WO2001019134A3 - Silicon-based sensor system - Google Patents

Silicon-based sensor system Download PDF

Info

Publication number
WO2001019134A3
WO2001019134A3 PCT/DK2000/000491 DK0000491W WO0119134A3 WO 2001019134 A3 WO2001019134 A3 WO 2001019134A3 DK 0000491 W DK0000491 W DK 0000491W WO 0119134 A3 WO0119134 A3 WO 0119134A3
Authority
WO
WIPO (PCT)
Prior art keywords
microphone
silicon
surface mount
different elements
sensor system
Prior art date
Application number
PCT/DK2000/000491
Other languages
French (fr)
Other versions
WO2001019134A2 (en
Inventor
Matthias Muellenborn
Jochen F Kuhmann
Peter U Scheel
Original Assignee
Microtronic As
Matthias Muellenborn
Jochen F Kuhmann
Peter U Scheel
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/570,434 external-priority patent/US6522762B1/en
Application filed by Microtronic As, Matthias Muellenborn, Jochen F Kuhmann, Peter U Scheel filed Critical Microtronic As
Priority to AT00958265T priority Critical patent/ATE242587T1/en
Priority to DE60003199T priority patent/DE60003199T2/en
Priority to EP00958265A priority patent/EP1214864B1/en
Priority to JP2001522196A priority patent/JP4459498B2/en
Priority to CA002383740A priority patent/CA2383740C/en
Priority to DK00958265T priority patent/DK1214864T3/en
Priority to AU69841/00A priority patent/AU6984100A/en
Publication of WO2001019134A2 publication Critical patent/WO2001019134A2/en
Publication of WO2001019134A3 publication Critical patent/WO2001019134A3/en

Links

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/005Electrostatic transducers using semiconductor materials
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/04Microphones
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
    • H04R25/60Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
    • H04R25/609Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of circuitry

Abstract

The present invention relates to solid state silicon-based condenser microphone systems suitable for batch production. The combination of the different elements forming the microphone system is more flexible compared to any other system disclosed in the prior art. Electrical connections between the different elements of the microphone system are established economically and reliably via a silicon carrier using flip-chip technology. The invention uses an integrated electronic circuit chip, preferably an application specific integrated circuit (ASIC) which may be designed and manufactured separately and independent of the design and manufacture of the transducer element of the microphone. The complete sensor system can be electrically connected to an external substrate by surface mount technology with the contacts facing one side of the system that is not in conflict with the above-mentioned interface to the environment. This allows the user to apply simple and efficient surface mount techniques for the assembly of the overall system.
PCT/DK2000/000491 1999-09-06 2000-09-06 Silicon-based sensor system WO2001019134A2 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
AT00958265T ATE242587T1 (en) 1999-09-06 2000-09-06 SILICONE BASED SENSOR SYSTEMS
DE60003199T DE60003199T2 (en) 1999-09-06 2000-09-06 SILICONE BASED SENSOR SYSTEMS
EP00958265A EP1214864B1 (en) 1999-09-06 2000-09-06 Silicon-based sensor system
JP2001522196A JP4459498B2 (en) 1999-09-06 2000-09-06 Silicon-based sensor system
CA002383740A CA2383740C (en) 1999-09-06 2000-09-06 Silicon-based sensor system
DK00958265T DK1214864T3 (en) 1999-09-06 2000-09-06 Silicon based sensor system
AU69841/00A AU6984100A (en) 1999-09-06 2000-09-06 Silicon-based sensor system

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
DKPA1999/01254 1999-09-06
DKPA199901254 1999-09-06
US39162899A 1999-09-07 1999-09-07
US09/391,628 1999-09-07
US09/570,434 US6522762B1 (en) 1999-09-07 2000-05-12 Silicon-based sensor system
US09/570,434 2000-05-12

Publications (2)

Publication Number Publication Date
WO2001019134A2 WO2001019134A2 (en) 2001-03-15
WO2001019134A3 true WO2001019134A3 (en) 2001-09-07

Family

ID=27221189

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DK2000/000491 WO2001019134A2 (en) 1999-09-06 2000-09-06 Silicon-based sensor system

Country Status (10)

