WO2001029281A9 - Abatement of effluent from chemical vapor deposition processes using ligand exchange resistant metal-organic precursor solutions - Google Patents

Abatement of effluent from chemical vapor deposition processes using ligand exchange resistant metal-organic precursor solutions

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Publication number
WO2001029281A9
WO2001029281A9 PCT/US2000/041253 US0041253W WO0129281A9 WO 2001029281 A9 WO2001029281 A9 WO 2001029281A9 US 0041253 W US0041253 W US 0041253W WO 0129281 A9 WO0129281 A9 WO 0129281A9
Authority
WO
WIPO (PCT)
Prior art keywords
effluent
sorbent bed
sorbent
species
metal
Prior art date
Application number
PCT/US2000/041253
Other languages
French (fr)
Other versions
WO2001029281A1 (en
Inventor
Mark Holst
Rebecca Faller
Ray Dubois
Jose Arno
Original Assignee
Advanced Tech Materials
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Tech Materials filed Critical Advanced Tech Materials
Priority to JP2001532260A priority Critical patent/JP2003512528A/en
Priority to KR1020027004953A priority patent/KR20020042724A/en
Priority to EP00984541A priority patent/EP1230420A4/en
Priority to AU21143/01A priority patent/AU2114301A/en
Publication of WO2001029281A1 publication Critical patent/WO2001029281A1/en
Publication of WO2001029281A9 publication Critical patent/WO2001029281A9/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D53/00Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/02Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D53/00Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/02Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography
    • B01D53/04Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography with stationary adsorbents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D53/00Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/34Chemical or biological purification of waste gases
    • B01D53/46Removing components of defined structure
    • B01D53/64Heavy metals or compounds thereof, e.g. mercury
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/40Oxides
    • C23C16/409Oxides of the type ABO3 with A representing alkali, alkaline earth metal or lead and B representing a refractory metal, nickel, scandium or a lanthanide
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4412Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D2253/00Adsorbents used in seperation treatment of gases and vapours
    • B01D2253/10Inorganic adsorbents
    • B01D2253/102Carbon
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D2253/00Adsorbents used in seperation treatment of gases and vapours
    • B01D2253/10Inorganic adsorbents
    • B01D2253/104Alumina
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D2253/00Adsorbents used in seperation treatment of gases and vapours
    • B01D2253/10Inorganic adsorbents
    • B01D2253/106Silica or silicates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D2253/00Adsorbents used in seperation treatment of gases and vapours
    • B01D2253/10Inorganic adsorbents
    • B01D2253/106Silica or silicates
    • B01D2253/108Zeolites
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D2258/00Sources of waste gases
    • B01D2258/02Other waste gases
    • B01D2258/0216Other waste gases from CVD treatment or semi-conductor manufacturing

Definitions

  • the present invention relates to a method and apparatus for abatement of effluent from any CVD process using a metal source reagent liquid solution comprising at least one metal coordination complex including a metal to which is coordinatively bound at least one ligand in a stable complex and a solvent for that metal coordination complex e.g., abatement of effluent from a multi- component metal oxide chemical vapor deposition (CVD) process used for forming barium strontium titanate (BST) thin films on substrates.
  • CVD multi- component metal oxide chemical vapor deposition
  • BST is an important material in the semiconductor manufacturing industry for fabrication of thin film dielectric microelectronic devices. Such fabrication typically is carried out by chemical vapor deposition (CVD), in which precursors (source reagents) for the respective barium, strontium and titanium components of the product film are volatilized for use in the deposition process.
  • CVD chemical vapor deposition
  • the source reagents for the BST film formation process may be provided to the CVD reactor by a liquid delivery process, in which the metalorganic precursors for the barium, strontium and titanium components are dissolved in a suitable solvent medium such as n-butyl acetate or tetrahydrofuran.
  • a suitable solvent medium such as n-butyl acetate or tetrahydrofuran.
  • the liquid solution containing precursors and corresponding solvent is pumped into a vaporizer comprising a hot zone maintained at low pressure.
  • the liquid solution is vaporized at high rate ("flash vaporized") under controlled temperature, pressure, and flow conditions.
  • the vaporizer is advantageously flushed with solvent immediately before and after deposition to prevent accumulation of solid species that could cause clogging in the process equipment and associated piping, valves and fittings.
  • the precursor vapor is combined with a carrier gas (e.g., argon or nitrogen) and an oxidizer (e.g., oxygen or nitrous oxide).
  • a carrier gas e.g., argon or nitrogen
  • an oxidizer e.g., oxygen or nitrous oxide
  • the CVD deposition chamber is typically operated at low pressure, e.g., on the order of 100 millitorr, by deployment of a dry pump or wet pump on the discharge of the system.
  • the precursors are decomposed on the heated substrate by a thermal reaction of the combined gases, organic vapors, and metalorganic precursors, resulting in the deposition of a thin perovskite film of BST material on the wafer substrate.
  • the wafer coated with the BST film is transferred to a separate chamber for annealing.
  • the effluent from the CVD deposition chamber in the CVD BST process comprises organic species, metals, unreacted precursor, precursor decomposition species and other thermal reaction products deriving from the CVD operation.
  • the present invention relates to abatement of effluent produced by multi-component metal oxides deposited by CVD processes using metal source reagent liquid solutions which comprise at least one metal coordination complex including a metal to which is coordinatively bound at least one ligand in a stable complex and a suitable solvent medium for that metal coordination complex e.g., CVD of BST.
  • metal source reagent liquid solutions which comprise at least one metal coordination complex including a metal to which is coordinatively bound at least one ligand in a stable complex and a suitable solvent medium for that metal coordination complex e.g., CVD of BST.
  • the invention relates to a method for abatement of effluent from a CVD process for depositing a multi-component metal oxide film on a substrate, in which the effluent is flowed through a sorbent bed having sorptive affinity for contaminant species (precursor species and CVD process by-products) in the effluent.
  • effluent from the CVD process is flowed in sequence through a metals trap, a motive fluid driver, and a sorbent bed having sorptive affinity for contaminant species in the effluent.
  • the method may further comprise monitoring the effluent discharged from the sorbent bed, to detect breakthrough of a selected contaminant component.
  • the invention relates in another aspect to an apparatus for abatement of effluent from a CND process for depositing multi-component metal oxide on a substrate from a precursor composition, wherein the apparatus comprises a sorbent bed having sorptive affinity for contaminants in the effluent.
  • Such sorbent bed may be part of an effluent flow circuit including a metals trap, a motive fluid driver, and a sorbent bed having sorptive affinity for contaminants in the effluent, optionally equipped with an endpoint detector for detecting the endpoint of sorption of the sorbent bed.
  • the apparatus described above may further include a semiconductor manufacturing facility whose operation comprises the CVD process
  • Figure 1 is a schematic representation of an CVD multi-component metal oxide film fabrication facility including an effluent abatement system according to one embodiment of the present invention.
  • the present invention provides an effluent abatement system for treatment of effluent
  • source reagent liquid solutions which comprise at least one metal coordination complex including a metal to which is coordinatively bound at least one ligand in a stable complex and a suitable solvent medium for that metal coordination complex e.g., CND BST processes.
  • Figure 1 shows a schematic representation of an CVD multi-component metal oxide film fabrication facility 10 including an effluent abatement system 12 according to one embodiment of the present invention.
  • a multi-component metal oxide source reagent or precursor material is furnished from source 14 thereof.
  • the source 14 may comprise a reservoir containing a liquid solution of the precursor material.
  • the source 14 may comprise a blending or synthesis unit wherein the liquid precursor is made or formulated in the first instance.
  • the liquid precursor flows in line 16 to the vaporizer unit 18, wherein the liquid precursor is flash vaporized for volatilization thereof to form corresponding precursor vapor
  • additional gases e g
  • a carrier gas such as argon, helium, hydrogen, etc
  • an oxidant such as oxygen, nitrogen oxide, etc
  • the carrier gas and oxidant gas may alternatively be separately introduced or alternatively the oxidant gas may be introduced downstream of the vaporizer before entry of the precursor vapor mixture into the CVD chamber As a still further alternative, the oxidant gas may be directly introduced into the CVD chamber
  • the precursor vapor mixture flows from the vaporizer unit 18 to the CVD reactor 26, and is dispersed in the interior volume of the reactor by showerhead discharge device 28 as a vapor flow stream 30
  • the stream of precursor vapor mixture thereby is directed to and impinges on a wafer substrate 32 positioned on susceptor 34 heated by heating element 36
  • the wafer substrate is maintained at a sufficiently elevated temperature to cause decomposition of the precursor vapor mixture and the chemical vapor deposition of the multi-component metal oxide film on the surface of the wafer substrate
  • An effluent comprising waste gases and decomposition by-products is discharged from the reactor 26 and flowed in line 38 to the effluent abatement system 12
  • the effluent abatement system 12 comprises an optional metals trap 40, to remove metal components of the effluent that could otherwise be deleterious m passage through the subsequent pump 44
  • the metals trap may be of any suitable form, comprising e g , a cold trap, a high surface area metals trap such as a foramtnous filter through which the effluent is flowed, a liquid contacting chamber for gas-liquid contacting of the effluent with an ultra-low volatility liquid (such as Krytox ® or Fomblin ® liquids), etc.
  • the metals trap may also be constituted to remove from the effluent components other than metals, e.g., heavy organic components, such as in a cold trap wherein such species are condensed, or in a gas-liquid contacting unit wherein such species are solubilized in the contacting liquid.
  • effluent components other than metals e.g., heavy organic components, such as in a cold trap wherein such species are condensed, or in a gas-liquid contacting unit wherein such species are solubilized in the contacting liquid.
  • the effluent flows in line 42 to the pump 44, which serves as a motive fluid driver for the effluent stream.
  • a pump is illustratively shown, it will be appreciated that any other motive fluid driver may be employed, e.g., a compressor, eductor, turbine, fan, blower, etc.
  • the pump may be constructed and operated to provide an appropriate pressure level in the upstream reactor 26, e.g., a subatmospheric pressure level.
  • the pump discharges the effluent into discharge line 46, from which it flows to the optional post- pump cold trap 48.
  • the cold trap 48 condensable and/or sohdifiable components may be extracted from the effluent under appropriate temperature conditions, and discharged from the cold trap in line 50 for recovery and/or reuse.
  • the resultantly treated effluent then is flowed in line 52 to the sorbent bed 54.
  • the cold trap 48 may be optionally used in place of or as an adjunct to the provision of the optional metals trap 40.
  • the metals trap 40 may comprise a particulate filter for recovering metals and other components, and the cold trap 48 then may be operated to recover heavy organics and metal-containing species susceptible to condensation or solidification in the cold trap.
  • the metals trap 40 may comprise a first cold trap removing species potentially deleterious to the pump, so that the cold trap 48 constitutes a second cold trap for removing further components of the effluent.
  • the cold trap 48 could be operated at lower temperature than the cold trap of metals trap 40, e.g., with a same heat exchange fluid chilling the second cold trap 48 and then cooling the cold trap of metals trap 40, so that the effluent is thereby successively reduced in temperature to a low level temperature that maximizes subsequent physisorption.
  • the optional process unit 48 rather than comprising a cold trap may comprise a heating unit for raising the temperature of the effluent to a temperature that maximizes subsequent chemisorption.
  • Sorbent bed 54 comprises a vessel containing a sorbent material having sorptive affinity for the components of the effluent that are to be removed. Sorbent materials may include physical adsorbents and/or chemisorbents, as desired and appropriate to the removal operation to be carried out.
  • the sorbent bed may in fact be a multiple bed arrangement comprising sorbent beds variously connected in series and/or parallel (manifolded) arrangements.
  • the resultantly treated effluent is flowed from the sorbent bed in line 58, and may be discharged to the atmosphere or further treated or processed, as necessary or desired in a given end use application of the invention.
  • the sorbent bed may be wrapped with a heating coil 56.
  • the heating coil may comprise an electrical resistance heating tape, a stream-tracing line, a heat exchange coil through which a suitable heat transfer fluid may be selectively flowed, or any other appropriate heating means.
  • the sorbent bed may be coupled with a source 68 of a regeneration fluid, which is selectively flowable in line 70 to the heater 72 for heating to elevated temperature appropriate to effect deso ⁇ tion of the sorbed species from the sorbent bed during the regeneration operation.
  • the resultantly heated fluid is flowed from the heater 72 in line 74 to the sorbent bed, and flows therethrough to effect deso ⁇ tion.
  • the heater 72 is optional and that in some instances the desired deso ⁇ tion of the sorbed species from the sorbent bed may be effected solely by mass transfer as a result of a concentration differential between the sorbent and the regeneration gas flowing through the sorbent bed.
  • an effluent tap line 60 which conveys a side- stream of the effluent gas to an endpoint detector 62, as hereinafter more fully described herein.
  • the endpoint detector 62 upon detecting the breakthrough or incipient breakthrough of the species in the effluent being monitored, may be constructed and arranged to generate a control signal that is transmitted in transmission line 64 to the central processing unit (CPU) 66, which may be operatively arranged to effect a corresponding action in the facility.
  • CPU central processing unit
  • the system may be arranged so that on incipient breakthrough detection by the endpoint detector, the effluent flow is diverted to a second sorbent bed, or to a holding (surge) vessel for retention until the regeneration of the sorbent bed has been carried out.
