGRATED CIRCUIT CHIP DEVICE AND METHOD FOR MANUFACTURING SUCH A DEVICE
La présente invention concerne un dispositif à puce de circuit intégré comportant un support portant une interface de communication à antenne et/ou à plages de contact reliée à une puce de circuit intégré par des éléments de connexion et un procédé de fabrication d'un tel dispositifThe present invention relates to an integrated circuit chip device comprising a support carrying a communication interface with antenna and / or contact pads connected to an integrated circuit chip by connection elements and a method of manufacturing such a device.
Il vise particulièrement un dispositif bas coût, jetable dont le nombre d'utilisation peut être limité à quelques transactions voire une seule, tel qu'un ticket de transport Son support pourrait être en une matière de faible résistance mécanique en matière polymère ou non comme une matière comportant des fibres naturelles, le papier par exempleIt is particularly aimed at a low cost, disposable device, the number of uses of which can be limited to a few transactions or even just one, such as a transport ticket. material containing natural fibers, for example paper
Les dispositifs à puce de circuit intégré regroupent généralement les cartes à puce, les étiquettes électroniques, les tickets et peuvent avoir un fonctionnement à contact et/ou à distance par l'intermédiaire d'une interface de communication notamment à antenne ou à capacité Les dimensions du dispositif peuvent être diverses et variées, supérieures au format carte à puces défini dans la norme ISO 7810 ou inférieures comme le format "Edmundson"Integrated circuit chip devices generally include smart cards, electronic labels, tickets and can have contact and / or remote operation via a communication interface, in particular with antenna or capacity. Dimensions of the device can be diverse and varied, greater than the smart card format defined in the ISO 7810 standard or less like the "Edmundson" format
Ces dispositifs sont utilisés dans diverses applications notamment des applications de transaction bancaire, d'identification, d'authentification, de fidélité, de porte-monnaie électronique, de téléphonie, de transport ou d'accès etcThese devices are used in various applications including banking transaction, identification, authentication, loyalty, electronic wallet, telephony, transport or access applications, etc.
L'art antérieur contient la demande de brevet FR 2 736 452 qui concerne un dispositif à bas prix de revient pour un usage unique Elle décrit une carte intelligente comprenant un corps en matière fibreuse munie d'une cavité définissant une paroi latérale sur laquelle font saillie des fibres La cavité est de dimensions appropriées pour retenir une puce de circuit intégré par les fibres La puce est montée avec sa face active vers l'extérieur de la cavité , des plages de contact et des éléments d'interconnection reliant les plages de contact aux plots de la puce sont réalisées par impression et un vernis protecteur recouvre le circuit intégré et les éléments d'interconnexion.The prior art contains patent application FR 2 736 452 which relates to a low cost device for single use. It describes a smart card comprising a body made of fibrous material provided with a cavity defining a side wall on which protrude. fibers The cavity is of appropriate dimensions to retain an integrated circuit chip by the fibers The chip is mounted with its active face outwards from the cavity, contact pads and elements interconnection connecting the contact pads to the studs of the chip are made by printing and a protective varnish covers the integrated circuit and the interconnection elements.
Une telle construction a l'inconvénient de présenter des risques de rupture des éléments d'interconnexion lors de la manipulation du dispositif notamment par flexion ou par pression sur le vernis compte tenu de la faible résistance mécanique du support en fibres et du faible maintien de la puce par les fibres.Such a construction has the disadvantage of presenting risks of rupture of the interconnection elements during the manipulation of the device, in particular by bending or by pressure on the varnish, taking into account the low mechanical resistance of the fiber support and the low retention of the chip by fibers.
La demande de brevet EP-A-0 803 839 concerne un dispositif qui vise également à abaisser le coût de fabrication. Il décrit une carte à circuit intégré comportant un corps polymère dans lequel une puce de circuit intégré est fixée par enfoncement à chaud de manière que ses plots de contact affleurent la surface de la carte. Des spires d'antenne sont déposées notamment par sérigraphie et une couche de résine de protection recouvre la puce et au moins une partie du corps de carte immédiatement adjacente à la puce.Patent application EP-A-0 803 839 relates to a device which also aims to lower the manufacturing cost. It describes an integrated circuit card comprising a polymer body in which an integrated circuit chip is fixed by hot pressing so that its contact pads are flush with the surface of the card. Antenna turns are deposited in particular by screen printing and a layer of protective resin covers the chip and at least a part of the card body immediately adjacent to the chip.
Le procédé décrit ne permet pas des cadences de production élevées qui pourraient conduire à abaisser significativement le coût du dispositif. La présente invention vise à résoudre les problèmes exposés ci- dessus.The method described does not allow high production rates which could lead to significantly lowering the cost of the device. The present invention aims to solve the problems set out above.
