WO2001019134A3 - Silicon-based sensor system - Google Patents
Silicon-based sensor system Download PDFInfo
- Publication number
- WO2001019134A3 WO2001019134A3 PCT/DK2000/000491 DK0000491W WO0119134A3 WO 2001019134 A3 WO2001019134 A3 WO 2001019134A3 DK 0000491 W DK0000491 W DK 0000491W WO 0119134 A3 WO0119134 A3 WO 0119134A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- microphone
- silicon
- surface mount
- different elements
- sensor system
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
- H04R25/60—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
- H04R25/609—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of circuitry
Abstract
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT00958265T ATE242587T1 (en) | 1999-09-06 | 2000-09-06 | SILICONE BASED SENSOR SYSTEMS |
DE60003199T DE60003199T2 (en) | 1999-09-06 | 2000-09-06 | SILICONE BASED SENSOR SYSTEMS |
EP00958265A EP1214864B1 (en) | 1999-09-06 | 2000-09-06 | Silicon-based sensor system |
JP2001522196A JP4459498B2 (en) | 1999-09-06 | 2000-09-06 | Silicon-based sensor system |
CA002383740A CA2383740C (en) | 1999-09-06 | 2000-09-06 | Silicon-based sensor system |
DK00958265T DK1214864T3 (en) | 1999-09-06 | 2000-09-06 | Silicon based sensor system |
AU69841/00A AU6984100A (en) | 1999-09-06 | 2000-09-06 | Silicon-based sensor system |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DKPA1999/01254 | 1999-09-06 | ||
DKPA199901254 | 1999-09-06 | ||
US39162899A | 1999-09-07 | 1999-09-07 | |
US09/391,628 | 1999-09-07 | ||
US09/570,434 US6522762B1 (en) | 1999-09-07 | 2000-05-12 | Silicon-based sensor system |
US09/570,434 | 2000-05-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2001019134A2 WO2001019134A2 (en) | 2001-03-15 |
WO2001019134A3 true WO2001019134A3 (en) | 2001-09-07 |
Family
ID=27221189
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DK2000/000491 WO2001019134A2 (en) | 1999-09-06 | 2000-09-06 | Silicon-based sensor system |
Country Status (10)
Country | Link |
---|---|
EP (1) | EP1214864B1 (en) |
JP (2) | JP4459498B2 (en) |
CN (1) | CN1203726C (en) |
AT (1) | ATE242587T1 (en) |
AU (1) | AU6984100A (en) |
CA (1) | CA2383740C (en) |
DE (1) | DE60003199T2 (en) |
DK (1) | DK1214864T3 (en) |
PL (1) | PL209935B1 (en) |
WO (1) | WO2001019134A2 (en) |
Families Citing this family (50)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6859542B2 (en) | 2001-05-31 | 2005-02-22 | Sonion Lyngby A/S | Method of providing a hydrophobic layer and a condenser microphone having such a layer |
US6696645B2 (en) * | 2002-05-08 | 2004-02-24 | The Regents Of The University Of Michigan | On-wafer packaging for RF-MEMS |
US7142682B2 (en) | 2002-12-20 | 2006-11-28 | Sonion Mems A/S | Silicon-based transducer for use in hearing instruments and listening devices |
US7466835B2 (en) | 2003-03-18 | 2008-12-16 | Sonion A/S | Miniature microphone with balanced termination |
JP2004356708A (en) * | 2003-05-27 | 2004-12-16 | Hosiden Corp | Sound detection mechanism and manufacturing method thereof |
CN100515119C (en) * | 2003-08-12 | 2009-07-15 | 中国科学院声学研究所 | Chip for silicon micro capacitor microphone and its preparation method |
CN100499877C (en) * | 2003-12-17 | 2009-06-10 | 中国科学院声学研究所 | Chip having high sensitivity for silicon micro-capacitor microphone and preparation method thereof |
DE102004011203B4 (en) * | 2004-03-04 | 2010-09-16 | Robert Bosch Gmbh | Method for mounting semiconductor chips and corresponding semiconductor chip arrangement |
JP4553611B2 (en) * | 2004-03-15 | 2010-09-29 | 三洋電機株式会社 | Circuit equipment |
JP4539450B2 (en) * | 2004-11-04 | 2010-09-08 | オムロン株式会社 | Capacitive vibration sensor and manufacturing method thereof |
DE102005008512B4 (en) * | 2005-02-24 | 2016-06-23 | Epcos Ag | Electrical module with a MEMS microphone |