  • endpoint breakthrough detection may be employed to initiate a regeneration sequence, to renew the sorbent bed for subsequent on-stream operation.
  • the sorbent bed comprises a bed of suitable sorbent material, e.g., high surface area activated carbon.
  • sorbent material e.g., high surface area activated carbon.
  • Activated carbon may be used in any of a number of grades, including high purity bead activated carbon, coconut carbon, bituminous carbon, etc.
  • the sorbent may alternatively comprise carbon impregnated with permanganate, or WetleriteTM carbon with some metal oxide content providing oxidative properties to the sorbent material.
  • special catalytic carbons can be used, such as those commercially available from Calgon Carbon Co ⁇ oration as part of their CentaurTM product line.
  • CentaurTM carbons include those described in U.S. Patent No. 5,356,849 and U.S. Patent No. 5,494,869, the disclosures of which are hereby inco ⁇ orated herein by reference in their entireties.
  • a high surface area alumina can be used to physically adsorb, as well as to physically trap the metalorganic and organic species.
  • a "wet" alumina may be employed if desired.
  • a high surface area alumina may be impregnated with a strong oxidizer, such as KMn0 4 , to partially oxidize the organic species.
  • CuS0 4 -impregnated silica gel may also be employed to provide a lesser oxidizing action, as desired.
  • Still another approach is to utilize a bed of alumina (or alumina impregnated with a strong oxidizer) over a bed of carbon, as a component of the abatement system.
  • the abatement system may further, optionally comprise an endpoint detection device, as a means of detecting endpoint or depletion of the sorbent material.
  • the endpoint detection device may for example comprise:
  • IR infrared
  • NDIR non-dispersive infrared
  • This chromatographic characteristic of the process can be used to separate the valuable sorbate components of the effluent gas from the non-valuable sorbate components.
  • the valuable sorbate components can then be recycled back to the precursor manufacturing process, while the non- valuable components can be disposed of by other means, such as incineration.
  • the non-valuable sorbate components can be left on the adsorbent media and the adsorbent media can be either incinerated or landfilled.
  • the regenerated physisorbent/chemisorbent material can be recycled and reused in the multi- component metal oxide CVD effluent abatement process itself.
  • the present invention also contemplates an apparatus for the regeneration of the spent physisorbent/chemisorbent material.
  • This device comprises a heating element, preferably of a conductive contact or a radiative infrared type, e.g., wrapped around the canister to be regenerated.
  • This first heater prevents heat losses from the bed and eliminates cold spots along the walls, as well as forcing heat into the bed itself.
  • the first heater will typically rely on conductive mechanisms to transfer heat within the bed itself.
  • the thermal conductivity of porous beds is typically poor due to the point- and/or small area-contacts that provide the conductive path for heat transfer.
  • this discontinuity of the heat conduction path due to void volume and interstitial spaces) may be insufficient to allow acceptably short heat-up times for the bed to be achieved, and other heating means and method must be alternatively employed.
  • a second convective heater assembly whereby a carrier gas (such as N 2 , Ar, air, etc.) is passed through a heating device to raise the gas temperature, and the resultantly heated gas is then passed through the physisorbent/chemisorbent bed to be regenerated. In this manner, heat from the carrier gas is applied to the bed.
  • a carrier gas such as N 2 , Ar, air, etc.
  • This second convective heater may be filled with heat transfer enhancement media, such as turbulators, spheres, packing media such as Pall ® rings or Intalox ® saddles, twisted tape inserts, delta wing inserts, or spiral wound wire inserts (such as those manufactured by Cal Gavin).
  • heat transfer enhancement media such as turbulators, spheres, packing media such as Pall ® rings or Intalox ® saddles, twisted tape inserts, delta wing inserts, or spiral wound wire inserts (such as those manufactured by Cal Gavin).
  • the second convective heater may utilize a direct, electrically heated element, or it may use indirect heating (such as inductive heating, etc) to heat the carrier gas.
  • Combustion-based heating may also be used if such mode of heating is compatible with the sorbent material; combustion- based heating should generally not be employed with activated carbon sorbents, due to the flammable nature of many activated carbon compositions.
  • a vacuum device with throttling means may also be provided for vacuum regeneration of the canister.
  • the exhaust of the canister or the vacuum pump may then be fed into a recovery unit, e.g., a condenser, a feed line into a precursor manufacturing unit (whereby the recovered component is reused for synthesis of the source reagent), a reaction vessel, or a distillation recovery process unit.
  • a recovery unit e.g., a condenser, a feed line into a precursor manufacturing unit (whereby the recovered component is reused for synthesis of the source reagent), a reaction vessel, or a distillation recovery process unit.
  • a test was run using a quartz microbalance (QMB) sensor element coated with a simple polymeric coating having affinity for the organic and organometallic components of the effluent.
  • QMB quartz microbalance
  • the polymeric coating is non-reactive with the targeted organic and organometallic species, but has the property of establishing an equilibrium between the vapor phase organic/organometallic species and the same species adsorbed on the polymeric coating. As a result of this equilibrium, when little or no organic passes through the scrubber vessel, little or no organic is adsorbed onto the polymeric coating of the QMB sensor.
  • This endpoint detection scheme is very versatile in that any of a number of coatings, including hydrophobic or hydrophilic coatings, can be applied to the QMB in order to target specific organic or organometallic species of interest
  • the QMB sensor preferably utilizes reversible chemistry, so that a slow bleed of organic through the system does not cause false "trips" of the system
  • Such QMB technology also can be used in conjunction with various selective adsorbents or traps, in order to allow only target species to pass through to the sensor
  • a water removal unit e g , a Permapure® filter
  • a Permapure® filter may be used to remove the bulk of the H 2 0 molecules from the effluent being monitored by the QMB endpoint detector
  • Kitigawa tubes may be used, having chemistries utilizing Cr(VI) or Cr(VI) and H 2 S0 4 Some of these tubes give color changes when the monitored component is present and others do not, but such tubes utilize chemistries that can be used as a simple endpoint momto ⁇ ng means
  • Specific endpoint monitoring means may for example comprise
  • This strong oxidizing chemistry can be used in conjunction with any of the physical methods described hereinabove in order to detect an endpoint condition.
  • a bed of high surface area organic adsorbent can be used, such as carbon, or organic polymer adsorbents such as Dow Sorbathene ® pellets or Rohm and Haas Amberlite ® pellets.
  • a bed of high surface inorganic material can also be used, such as alumina, molecular sieve, silica gel, hydrophobic zeolites, hydrophilic zeolites, etc.
  • a bed of high surface area adsorbent impregnated with a strong oxidizer, such as KMn0 4 , could also be utilized for some or all of the sorbent bed.
  • the BST precursor composition and solvent were bypassed around the deposition chamber.
  • An Edwards QDP dry pump was used as the reaction chamber vacuum source. The system utilized a cold trap before the pump, but no post-pump treatment of the effluent.
  • TLV and Vi IDLH levels for each of the potential species involved was as follows:
  • Example 1 The system of Example 1 is modified by providing (downstream of the pump) a two-zone sorbent unit including a bed of alumina as a first stage of the two-zone sorbent unit, and a bed of KmnO-r impregnated activated carbon as the second stage of the two-zone sorbent unit.
  • the effluent from the pump is flowed in sequence through the first and second sorbent beds. Periodically, heat and vacuum are applied to the sorbent beds to desorb adsorbed species therefrom. The desorbate vapor species are then sent to a vapor recovery process and separated to recover the organic components of the vapor.
  • a quartz microbalance detector having a coating on the piezoelectric quartz crystal element with so ⁇ tive affinity for an organic component of the effluent, is coupled to the discharge line of each of the first and second sorbent beds, to monitor the discharged effluent gas for breakthrough of organic species therein, so that the sorbent beds can be changed out and charged with fresh sorbent material, for high efficiency abatement of the effluent.

Abstract

Apparatus and method for abatement of effluent from multi-component metal oxides deposited by CVD processes using metal source reagent liquid solutions which comprise at least one metal coordination complex including a metal to which is coordinatively bound at least one ligand in a stable complex and a suitable solvent medium for that metal coordination complex e.g., a metalorganic chemical vapor deposition (MOCVD) process for forming barium strontium titanate (BST) thin films on substrates. The effluent is sorptively treated to remove precursor species and MOCVD process by-products for the effluent. An endpoint detector (62) such as a quartz microbalance detector may be employed to detect incipient breakthrough conditions in the sorptive treatment unit.

Description

ABATEMENT OF EFFLUENT FROM CHEMICAL VAPOR DEPOSITION PROCESSES USING LIGAND EXCHANGE RESISTANT METAL-ORGANIC
PRECURSOR SOLUTIONS
BACKGROUND OF THE INVENTION
Field Of The Invention
The present invention relates to a method and apparatus for abatement of effluent from any CVD process using a metal source reagent liquid solution comprising at least one metal coordination complex including a metal to which is coordinatively bound at least one ligand in a stable complex and a solvent for that metal coordination complex e.g., abatement of effluent from a multi- component metal oxide chemical vapor deposition (CVD) process used for forming barium strontium titanate (BST) thin films on substrates.
Description of the Related Art
BST is an important material in the semiconductor manufacturing industry for fabrication of thin film dielectric microelectronic devices. Such fabrication typically is carried out by chemical vapor deposition (CVD), in which precursors (source reagents) for the respective barium, strontium and titanium components of the product film are volatilized for use in the deposition process.
The source reagents for the BST film formation process may be provided to the CVD reactor by a liquid delivery process, in which the metalorganic precursors for the barium, strontium and titanium components are dissolved in a suitable solvent medium such as n-butyl acetate or tetrahydrofuran. The liquid solution containing precursors and corresponding solvent (separate solutions of different precursors can also be used) is pumped into a vaporizer comprising a hot zone maintained at low pressure. In the vaporizer, the liquid solution is vaporized at high rate ("flash vaporized") under controlled temperature, pressure, and flow conditions. The vaporizer is advantageously flushed with solvent immediately before and after deposition to prevent accumulation of solid species that could cause clogging in the process equipment and associated piping, valves and fittings.
In the vaporizer, or downstream therefrom, the precursor vapor is combined with a carrier gas (e.g., argon or nitrogen) and an oxidizer (e.g., oxygen or nitrous oxide). The combined precursor vapor mixture then is flowed to the CVD deposition chamber.
The CVD deposition chamber is typically operated at low pressure, e.g., on the order of 100 millitorr, by deployment of a dry pump or wet pump on the discharge of the system. In such chamber, the precursors are decomposed on the heated substrate by a thermal reaction of the combined gases, organic vapors, and metalorganic precursors, resulting in the deposition of a thin perovskite film of BST material on the wafer substrate. After chemical deposition, the wafer coated with the BST film is transferred to a separate chamber for annealing.
The effluent from the CVD deposition chamber in the CVD BST process comprises organic species, metals, unreacted precursor, precursor decomposition species and other thermal reaction products deriving from the CVD operation.
Currently, there is no effective abatement scheme commercially available for the effluent of such CVD BST process.
The foregoing issues are not unique to the CVD BST process. They also apply to other multi- component metal oxides deposited by CVD processes using metal source reagent liquid solutions which comprise at least one metal coordination complex including a metal to which is coordinatively bound at least one ligand in a stable complex and a suitable solvent medium for that metal coordination complex. These include the multi-component metal oxide CND processes
using ligand exchange resistant metal-organic precursor solutions described in U.S. Patent No. 5,820,664 issued Oct. 13, 1998 to Gardiner et al. and assigned to Advanced Technology Materials, Inc., Danbury, Conn..
SUMMARY OF THE INVENTION
The present invention relates to abatement of effluent produced by multi-component metal oxides deposited by CVD processes using metal source reagent liquid solutions which comprise at least one metal coordination complex including a metal to which is coordinatively bound at least one ligand in a stable complex and a suitable solvent medium for that metal coordination complex e.g., CVD of BST.
In one aspect, the invention relates to a method for abatement of effluent from a CVD process for depositing a multi-component metal oxide film on a substrate, in which the effluent is flowed through a sorbent bed having sorptive affinity for contaminant species (precursor species and CVD process by-products) in the effluent.
In a specific embodiment, effluent from the CVD process is flowed in sequence through a metals trap, a motive fluid driver, and a sorbent bed having sorptive affinity for contaminant species in the effluent.
The method may further comprise monitoring the effluent discharged from the sorbent bed, to detect breakthrough of a selected contaminant component. The invention relates in another aspect to an apparatus for abatement of effluent from a CND process for depositing multi-component metal oxide on a substrate from a precursor composition, wherein the apparatus comprises a sorbent bed having sorptive affinity for contaminants in the effluent. Such sorbent bed may be part of an effluent flow circuit including a metals trap, a motive fluid driver, and a sorbent bed having sorptive affinity for contaminants in the effluent, optionally equipped with an endpoint detector for detecting the endpoint of sorption of the sorbent bed.
The apparatus described above may further include a semiconductor manufacturing facility whose operation comprises the CVD process
Other aspects, features and embodiments of the invention will be more fully apparent from the ensuing disclosure and appended claims
BRIEF DESCRIPTION OF THE DRAWINGS
Figure 1 is a schematic representation of an CVD multi-component metal oxide film fabrication facility including an effluent abatement system according to one embodiment of the present invention.