L'objectif de la présente invention est de proposer une structure de dispositif fiable qui puisse être fabriquée par des technologies aptes à reporter et interconnecter des puces à l'interface de communication de manière très précise et à très haute cadence sur un substrat bas coût ou faiblement résistant mécaniquement comme le papier.The objective of the present invention is to provide a reliable device structure which can be manufactured by technologies capable of transferring and interconnecting chips to the communication interface very precisely and at very high speed on a low cost substrate or weak mechanical resistance like paper.
A cet effet, la présente invention a pour objet un dispositif à puce de circuit intégré comportant un support présentant un plan général et dans lequel débouche un rebord d'une cavité, une interface de communication à antenne et/ou à plages de contact portée par ledit plan, au moins une puce de circuit intégré disposée dans ladite cavité face active vers l'extérieur et connectée à ladite interface par des éléments d'interconnexion, ladite puce présentant une face active munie de plots de connexion et délimitée par une arête périphérique. II se distingue en ce que ladite arête périphérique de puce est distante dudit rebord de cavité et en ce que chaque élément d'interconnexion est constituée par un cordon continu de matière électriquement conductrice s'étendant des plots de la puce jusqu'au plan du support. Selon un premier mode de réalisation, ladite face active est disposée en dessous du plan général du support.To this end, the subject of the present invention is an integrated circuit chip device comprising a support having a general plane and into which opens a rim of a cavity, a communication interface with antenna and / or with contact pads carried by said plan, at least one chip an integrated circuit disposed in said active face cavity towards the outside and connected to said interface by interconnection elements, said chip having an active face provided with connection pads and delimited by a peripheral edge. It is distinguished in that said peripheral edge of the chip is distant from said edge of the cavity and in that each interconnection element is constituted by a continuous cord of electrically conductive material extending from the studs of the chip to the plane of the support . According to a first embodiment, said active face is arranged below the general plane of the support.
Selon un deuxième mode de réalisation, ou une caractéristique supplémentaire, le dispositif présente un espace autour de la puce. Selon d'autres caractéristiques : - la puce est recouverte de matière de protection ;According to a second embodiment, or an additional feature, the device has a space around the chip. According to other characteristics: - the chip is covered with protective material;
- ledit espace comporte de la matière de protection;- said space includes protective material;
- ladite matière de protection est comprise dans la cavité;- said protective material is included in the cavity;
- l'antenne et les éléments de connexions sont réalisées par une même matière homogène électriquement conductrice ; - des points de connexion de l'interface sont placés aux abords de la cavité ;- The antenna and the connection elements are made of the same homogeneous electrically conductive material; - interface connection points are placed around the cavity;
- la puce est fixée dans la cavité par une matière adhésive isolante électriquement ;- The chip is fixed in the cavity by an electrically insulating adhesive material;
- ladite matière adhésive s'étend sur le fond de la cavité et comble au moins partiellement l'espace autour de la puce ;- Said adhesive material extends over the bottom of the cavity and at least partially fills the space around the chip;
- le support comporte de la matière fibreuse ;- The support comprises fibrous material;
La présente invention a également pour objet un procédé de fabrication d'un dispositif à puce de circuit intégré comportant une puce de circuit intégré reliée à une interface de communication à contact et/ou à antenne. Il se distingue en ce qu'il comprend les étapes suivantes selon lesquelles :The present invention also relates to a method for manufacturing an integrated circuit chip device comprising an integrated circuit chip connected to a contact communication interface and / or to antenna. It is distinguished in that it comprises the following stages according to which:
- on réalise une cavité dans le support de manière que le volume disponible de la cavité soit nettement supérieur à l'encombrement de la puce,a cavity is produced in the support so that the available volume of the cavity is significantly greater than the size of the chip,
- on reporte la puce dans la cavité, de manière que l'arête de sa face active soit distante du plan support;- The chip is transferred to the cavity, so that the edge of its active face is distant from the support plane;
- on dépose des cordons de matière conductrice de la puce au plan du support pour former des éléments d'interconnexion avec l'interface.- Cords of conductive material of the chip are deposited on the plane of the support to form interconnection elements with the interface.