DE102005008511B4 (en) | 2005-02-24 | 2019-09-12 | Tdk Corporation | MEMS microphone |
DE102005053765B4 (en) | 2005-11-10 | 2016-04-14 | Epcos Ag | MEMS package and method of manufacture |
DE102005053767B4 (en) | 2005-11-10 | 2014-10-30 | Epcos Ag | MEMS microphone, method of manufacture and method of installation |
DE102005056759A1 (en) * | 2005-11-29 | 2007-05-31 | Robert Bosch Gmbh | Micromechanical structure for use as e.g. microphone, has counter units forming respective sides of structure, where counter units have respective electrodes, and closed diaphragm is arranged between counter units |
CN101005718B (en) * | 2006-01-16 | 2011-04-20 | 财团法人工业技术研究院 | Micro acoustic sensor and its producing method |
JP4771290B2 (en) * | 2006-07-19 | 2011-09-14 | ヤマハ株式会社 | Manufacturing method of pressure sensor |
DE112007003083B4 (en) * | 2006-12-22 | 2019-05-09 | Tdk Corp. | Microphone assembly with underfill with low coefficient of thermal expansion |
JP4893380B2 (en) * | 2007-03-09 | 2012-03-07 | ヤマハ株式会社 | Condenser microphone device |
US7557417B2 (en) | 2007-02-21 | 2009-07-07 | Infineon Technologies Ag | Module comprising a semiconductor chip comprising a movable element |
DE102007008518A1 (en) * | 2007-02-21 | 2008-08-28 | Infineon Technologies Ag | Semiconductor module for micro-electro-mechanical system, has semiconductor chip having movable unit and active main surface that is turned towards carrier, where another chip is attached at former chip, and cavity is formed between chips |
US8767983B2 (en) | 2007-06-01 | 2014-07-01 | Infineon Technologies Ag | Module including a micro-electro-mechanical microphone |
JP2009081624A (en) * | 2007-09-26 | 2009-04-16 | Rohm Co Ltd | Semiconductor sensor device |
TWI336770B (en) * | 2007-11-05 | 2011-02-01 | Ind Tech Res Inst | Sensor |
TWI365525B (en) * | 2007-12-24 | 2012-06-01 | Ind Tech Res Inst | An ultra thin package for a sensor chip of a micro electro mechanical system |
EP2094028B8 (en) * | 2008-02-22 | 2017-03-29 | TDK Corporation | Miniature microphone assembly with solder sealing ring |
DE112009002542A5 (en) * | 2008-10-14 | 2011-09-08 | Knowles Electronics, Llc | Microphone with a plurality of transducer elements |
DE112010002028T5 (en) * | 2009-05-18 | 2012-08-02 | Knowles Electronics, Llc | Microphone with reduced vibration sensitivity |
KR101609270B1 (en) | 2009-08-12 | 2016-04-06 | 삼성전자주식회사 | Piezoelectric micro speaker and method of manufacturing the same |
DE102009047592B4 (en) * | 2009-12-07 | 2019-06-19 | Robert Bosch Gmbh | Process for producing a silicon intermediate carrier |
IT1397976B1 (en) * | 2009-12-23 | 2013-02-04 | St Microelectronics Rousset | MICROELETTROMECHANICAL TRANSDUCER AND RELATIVE ASSEMBLY PROCEDURE. |
JP2013093637A (en) * | 2010-02-24 | 2013-05-16 | Panasonic Corp | Semiconductor device and manufacturing method of the same |
TWI491009B (en) | 2010-10-08 | 2015-07-01 | Chip level emi shielding structure and manufacture method thereof | |
CN102456669B (en) * | 2010-10-25 | 2015-07-22 | 环旭电子股份有限公司 | Chip-grade electromagnetic interference shielding structure and manufacturing method thereof |
US9108840B2 (en) * | 2010-12-30 | 2015-08-18 | Goertek Inc. | MEMS microphone and method for packaging the same |
JP5721452B2 (en) * | 2011-01-27 | 2015-05-20 | ローム株式会社 | Capacitive MEMS sensor |
JP5799619B2 (en) | 2011-06-24 | 2015-10-28 | 船井電機株式会社 | Microphone unit |
DE102011086722A1 (en) * | 2011-11-21 | 2013-05-23 | Robert Bosch Gmbh | Micromechanical functional device, in particular speaker device, and corresponding manufacturing method |
US20130147040A1 (en) * | 2011-12-09 | 2013-06-13 | Robert Bosch Gmbh | Mems chip scale package |
DE102012203373A1 (en) * | 2012-03-05 | 2013-09-05 | Robert Bosch Gmbh | Micromechanical sound transducer arrangement and a corresponding manufacturing method |