DETAILED DESCRIPTION OF THE INVENTION. AND PREFERRED EMBODIMENTS
THEREOF
The present invention provides an effluent abatement system for treatment of effluent
streams from multi-component metal oxides deposited by CVD processes using metal
source reagent liquid solutions which comprise at least one metal coordination complex including a metal to which is coordinatively bound at least one ligand in a stable complex and a suitable solvent medium for that metal coordination complex e.g., CND BST processes.
Although illustrated herein with reference to a specific examples involving treatment of effluent from a CND BST process, it will be recognized that the apparatus and methodology disclosed herein may be widely and effectively employed for the abatement of streams deriving from operations utilizing multi-component metal oxides deposited by CND processes using metal source reagent liquid solutions which comprise at least one metal coordination complex including a metal to which is coordinatively bound at least one ligand in a stable complex and a suitable solvent medium for that metal coordination complex. These include the multi-component metal oxides deposited by CND processes using ligand exchange resistant metal-organic precursor solutions described in U.S. Patent No. 5,820,664 issued Oct. 13, 1998 to Gardiner et al. the disclosure of which is hereby incorporated herein by reference in its entirety.
Figure 1 shows a schematic representation of an CVD multi-component metal oxide film fabrication facility 10 including an effluent abatement system 12 according to one embodiment of the present invention.
In the Figure 1 facility, a multi-component metal oxide source reagent or precursor material is furnished from source 14 thereof. The source 14 may comprise a reservoir containing a liquid solution of the precursor material. Alternatively, the source 14 may comprise a blending or synthesis unit wherein the liquid precursor is made or formulated in the first instance. From the source 14, the liquid precursor flows in line 16 to the vaporizer unit 18, wherein the liquid precursor is flash vaporized for volatilization thereof to form corresponding precursor vapor Concurrently, additional gases, e g , a carrier gas, such as argon, helium, hydrogen, etc , and an oxidant, such as oxygen, nitrogen oxide, etc , are flowed from the gas supply unit 20 in line 22 to the vaporizer unit 18 The carrier gas entrains the precursor vapor and together with the introduced oxidant gas forms a precursor vapor mixture
The carrier gas and oxidant gas may alternatively be separately introduced or alternatively the oxidant gas may be introduced downstream of the vaporizer before entry of the precursor vapor mixture into the CVD chamber As a still further alternative, the oxidant gas may be directly introduced into the CVD chamber
The precursor vapor mixture flows from the vaporizer unit 18 to the CVD reactor 26, and is dispersed in the interior volume of the reactor by showerhead discharge device 28 as a vapor flow stream 30 The stream of precursor vapor mixture thereby is directed to and impinges on a wafer substrate 32 positioned on susceptor 34 heated by heating element 36 The wafer substrate is maintained at a sufficiently elevated temperature to cause decomposition of the precursor vapor mixture and the chemical vapor deposition of the multi-component metal oxide film on the surface of the wafer substrate
An effluent comprising waste gases and decomposition by-products is discharged from the reactor 26 and flowed in line 38 to the effluent abatement system 12
The effluent abatement system 12 comprises an optional metals trap 40, to remove metal components of the effluent that could otherwise be deleterious m passage through the subsequent pump 44 The metals trap may be of any suitable form, comprising e g , a cold trap, a high surface area metals trap such as a foramtnous filter through which the effluent is flowed, a liquid contacting chamber for gas-liquid contacting of the effluent with an ultra-low volatility liquid (such as Krytox® or Fomblin® liquids), etc.
As a specific example, the metals trap 40 may include a cold trap device comprising a suitable means for chilling the effluent to appropriate temperature. Such means may for example comprise a heat exchanger through which the effluent is flowed in indirect heat exchange relationship with a coolant fluid, a chiller-tracing on the line 38, an embedded resistance cooling element disposed in the line for cooling of the effluent gas stream as it flows therethrough, a packed column of high heat capacity packing elements that are continuously or intermittently cooled, e.g., by cryogenic or other refrigeration means, a heat pipe unit arranged for extracting heat from the effluent, or any other means by which the effluent is suitably cooled.
The metals trap may also be constituted to remove from the effluent components other than metals, e.g., heavy organic components, such as in a cold trap wherein such species are condensed, or in a gas-liquid contacting unit wherein such species are solubilized in the contacting liquid.
From the metals trap 40, the effluent flows in line 42 to the pump 44, which serves as a motive fluid driver for the effluent stream. While a pump is illustratively shown, it will be appreciated that any other motive fluid driver may be employed, e.g., a compressor, eductor, turbine, fan, blower, etc. The pump may be constructed and operated to provide an appropriate pressure level in the upstream reactor 26, e.g., a subatmospheric pressure level.
The pump discharges the effluent into discharge line 46, from which it flows to the optional post- pump cold trap 48. In the cold trap 48, condensable and/or sohdifiable components may be extracted from the effluent under appropriate temperature conditions, and discharged from the cold trap in line 50 for recovery and/or reuse. The resultantly treated effluent then is flowed in line 52 to the sorbent bed 54. The cold trap 48 may be optionally used in place of or as an adjunct to the provision of the optional metals trap 40. For example, the metals trap 40 may comprise a particulate filter for recovering metals and other components, and the cold trap 48 then may be operated to recover heavy organics and metal-containing species susceptible to condensation or solidification in the cold trap.
Alternatively, the metals trap 40 may comprise a first cold trap removing species potentially deleterious to the pump, so that the cold trap 48 constitutes a second cold trap for removing further components of the effluent. In this fashion, the cold trap 48 could be operated at lower temperature than the cold trap of metals trap 40, e.g., with a same heat exchange fluid chilling the second cold trap 48 and then cooling the cold trap of metals trap 40, so that the effluent is thereby successively reduced in temperature to a low level temperature that maximizes subsequent physisorption.
Alternatively, the optional process unit 48 rather than comprising a cold trap may comprise a heating unit for raising the temperature of the effluent to a temperature that maximizes subsequent chemisorption.
It therefore is seen that the effluent abatement process of the invention may be flexibly constituted in connection with a sorbent treatment step that may involve physisorption and/or chemisorption.
The effluent gas in line 52 is therefore flowed to sorbent bed 54. Sorbent bed 54 comprises a vessel containing a sorbent material having sorptive affinity for the components of the effluent that are to be removed. Sorbent materials may include physical adsorbents and/or chemisorbents, as desired and appropriate to the removal operation to be carried out.
Although illustratively shown as comprising a single adsorber unit, the sorbent bed may in fact be a multiple bed arrangement comprising sorbent beds variously connected in series and/or parallel (manifolded) arrangements. After sorptive treatment in the sorbent bed 54, the resultantly treated effluent is flowed from the sorbent bed in line 58, and may be discharged to the atmosphere or further treated or processed, as necessary or desired in a given end use application of the invention. For regeneration purposes, the sorbent bed may be wrapped with a heating coil 56. The heating coil may comprise an electrical resistance heating tape, a stream-tracing line, a heat exchange coil through which a suitable heat transfer fluid may be selectively flowed, or any other appropriate heating means.
As an additional feature accommodating regeneration of the sorbent bed, the sorbent bed may be coupled with a source 68 of a regeneration fluid, which is selectively flowable in line 70 to the heater 72 for heating to elevated temperature appropriate to effect desoφtion of the sorbed species from the sorbent bed during the regeneration operation. The resultantly heated fluid is flowed from the heater 72 in line 74 to the sorbent bed, and flows therethrough to effect desoφtion. It will be appreciated that the heater 72 is optional and that in some instances the desired desoφtion of the sorbed species from the sorbent bed may be effected solely by mass transfer as a result of a concentration differential between the sorbent and the regeneration gas flowing through the sorbent bed.
The sorbent bed is also provide with a discharge line 76 for efflux of the regeneration gas subsequent to its contacting with the sorbent in the sorbent bed. The line 76 may be coupled with a recovery unit 78, in which separation of the desorbate gas may be effected, to recover components thereof for final disposition, recycle or other use. In the illustrated recovery unit, the desorbate gas is separated into a first fraction, which is discharged from the recovery unit in line 80, and a second fraction, which is discharged from the recovery unit in line 82.
Other modes and means of regeneration of the sorbent bed may usefully be employed, as hereinafter more fully described.
At the outlet end of the sorbent bed 54 is provided an effluent tap line 60, which conveys a side- stream of the effluent gas to an endpoint detector 62, as hereinafter more fully described herein. The endpoint detector 62, upon detecting the breakthrough or incipient breakthrough of the species in the effluent being monitored, may be constructed and arranged to generate a control signal that is transmitted in transmission line 64 to the central processing unit (CPU) 66, which may be operatively arranged to effect a corresponding action in the facility.
For example, the system may be arranged so that on incipient breakthrough detection by the endpoint detector, the effluent flow is diverted to a second sorbent bed, or to a holding (surge) vessel for retention until the regeneration of the sorbent bed has been carried out. Alternatively, or additionally, such endpoint breakthrough detection may be employed to initiate a regeneration sequence, to renew the sorbent bed for subsequent on-stream operation.
As mentioned, the features and layout of the semiconductor manufacturing facility shown in Figure 1 is illustrative in character only, and other features, arrangements and operation may be advantageously employed.
The abatement system of the invention may therefore variously comprise: a) a sorbent-based effluent abatement unit, b) a pre-pump metals trap, pump, and sorbent-based effluent abatement unit, c) a pre-pump metals trap, pump, post-pump cold trap/heating unit, and sorbent-based effluent abatement unit, or d) any other configuration utilizing suitable components selected from, or at a minimum including, one or more of the aforementioned elements.
In an illustrative configuration, the sorbent bed comprises a bed of suitable sorbent material, e.g., high surface area activated carbon. Such sorbent material will remove heavy organometallic species. Activated carbon may be used in any of a number of grades, including high purity bead activated carbon, coconut carbon, bituminous carbon, etc. The sorbent may alternatively comprise carbon impregnated with permanganate, or Wetlerite™ carbon with some metal oxide content providing oxidative properties to the sorbent material. In addition, special catalytic carbons can be used, such as those commercially available from Calgon Carbon Coφoration as part of their Centaur™ product line. These carbons are formulated to have especially high catalytic properties, but without the addition of metal oxides. Illustrative Centaur™ carbons include those described in U.S. Patent No. 5,356,849 and U.S. Patent No. 5,494,869, the disclosures of which are hereby incoφorated herein by reference in their entireties.
In addition to, or instead of, activated carbon, a high surface area alumina can be used to physically adsorb, as well as to physically trap the metalorganic and organic species. A "wet" alumina may be employed if desired. A high surface area alumina may be impregnated with a strong oxidizer, such as KMn04, to partially oxidize the organic species. CuS04-impregnated silica gel may also be employed to provide a lesser oxidizing action, as desired.
KMn04 is of sufficient strength to oxidize the organic species. An alumina bed will have some affinity for the oxidized products; alternatively, a carbon bed after the alumina bed may be employed so that partially oxidized organic species are adsorbed on the alumina or the activated carbon, while innocuous fragments pass through the system.
Still another approach is to utilize a bed of alumina (or alumina impregnated with a strong oxidizer) over a bed of carbon, as a component of the abatement system.
The abatement system may further, optionally comprise an endpoint detection device, as a means of detecting endpoint or depletion of the sorbent material. The endpoint detection device may for example comprise:
a) a piezoelectric quartz crystal microbalance, with the quartz crystal coated with a thin film coating having affinity for a component of the gas; b) a colorimetric material, such as K-Mn0 -impregnated alumina, which can be located in a sightglass (protected from normal light in order to prevent colorimetric property degradation), and which will change color upon oxidation;
c) a thermal conductivity detector on the exhaust of the system; and/or
d) an infrared (IR) device, such as a non-dispersive infrared (NDIR) system.
Any of various other endpoint detection schemes could alternatively be used.
The abatement system can also be combined with a method and apparatus for recycle of the organic and organometallic material, if a reversible physisoφtive material is employed as the sorbent medium. Upon depletion, the spent canister of physisorbent/chemisorbent material can be removed from the effluent abatement system and can be returned to a regeneration site. At this site heat, vacuum, or both, can be applied to the bed, thereby revolatilizing some or all of the physically adsorbed material. In certain cases when carbon is used as a physisorbent material, it may be advantageous to pyrolyze the carbon, to volatilize the sorbed species and effect their release from the sorbent.
Due to the differing physisoφtion characteristics of organic and organo-metallic species, the various adsorbed species will elute at different times in the regeneration heat-up or vacuum cycle.
This chromatographic characteristic of the process can be used to separate the valuable sorbate components of the effluent gas from the non-valuable sorbate components. The valuable sorbate components can then be recycled back to the precursor manufacturing process, while the non- valuable components can be disposed of by other means, such as incineration.
Alternatively, the non-valuable sorbate components can be left on the adsorbent media and the adsorbent media can be either incinerated or landfilled. In yet another alternative approach, the regenerated physisorbent/chemisorbent material can be recycled and reused in the multi- component metal oxide CVD effluent abatement process itself.