D'autres particularités et avantages de la présente invention apparaîtront au cours de la description qui suit, donnée à titre d'exemple illustratif et non limitatif en référence aux figures dans lesquelles:Other particularities and advantages of the present invention will appear during the description which follows, given by way of illustrative and nonlimiting example with reference to the figures in which:
- La figure 1 , est un schéma en coupe de l'invention selon un premier mode de réalisation ;- Figure 1 is a sectional diagram of the invention according to a first embodiment;
- La figure 2, représente une coupe du corps support et de la puce;- Figure 2 shows a section of the support body and the chip;
- La figure 3, est un schéma en coupe de l'invention selon un deuxième mode de réalisation ; - La figure 4, est un schéma en coupe de l'invention selon un troisième mode de réalisation.- Figure 3 is a sectional diagram of the invention according to a second embodiment; - Figure 4 is a sectional diagram of the invention according to a third embodiment.
A la figure 1 et 2, un dispositif 10 à puce de circuit intégré comporte une puce de circuit intégré 1 1 reliée à une interface de communication 13. Le dispositif peut être quelconque selon l'application, notamment une étiquette électronique ou une carte à puce ou un ticket de transport.In FIGS. 1 and 2, a device 10 with an integrated circuit chip comprises an integrated circuit chip 1 1 connected to a communication interface 13. The device can be any according to the application, in particular an electronic label or a smart card or a transport ticket.
Il comporte un support 14 définissant un plan général 1 5 dans lequel débouche une cavité 16. La cavité présente un fond 17 et une paroi latéraleIt comprises a support 14 defining a general plane 1 5 into which opens a cavity 16. The cavity has a bottom 17 and a side wall
1 8 et une arête périphérique 1 9 résultant de l'intersection entre le plan général et ladite paroi latérale. Dans l'exemple, le dispositif est un ticket de transport genre ticket de métro en papier ou comportant des fibres en cellulose ou en polymère Son épaisseur est de l'ordre de 1 mm La cavité présente une profondeur de 0,6 mm et une largeur de 1 ,5 mm Elle peut être ronde, ovale, carrée La puce 11 (figure 3) présente généralement une face active 20 munie de plots de connexion 21 , une face arrière 22 et une tranche 23 La face active est délimitée par une arête périphérique 24 résultant de l'intersection de la tranche avec la face active Elle est par exemple de l'ordre de 0,5 mm de côté avec une épaisseur pouvant aller notamment de 10 μm à 400 μm1 8 and a peripheral edge 1 9 resulting from the intersection between the general plane and said side wall. In the example, the device is a metro ticket type transport in paper or with cellulose or polymer fibers Its thickness is around 1 mm The cavity has a depth of 0.6 mm and a width of 1.5 mm It can be round, oval , square The chip 11 (FIG. 3) generally has an active face 20 provided with connection pads 21, a rear face 22 and a wafer 23 The active face is delimited by a peripheral edge 24 resulting from the intersection of the wafer with the active face It is for example of the order of 0.5 mm on a side with a thickness which can range in particular from 10 μm to 400 μm
Comme on l'a compris, le volume offert par la cavité doit être nettement supérieur à l'encombrement de la puce contrairement à l'art antérieur, par exemple supérieur à 1 , 10 de préférence 1 ,25 foisAs has been understood, the volume offered by the cavity must be significantly greater than the size of the chip, unlike the prior art, for example greater than 1.10, preferably 1.25 times
L'interface de communication 13 est disposée sur le plan 15 de son support 14 pour communiquer avec un lecteur approprié par contact ohmique ou par ondes électromagnétiques L'interface peut donc être notamment une antenne et/ou un bornier de contact de carte à puce ou une capacitéThe communication interface 13 is arranged on the plane 15 of its support 14 to communicate with an appropriate reader by ohmic contact or by electromagnetic waves. The interface can therefore be in particular an antenna and / or a smart card contact terminal or a capacity
Selon l'invention, comme visible à la figure 1 , la puce est disposée dans la cavité face active vers l'extérieur, c'est-à-dire dirigée à l'opposé du fond de la cavité En l'occurrence dans l'exemple, la puce est fixée au fond de la cavité par sa face arrière à l'aide d'une matière adhésive isolante 12According to the invention, as can be seen in FIG. 1, the chip is placed in the active face cavity towards the outside, that is to say directed away from the bottom of the cavity In this case in the example, the chip is fixed to the bottom of the cavity by its rear face using an insulating adhesive material 12
Selon l'invention encore, ladite arête périphérique de puce 24 est distante dudit rebord de cavité La signification de distante est illustrée successivement en référence aux exemples et ultérieurement en référence au procédéAccording to the invention also, said peripheral edge of chip 24 is distant from said cavity rim. The meaning of remote is illustrated successively with reference to the examples and subsequently with reference to the method.
