WO2001029890A3 - Method relating to anodic bonding - Google Patents

Method relating to anodic bonding Download PDF

Info

Publication number
WO2001029890A3
WO2001029890A3 PCT/SE2000/002012 SE0002012W WO0129890A3 WO 2001029890 A3 WO2001029890 A3 WO 2001029890A3 SE 0002012 W SE0002012 W SE 0002012W WO 0129890 A3 WO0129890 A3 WO 0129890A3
Authority
WO
WIPO (PCT)
Prior art keywords
anodic bonding
method relating
bonding
anodic
bondable
Prior art date
Application number
PCT/SE2000/002012
Other languages
French (fr)
Other versions
WO2001029890A2 (en
Inventor
Leif Bergstedt
Gert Andersonn
Britta Ottosson
Original Assignee
Imego Ab
Leif Bergstedt
Gert Andersonn
Britta Ottosson
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from SE9903798A external-priority patent/SE522141C2/en
Application filed by Imego Ab, Leif Bergstedt, Gert Andersonn, Britta Ottosson filed Critical Imego Ab
Priority to JP2001531139A priority Critical patent/JP2003512723A/en
Priority to US10/111,138 priority patent/US6951797B1/en
Priority to AU11831/01A priority patent/AU1183101A/en
Priority to EP00973305A priority patent/EP1234330A2/en
Publication of WO2001029890A2 publication Critical patent/WO2001029890A2/en
Publication of WO2001029890A3 publication Critical patent/WO2001029890A3/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01011—Sodium [Na]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor

Abstract

The present invention relates to a method of bonding a first member (110, 210, 130, 230, 410, 430, 510, 530, 610) to a second silicon member (120, 220, 420a, 420b, 600) through anodic bonding. The method comprises the steps of selectively depositing on said first member bondable sections (170a, 170b, 270, 470a, 470b, 470c, 570, 620) before bringing said first and second members together for anodic bonding.
PCT/SE2000/002012 1999-10-19 2000-10-17 Method relating to anodic bonding WO2001029890A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2001531139A JP2003512723A (en) 1999-10-19 2000-10-17 Method for anodic bonding
US10/111,138 US6951797B1 (en) 1999-10-19 2000-10-17 Method relating to anodic bonding
AU11831/01A AU1183101A (en) 1999-10-19 2000-10-17 Method relating to anodic bonding
EP00973305A EP1234330A2 (en) 1999-10-19 2000-10-17 Method relating to anodic bonding

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US16041199P 1999-10-19 1999-10-19
US60/160,411 1999-10-19
SE9903798-8 1999-10-19
SE9903798A SE522141C2 (en) 1999-10-19 1999-10-19 Bonding method for sensor and biological circuit, involves selectively depositing bondable section on a member before bonding the member with silicon member together for anodic bonding

Publications (2)

Publication Number Publication Date
WO2001029890A2 WO2001029890A2 (en) 2001-04-26
WO2001029890A3 true WO2001029890A3 (en) 2001-09-07

Family

ID=26663664

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/SE2000/002012 WO2001029890A2 (en) 1999-10-19 2000-10-17 Method relating to anodic bonding

Country Status (4)