Country Link
EP (1) EP1214864B1 (en)
JP (2) JP4459498B2 (en)
CN (1) CN1203726C (en)
AT (1) ATE242587T1 (en)
AU (1) AU6984100A (en)
CA (1) CA2383740C (en)
DE (1) DE60003199T2 (en)
DK (1) DK1214864T3 (en)
PL (1) PL209935B1 (en)
WO (1) WO2001019134A2 (en)

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6859542B2 (en) 2001-05-31 2005-02-22 Sonion Lyngby A/S Method of providing a hydrophobic layer and a condenser microphone having such a layer
US6696645B2 (en) * 2002-05-08 2004-02-24 The Regents Of The University Of Michigan On-wafer packaging for RF-MEMS
US7142682B2 (en) 2002-12-20 2006-11-28 Sonion Mems A/S Silicon-based transducer for use in hearing instruments and listening devices
US7466835B2 (en) 2003-03-18 2008-12-16 Sonion A/S Miniature microphone with balanced termination
JP2004356708A (en) * 2003-05-27 2004-12-16 Hosiden Corp Sound detection mechanism and manufacturing method thereof
CN100515119C (en) * 2003-08-12 2009-07-15 中国科学院声学研究所 Chip for silicon micro capacitor microphone and its preparation method
CN100499877C (en) * 2003-12-17 2009-06-10 中国科学院声学研究所 Chip having high sensitivity for silicon micro-capacitor microphone and preparation method thereof
DE102004011203B4 (en) * 2004-03-04 2010-09-16 Robert Bosch Gmbh Method for mounting semiconductor chips and corresponding semiconductor chip arrangement
JP4553611B2 (en) * 2004-03-15 2010-09-29 三洋電機株式会社 Circuit equipment
JP4539450B2 (en) * 2004-11-04 2010-09-08 オムロン株式会社 Capacitive vibration sensor and manufacturing method thereof
DE102005008512B4 (en) * 2005-02-24 2016-06-23 Epcos Ag Electrical module with a MEMS microphone
DE102005008511B4 (en) 2005-02-24 2019-09-12 Tdk Corporation MEMS microphone
DE102005053765B4 (en) 2005-11-10 2016-04-14 Epcos Ag MEMS package and method of manufacture
DE102005053767B4 (en) 2005-11-10 2014-10-30 Epcos Ag MEMS microphone, method of manufacture and method of installation
DE102005056759A1 (en) * 2005-11-29 2007-05-31 Robert Bosch Gmbh Micromechanical structure for use as e.g. microphone, has counter units forming respective sides of structure, where counter units have respective electrodes, and closed diaphragm is arranged between counter units
CN101005718B (en) * 2006-01-16 2011-04-20 财团法人工业技术研究院 Micro acoustic sensor and its producing method
JP4771290B2 (en) * 2006-07-19 2011-09-14 ヤマハ株式会社 Manufacturing method of pressure sensor
DE112007003083B4 (en) * 2006-12-22 2019-05-09 Tdk Corp. Microphone assembly with underfill with low coefficient of thermal expansion
JP4893380B2 (en) * 2007-03-09 2012-03-07 ヤマハ株式会社 Condenser microphone device
US7557417B2 (en) 2007-02-21 2009-07-07 Infineon Technologies Ag Module comprising a semiconductor chip comprising a movable element
DE102007008518A1 (en) * 2007-02-21 2008-08-28 Infineon Technologies Ag Semiconductor module for micro-electro-mechanical system, has semiconductor chip having movable unit and active main surface that is turned towards carrier, where another chip is attached at former chip, and cavity is formed between chips
US8767983B2 (en) 2007-06-01 2014-07-01 Infineon Technologies Ag Module including a micro-electro-mechanical microphone
JP2009081624A (en) * 2007-09-26 2009-04-16 Rohm Co Ltd Semiconductor sensor device