Dans l'exemple, l'arête 24 est distante parce qu'elle est disposée en dessous du plan général du support La différence de niveau est notamment de l'ordre de 0,25 mm Ainsi, la puce est à l'abri d'une éventuelle pression d'un doigt qui pourrait être exercée sur la surface de la puce provoquant son déplacement et endommageant ses connexionsIn the example, the edge 24 is distant because it is arranged below the general plane of the support. The level difference is in particular of the order of 0.25 mm. Thus, the chip is protected from possible pressure by a finger which could be exerted on the surface of the chip causing it to move and damaging its connections.
En alternative, ou cumulativement comme dans l'exemple de la figure 3, le dispositif peut présenter un espace 25 autour de la puce entre la tranche de celle-ci et la paroi de la cavité Cet espace est libre au moins partiellement de fibres éventuelles dans le cas où le support serait en matière fibreuse comme dans l'art antérieur citéAlternatively, or cumulatively as in the example in FIG. 3, the device may have a space 25 around the chip between the edge thereof and the wall of the cavity. This space is at least partially free of any fibers in the case where the support is made of fibrous material as in the cited prior art
Contrairement à l'art antérieur, dans l'invention, de telles fibres éventuelles n'atteindraient pas la tranche de la puce et ne la maintiendraient pas en place dans la cavitéUnlike the prior art, in the invention, such possible fibers would not reach the edge of the chip and would not hold it in place in the cavity
Selon l'invention, les plots de la puce sont connectés à l'interface par des éléments d'interconnexion constitués chacun d'un cordon de matière 9 électriquement conductrice La matière du cordon est homogène dans le sens où c'est le même cordon continu en une même matière qui s'étend des plots de la puce jusqu'au rebord de la cavité voire au-delà sur le plan du support jusqu'à rencontrer des points de connexion de l'interface placés aux abords de la cavité ou jusqu'à former l'interface de communication sur le plan 15 Pour une meilleure protection, la puce peut être recouverte de matière de protection 26, par exemple une résine d'enrobage couramment utilisée dans le domaine de la carte à puce La matière de protection a pour effet de renforcer l'ensemble constitué par la puce et l'interconnexion aux plots à l'intérieur de la cavité La matière de protection peut également ou alternativement à la fonction ci-dessus remplir ou venir compléter l'espace 25 autour de la puce La matière peut adhérer à la paroi 18 de la cavité et avoir ainsi notamment pour fonction d'accrocher à la paroi et d'empêcher un déplacement de la puce dans la cavité quand elle est soumise à une force résultant d'une éventuelle pression transversale au plan 15 Cette fonction ci-dessus peut être, le cas échéant, réalisée totalement ou partiellement par la matière adhésive isolante 12 qui comblerait l'espace 25 au moins en partie en remontant vers le plan sous l'effet de la pression de report et de collage de la puce. On remarque dans l'exemple, que ladite matière 12, 26 est de préférence comprise dans la cavité, c'est-à-dire qu'elle ne déborde pas sur le plan du support ni sur les extrémités d'antenne; sa hauteur est de préférence maintenue en deçà du niveau supérieur de l'interface, l'avantage étant d'éviter d'avoir des surépaisseurs inutiles qui pourraient gêner l'introduction des dispositifs dans des lecteurs.According to the invention, the studs of the chip are connected to the interface by interconnection elements each consisting of a cord of electrically conductive material 9 The material of the cord is homogeneous in the sense that it is the same continuous cord in the same material which extends from the studs of the chip to the edge of the cavity or even beyond on the plane of the support until meeting connection points of the interface placed near the cavity or up to forming the communication interface on the plane 15 For better protection, the chip can be covered with protective material 26, for example a coating resin commonly used in the field of the smart card The protective material has for effect of reinforcing the assembly constituted by the chip and the interconnection to the studs inside the cavity The protective material can also or alternatively to the above function fill or come to complete the space 25 aut our chip The material can adhere to the wall 18 of the cavity and thus have in particular the function of hanging on the wall and of preventing a displacement of the chip in the cavity when it is subjected to a force resulting from a possible pressure transverse to plane 15 This function above can be, if necessary, made entirely or partially by the insulating adhesive material 12 which would fill the space 25 at least in part by going up towards the plane under the effect of the pressure of transfer and bonding of the chip. It is noted in the example, that said material 12, 26 is preferably included in the cavity, that is to say that it does not extend beyond the plane of the support nor onto the antenna ends; its height is preferably kept below the upper level of the interface, the advantage being to avoid having unnecessary extra thicknesses which could hinder the introduction of the devices into readers.