The present invention also contemplates an apparatus for the regeneration of the spent physisorbent/chemisorbent material. This device comprises a heating element, preferably of a conductive contact or a radiative infrared type, e.g., wrapped around the canister to be regenerated. This first heater prevents heat losses from the bed and eliminates cold spots along the walls, as well as forcing heat into the bed itself.
The first heater will typically rely on conductive mechanisms to transfer heat within the bed itself. In this respect, the thermal conductivity of porous beds is typically poor due to the point- and/or small area-contacts that provide the conductive path for heat transfer. For large diameter beds, this discontinuity of the heat conduction path (due to void volume and interstitial spaces) may be insufficient to allow acceptably short heat-up times for the bed to be achieved, and other heating means and method must be alternatively employed.
Accordingly, where large diameter beds are employed, it may be desirable to use a second convective heater assembly whereby a carrier gas (such as N2, Ar, air, etc.) is passed through a heating device to raise the gas temperature, and the resultantly heated gas is then passed through the physisorbent/chemisorbent bed to be regenerated. In this manner, heat from the carrier gas is applied to the bed.
This second convective heater may be filled with heat transfer enhancement media, such as turbulators, spheres, packing media such as Pall® rings or Intalox® saddles, twisted tape inserts, delta wing inserts, or spiral wound wire inserts (such as those manufactured by Cal Gavin).
The second convective heater may utilize a direct, electrically heated element, or it may use indirect heating (such as inductive heating, etc) to heat the carrier gas. Combustion-based heating may also be used if such mode of heating is compatible with the sorbent material; combustion- based heating should generally not be employed with activated carbon sorbents, due to the flammable nature of many activated carbon compositions.
A vacuum device with throttling means (such as a valve, or a variable flow device (VFD)) may also be provided for vacuum regeneration of the canister. The exhaust of the canister or the vacuum pump may then be fed into a recovery unit, e.g., a condenser, a feed line into a precursor manufacturing unit (whereby the recovered component is reused for synthesis of the source reagent), a reaction vessel, or a distillation recovery process unit.
As an illustrative embodiment of one endpoint detection system in accordance with the present invention, a test was run using a quartz microbalance (QMB) sensor element coated with a simple polymeric coating having affinity for the organic and organometallic components of the effluent.
The polymeric coating is non-reactive with the targeted organic and organometallic species, but has the property of establishing an equilibrium between the vapor phase organic/organometallic species and the same species adsorbed on the polymeric coating. As a result of this equilibrium, when little or no organic passes through the scrubber vessel, little or no organic is adsorbed onto the polymeric coating of the QMB sensor.
However, when organics start to pass through the scrubber, equilibrium constraints cause some of the organic to be adsorbed onto the polymeric coating of the QMB. This resultantly effects a weight change of the QMB and a concomitant change in the frequency output of the QMB. Such change in frequency output may be used to trigger a signal of a suitable type (auditory, visual, tactile, etc.) indicating that the canister has reached endpoint and requires change-out.
This endpoint detection scheme is very versatile in that any of a number of coatings, including hydrophobic or hydrophilic coatings, can be applied to the QMB in order to target specific organic or organometallic species of interest The QMB sensor preferably utilizes reversible chemistry, so that a slow bleed of organic through the system does not cause false "trips" of the system
Such QMB technology also can be used in conjunction with various selective adsorbents or traps, in order to allow only target species to pass through to the sensor For instance, if the QMB sensor coating may tend to physisorb H20 molecules in circumstances where H20 is present or may be highly variable in concentration, then a water removal unit, e g , a Permapure® filter, may be used to remove the bulk of the H20 molecules from the effluent being monitored by the QMB endpoint detector
Alternatively, other low cost means of endpoint monitoring may be utilized in the broad practice of the present invention For example, Kitigawa tubes may be used, having chemistries utilizing Cr(VI) or Cr(VI) and H2S04 Some of these tubes give color changes when the monitored component is present and others do not, but such tubes utilize chemistries that can be used as a simple endpoint momtoπng means
Specific endpoint monitoring means may for example comprise
a) the use of sample tubes with Cr(VI) or Cr(VI)+H2S04 characteristics, for periodic "spot sampling" of the exhaust stream of the CVD reactor,
b) the incoφoration of a sight glass on the scrubber canister, with Cr(VI) or Cr(VI)+H2S04 chemistry impregnated onto the resm behind the sight glass, so as produce a visually discernible color change as the end portion of the scrubber resin (sorbent material) is contacted by organic molecules of interest, or
c) the incoφoration of Cr(VI) or Cr(VI)+H2S04 chemistry in an automated monitor using a colorimetric sensing tape, such as that manufactured by Zellweger Analytics and employed in that company's MDA line of monitoring systems Another example of a chemistry that is potentially usefully employed in the broad practice of the invention comprises a high surface alumina absorbent loaded with KMn04 for colorimetric indication upon exposure to organic molecules. A distinct color change is observable after reaction with organic species. This strong oxidizing chemistry can be used in conjunction with any of the physical methods described hereinabove in order to detect an endpoint condition.
For abatement of precursor or organic species, a bed of high surface area organic adsorbent can be used, such as carbon, or organic polymer adsorbents such as Dow Sorbathene® pellets or Rohm and Haas Amberlite® pellets. A bed of high surface inorganic material can also be used, such as alumina, molecular sieve, silica gel, hydrophobic zeolites, hydrophilic zeolites, etc. In addition, a bed of high surface area adsorbent (either organic or inorganic) impregnated with a strong oxidizer, such as KMn04, could also be utilized for some or all of the sorbent bed.
While the invention has been described in specific reference to multi-component metal oxides , it is understood that the abatement method and apparatus of the invention can be applied to other processes utilizing low vapor pressure, metalorganic species that can be delivered by liquid delivery systems.
The features and advantages of the invention are more fully shown with reference to the following examples. Although illustrated herein with reference to these specific examples involving treatment of effluent from a CND BST process, it will be recognized that the apparatus and
methodology disclosed herein may be widely and effectively employed for the abatement
of streams deriving from operations utilizing multi-component metal oxides deposited by
CND processes.
EXAMPLE 1 Post-pump FTIR characterization of gas-phase BST process effluents on a commercially available BST tool using precursor BST9-0047 (Advanced Technology Materials, Inc., Danbury, CT) at a delivery flow rate of 35 mg/min. The BST precursor mixture included:
bis(TMHD)bariumpentamethyldiethylenetriamine
bis(TMHD)strontiumpentamethyldiethylenetri amine
bis(isopropoxy)bis(TMHD)titanium.
The metalorganic reactants used a Ba/Sr volume ratio of about 3/2 and were combined with n-butyl acetate. Oxygen was used as the oxidizing agent and flowed at 0.5 standard liters per minute (slpm). Nitrogen and argon were used as transport gases. The reactor and liquid delivery systems were flushed with n-butyl acetate (nBA) for 5 to 10 minutes before and after deposition of all wafers. Flushes lasted typically 5 to 10 minutes, and the solvent was introduced at a rate of 500 standard cubic centimeters per minute (seem). Wafers were processed sequentially with a deposition lasting 3.5 minutes per wafer at a deposition rate of 70 Angstroms/minute. Wafer handling and transfer time between depositions was approximately 2.5 minutes.
During wafer handling and transfer, the BST precursor composition and solvent were bypassed around the deposition chamber. An Edwards QDP dry pump was used as the reaction chamber vacuum source. The system utilized a cold trap before the pump, but no post-pump treatment of the effluent.
Significant volumes of nBA were measured during flushes, with concentration up to 900 to 1250 parts per million (ppm), or close to 10 times the Federal and ACGIH exposure limits of 150 ppm. The concentration profiles generated during deposition showed a decrease in nBA concentrations every time a wafer was processed at the expense of forming carbon oxides. The nBA before deposition (but while not flushing) was shown to be stable at a concentration of 45.5 ppm. During deposition, the solvent concentration dropped to 32.5% to 30.9 ppm. At the same time, CO concentrations rose rapidly to 24.1 ppm while C02 concentrations rose rapidly to 30.7 ppm.
TLV and Vi IDLH levels for each of the potential species involved was as follows:
TLV Λ IDLH
Barium precursor Unknown Unknown
Strontium precursor Unknown Unknown
Titanium precursor Unknown Unknown
nBA 150 ppm 5000 ppm
THF 200 ppm 10000 ppm
CO 50 ppm 750 ppm
C02 5000 ppm 25000 ppm
This system operation was characterized by a number of deficiencies:
( 1 ) The volumes of nBA measured during flushes are close to 10 times the federal and ACGIH exposure limits (TLV) of 150 ppm, although they were well below the XA IDLH level of 5000 ppm.
(2) The volumes of nBA, especially those measured during flushes, pose odor issues.
(3) Some Ba, Sr and Ti species (either precursor species, or byproducts of precursor decomposition) pass through the cold trap and are not abated. (4) Volumes of CO and C02 formed in the process contribute to greenhouse warming of the environment.
EXAMPLE 2
The system of Example 1 is modified by providing (downstream of the pump) a two-zone sorbent unit including a bed of alumina as a first stage of the two-zone sorbent unit, and a bed of KmnO-r impregnated activated carbon as the second stage of the two-zone sorbent unit. The effluent from the pump is flowed in sequence through the first and second sorbent beds. Periodically, heat and vacuum are applied to the sorbent beds to desorb adsorbed species therefrom. The desorbate vapor species are then sent to a vapor recovery process and separated to recover the organic components of the vapor. A quartz microbalance detector, having a coating on the piezoelectric quartz crystal element with soφtive affinity for an organic component of the effluent, is coupled to the discharge line of each of the first and second sorbent beds, to monitor the discharged effluent gas for breakthrough of organic species therein, so that the sorbent beds can be changed out and charged with fresh sorbent material, for high efficiency abatement of the effluent.
While the invention has been described herein with reference to specific features and illustrative embodiments, it will be recognized that the utility of the invention is not thus limited, but rather extends to and encompasses other features, modifications and alternative embodiments, as will readily suggest themselves to those of ordinary skill in the art based on the disclosure and illustrative teachings herein. The claims that follow are therefore to be construed and inteφreted, as including all such features, modifications and alternative embodiments within their spirit and scope.

Claims

THE CLAIMSWhat is claimed is:
1. A method for abatement of effluent from a CVD process for depositing a multi-
component metal oxide film on a substrate from corresponding source reagent(s), said method comprising flowing the effluent from the CVD process through a sorbent bed having soφtive affinity for organic and metalorganic species in the effluent.
2. The method of claim 1 , wherein the sorbent bed comprises a physical sorbent.
3. The method of claim 1 , wherein the sorbent bed comprises a chemisorbent.
4. The method of claim 1, wherein the sorbent bed has a bed conformation selected from the group consisting of fixed beds, trickle beds, fluidized beds, and recirculating fluidized beds.
5. The method of claim 1, wherein a pump is disposed upstream of the sorbent bed, and is operative to maintain predetermined pressure conditions in the CVD process.
6. The method of claim 5, further comprising removing metal species from the effluent upstream of the pump.
7. The method of claim 5, further comprising flowing the effluent through a post-pump cold trap to remove organic and metalorganic components from the effluent.
8. The method of claim 1, wherein the sorbent bed comprises an activated carbon sorbent.
9. The method of claim 8, wherein the activated carbon sorbent includes a sorbent selected from the group consisting of bead activated carbon, coconut carbon, bituminous carbon, and mixtures thereof.
10. The method of claim 1, wherein the sorbent bed comprises a carbon sorbent.
1 1. The method of claim 10, wherein the carbon sorbent further comprises permanganate.
12. The method of claim 10, wherein the carbon sorbent further comprises a metal oxide.
13. The method of claim 1 , wherein the sorbent bed comprises a catalytic carbon sorbent.
14. The method of claim 1, wherein the sorbent bed comprises alumina.
15. The method of claim 1 , wherein the sorbent bed comprises wet alumina.
16. The method of claim 1, wherein the sorbent bed comprises alumina impregnated with an oxidizer.
17. The method of claim 16, wherein the oxidizer comprises potassium permanganate.
18. The method of claim 1, wherein the sorbent bed comprises silica impregnated with copper sulfate.
19. The method of claim 1, wherein the sorbent bed comprises an adsorbent mass of activated carbon and an adsorbent mass of alumina.
20. The method of claim 1 , wherein the sorbent bed comprises an adsorbent mass of activated carbon and an adsorbent mass of alumina impregnated with an oxidizer.
21. The method of claim 1, further comprising monitoring the effluent discharged from the sorbent bed, to detect breakthrough of a selected component.
22. The method of claim 21, wherein the monitoring comprises exposure of the effluent to a colorimetric medium exhibiting a colorimetric change upon breakthrough of said selected component.
23. The method of claim 21, wherein the monitoring comprises detecting the thermal conductivity of the effluent.
24. The method of claim 21 , wherein the monitoring comprises non-dispersive infrared monitoring.
25. The method of claim 21 , wherein the monitoring comprises exposing the effluent to a quartz microbalance detector comprising a piezoelectric crystal having on a surface thereof a coating with affinity for the selected component of the effluent, whereby the piezoelectric crystal exhibits a change in frequency characteristics indicative of breakthrough of the selected component of the effluent.