US20140090485A1 (en) * | 2012-10-02 | 2014-04-03 | Robert Bosch Gmbh | MEMS Pressure Sensor Assembly |
WO2014094831A1 (en) | 2012-12-18 | 2014-06-26 | Epcos Ag | Top-port mems microphone and method of manufacturing the same |
US20140312439A1 (en) * | 2013-04-19 | 2014-10-23 | Infineon Technologies Ag | Microphone Module and Method of Manufacturing Thereof |
ITTO20130350A1 (en) | 2013-04-30 | 2014-10-31 | St Microelectronics Srl | SLICE ASSEMBLY OF A MEMS SENSOR DEVICE AND RELATIVE MEMS SENSOR DEVICE |
US9264832B2 (en) | 2013-10-30 | 2016-02-16 | Solid State System Co., Ltd. | Microelectromechanical system (MEMS) microphone with protection film and MEMS microphonechips at wafer level |
GB2529134B (en) * | 2014-06-10 | 2017-09-13 | Cirrus Logic Int Semiconductor Ltd | Packaging for MEMS transducers |
US10455308B2 (en) * | 2014-09-17 | 2019-10-22 | Intel Corporation | Die with integrated microphone device using through-silicon vias (TSVs) |
CN104780490A (en) * | 2015-04-20 | 2015-07-15 | 歌尔声学股份有限公司 | MEMS microphone packaging structure and manufacturing method thereof |
TWI660466B (en) * | 2017-04-26 | 2019-05-21 | 矽品精密工業股份有限公司 | Package structure and method of manufacture thereof |
CN111711903B (en) * | 2020-06-24 | 2021-10-01 | 歌尔微电子有限公司 | Miniature microphone dust keeper and MEMS microphone |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4533795A (en) * | 1983-07-07 | 1985-08-06 | American Telephone And Telegraph | Integrated electroacoustic transducer |
US5490220A (en) * | 1992-03-18 | 1996-02-06 | Knowles Electronics, Inc. | Solid state condenser and microphone devices |
US5856914A (en) * | 1996-07-29 | 1999-01-05 | National Semiconductor Corporation | Micro-electronic assembly including a flip-chip mounted micro-device and method |
US5870482A (en) * | 1997-02-25 | 1999-02-09 | Knowles Electronics, Inc. | Miniature silicon condenser microphone |
US5889872A (en) * | 1996-07-02 | 1999-03-30 | Motorola, Inc. | Capacitive microphone and method therefor |
-
2000
- 2000-09-06 PL PL354095A patent/PL209935B1/en unknown
- 2000-09-06 CN CNB008153809A patent/CN1203726C/en not_active Expired - Lifetime
- 2000-09-06 JP JP2001522196A patent/JP4459498B2/en not_active Expired - Fee Related
- 2000-09-06 AT AT00958265T patent/ATE242587T1/en active
- 2000-09-06 CA CA002383740A patent/CA2383740C/en not_active Expired - Fee Related
- 2000-09-06 AU AU69841/00A patent/AU6984100A/en not_active Abandoned
- 2000-09-06 DK DK00958265T patent/DK1214864T3/en active
- 2000-09-06 DE DE60003199T patent/DE60003199T2/en not_active Expired - Lifetime
- 2000-09-06 WO PCT/DK2000/000491 patent/WO2001019134A2/en active IP Right Grant
- 2000-09-06 EP EP00958265A patent/EP1214864B1/en not_active Expired - Lifetime
-
2006
- 2006-10-04 JP JP2006273173A patent/JP4303742B2/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4533795A (en) * | 1983-07-07 | 1985-08-06 | American Telephone And Telegraph | Integrated electroacoustic transducer |
US5490220A (en) * | 1992-03-18 | 1996-02-06 | Knowles Electronics, Inc. | Solid state condenser and microphone devices |
US5889872A (en) * | 1996-07-02 | 1999-03-30 | Motorola, Inc. | Capacitive microphone and method therefor |
US5856914A (en) * | 1996-07-29 | 1999-01-05 | National Semiconductor Corporation | Micro-electronic assembly including a flip-chip mounted micro-device and method |
US5870482A (en) * | 1997-02-25 | 1999-02-09 | Knowles Electronics, Inc. | Miniature silicon condenser microphone |
Non-Patent Citations (1)
Title |
---|
KRISTIANSEN L: "Forste Silicium-baserede Mikro-mikrofon", NYHEDSMAGASINET ELEKTRONIK & DATA, no. 3, 1998, pages 4 - 8, XP002901441 * |
Also Published As
Publication number | Publication date |
---|---|