A la figure 3, le dispositif selon le deuxième mode de réalisation comporte une puce de circuit intégré 1 1 dont la surface active 20 se situe sensiblement au même niveau que le plan 1 5 du support.In Figure 3, the device according to the second embodiment comprises an integrated circuit chip 1 1 whose active surface 20 is located substantially at the same level as the plane 1 5 of the support.
Selon l'invention, ladite arête périphérique 24 de la puce est distante dudit rebord de cavité du fait de l'espace ménagé autour de la puce.According to the invention, said peripheral edge 24 of the chip is distant from said cavity rim due to the space provided around the chip.
Dans l'exemple, l'espace est de l'ordre de 0,25 mm. L'avantage d'un tel espace est de favoriser le report de la puce par une opération classique de report de puce dite "die attach". La cadence du report est d'autant plus importante que la tolérance de positionnement et/ou d'indexation des puces par rapport à la cavité est peu contraignante. L'avantage est également de faciliter l'introduction d'une matière dans l'espace non occupéIn the example, the space is of the order of 0.25 mm. The advantage of such a space is to promote the transfer of the chip by a conventional chip transfer operation called "die attach". The rate of the transfer is all the more important as the tolerance of positioning and / or indexing of the chips relative to the cavity is not very restrictive. The advantage is also to facilitate the introduction of a material into the unoccupied space
La puce comporte comme précédemment une matière adhésive au fond de la cavité pour fixer la puce. La matière remplie également en grande partie l'espace autour de la puce ce qui favorise son accrochage à la paroi de la cavité.As before, the chip includes an adhesive material at the bottom of the cavity for fixing the chip. The material also largely fills the space around the chip, which promotes its attachment to the wall of the cavity.
Une matière de protection, facultative couvre de préférence la face active de la puce et sur les cordons d'interconnexion aux plots 21 tout en restant de préférence dans le périmètre formées par l'arête 19 de la cavité. Ce produit jetable, décrit précédemment, peut si nécessaire avoir une faible épaisseur de l 'ordre de 200 à 400μm L 'utilisation de substrats bas coût est ICI envisageableAn optional protective material preferably covers the active face of the chip and on the interconnection cords to the pads 21 while preferably remaining within the perimeter formed by the edge 19 of the cavity. This disposable product, described above, can if necessary have a small thickness of the order of 200 to 400 μm. The use of low cost substrates is HERE conceivable.
A la figure 4, selon un troisième mode de réalisation, la puce possède sensiblement la largeur de la cavité Elle est distante du rebord de la cavité du fait que sa face active est située à un niveau inférieur à celui du plan du support Bien que facultatif, la puce est fixée au fond par un adhésif et est protégée par de la matière d'enrobage Dans cet exemple, les éléments d'interconnexion 9 s'étendent des plots jusqu'au plan où ils sont prolongés par une interface de communication à antenneIn FIG. 4, according to a third embodiment, the chip has substantially the width of the cavity. It is distant from the edge of the cavity because its active face is located at a level below that of the plane of the support. Although optional , the chip is fixed to the bottom by an adhesive and is protected by coating material In this example, the interconnection elements 9 extend from the studs to the plane where they are extended by an antenna communication interface
Le procédé de fabrication du dispositif peut être mis en œuvre de la manière ci-après Selon l'invention, le procédé comporte une étape selon laquelle, on réalise une cavité dans le support de manière que le volume disponible soit nettement supérieur à l'encombrement de la puce , Cela peut signifier d'avoir une cavité beaucoup plus large que les dimensions de la puce, par exemple 1 ,5 à 4 fois plus large, et/ou plus profonde de manière à offrir un dénivelé en la face active de la puce et le plan du support supérieur à 50 μm, de préférence égal à environ 100 μmThe method of manufacturing the device can be implemented in the following manner. According to the invention, the method comprises a step according to which a cavity is produced in the support so that the available volume is significantly greater than the bulk. of the chip, This can mean having a much wider cavity than the dimensions of the chip, for example 1, 5 to 4 times wider, and / or deeper so as to offer a difference in level on the active face of the chip and the plane of the support greater than 50 μm, preferably equal to approximately 100 μm
Puis, on reporte la puce dans la cavité, de manière que l'arête de sa face active soit distante du plan support, Plusieurs cas présentés aux figures et décrits précédemment peuvent se produireThen, the chip is transferred to the cavity, so that the edge of its active face is distant from the support plane, Several cases presented in the figures and described previously can occur
Un premier cas extrême de la figure 4, où la puce est très en deçà du niveau du support, les parois latérales étant quasiment contre celles de la puce, présente l'avantage d'être très résistant à rencontre des forces de pression qui seraient exercées par un doigt compte tenu de l'inaccessibi té de la puce Ce cas peut toutefois présenter un handicap de requérir une précision de report élevée pouvant réduire la cadence de fabricationA first extreme case of FIG. 4, where the chip is far below the level of the support, the side walls being almost against those of the chip, has the advantage of being very resistant against pressure forces which would be exerted by a finger taking into account the inaccessibility of the chip This case can however present a handicap of requiring a high precision of transfer which can reduce the production rate
Un second cas également extrême de la figure 3, où les parois de la puce sont éloignés de celles de la cavité, présente l'avantage de permettre des cadences de report élevées Néanmoins, il convient d'avoir une matière remplissant l'espace en:re la puce et la cavité, pour assurer le maintien de la puce dans le support à rencontre d'une éventuelle pression de doigt.A second case, also extreme in FIG. 3, where the walls of the chip are distant from those of the cavity, has the advantage of allowing high transfer rates Nevertheless, it is advisable to have a material filling the space by: re the chip and the cavity, to ensure the maintenance of the chip in the support against possible finger pressure.