26. The method of claim 25, wherein the coating exhibits reversible affinity for the selected component.
27. The method of claim 25, wherein the coating is selected from the group consisting of hydrophilic coatings and hydrophobic coatings.
28. The method of claim 25, further comprising removing water from the effluent before the effluent contacts the coating of the piezoelectric crystal.
29. The method of claim 21, wherein the monitoring comprises exposing the effluent to a chemistry comprising Cr(VI) or Cr(VI) and H2S04.
30. The method of claim 21 , wherein the monitoring comprises impregnating an outlet end portion of the sorbent bed with a colorimetric chemistry evidencing a visually discernible colorimetric change upon breakthrough of the selected component of the effluent, and disposing a sight glass in viewing relationship to the impregnated outlet end portion of the sorbent bed.
31. The method of claim 1 , wherein the sorbent bed is regenerated by heat.
32. The method of claim 1, wherein the sorbent bed is regenerated by vacuum desoφtion of previously sorbed species therefrom.
33. The method of claim 1 , wherein the sorbent bed is regenerated by pyrolysis.
34. The method of claim 1, wherein the sorbent bed is regenerated by desorbing previously sorbed species therefrom, wherein said desorbing is carried out under varied desoφtion conditions including a first desoφtion condition for desorbing a first desorbate component and a second desoφtion condition for desorbing a second desorbate component.
35. The method of claim 1, wherein the sorbent bed is regenerated in a first regeneration step involving conductive transfer of heat to the sorbent bed, and is regenerated in a second regeneration step involving convective heating by a heated gas flowed through the sorbent bed.
36. The method of claim 1, further comprising throttling the flow of gas through the sorbent bed to control vacuum pressure on the sorbent bed.
37. The method of claim 1 , wherein effluent from the sorbent bed is flowed to a recovery unit for recovery of a selected component of the effluent.
38. The method of claim 37, wherein the recovery unit comprises a unit selected from the group consisting of condenser units, distillation units, synthesis units and reaction units.
39. The method of claim 1, wherein the sorbent bed comprises a sorbent material selected from the group consisting of carbon, organic polymers, alumina, molecular sieve, silica gel, hydrophilic zeolites, hydrophobic zeolites, and combinations thereof.
40. The method of claim 1, wherein the CVD process for depositing a multi-component metal oxide film on a substrate is a process for depositing BST.
41. A method for abatement of effluent from a CVD process for depositing BST on a substrate from a precursor composition including barium, strontium and titanium metalorganic source reagents, wherein organic solvent is contained in the precursor composition and/or employed as a flush medium in the CVD process, and organic solvent correspondingly is present in effluent from the CVD process, said method comprising flowing organic solvent-containing effluent from the CVD process in sequence through a metals trap, a motive fluid driver, and a sorbent bed having soφtive affinity for organic species, to remove organic species from the effluent.
42. The method of claim 41, wherein the metals trap is chilled to capture metal species from the effluent.
43. The method of claim 41, wherein the metals trap comprises a high surface area medium to capture metal species from the effluent.
44. The method of claim 41, wherein the metals trap comprises an essentially non-volatile liquid to capture metal species from the effluent.
45. The method of claim 41, wherein the sorbent bed comprises a physical sorbent.
46. The method of claim 414, wherein the sorbent bed is regenerated to recover said organic species.
47. The method of claim 46, wherein the regeneration is effected by the application of heat and/or vacuum to the sorbent bed.
48. The method of claim 46, wherein the recovered organic species are separated from the sorbent bed at different times, to separately recover different portions thereof .
49. The method of claim 46, wherein the recovered organic species are subsequently subjected to condensation.
50. The method of claim 46, wherein the recovered organic species are subsequently subjected to distillation.
51. The method of claim 46, wherein the regeneration is effected by the application of heat.
52. The method of claim 51, wherein said heat is applied in a rotary kiln to desorb sorbent from the sorbent bed.
53. The method of claim 51, wherein said heat is applied by a heated rotary screw to sorbent from the sorbent bed.
54. The method of claim 51, wherein said heat is applied by exposing the sorbent bed to a stream of heated gas, and desorbed organic species are subjected to a recovery process to recover a desired type of organic species therefrom.
55. An apparatus for abatement of effluent from a CVD process for depositing multi-
component metal oxide films on a substrate from corresponding metal source reagents, said apparatus comprising:
a sorbent bed having soφtive affinity for said metal source reagents and CVD process by- products thereof;
a flow path coupling the CVD process with said sorbent bed so that effluent flows from the CVD process to the sorbent bed, to remove residual source reagents and CVD process by-products thereof from the effluent.
56. The apparatus of claim 55, further comprising a pump in said flow path.
57. The apparatus of claim 56, further comprising a metals trap upstream of the pump.
58. The apparatus of claim 56, further comprising a cold trap downstream of the pump.
59. The apparatus of claim 55, wherein the sorbent bed is arranged to be regeneratable.
60. The apparatus of claim 55, further comprising an endpoint detector coupled to a discharge portion of the sorbent bed.
61. The apparatus of claim 60, wherein the endpoint detector comprises a quartz microbalance detector.
62. The apparatus of claim 55, further including a semiconductor manufacturing facility whose operation comprises said MOCVD process.
63. The apparatus of claim 55, wherein the CVD process for depositing a multi-component metal oxide film on a substrate is a process for depositing BST.
64. An apparatus for abatement of effluent from a liquid delivery CVD process for depositing BST on a substrate from a precursor composition including corresponding barium strontium titanate metalorganic source reagents, wherein organic solvent is contained in the precursor composition and/or employed as a flush medium in the liquid delivery CVD process, and organic solvent correspondingly is present in effluent from the liquid delivery CVD process, said apparatus comprising an effluent flow circuit including in sequence a metals trap, a motive fluid driver, and a sorbent bed having soφtive affinity for organic species.
65. The apparatus of claim 64, further including a semiconductor manufacturing facility whose operation comprises said CVD process.
66. The apparatus of claim 64, further comprising an endpoint detector arranged to breakthrough of organic species in the sorbent bed.
67. The apparatus of claim 64, wherein the sorbent bed is regeneratable for recovery of previously sorbed organic species therefrom.
68. A method for abatement of effluent from a multi-component metal oxide CND process using a metal source reagent liquid solution comprising at least one metal coordination complex including a metal to which is coordinatively bound at least one ligand in a stable complex and a suitable solvent medium for that metal coordination complex, said method comprising flowing the effluent from the multi-component metal oxide CND process through a sorbent bed having soφtive affinity for organic and metalorganic species in the effluent.
69. The method of claim 68, wherein a pump is disposed upstream of the sorbent bed, and is operative to maintain predetermined pressure conditions in the CND process.
70. The method of claim 69, further comprising removing metal species from the effluent upstream of the pump.
71. The method of claim 69, further comprising flowing the effluent through a post-pump cold trap to remove organic and metalorganic components from the effluent.
72. The method of claim 68, further comprising monitoring the effluent discharged from the sorbent bed, to detect breakthrough of a selected component.
73. The method of claim 72, wherein the monitoring comprises exposing the effluent to a quartz microbalance detector comprising a piezoelectric crystal having on a surface thereof a coating with affinity for the selected component of the effluent, whereby the piezoelectric crystal exhibits a change in frequency characteristics indicative of breakthrough of the selected component of the effluent.
74. The method of claim 73, wherein the coating exhibits reversible affinity for the selected component.
75. The method of claim 73, wherein the coating is selected from the group consisting of hydrophilic coatings and hydrophobic coatings.
76. The method of claim 73, further comprising removing water from the effluent before the effluent contacts the coating of the piezoelectric crystal.
77. The method of claim 72, wherein the monitoring comprises impregnating an outlet end portion of the sorbent bed with a colorimetric chemistry evidencing a visually discernible colorimetric change upon breakthrough of the selected component of the effluent, and disposing a sight glass in viewing relationship to the impregnated outlet end portion of the sorbent bed.
78. A method for abatement of effluent from a multi-component metal oxide CND process using a metal source reagent liquid solution comprising at least one metal coordination complex including a metal to which is coordinatively bound at least one ligand in a stable complex and a suitable solvent medium for that metal coordination complex, said method comprising flowing solvent-containing effluent from the CND process in sequence through a metals trap, a motive fluid driver, and a sorbent bed having soφtive affinity for organic species, to remove organic species from the effluent.
79. The method of claim 78, wherein the metals trap is chilled to capture metal species from the effluent.
80. The method of claim 78, wherein the metals trap comprises a high surface area medium to capture metal species from the effluent.
81. The method of claim 78, wherein the metals trap comprises an essentially non-volatile liquid to capture metal species from the effluent.
82. An apparatus for abatement of effluent from a multi-component metal oxide CND process using a metal source reagent liquid solution comprising at least one metal coordination complex including a metal to which is coordinatively bound at least one ligand in a stable complex and a suitable solvent medium for that metal coordination complex, said apparatus comprising an effluent flow circuit including in sequence a metals trap, a motive fluid driver, and a sorbent bed having soφtive affinity for organic species.
83. The apparatus of claim 82, further comprising an endpoint detector coupled to a discharge portion of the sorbent bed.
84. The apparatus of claim 83, wherein the endpoint detector comprises a quartz microbalance detector.
PCT/US2000/041253 1999-10-18 2000-10-18 Abatement of effluent from chemical vapor deposition processes using ligand exchange resistant metal-organic precursor solutions WO2001029281A1 (en)

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Families Citing this family (261)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6943392B2 (en) * 1999-08-30 2005-09-13 Micron Technology, Inc. Capacitors having a capacitor dielectric layer comprising a metal oxide having multiple different metals bonded with oxygen
US6500487B1 (en) * 1999-10-18 2002-12-31 Advanced Technology Materials, Inc Abatement of effluent from chemical vapor deposition processes using ligand exchange resistant metal-organic precursor solutions
US6558517B2 (en) * 2000-05-26 2003-05-06 Micron Technology, Inc. Physical vapor deposition methods