Country Link
EP (1) EP1234330A2 (en)
JP (1) JP2003512723A (en)
AU (1) AU1183101A (en)
WO (1) WO2001029890A2 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6809424B2 (en) * 2000-12-19 2004-10-26 Harris Corporation Method for making electronic devices including silicon and LTCC and devices produced thereby
WO2003097552A1 (en) 2002-04-30 2003-11-27 Agency For Science Technology And Research A method of wafer/substrate bonding
US7259466B2 (en) 2002-12-17 2007-08-21 Finisar Corporation Low temperature bonding of multilayer substrates
US7361593B2 (en) 2002-12-17 2008-04-22 Finisar Corporation Methods of forming vias in multilayer substrates
GB2443573B (en) * 2003-10-24 2008-08-27 Miradia Inc Method and system for hermetically sealing packages for optics
US7303645B2 (en) * 2003-10-24 2007-12-04 Miradia Inc. Method and system for hermetically sealing packages for optics
GB2439403B (en) * 2003-10-24 2008-06-04 Miradia Inc Method and system for hermetically sealing packages for optics
GB2443352B (en) * 2003-10-24 2008-07-16 Miradia Inc Method and system for hermetically sealing packages for optics
US7153759B2 (en) 2004-04-20 2006-12-26 Agency For Science Technology And Research Method of fabricating microelectromechanical system structures
US7344956B2 (en) 2004-12-08 2008-03-18 Miradia Inc. Method and device for wafer scale packaging of optical devices using a scribe and break process
US7473616B2 (en) * 2004-12-23 2009-01-06 Miradia, Inc. Method and system for wafer bonding of structured substrates for electro-mechanical devices
US7349140B2 (en) 2005-05-31 2008-03-25 Miradia Inc. Triple alignment substrate method and structure for packaging devices
JP2011049324A (en) * 2009-08-26 2011-03-10 Seiko Instruments Inc Anode boding method and method of manufacturing piezoelectric vibrator
EP3728151A4 (en) 2017-12-21 2021-07-21 Schott Glass Technologies (Suzhou) Co. Ltd. Bondable glass and low auto-fluorescence article and method of mak-ing it

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4291293A (en) * 1978-09-27 1981-09-22 Hitachi, Ltd. Semiconductor absolute pressure transducer assembly and method
US4746893A (en) * 1985-01-31 1988-05-24 Motorola, Inc. Pressure transducer with sealed conductors
JPH0786313A (en) * 1993-09-09 1995-03-31 Asahi Kasei Denshi Kk Method for bonding compact element
EP0742581A2 (en) * 1995-04-12 1996-11-13 Sensonor A.S. Sealed cavity arrangement
JPH10256285A (en) * 1997-03-06 1998-09-25 Toray Ind Inc Manufacture of substrate with sealing frame body for semiconductor package and device there

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0693972A (en) * 1992-09-11 1994-04-05 Seiko Epson Corp Micropump and manufacture thereof
JPH07283419A (en) * 1994-04-06 1995-10-27 Nikon Corp Semiconductor sensor and its manufacturing method
JP3406940B2 (en) * 1994-07-14 2003-05-19 キヤノン株式会社 Microstructure and method for forming the same
JPH0918017A (en) * 1995-06-30 1997-01-17 Omron Corp Semiconductor acceleration sensor and semiconductor pressure sensor
JP3139339B2 (en) * 1995-09-13 2001-02-26 株式会社村田製作所 Vacuum sealing device and manufacturing method thereof
JPH10200128A (en) * 1997-01-16 1998-07-31 Toyota Motor Corp Manufacture of semiconductor sensor
JP3654481B2 (en) * 1997-06-05 2005-06-02 独立行政法人理化学研究所 Microreactor for biochemical reaction
JPH11326366A (en) * 1998-05-13 1999-11-26 Murata Mfg Co Ltd Semiconductor electronic component device and its manufacture

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4291293A (en) * 1978-09-27 1981-09-22 Hitachi, Ltd. Semiconductor absolute pressure transducer assembly and method
US4746893A (en) * 1985-01-31 1988-05-24 Motorola, Inc. Pressure transducer with sealed conductors
JPH0786313A (en) * 1993-09-09 1995-03-31 Asahi Kasei Denshi Kk Method for bonding compact element
EP0742581A2 (en) * 1995-04-12 1996-11-13 Sensonor A.S. Sealed cavity arrangement
JPH10256285A (en) * 1997-03-06 1998-09-25 Toray Ind Inc Manufacture of substrate with sealing frame body for semiconductor package and device there

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Week 199522, Derwent World Patents Index; AN 1995-165182, XP002951410 *
DATABASE WPI Week 199849, Derwent World Patents Index; AN 1998-574496, XP002951411 *
PATENT ABSTRACTS OF JAPAN *

Also Published As

Publication number Publication date
JP2003512723A (en) 2003-04-02
WO2001029890A2 (en) 2001-04-26
AU1183101A (en) 2001-04-30
EP1234330A2 (en) 2002-08-28

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