TWI336770B (en) * 2007-11-05 2011-02-01 Ind Tech Res Inst Sensor
TWI365525B (en) * 2007-12-24 2012-06-01 Ind Tech Res Inst An ultra thin package for a sensor chip of a micro electro mechanical system
EP2094028B8 (en) * 2008-02-22 2017-03-29 TDK Corporation Miniature microphone assembly with solder sealing ring
DE112009002542A5 (en) * 2008-10-14 2011-09-08 Knowles Electronics, Llc Microphone with a plurality of transducer elements
DE112010002028T5 (en) * 2009-05-18 2012-08-02 Knowles Electronics, Llc Microphone with reduced vibration sensitivity
KR101609270B1 (en) 2009-08-12 2016-04-06 삼성전자주식회사 Piezoelectric micro speaker and method of manufacturing the same
DE102009047592B4 (en) * 2009-12-07 2019-06-19 Robert Bosch Gmbh Process for producing a silicon intermediate carrier
IT1397976B1 (en) * 2009-12-23 2013-02-04 St Microelectronics Rousset MICROELETTROMECHANICAL TRANSDUCER AND RELATIVE ASSEMBLY PROCEDURE.
JP2013093637A (en) * 2010-02-24 2013-05-16 Panasonic Corp Semiconductor device and manufacturing method of the same
TWI491009B (en) 2010-10-08 2015-07-01 Chip level emi shielding structure and manufacture method thereof
CN102456669B (en) * 2010-10-25 2015-07-22 环旭电子股份有限公司 Chip-grade electromagnetic interference shielding structure and manufacturing method thereof
US9108840B2 (en) * 2010-12-30 2015-08-18 Goertek Inc. MEMS microphone and method for packaging the same
JP5721452B2 (en) * 2011-01-27 2015-05-20 ローム株式会社 Capacitive MEMS sensor
JP5799619B2 (en) 2011-06-24 2015-10-28 船井電機株式会社 Microphone unit
DE102011086722A1 (en) * 2011-11-21 2013-05-23 Robert Bosch Gmbh Micromechanical functional device, in particular speaker device, and corresponding manufacturing method
US20130147040A1 (en) * 2011-12-09 2013-06-13 Robert Bosch Gmbh Mems chip scale package
DE102012203373A1 (en) * 2012-03-05 2013-09-05 Robert Bosch Gmbh Micromechanical sound transducer arrangement and a corresponding manufacturing method
US20140090485A1 (en) * 2012-10-02 2014-04-03 Robert Bosch Gmbh MEMS Pressure Sensor Assembly
WO2014094831A1 (en) 2012-12-18 2014-06-26 Epcos Ag Top-port mems microphone and method of manufacturing the same
US20140312439A1 (en) * 2013-04-19 2014-10-23 Infineon Technologies Ag Microphone Module and Method of Manufacturing Thereof
ITTO20130350A1 (en) 2013-04-30 2014-10-31 St Microelectronics Srl SLICE ASSEMBLY OF A MEMS SENSOR DEVICE AND RELATIVE MEMS SENSOR DEVICE
US9264832B2 (en) 2013-10-30 2016-02-16 Solid State System Co., Ltd. Microelectromechanical system (MEMS) microphone with protection film and MEMS microphonechips at wafer level
GB2529134B (en) * 2014-06-10 2017-09-13 Cirrus Logic Int Semiconductor Ltd Packaging for MEMS transducers
US10455308B2 (en) * 2014-09-17 2019-10-22 Intel Corporation Die with integrated microphone device using through-silicon vias (TSVs)
CN104780490A (en) * 2015-04-20 2015-07-15 歌尔声学股份有限公司 MEMS microphone packaging structure and manufacturing method thereof
TWI660466B (en) * 2017-04-26 2019-05-21 矽品精密工業股份有限公司 Package structure and method of manufacture thereof
CN111711903B (en) * 2020-06-24 2021-10-01 歌尔微电子有限公司 Miniature microphone dust keeper and MEMS microphone