US6838122B2 (en) * 2001-07-13 2005-01-04 Micron Technology, Inc. Chemical vapor deposition methods of forming barium strontium titanate comprising dielectric layers
US20030017266A1 (en) * 2001-07-13 2003-01-23 Cem Basceri Chemical vapor deposition methods of forming barium strontium titanate comprising dielectric layers, including such layers having a varied concentration of barium and strontium within the layer
US7011978B2 (en) 2001-08-17 2006-03-14 Micron Technology, Inc. Methods of forming capacitor constructions comprising perovskite-type dielectric materials with different amount of crystallinity regions
JP3744850B2 (en) * 2001-12-18 2006-02-15 富士通株式会社 Manufacturing method of semiconductor device
JP3973605B2 (en) * 2002-07-10 2007-09-12 東京エレクトロン株式会社 Film forming apparatus, raw material supply apparatus used therefor, and film forming method
JP4113755B2 (en) * 2002-10-03 2008-07-09 東京エレクトロン株式会社 Processing equipment
US20040159235A1 (en) * 2003-02-19 2004-08-19 Marganski Paul J. Low pressure drop canister for fixed bed scrubber applications and method of using same
US6843830B2 (en) * 2003-04-15 2005-01-18 Advanced Technology Materials, Inc. Abatement system targeting a by-pass effluent stream of a semiconductor process tool
FR2858333B1 (en) * 2003-07-31 2006-12-08 Cit Alcatel METHOD AND DEVICE FOR LOW-AGGRESSIVE DEPOSITION OF PLASMA-ASSISTED VAPOR PHASE DIELECTRIC FILMS
CN100411102C (en) * 2003-12-26 2008-08-13 尤泰克株式会社 Vaporizer for CVD, solution voporizing CVD device and voporization method for CVD
US20070197895A1 (en) 2006-02-17 2007-08-23 Sdgi Holdings, Inc. Surgical instrument to assess tissue characteristics
EP1994456A4 (en) * 2006-03-16 2010-05-19 Applied Materials Inc Methods and apparatus for pressure control in electronic device manufacturing systems
JP5660888B2 (en) * 2007-05-25 2015-01-28 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated Method and apparatus for efficient operation of an abatement system
CN101681398B (en) * 2007-05-25 2016-08-10 应用材料公司 Assemble and the method and apparatus of operating electronic device manufacturing systems
WO2008156687A1 (en) * 2007-06-15 2008-12-24 Applied Materials, Inc. Methods and systems for designing and validating operation of abatement systems
JP5133013B2 (en) * 2007-09-10 2013-01-30 東京エレクトロン株式会社 Exhaust system structure of film forming apparatus, film forming apparatus, and exhaust gas treatment method
US8668868B2 (en) * 2007-10-26 2014-03-11 Applied Materials, Inc. Methods and apparatus for smart abatement using an improved fuel circuit
JP5277784B2 (en) * 2008-08-07 2013-08-28 東京エレクトロン株式会社 Raw material recovery method, trap mechanism, exhaust system, and film forming apparatus using the same
US9394608B2 (en) 2009-04-06 2016-07-19 Asm America, Inc. Semiconductor processing reactor and components thereof
US8197579B2 (en) * 2009-06-19 2012-06-12 Empire Technology Development Llc Gas storage and release using piezoelectric materials
US8802201B2 (en) 2009-08-14 2014-08-12 Asm America, Inc. Systems and methods for thin-film deposition of metal oxides using excited nitrogen-oxygen species
US8241596B2 (en) * 2010-12-31 2012-08-14 Mks Instruments, Inc. High-efficiency, hot trap apparatus and method
US20130023129A1 (en) 2011-07-20 2013-01-24 Asm America, Inc. Pressure transmitter for a semiconductor processing environment
CN102426146B (en) * 2011-09-21 2013-06-19 重庆交通大学 Method for measuring content of asphalt smoke dust and device for sampling asphalt smoke dust
US9017481B1 (en) 2011-10-28 2015-04-28 Asm America, Inc. Process feed management for semiconductor substrate processing
JP5910286B2 (en) * 2012-04-24 2016-04-27 宇部興産株式会社 Method for treating exhaust gas containing nitrogen-containing compounds
JP6123454B2 (en) * 2012-04-27 2017-05-10 宇部興産株式会社 Organic nitrogen-containing gas processing apparatus, organic nitrogen-containing gas processing agent, and film forming apparatus
US8728240B2 (en) * 2012-05-02 2014-05-20 Msp Corporation Apparatus for vapor condensation and recovery
US10714315B2 (en) 2012-10-12 2020-07-14 Asm Ip Holdings B.V. Semiconductor reaction chamber showerhead
US11015245B2 (en) 2014-03-19 2021-05-25 Asm Ip Holding B.V. Gas-phase reactor and system having exhaust plenum and components thereof
US10858737B2 (en) 2014-07-28 2020-12-08 Asm Ip Holding B.V. Showerhead assembly and components thereof
US9890456B2 (en) 2014-08-21 2018-02-13 Asm Ip Holding B.V. Method and system for in situ formation of gas-phase compounds
US10941490B2 (en) 2014-10-07 2021-03-09 Asm Ip Holding B.V. Multiple temperature range susceptor, assembly, reactor and system including the susceptor, and methods of using the same
US10276355B2 (en) 2015-03-12 2019-04-30 Asm Ip Holding B.V. Multi-zone reactor, system including the reactor, and method of using the same
US10458018B2 (en) 2015-06-26 2019-10-29 Asm Ip Holding B.V. Structures including metal carbide material, devices including the structures, and methods of forming same
US10211308B2 (en) 2015-10-21 2019-02-19 Asm Ip Holding B.V. NbMC layers
US11139308B2 (en) 2015-12-29 2021-10-05 Asm Ip Holding B.V. Atomic layer deposition of III-V compounds to form V-NAND devices
US10529554B2 (en) 2016-02-19 2020-01-07 Asm Ip Holding B.V. Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenches
JP6602709B2 (en) * 2016-03-23 2019-11-06 大陽日酸株式会社 Exhaust gas treatment apparatus and exhaust gas treatment method
US10865475B2 (en) 2016-04-21 2020-12-15 Asm Ip Holding B.V. Deposition of metal borides and silicides
US10190213B2 (en) 2016-04-21 2019-01-29 Asm Ip Holding B.V. Deposition of metal borides
US10367080B2 (en) 2016-05-02 2019-07-30 Asm Ip Holding B.V. Method of forming a germanium oxynitride film
US11453943B2 (en) 2016-05-25 2022-09-27 Asm Ip Holding B.V. Method for forming carbon-containing silicon/metal oxide or nitride film by ALD using silicon precursor and hydrocarbon precursor
US9859151B1 (en) 2016-07-08 2018-01-02 Asm Ip Holding B.V. Selective film deposition method to form air gaps
US10612137B2 (en) 2016-07-08 2020-04-07 Asm Ip Holdings B.V. Organic reactants for atomic layer deposition
US9887082B1 (en) 2016-07-28 2018-02-06 Asm Ip Holding B.V. Method and apparatus for filling a gap
US9812320B1 (en) 2016-07-28 2017-11-07 Asm Ip Holding B.V. Method and apparatus for filling a gap
KR102532607B1 (en) 2016-07-28 2023-05-15 에이에스엠 아이피 홀딩 비.브이. Substrate processing apparatus and method of operating the same
US10005018B2 (en) * 2016-09-02 2018-06-26 Battelle Memorial Institute Xenon collection method and system
US10643826B2 (en) 2016-10-26 2020-05-05 Asm Ip Holdings B.V. Methods for thermally calibrating reaction chambers
US11532757B2 (en) 2016-10-27 2022-12-20 Asm Ip Holding B.V. Deposition of charge trapping layers
US10714350B2 (en) 2016-11-01 2020-07-14 ASM IP Holdings, B.V. Methods for forming a transition metal niobium nitride film on a substrate by atomic layer deposition and related semiconductor device structures
US10229833B2 (en) 2016-11-01 2019-03-12 Asm Ip Holding B.V. Methods for forming a transition metal nitride film on a substrate by atomic layer deposition and related semiconductor device structures
KR102546317B1 (en) 2016-11-15 2023-06-21 에이에스엠 아이피 홀딩 비.브이. Gas supply unit and substrate processing apparatus including the same
KR102185315B1 (en) * 2016-12-09 2020-12-01 어플라이드 머티어리얼스, 인코포레이티드 Utilization of crystal oscillator microbalance for quantification of foreline solid formation
KR20180068582A (en) 2016-12-14 2018-06-22 에이에스엠 아이피 홀딩 비.브이. Substrate processing apparatus
US11581186B2 (en) 2016-12-15 2023-02-14 Asm Ip Holding B.V. Sequential infiltration synthesis apparatus
US11447861B2 (en) 2016-12-15 2022-09-20 Asm Ip Holding B.V. Sequential infiltration synthesis apparatus and a method of forming a patterned structure
KR20180070971A (en) 2016-12-19 2018-06-27 에이에스엠 아이피 홀딩 비.브이. Substrate processing apparatus
US10269558B2 (en) 2016-12-22 2019-04-23 Asm Ip Holding B.V. Method of forming a structure on a substrate
US10867788B2 (en) 2016-12-28 2020-12-15 Asm Ip Holding B.V. Method of forming a structure on a substrate
US11390950B2 (en) 2017-01-10 2022-07-19 Asm Ip Holding B.V. Reactor system and method to reduce residue buildup during a film deposition process
US10468261B2 (en) 2017-02-15 2019-11-05 Asm Ip Holding B.V. Methods for forming a metallic film on a substrate by cyclical deposition and related semiconductor device structures
US10529563B2 (en) 2017-03-29 2020-01-07 Asm Ip Holdings B.V. Method for forming doped metal oxide films on a substrate by cyclical deposition and related semiconductor device structures
KR102457289B1 (en) 2017-04-25 2022-10-21 에이에스엠 아이피 홀딩 비.브이. Method for depositing a thin film and manufacturing a semiconductor device
US10770286B2 (en) 2017-05-08 2020-09-08 Asm Ip Holdings B.V. Methods for selectively forming a silicon nitride film on a substrate and related semiconductor device structures
US10892156B2 (en) 2017-05-08 2021-01-12 Asm Ip Holding B.V. Methods for forming a silicon nitride film on a substrate and related semiconductor device structures
US10886123B2 (en) 2017-06-02 2021-01-05 Asm Ip Holding B.V. Methods for forming low temperature semiconductor layers and related semiconductor device structures
US11306395B2 (en) 2017-06-28 2022-04-19 Asm Ip Holding B.V. Methods for depositing a transition metal nitride film on a substrate by atomic layer deposition and related deposition apparatus
KR20190009245A (en) 2017-07-18 2019-01-28 에이에스엠 아이피 홀딩 비.브이. Methods for forming a semiconductor device structure and related semiconductor device structures
US10541333B2 (en) 2017-07-19 2020-01-21 Asm Ip Holding B.V. Method for depositing a group IV semiconductor and related semiconductor device structures
US11018002B2 (en) 2017-07-19 2021-05-25 Asm Ip Holding B.V. Method for selectively depositing a Group IV semiconductor and related semiconductor device structures
US11374112B2 (en) 2017-07-19 2022-06-28 Asm Ip Holding B.V. Method for depositing a group IV semiconductor and related semiconductor device structures
US10590535B2 (en) 2017-07-26 2020-03-17 Asm Ip Holdings B.V. Chemical treatment, deposition and/or infiltration apparatus and method for using the same
US10692741B2 (en) 2017-08-08 2020-06-23 Asm Ip Holdings B.V. Radiation shield
US10770336B2 (en) 2017-08-08 2020-09-08 Asm Ip Holding B.V. Substrate lift mechanism and reactor including same
US11769682B2 (en) 2017-08-09 2023-09-26 Asm Ip Holding B.V. Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith
US11139191B2 (en) 2017-08-09 2021-10-05 Asm Ip Holding B.V. Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith
US11830730B2 (en) 2017-08-29 2023-11-28 Asm Ip Holding B.V. Layer forming method and apparatus
US11295980B2 (en) 2017-08-30 2022-04-05 Asm Ip Holding B.V. Methods for depositing a molybdenum metal film over a dielectric surface of a substrate by a cyclical deposition process and related semiconductor device structures
US11056344B2 (en) 2017-08-30 2021-07-06 Asm Ip Holding B.V. Layer forming method
KR102491945B1 (en) 2017-08-30 2023-01-26 에이에스엠 아이피 홀딩 비.브이. Substrate processing apparatus
KR102630301B1 (en) 2017-09-21 2024-01-29 에이에스엠 아이피 홀딩 비.브이. Method of sequential infiltration synthesis treatment of infiltrateable material and structures and devices formed using same
US10844484B2 (en) 2017-09-22 2020-11-24 Asm Ip Holding B.V. Apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods
US10658205B2 (en) 2017-09-28 2020-05-19 Asm Ip Holdings B.V. Chemical dispensing apparatus and methods for dispensing a chemical to a reaction chamber
US10403504B2 (en) 2017-10-05 2019-09-03 Asm Ip Holding B.V. Method for selectively depositing a metallic film on a substrate
US10923344B2 (en) 2017-10-30 2021-02-16 Asm Ip Holding B.V. Methods for forming a semiconductor structure and related semiconductor structures
US10910262B2 (en) 2017-11-16 2021-02-02 Asm Ip Holding B.V. Method of selectively depositing a capping layer structure on a semiconductor device structure
US11022879B2 (en) 2017-11-24 2021-06-01 Asm Ip Holding B.V. Method of forming an enhanced unexposed photoresist layer
CN111316417B (en) 2017-11-27 2023-12-22 阿斯莫Ip控股公司 Storage device for storing wafer cassettes for use with batch ovens