Un troisième cas préféré, illustré à la figure 1 , correspondant à une configuration intermédiaire entre les variantes ci-dessus offre un bon compromis.A third preferred case, illustrated in FIG. 1, corresponding to an intermediate configuration between the above variants offers a good compromise.
Ces variantes de construction présentent également l'avantage de permettre l'utilisation de puces possédant les tranches légèrement conductrices dans la mesure où elles ne rentrent pas en court-circuit avec les éléments d'interconnexion, de la matière isolante (résine d'enrobage ou adhésif)recouvrant la tranche de la puce.These construction variants also have the advantage of allowing the use of chips having slightly conductive wafers insofar as they do not short-circuit with the interconnection elements, of the insulating material (coating resin or adhesive) covering the edge of the chip.
Le support peut être réalisé par lamination de feuilles, la feuille supérieure étant perforée. La cavité peut être également réalisée par embossage, usinage, découpage ou obtenue directement par injection du support si celui-ci est en matière polymère. Le procédé comporte une étape de réalisation d'interfaces de communication sur le plan du support. L'interface peut être obtenue de toute manière connue comme par exemple impression d'encre électriquement conductrice, par dépôt d'une substance électriquement conductrice, par lamination d'une grille prédécoupée et contre-collée sur le support ou par gravure chimique si la nature du support le permet.The support can be produced by laminating sheets, the upper sheet being perforated. The cavity can also be produced by embossing, machining, cutting or obtained directly by injection of the support if the latter is made of polymeric material. The method includes a step of producing communication interfaces on the support plane. The interface can be obtained in any known manner such as for example printing of electrically conductive ink, by depositing an electrically conductive substance, by lamination of a precut grid and laminated to the support or by chemical etching if the nature support allows it.
Dans l'exemple, l'interface est obtenue par impression en ayant ses extrémités ou point de connexion à proximité du bord de la cavité.In the example, the interface is obtained by printing by having its ends or connection point near the edge of the cavity.
Ensuite, selon le procédé de l'invention, on dépose des cordons de matière conductrice entre la puce et le plan du support pour former un élément d'interconnexion avec l'interface.Then, according to the method of the invention, cords of conductive material are deposited between the chip and the plane of the support to form an interconnection element with the interface.
Le procédé de dépôt utilisé consiste en une distribution de la matière ou résine conductrice conformément au procédé décrit dans la demande de brevet français n° 2 761 497 ou bien par jet de matière conductrice. Cette résine conductrice peut être par exemple une colle polymérisable chargée en particules conductrices telles que des particules d'argent. Ces techniques de connexion de puce par des polymères conducteurs sont très efficaces et performantes Elles permettent de réduire le nombre d'opérations de fabrication et de diminuer nettement le coût de fabrication des matériaux des circuits intégrés Ces procédés sont particulièrement intéressants pour des connexions de points situés à différents niveaux ou séparés d'une tranchée , d'autre part, ils permettent de s'affranchir d'une opération d'enrobage si besoinThe deposition process used consists in distributing the conductive material or resin in accordance with the process described in French patent application No. 2,761,497 or else by jet of conductive material. This conductive resin may for example be a polymerizable adhesive loaded with conductive particles such as silver particles. These chip connection techniques using conductive polymers are very effective and efficient. They make it possible to reduce the number of manufacturing operations and to significantly reduce the cost of manufacturing materials for integrated circuits. These methods are particularly advantageous for connections of points located at different levels or separated from a trench, on the other hand, they make it possible to dispense with a coating operation if necessary
Il est également possible d'effectuer une impression sérigraphie dans le cas où la face active de la puce est sensiblement au même niveau que le plan du support et où l'espace autour de la puce est rempli par de la matière isolante (enrobage ou adhésif de fixation)It is also possible to carry out a screen printing in the case where the active face of the chip is substantially at the same level as the plane of the support and where the space around the chip is filled with insulating material (coating or adhesive of fixation)