JP4303742B2 (en) | 2009-07-29 |
CA2383740A1 (en) | 2001-03-15 |
CN1387741A (en) | 2002-12-25 |
DE60003199T2 (en) | 2004-07-01 |
WO2001019134A2 (en) | 2001-03-15 |
CA2383740C (en) | 2005-04-05 |
AU6984100A (en) | 2001-04-10 |
DK1214864T3 (en) | 2003-08-25 |
EP1214864A2 (en) | 2002-06-19 |
PL354095A1 (en) | 2003-12-29 |
DE60003199D1 (en) | 2003-07-10 |
JP4459498B2 (en) | 2010-04-28 |
PL209935B1 (en) | 2011-11-30 |
JP2007028671A (en) | 2007-02-01 |
JP2003508998A (en) | 2003-03-04 |
EP1214864B1 (en) | 2003-06-04 |
CN1203726C (en) | 2005-05-25 |
ATE242587T1 (en) | 2003-06-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2001019134A3 (en) | Silicon-based sensor system | |
US6522762B1 (en) | Silicon-based sensor system | |
ATE243406T1 (en) | PRESSURE TRANSDUCER | |
WO2002016897A3 (en) | High temperature circuit structures | |
WO2006094025A3 (en) | Fabricated adhesive microstructures for making an electrical connection | |
WO2007000697A3 (en) | Method of manufacturing an assembly and assembly | |
WO2004080133A3 (en) | Integrated sensor and electronics package | |
WO2003023819A3 (en) | Apparatus with compliant electrical terminals, and methods for forming same | |
WO2002056940A3 (en) | Sensing catheter system and method of fabrication | |
EP1187204A3 (en) | Circuit device and method of manufacturing the same | |
WO2003067646A3 (en) | Semiconductor substrate comprising an electrically isolated region, in particular for vertical integration | |
WO2007111610A8 (en) | Hybrid chip fuse assembly having wire leads and fabrication method therefor | |
US10362406B2 (en) | MEMS microphone package | |
WO2001088983A3 (en) | Power semiconductor module | |
WO2003030260A1 (en) | Semiconductor device and semiconductor device manufacturing method | |
WO2001097285A3 (en) | Electronic component consisting of a housing and a substrate | |
US10299046B2 (en) | MEMS microphone package | |
WO2003012930A3 (en) | Electric contact and contact element of silicone for fixing an antenna to a circuit card | |
EP1367643A3 (en) | Electronic module | |
ATE299295T1 (en) | METHOD FOR PRODUCING ELECTRICALLY CONDUCTIVE CONNECTIONS | |
WO2003059029A3 (en) | Integrated sensor module and method for producing the same | |
KR101447982B1 (en) | Sensor package and method for producting of the same | |
TW200511523A (en) | Process for fabricating narrow thickness electronic components |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A2 Designated state(s): AE AG AL AM AT AT AU AZ BA BB BG BR BY BZ CA CH CN CR CU CZ CZ DE DE DK DK DM DZ EE EE ES FI FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PL PT RO RU SD SE SG SI SK SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A2 Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
AK | Designated states |
Kind code of ref document: A3 Designated state(s): AE AG AL AM AT AT AU AZ BA BB BG BR BY BZ CA CH CN CR CU CZ CZ DE DE DK DK DM DZ EE EE ES FI FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PL PT RO RU SD SE SG SI SK SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A3 Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2383740 Country of ref document: CA |
|
ENP | Entry into the national phase |
Ref country code: JP Ref document number: 2001 522196 Kind code of ref document: A Format of ref document f/p: F |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2000958265 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 008153809 Country of ref document: CN |
|
WWP | Wipo information: published in national office |
Ref document number: 2000958265 Country of ref document: EP |
|
REG | Reference to national code |
Ref country code: DE Ref legal event code: 8642 |
|
WWG | Wipo information: grant in national office |
Ref document number: 2000958265 Country of ref document: EP |