JP7206265B2 (en) 2017-11-27 2023-01-17 エーエスエム アイピー ホールディング ビー.ブイ. Equipment with a clean mini-environment
US10872771B2 (en) 2018-01-16 2020-12-22 Asm Ip Holding B. V. Method for depositing a material film on a substrate within a reaction chamber by a cyclical deposition process and related device structures
CN111630203A (en) 2018-01-19 2020-09-04 Asm Ip私人控股有限公司 Method for depositing gap filling layer by plasma auxiliary deposition
TW202325889A (en) 2018-01-19 2023-07-01 荷蘭商Asm 智慧財產控股公司 Deposition method
US11018047B2 (en) 2018-01-25 2021-05-25 Asm Ip Holding B.V. Hybrid lift pin
USD880437S1 (en) 2018-02-01 2020-04-07 Asm Ip Holding B.V. Gas supply plate for semiconductor manufacturing apparatus
US11081345B2 (en) 2018-02-06 2021-08-03 Asm Ip Holding B.V. Method of post-deposition treatment for silicon oxide film
US10896820B2 (en) 2018-02-14 2021-01-19 Asm Ip Holding B.V. Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process
WO2019158960A1 (en) 2018-02-14 2019-08-22 Asm Ip Holding B.V. A method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process
KR102636427B1 (en) 2018-02-20 2024-02-13 에이에스엠 아이피 홀딩 비.브이. Substrate processing method and apparatus
US10975470B2 (en) 2018-02-23 2021-04-13 Asm Ip Holding B.V. Apparatus for detecting or monitoring for a chemical precursor in a high temperature environment
US11473195B2 (en) 2018-03-01 2022-10-18 Asm Ip Holding B.V. Semiconductor processing apparatus and a method for processing a substrate
US11629406B2 (en) 2018-03-09 2023-04-18 Asm Ip Holding B.V. Semiconductor processing apparatus comprising one or more pyrometers for measuring a temperature of a substrate during transfer of the substrate
US11114283B2 (en) 2018-03-16 2021-09-07 Asm Ip Holding B.V. Reactor, system including the reactor, and methods of manufacturing and using same
KR102646467B1 (en) 2018-03-27 2024-03-11 에이에스엠 아이피 홀딩 비.브이. Method of forming an electrode on a substrate and a semiconductor device structure including an electrode
US11230766B2 (en) 2018-03-29 2022-01-25 Asm Ip Holding B.V. Substrate processing apparatus and method
US11088002B2 (en) 2018-03-29 2021-08-10 Asm Ip Holding B.V. Substrate rack and a substrate processing system and method
KR102501472B1 (en) 2018-03-30 2023-02-20 에이에스엠 아이피 홀딩 비.브이. Substrate processing method
KR20190128558A (en) 2018-05-08 2019-11-18 에이에스엠 아이피 홀딩 비.브이. Methods for depositing an oxide film on a substrate by a cyclical deposition process and related device structures
TW202349473A (en) 2018-05-11 2023-12-16 荷蘭商Asm Ip私人控股有限公司 Methods for forming a doped metal carbide film on a substrate and related semiconductor device structures
KR102596988B1 (en) 2018-05-28 2023-10-31 에이에스엠 아이피 홀딩 비.브이. Method of processing a substrate and a device manufactured by the same
US11718913B2 (en) 2018-06-04 2023-08-08 Asm Ip Holding B.V. Gas distribution system and reactor system including same
TW202013553A (en) 2018-06-04 2020-04-01 荷蘭商Asm 智慧財產控股公司 Wafer handling chamber with moisture reduction
US11286562B2 (en) 2018-06-08 2022-03-29 Asm Ip Holding B.V. Gas-phase chemical reactor and method of using same
KR102568797B1 (en) 2018-06-21 2023-08-21 에이에스엠 아이피 홀딩 비.브이. Substrate processing system
US10797133B2 (en) 2018-06-21 2020-10-06 Asm Ip Holding B.V. Method for depositing a phosphorus doped silicon arsenide film and related semiconductor device structures
CN112292478A (en) 2018-06-27 2021-01-29 Asm Ip私人控股有限公司 Cyclic deposition methods for forming metal-containing materials and films and structures containing metal-containing materials
WO2020003000A1 (en) 2018-06-27 2020-01-02 Asm Ip Holding B.V. Cyclic deposition methods for forming metal-containing material and films and structures including the metal-containing material
CN110876270A (en) * 2018-06-29 2020-03-10 奥塔装置公司 Method and system for MOCVD emission reduction
KR20200002519A (en) 2018-06-29 2020-01-08 에이에스엠 아이피 홀딩 비.브이. Method for depositing a thin film and manufacturing a semiconductor device
US10612136B2 (en) 2018-06-29 2020-04-07 ASM IP Holding, B.V. Temperature-controlled flange and reactor system including same
US10388513B1 (en) 2018-07-03 2019-08-20 Asm Ip Holding B.V. Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition
US10755922B2 (en) 2018-07-03 2020-08-25 Asm Ip Holding B.V. Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition
US10767789B2 (en) 2018-07-16 2020-09-08 Asm Ip Holding B.V. Diaphragm valves, valve components, and methods for forming valve components
US11053591B2 (en) 2018-08-06 2021-07-06 Asm Ip Holding B.V. Multi-port gas injection system and reactor system including same
US10883175B2 (en) 2018-08-09 2021-01-05 Asm Ip Holding B.V. Vertical furnace for processing substrates and a liner for use therein
US10829852B2 (en) 2018-08-16 2020-11-10 Asm Ip Holding B.V. Gas distribution device for a wafer processing apparatus
US11430674B2 (en) 2018-08-22 2022-08-30 Asm Ip Holding B.V. Sensor array, apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods
US11024523B2 (en) 2018-09-11 2021-06-01 Asm Ip Holding B.V. Substrate processing apparatus and method
KR20200030162A (en) 2018-09-11 2020-03-20 에이에스엠 아이피 홀딩 비.브이. Method for deposition of a thin film
US11049751B2 (en) 2018-09-14 2021-06-29 Asm Ip Holding B.V. Cassette supply system to store and handle cassettes and processing apparatus equipped therewith
CN110970344A (en) 2018-10-01 2020-04-07 Asm Ip控股有限公司 Substrate holding apparatus, system including the same, and method of using the same
US11232963B2 (en) 2018-10-03 2022-01-25 Asm Ip Holding B.V. Substrate processing apparatus and method
KR102592699B1 (en) 2018-10-08 2023-10-23 에이에스엠 아이피 홀딩 비.브이. Substrate support unit and apparatuses for depositing thin film and processing the substrate including the same
KR102546322B1 (en) 2018-10-19 2023-06-21 에이에스엠 아이피 홀딩 비.브이. Substrate processing apparatus and substrate processing method
KR102605121B1 (en) 2018-10-19 2023-11-23 에이에스엠 아이피 홀딩 비.브이. Substrate processing apparatus and substrate processing method
USD948463S1 (en) 2018-10-24 2022-04-12 Asm Ip Holding B.V. Susceptor for semiconductor substrate supporting apparatus
US11087997B2 (en) 2018-10-31 2021-08-10 Asm Ip Holding B.V. Substrate processing apparatus for processing substrates
KR20200051105A (en) 2018-11-02 2020-05-13 에이에스엠 아이피 홀딩 비.브이. Substrate support unit and substrate processing apparatus including the same
US11572620B2 (en) 2018-11-06 2023-02-07 Asm Ip Holding B.V. Methods for selectively depositing an amorphous silicon film on a substrate
US11031242B2 (en) 2018-11-07 2021-06-08 Asm Ip Holding B.V. Methods for depositing a boron doped silicon germanium film
US10818758B2 (en) 2018-11-16 2020-10-27 Asm Ip Holding B.V. Methods for forming a metal silicate film on a substrate in a reaction chamber and related semiconductor device structures
US10847366B2 (en) 2018-11-16 2020-11-24 Asm Ip Holding B.V. Methods for depositing a transition metal chalcogenide film on a substrate by a cyclical deposition process
US11217444B2 (en) 2018-11-30 2022-01-04 Asm Ip Holding B.V. Method for forming an ultraviolet radiation responsive metal oxide-containing film
KR102636428B1 (en) 2018-12-04 2024-02-13 에이에스엠 아이피 홀딩 비.브이. A method for cleaning a substrate processing apparatus
US11158513B2 (en) 2018-12-13 2021-10-26 Asm Ip Holding B.V. Methods for forming a rhenium-containing film on a substrate by a cyclical deposition process and related semiconductor device structures
TW202037745A (en) 2018-12-14 2020-10-16 荷蘭商Asm Ip私人控股有限公司 Method of forming device structure, structure formed by the method and system for performing the method
TWI819180B (en) 2019-01-17 2023-10-21 荷蘭商Asm 智慧財產控股公司 Methods of forming a transition metal containing film on a substrate by a cyclical deposition process
KR20200091543A (en) 2019-01-22 2020-07-31 에이에스엠 아이피 홀딩 비.브이. Semiconductor processing device
CN111524788B (en) 2019-02-01 2023-11-24 Asm Ip私人控股有限公司 Method for topologically selective film formation of silicon oxide
JP2020136678A (en) 2019-02-20 2020-08-31 エーエスエム・アイピー・ホールディング・ベー・フェー Method for filing concave part formed inside front surface of base material, and device
US11482533B2 (en) 2019-02-20 2022-10-25 Asm Ip Holding B.V. Apparatus and methods for plug fill deposition in 3-D NAND applications
TW202104632A (en) 2019-02-20 2021-02-01 荷蘭商Asm Ip私人控股有限公司 Cyclical deposition method and apparatus for filling a recess formed within a substrate surface
KR102626263B1 (en) 2019-02-20 2024-01-16 에이에스엠 아이피 홀딩 비.브이. Cyclical deposition method including treatment step and apparatus for same
TW202100794A (en) 2019-02-22 2021-01-01 荷蘭商Asm Ip私人控股有限公司 Substrate processing apparatus and method for processing substrate
US11742198B2 (en) 2019-03-08 2023-08-29 Asm Ip Holding B.V. Structure including SiOCN layer and method of forming same
KR20200108243A (en) 2019-03-08 2020-09-17 에이에스엠 아이피 홀딩 비.브이. Structure Including SiOC Layer and Method of Forming Same
KR20200108242A (en) 2019-03-08 2020-09-17 에이에스엠 아이피 홀딩 비.브이. Method for Selective Deposition of Silicon Nitride Layer and Structure Including Selectively-Deposited Silicon Nitride Layer
JP2020167398A (en) 2019-03-28 2020-10-08 エーエスエム・アイピー・ホールディング・ベー・フェー Door opener and substrate processing apparatus provided therewith
KR20200116855A (en) 2019-04-01 2020-10-13 에이에스엠 아이피 홀딩 비.브이. Method of manufacturing semiconductor device
KR20200123380A (en) 2019-04-19 2020-10-29 에이에스엠 아이피 홀딩 비.브이. Layer forming method and apparatus
KR20200125453A (en) 2019-04-24 2020-11-04 에이에스엠 아이피 홀딩 비.브이. Gas-phase reactor system and method of using same
KR20200130121A (en) 2019-05-07 2020-11-18 에이에스엠 아이피 홀딩 비.브이. Chemical source vessel with dip tube
KR20200130118A (en) 2019-05-07 2020-11-18 에이에스엠 아이피 홀딩 비.브이. Method for Reforming Amorphous Carbon Polymer Film
KR20200130652A (en) 2019-05-10 2020-11-19 에이에스엠 아이피 홀딩 비.브이. Method of depositing material onto a surface and structure formed according to the method
JP2020188255A (en) 2019-05-16 2020-11-19 エーエスエム アイピー ホールディング ビー.ブイ. Wafer boat handling device, vertical batch furnace, and method
USD975665S1 (en) 2019-05-17 2023-01-17 Asm Ip Holding B.V. Susceptor shaft
USD947913S1 (en) 2019-05-17 2022-04-05 Asm Ip Holding B.V. Susceptor shaft
USD935572S1 (en) 2019-05-24 2021-11-09 Asm Ip Holding B.V. Gas channel plate
US11491435B2 (en) * 2019-05-24 2022-11-08 Entegris, Inc. Methods and systems for removing ammonia from a gas mixture
EP3976231A4 (en) * 2019-05-24 2023-10-11 Entegris, Inc. Methods and systems for adsorbing organometallic vapor
USD922229S1 (en) 2019-06-05 2021-06-15 Asm Ip Holding B.V. Device for controlling a temperature of a gas supply unit
KR20200141002A (en) 2019-06-06 2020-12-17 에이에스엠 아이피 홀딩 비.브이. Method of using a gas-phase reactor system including analyzing exhausted gas
KR20200143254A (en) 2019-06-11 2020-12-23 에이에스엠 아이피 홀딩 비.브이. Method of forming an electronic structure using an reforming gas, system for performing the method, and structure formed using the method
USD944946S1 (en) 2019-06-14 2022-03-01 Asm Ip Holding B.V. Shower plate
USD931978S1 (en) 2019-06-27 2021-09-28 Asm Ip Holding B.V. Showerhead vacuum transport
KR20210005515A (en) 2019-07-03 2021-01-14 에이에스엠 아이피 홀딩 비.브이. Temperature control assembly for substrate processing apparatus and method of using same
JP2021015791A (en) 2019-07-09 2021-02-12 エーエスエム アイピー ホールディング ビー.ブイ. Plasma device and substrate processing method using coaxial waveguide
CN112216646A (en) 2019-07-10 2021-01-12 Asm Ip私人控股有限公司 Substrate supporting assembly and substrate processing device comprising same
KR20210010307A (en) 2019-07-16 2021-01-27 에이에스엠 아이피 홀딩 비.브이. Substrate processing apparatus
KR20210010816A (en) 2019-07-17 2021-01-28 에이에스엠 아이피 홀딩 비.브이. Radical assist ignition plasma system and method
KR20210010820A (en) 2019-07-17 2021-01-28 에이에스엠 아이피 홀딩 비.브이. Methods of forming silicon germanium structures
US11643724B2 (en) 2019-07-18 2023-05-09 Asm Ip Holding B.V. Method of forming structures using a neutral beam
TW202121506A (en) 2019-07-19 2021-06-01 荷蘭商Asm Ip私人控股有限公司 Method of forming topology-controlled amorphous carbon polymer film
CN112309843A (en) 2019-07-29 2021-02-02 Asm Ip私人控股有限公司 Selective deposition method for achieving high dopant doping
CN112309900A (en) 2019-07-30 2021-02-02 Asm Ip私人控股有限公司 Substrate processing apparatus