Ensuite, on peut effectuer une protection de l'ensemble ainsi réalisé, par dépôt d'une substance dans la cavité cette opération étant facultative La réalisation de l'interface de communication et la connexion électrique peut être effectuée en une seule étape de dépôt de matière par les procédés mentionnés précédemmentThen, it is possible to protect the assembly thus produced, by depositing a substance in the cavity, this operation being optional. The production of the communication interface and the electrical connection can be carried out in a single step of depositing material by the previously mentioned processes
Le dispositif peut comporter le cas échéant une seconde puce supplémentaire Elle pourrait être connectée en parallèle à la première par d'autres éléments d'interconnexion Cette seconde puce pourrait porter par exemple une capacité d'accord d'un circuit résonnant du dispositif constitué de la première puce et de l'antenne The device may include, if appropriate, a second additional chip. It could be connected in parallel to the first by other interconnection elements. This second chip could, for example, carry a tuning capacity of a resonant circuit of the device consisting of the first chip and antenna

Claims

REVENDICATIONS
1 . Dispositif à puce de circuit intégré comportant un support (14) présentant un plan général (15) et dans lequel débouche un rebord (19) d'une cavité (16), une interface de communication (13) à antenne et/ou à plages de contact portée par ledit pian, au moins une puce de circuit intégré (1 1 ) disposée dans ladite cavité face active vers l'extérieur et connectée à ladite interface par des éléments d'interconnexion (9), ladite puce présentant une face active (20) munie de plots de connexion (21 ) et délimitée par une arête périphérique (24), caractérisé en ce que ladite arête périphérique (24) de puce est distante dudit rebord de cavité (19) et en ce que chaque élément d'interconnexion est constituée par un cordon continu (9) de matière électriquement conductrice s'étendant des plots (21 ) de la puce jusqu'au plan du support. 1. Integrated circuit chip device comprising a support (14) having a general plane (15) and into which opens a flange (19) of a cavity (16), a communication interface (13) with antenna and / or with pads contact carried by said yaws, at least one integrated circuit chip (1 1) disposed in said active face cavity towards the outside and connected to said interface by interconnection elements (9), said chip having an active face ( 20) provided with connection pads (21) and delimited by a peripheral edge (24), characterized in that said peripheral edge (24) of the chip is distant from said cavity edge (19) and in that each interconnection element consists of a continuous cord (9) of electrically conductive material extending from the studs (21) of the chip to the plane of the support.
2. Dispositif à puce de circuit intégré selon la revendication 2, caractérisé en ce que ladite face active (20) est disposée en dessous du plan général (15) du support (14).2. Integrated circuit chip device according to claim 2, characterized in that said active face (20) is arranged below the general plane (15) of the support (14).
3. Dispositif à puce de circuit intégré selon la revendication 1 ou 2, caractérisé en ce qu'il présente un espace autour de la puce. 3. Integrated circuit chip device according to claim 1 or 2, characterized in that it has a space around the chip.
4. Dispositif à puce de circuit intégré selon la revendication 2, caractérisé en ce que la puce est recouverte de matière de protection (26). 4. Integrated circuit chip device according to claim 2, characterized in that the chip is covered with protective material (26).
5. Dispositif à puce de circuit intégré selon la revendication 3, caractérisé en ce que ledit espace comporte de la matière de protection (12, 26). 5. Integrated circuit chip device according to claim 3, characterized in that said space comprises protective material (12, 26).
6. Dispositif à puce de circuit intégré selon l'une des revendications précédentes, caractérisé en ce que ladite matière de protection (12, 26) est comprise dans la cavité.6. Integrated circuit chip device according to one of the preceding claims, characterized in that said protective material (12, 26) is included in the cavity.
7. Dispositif à puce de circuit intégré selon l'une quelconque des revendications précédentes, caractérisé en ce que l'antenne et les éléments de connexions sont réalisées par une même matière homogène (9, 13) électriquement conductrice.7. Integrated circuit chip device according to any one of the preceding claims, characterized in that the antenna and the connection elements are made of the same homogeneous material (9, 13) electrically conductive.
8. Dispositif à puce de circuit intégré selon l'une des revendications 1 à 6, caractérisé en ce que des points de connexion de l'interface (13) sont placés aux abords de la cavité (16).8. Integrated circuit chip device according to one of claims 1 to 6, characterized in that interface connection points (13) are placed around the cavity (16).