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4533795A (en) * 1983-07-07 1985-08-06 American Telephone And Telegraph Integrated electroacoustic transducer
US5490220A (en) * 1992-03-18 1996-02-06 Knowles Electronics, Inc. Solid state condenser and microphone devices
US5856914A (en) * 1996-07-29 1999-01-05 National Semiconductor Corporation Micro-electronic assembly including a flip-chip mounted micro-device and method
US5870482A (en) * 1997-02-25 1999-02-09 Knowles Electronics, Inc. Miniature silicon condenser microphone
US5889872A (en) * 1996-07-02 1999-03-30 Motorola, Inc. Capacitive microphone and method therefor

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4533795A (en) * 1983-07-07 1985-08-06 American Telephone And Telegraph Integrated electroacoustic transducer
US5490220A (en) * 1992-03-18 1996-02-06 Knowles Electronics, Inc. Solid state condenser and microphone devices
US5889872A (en) * 1996-07-02 1999-03-30 Motorola, Inc. Capacitive microphone and method therefor
US5856914A (en) * 1996-07-29 1999-01-05 National Semiconductor Corporation Micro-electronic assembly including a flip-chip mounted micro-device and method
US5870482A (en) * 1997-02-25 1999-02-09 Knowles Electronics, Inc. Miniature silicon condenser microphone

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
KRISTIANSEN L: "Forste Silicium-baserede Mikro-mikrofon", NYHEDSMAGASINET ELEKTRONIK & DATA, no. 3, 1998, pages 4 - 8, XP002901441 *

Also Published As

Publication number Publication date
JP4303742B2 (en) 2009-07-29
CA2383740A1 (en) 2001-03-15
CN1387741A (en) 2002-12-25
DE60003199T2 (en) 2004-07-01
WO2001019134A2 (en) 2001-03-15
CA2383740C (en) 2005-04-05
AU6984100A (en) 2001-04-10
DK1214864T3 (en) 2003-08-25
EP1214864A2 (en) 2002-06-19
PL354095A1 (en) 2003-12-29
DE60003199D1 (en) 2003-07-10
JP4459498B2 (en) 2010-04-28
PL209935B1 (en) 2011-11-30
JP2007028671A (en) 2007-02-01
JP2003508998A (en) 2003-03-04
EP1214864B1 (en) 2003-06-04
CN1203726C (en) 2005-05-25
ATE242587T1 (en) 2003-06-15

Similar Documents

Publication Publication Date Title
WO2001019134A3 (en) Silicon-based sensor system
US6522762B1 (en) Silicon-based sensor system
ATE243406T1 (en) PRESSURE TRANSDUCER
WO2002016897A3 (en) High temperature circuit structures
WO2006094025A3 (en) Fabricated adhesive microstructures for making an electrical connection
WO2007000697A3 (en) Method of manufacturing an assembly and assembly
WO2004080133A3 (en) Integrated sensor and electronics package
WO2003023819A3 (en) Apparatus with compliant electrical terminals, and methods for forming same
WO2002056940A3 (en) Sensing catheter system and method of fabrication
EP1187204A3 (en) Circuit device and method of manufacturing the same
WO2003067646A3 (en) Semiconductor substrate comprising an electrically isolated region, in particular for vertical integration
WO2007111610A8 (en) Hybrid chip fuse assembly having wire leads and fabrication method therefor
US10362406B2 (en) MEMS microphone package
WO2001088983A3 (en) Power semiconductor module
WO2003030260A1 (en) Semiconductor device and semiconductor device manufacturing method
WO2001097285A3 (en) Electronic component consisting of a housing and a substrate
US10299046B2 (en) MEMS microphone package
WO2003012930A3 (en) Electric contact and contact element of silicone for fixing an antenna to a circuit card
EP1367643A3 (en) Electronic module
ATE299295T1 (en) METHOD FOR PRODUCING ELECTRICALLY CONDUCTIVE CONNECTIONS
WO2003059029A3 (en) Integrated sensor module and method for producing the same
KR101447982B1 (en) Sensor package and method for producting of the same
TW200511523A (en) Process for fabricating narrow thickness electronic components

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AT AU AZ BA BB BG BR BY BZ CA CH CN CR CU CZ CZ DE DE DK DK DM DZ EE EE ES FI FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PL PT RO RU SD SE SG SI SK SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
AK Designated states

Kind code of ref document: A3

Designated state(s): AE AG AL AM AT AT AU AZ BA BB BG BR BY BZ CA CH CN CR CU CZ CZ DE DE DK DK DM DZ EE EE ES FI FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PL PT RO RU SD SE SG SI SK SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A3

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG

WWE Wipo information: entry into national phase

Ref document number: 2383740

Country of ref document: CA

ENP Entry into the national phase

Ref country code: JP

Ref document number: 2001 522196

Kind code of ref document: A

Format of ref document f/p: F

WWE Wipo information: entry into national phase

Ref document number: 2000958265

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 008153809

Country of ref document: CN

WWP Wipo information: published in national office

Ref document number: 2000958265

Country of ref document: EP

REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

WWG Wipo information: grant in national office

Ref document number: 2000958265

Country of ref document: EP