CN112309899A (en) 2019-07-30 2021-02-02 Asm Ip私人控股有限公司 Substrate processing apparatus
US11587815B2 (en) 2019-07-31 2023-02-21 Asm Ip Holding B.V. Vertical batch furnace assembly
US11587814B2 (en) 2019-07-31 2023-02-21 Asm Ip Holding B.V. Vertical batch furnace assembly
US11227782B2 (en) 2019-07-31 2022-01-18 Asm Ip Holding B.V. Vertical batch furnace assembly
CN112323048B (en) 2019-08-05 2024-02-09 Asm Ip私人控股有限公司 Liquid level sensor for chemical source container
USD965524S1 (en) 2019-08-19 2022-10-04 Asm Ip Holding B.V. Susceptor support
USD965044S1 (en) 2019-08-19 2022-09-27 Asm Ip Holding B.V. Susceptor shaft
JP2021031769A (en) 2019-08-21 2021-03-01 エーエスエム アイピー ホールディング ビー.ブイ. Production apparatus of mixed gas of film deposition raw material and film deposition apparatus
USD979506S1 (en) 2019-08-22 2023-02-28 Asm Ip Holding B.V. Insulator
KR20210024423A (en) 2019-08-22 2021-03-05 에이에스엠 아이피 홀딩 비.브이. Method for forming a structure with a hole
USD940837S1 (en) 2019-08-22 2022-01-11 Asm Ip Holding B.V. Electrode
USD930782S1 (en) 2019-08-22 2021-09-14 Asm Ip Holding B.V. Gas distributor
USD949319S1 (en) 2019-08-22 2022-04-19 Asm Ip Holding B.V. Exhaust duct
KR20210024420A (en) 2019-08-23 2021-03-05 에이에스엠 아이피 홀딩 비.브이. Method for depositing silicon oxide film having improved quality by peald using bis(diethylamino)silane
US11286558B2 (en) 2019-08-23 2022-03-29 Asm Ip Holding B.V. Methods for depositing a molybdenum nitride film on a surface of a substrate by a cyclical deposition process and related semiconductor device structures including a molybdenum nitride film
KR20210029090A (en) 2019-09-04 2021-03-15 에이에스엠 아이피 홀딩 비.브이. Methods for selective deposition using a sacrificial capping layer
KR20210029663A (en) 2019-09-05 2021-03-16 에이에스엠 아이피 홀딩 비.브이. Substrate processing apparatus
US11562901B2 (en) 2019-09-25 2023-01-24 Asm Ip Holding B.V. Substrate processing method
CN112593212B (en) 2019-10-02 2023-12-22 Asm Ip私人控股有限公司 Method for forming topologically selective silicon oxide film by cyclic plasma enhanced deposition process
TW202129060A (en) 2019-10-08 2021-08-01 荷蘭商Asm Ip控股公司 Substrate processing device, and substrate processing method
TW202115273A (en) 2019-10-10 2021-04-16 荷蘭商Asm Ip私人控股有限公司 Method of forming a photoresist underlayer and structure including same
KR20210045930A (en) 2019-10-16 2021-04-27 에이에스엠 아이피 홀딩 비.브이. Method of Topology-Selective Film Formation of Silicon Oxide
US11637014B2 (en) 2019-10-17 2023-04-25 Asm Ip Holding B.V. Methods for selective deposition of doped semiconductor material
KR20210047808A (en) 2019-10-21 2021-04-30 에이에스엠 아이피 홀딩 비.브이. Apparatus and methods for selectively etching films
US11646205B2 (en) 2019-10-29 2023-05-09 Asm Ip Holding B.V. Methods of selectively forming n-type doped material on a surface, systems for selectively forming n-type doped material, and structures formed using same
KR20210054983A (en) 2019-11-05 2021-05-14 에이에스엠 아이피 홀딩 비.브이. Structures with doped semiconductor layers and methods and systems for forming same
US11501968B2 (en) 2019-11-15 2022-11-15 Asm Ip Holding B.V. Method for providing a semiconductor device with silicon filled gaps
KR20210062561A (en) 2019-11-20 2021-05-31 에이에스엠 아이피 홀딩 비.브이. Method of depositing carbon-containing material on a surface of a substrate, structure formed using the method, and system for forming the structure
CN112951697A (en) 2019-11-26 2021-06-11 Asm Ip私人控股有限公司 Substrate processing apparatus
KR20210065848A (en) 2019-11-26 2021-06-04 에이에스엠 아이피 홀딩 비.브이. Methods for selectivley forming a target film on a substrate comprising a first dielectric surface and a second metallic surface
CN112885692A (en) 2019-11-29 2021-06-01 Asm Ip私人控股有限公司 Substrate processing apparatus
CN112885693A (en) 2019-11-29 2021-06-01 Asm Ip私人控股有限公司 Substrate processing apparatus
JP2021090042A (en) 2019-12-02 2021-06-10 エーエスエム アイピー ホールディング ビー.ブイ. Substrate processing apparatus and substrate processing method
KR20210070898A (en) 2019-12-04 2021-06-15 에이에스엠 아이피 홀딩 비.브이. Substrate processing apparatus
KR20210078405A (en) 2019-12-17 2021-06-28 에이에스엠 아이피 홀딩 비.브이. Method of forming vanadium nitride layer and structure including the vanadium nitride layer
US11527403B2 (en) 2019-12-19 2022-12-13 Asm Ip Holding B.V. Methods for filling a gap feature on a substrate surface and related semiconductor structures
KR20210095050A (en) 2020-01-20 2021-07-30 에이에스엠 아이피 홀딩 비.브이. Method of forming thin film and method of modifying surface of thin film
TW202130846A (en) 2020-02-03 2021-08-16 荷蘭商Asm Ip私人控股有限公司 Method of forming structures including a vanadium or indium layer
TW202146882A (en) 2020-02-04 2021-12-16 荷蘭商Asm Ip私人控股有限公司 Method of verifying an article, apparatus for verifying an article, and system for verifying a reaction chamber
US11776846B2 (en) 2020-02-07 2023-10-03 Asm Ip Holding B.V. Methods for depositing gap filling fluids and related systems and devices
TW202146715A (en) 2020-02-17 2021-12-16 荷蘭商Asm Ip私人控股有限公司 Method for growing phosphorous-doped silicon layer and system of the same
KR20210116240A (en) 2020-03-11 2021-09-27 에이에스엠 아이피 홀딩 비.브이. Substrate handling device with adjustable joints
US11876356B2 (en) 2020-03-11 2024-01-16 Asm Ip Holding B.V. Lockout tagout assembly and system and method of using same
KR20210124042A (en) 2020-04-02 2021-10-14 에이에스엠 아이피 홀딩 비.브이. Thin film forming method
TW202146689A (en) 2020-04-03 2021-12-16 荷蘭商Asm Ip控股公司 Method for forming barrier layer and method for manufacturing semiconductor device
TW202145344A (en) 2020-04-08 2021-12-01 荷蘭商Asm Ip私人控股有限公司 Apparatus and methods for selectively etching silcon oxide films
US11821078B2 (en) 2020-04-15 2023-11-21 Asm Ip Holding B.V. Method for forming precoat film and method for forming silicon-containing film
KR20210132605A (en) 2020-04-24 2021-11-04 에이에스엠 아이피 홀딩 비.브이. Vertical batch furnace assembly comprising a cooling gas supply
KR20210132600A (en) 2020-04-24 2021-11-04 에이에스엠 아이피 홀딩 비.브이. Methods and systems for depositing a layer comprising vanadium, nitrogen, and a further element
US11898243B2 (en) 2020-04-24 2024-02-13 Asm Ip Holding B.V. Method of forming vanadium nitride-containing layer
KR20210134869A (en) 2020-05-01 2021-11-11 에이에스엠 아이피 홀딩 비.브이. Fast FOUP swapping with a FOUP handler
KR20210141379A (en) 2020-05-13 2021-11-23 에이에스엠 아이피 홀딩 비.브이. Laser alignment fixture for a reactor system
KR20210143653A (en) 2020-05-19 2021-11-29 에이에스엠 아이피 홀딩 비.브이. Substrate processing apparatus
KR20210145078A (en) 2020-05-21 2021-12-01 에이에스엠 아이피 홀딩 비.브이. Structures including multiple carbon layers and methods of forming and using same
TW202201602A (en) 2020-05-29 2022-01-01 荷蘭商Asm Ip私人控股有限公司 Substrate processing device
TW202218133A (en) 2020-06-24 2022-05-01 荷蘭商Asm Ip私人控股有限公司 Method for forming a layer provided with silicon
TW202217953A (en) 2020-06-30 2022-05-01 荷蘭商Asm Ip私人控股有限公司 Substrate processing method
KR20220010438A (en) 2020-07-17 2022-01-25 에이에스엠 아이피 홀딩 비.브이. Structures and methods for use in photolithography
TW202204662A (en) 2020-07-20 2022-02-01 荷蘭商Asm Ip私人控股有限公司 Method and system for depositing molybdenum layers
TW202212623A (en) 2020-08-26 2022-04-01 荷蘭商Asm Ip私人控股有限公司 Method of forming metal silicon oxide layer and metal silicon oxynitride layer, semiconductor structure, and system
USD990534S1 (en) 2020-09-11 2023-06-27 Asm Ip Holding B.V. Weighted lift pin
USD1012873S1 (en) 2020-09-24 2024-01-30 Asm Ip Holding B.V. Electrode for semiconductor processing apparatus
TW202229613A (en) 2020-10-14 2022-08-01 荷蘭商Asm Ip私人控股有限公司 Method of depositing material on stepped structure
TW202217037A (en) 2020-10-22 2022-05-01 荷蘭商Asm Ip私人控股有限公司 Method of depositing vanadium metal, structure, device and a deposition assembly
TW202223136A (en) 2020-10-28 2022-06-16 荷蘭商Asm Ip私人控股有限公司 Method for forming layer on substrate, and semiconductor processing system
TW202235675A (en) 2020-11-30 2022-09-16 荷蘭商Asm Ip私人控股有限公司 Injector, and substrate processing apparatus
US11946137B2 (en) 2020-12-16 2024-04-02 Asm Ip Holding B.V. Runout and wobble measurement fixtures
TW202231903A (en) 2020-12-22 2022-08-16 荷蘭商Asm Ip私人控股有限公司 Transition metal deposition method, transition metal layer, and deposition assembly for depositing transition metal on substrate
USD981973S1 (en) 2021-05-11 2023-03-28 Asm Ip Holding B.V. Reactor wall for substrate processing apparatus
USD980813S1 (en) 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas flow control plate for substrate processing apparatus
USD980814S1 (en) 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas distributor for substrate processing apparatus
USD990441S1 (en) 2021-09-07 2023-06-27 Asm Ip Holding B.V. Gas flow control plate

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4842746A (en) * 1986-06-16 1989-06-27 Quadrex Hps Inc. Method of removing toxic agents for trichlorotrifluoroethane
US5151395A (en) * 1987-03-24 1992-09-29 Novapure Corporation Bulk gas sorption and apparatus, gas containment/treatment system comprising same, and sorbent composition therefor
US4842621A (en) * 1987-03-26 1989-06-27 The Dow Chemical Company Recovery process
US5417934A (en) * 1988-06-04 1995-05-23 Boc Limited Dry exhaust gas conditioning
EP0382984A1 (en) * 1989-02-13 1990-08-22 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Thermal decomposition trap
CA2044242A1 (en) * 1989-10-27 1991-04-28 Leonard A. Jonas Sorbing apparatus with guard bed
US5187131A (en) * 1990-01-16 1993-02-16 Tigg Corporation Method for regenerating particulate adsorbents
US5820664A (en) 1990-07-06 1998-10-13 Advanced Technology Materials, Inc. Precursor compositions for chemical vapor deposition, and ligand exchange resistant metal-organic precursor solutions comprising same
US5151110A (en) * 1990-09-11 1992-09-29 University Of New Mexico Molecular sieve sensors for selective detection at the nanogram level
US6110531A (en) * 1991-02-25 2000-08-29 Symetrix Corporation Method and apparatus for preparing integrated circuit thin films by chemical vapor deposition
US5648114A (en) * 1991-12-13 1997-07-15 Symetrix Corporation Chemical vapor deposition process for fabricating layered superlattice materials
US5356849A (en) 1993-01-21 1994-10-18 Calgon Carbon Corporation Catalytic carbon
US5444249A (en) * 1994-02-14 1995-08-22 Telaire Systems, Inc. NDIR gas sensor
US5445008A (en) * 1994-03-24 1995-08-29 Martin Marietta Energy Systems, Inc. Microbar sensor
US5494869A (en) 1994-03-29 1996-02-27 Calgon Carbon Corporation Process for regenerating nitrogen-treated carbonaceous chars used for hydrogen sulfide removal
US6030591A (en) * 1994-04-06 2000-02-29 Atmi Ecosys Corporation Process for removing and recovering halocarbons from effluent process streams
US5817575A (en) * 1996-01-30 1998-10-06 Advanced Micro Devices, Inc. Prevention of clogging in CVD apparatus
US5928426A (en) * 1996-08-08 1999-07-27 Novellus Systems, Inc. Method and apparatus for treating exhaust gases from CVD, PECVD or plasma etch reactors
US5827947A (en) * 1997-01-17 1998-10-27 Advanced Technology Materials, Inc. Piezoelectric sensor for hydride gases, and fluid monitoring apparatus comprising same
KR100253089B1 (en) * 1997-10-29 2000-05-01 윤종용 Chemical vapor deposition apparatus
US6099649A (en) * 1997-12-23 2000-08-08 Applied Materials, Inc. Chemical vapor deposition hot-trap for unreacted precursor conversion and effluent removal
US6328804B1 (en) * 1998-07-10 2001-12-11 Ball Semiconductor, Inc. Chemical vapor deposition of metals on a spherical shaped semiconductor substrate
US6383300B1 (en) * 1998-11-27 2002-05-07 Tokyo Electron Ltd. Heat treatment apparatus and cleaning method of the same
US6238514B1 (en) * 1999-02-18 2001-05-29 Mks Instruments, Inc. Apparatus and method for removing condensable aluminum vapor from aluminum etch effluent
US6391385B1 (en) * 1999-10-18 2002-05-21 Advanced Technology Materials, Inc. Method of abating of effluents from chemical vapor deposition processes using organometallic source reagents
US6500487B1 (en) * 1999-10-18 2002-12-31 Advanced Technology Materials, Inc Abatement of effluent from chemical vapor deposition processes using ligand exchange resistant metal-organic precursor solutions

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