9. Dispositif à puce de circuit intégré selon l'une des revendications précédentes, caractérisé en ce que la puce est fixée dans la cavité par une matière adhésive (12) isolante électriquement.9. Integrated circuit chip device according to one of the preceding claims, characterized in that the chip is fixed in the cavity by an electrically insulating adhesive material (12).
10. Dispositif à puce de circuit intégré selon l'une des revendications précédentes, caractérisé en ce que ladite matière adhésive(12)s' étend sur le fond de la cavité et comble au moins partiellement l'espace autour de la puce.10. Integrated circuit chip device according to one of the preceding claims, characterized in that said adhesive material (12) extends over the bottom of the cavity and at least partially fills the space around the chip.
11. Dispositif à puce de circuit intégré selon l'une des revendications précédentes, caractérisé en ce que le support (14)comporte de la matière fibreuse.11. Integrated circuit chip device according to one of the preceding claims, characterized in that the support (14) comprises fibrous material.
12. Procédé de fabrication d'un dispositif à puce de circuit intégré comportant une puce de circuit intégré (1 1 ) reliée à une interface de communication (13) à contact et/ou à antenne, ledit procédé comprenant les étapes suivantes selon lesquelles : - on réalise une cavité (16) dans un support (14) de manière que le volume disponible de la cavité soit nettement supérieur à l'encombrement de la puce (1 1 ),12. Method for manufacturing an integrated circuit chip device comprising an integrated circuit chip (1 1) connected to a contact and / or antenna communication interface (13), said method comprising the following steps according to which: - A cavity (16) is made in a support (14) so that the available volume of the cavity is significantly greater than the size of the chip (1 1),
- on reporte la puce dans la cavité, de manière que l'arête (24)de sa face active soit distante du plan support (15); - on dépose des cordons (9) de matière conductrice de la puce au plan du support pour former des éléments d'interconnexion avec l'interface. - The chip is transferred into the cavity, so that the edge (24) of its active face is distant from the support plane (15); - Cords (9) of conductive material of the chip are deposited in the plane of the support to form interconnection elements with the interface.
PCT/FR2000/003513 1999-12-15 2000-12-13 Disposable smart card WO2001045040A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU21852/01A AU2185201A (en) 1999-12-15 2000-12-13 Disposable integrated circuit chip device and method for making same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR99/16026 1999-12-15
FR9916026A FR2802684B1 (en) 1999-12-15 1999-12-15 DISPOSABLE INTEGRATED CIRCUIT CHIP DEVICE AND METHOD FOR MANUFACTURING SUCH A METHOD

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WO2001045040A2 true WO2001045040A2 (en) 2001-06-21
WO2001045040A3 WO2001045040A3 (en) 2001-11-08
WO2001045040B1 WO2001045040B1 (en) 2002-06-06

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AU (1) AU2185201A (en)
FR (1) FR2802684B1 (en)
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FR2877462A1 (en) * 2004-10-29 2006-05-05 Arjowiggins Security Soc Par A STRUCTURE COMPRISING AN ELECTRONIC DEVICE FOR THE MANUFACTURE OF A SAFETY DOCUMENT.
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EP1509986A2 (en) * 2002-03-13 2005-03-02 Celis Semiconductor Corporation Rectifier utilizing a grounded antenna
EP1509986A4 (en) * 2002-03-13 2006-02-15 Celis Semiconductor Corp Rectifier utilizing a grounded antenna
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US8144016B2 (en) 2004-04-14 2012-03-27 Arjowiggins Security Structure including an electronic device, in particular for fabricating a security document or a document of value
FR2877462A1 (en) * 2004-10-29 2006-05-05 Arjowiggins Security Soc Par A STRUCTURE COMPRISING AN ELECTRONIC DEVICE FOR THE MANUFACTURE OF A SAFETY DOCUMENT.
WO2006048577A1 (en) * 2004-10-29 2006-05-11 Arjowiggins Security Structure comprising an electronic device for producing a security document
US8079519B2 (en) 2004-10-29 2011-12-20 Arjowiggins Security Structure including an electronic device for making a security document
WO2011135497A1 (en) * 2010-04-28 2011-11-03 Arjowiggins Security Fibrous insert consisting of a single layer and provided with an electronic device having contactless communication
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Also Published As

Publication number Publication date
AU2185201A (en) 2001-06-25
FR2802684A1 (en) 2001-06-22
FR2802684B1 (en) 2003-11-28
WO2001045040B1 (en) 2002-06-06
WO2001045040A3 (en) 2001-11-08

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