WO2001019134A2 - Silicon-based sensor system - Google Patents
Silicon-based sensor system Download PDFInfo
- Publication number
- WO2001019134A2 WO2001019134A2 PCT/DK2000/000491 DK0000491W WO0119134A2 WO 2001019134 A2 WO2001019134 A2 WO 2001019134A2 DK 0000491 W DK0000491 W DK 0000491W WO 0119134 A2 WO0119134 A2 WO 0119134A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- sensor system
- contact
- transducer element
- carrier member
- elements
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
- H04R25/60—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
- H04R25/609—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of circuitry
Abstract
Description
Claims
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE60003199T DE60003199T2 (en) | 1999-09-06 | 2000-09-06 | SILICONE BASED SENSOR SYSTEMS |
JP2001522196A JP4459498B2 (en) | 1999-09-06 | 2000-09-06 | Silicon-based sensor system |
AU69841/00A AU6984100A (en) | 1999-09-06 | 2000-09-06 | Silicon-based sensor system |
DK00958265T DK1214864T3 (en) | 1999-09-06 | 2000-09-06 | Silicon based sensor system |
EP00958265A EP1214864B1 (en) | 1999-09-06 | 2000-09-06 | Silicon-based sensor system |
CA002383740A CA2383740C (en) | 1999-09-06 | 2000-09-06 | Silicon-based sensor system |
AT00958265T ATE242587T1 (en) | 1999-09-06 | 2000-09-06 | SILICONE BASED SENSOR SYSTEMS |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DKPA1999/01254 | 1999-09-06 | ||
DKPA199901254 | 1999-09-06 | ||
US39162899A | 1999-09-07 | 1999-09-07 | |
US09/391,628 | 1999-09-07 | ||
US09/570,434 | 2000-05-12 | ||
US09/570,434 US6522762B1 (en) | 1999-09-07 | 2000-05-12 | Silicon-based sensor system |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2001019134A2 true WO2001019134A2 (en) | 2001-03-15 |
WO2001019134A3 WO2001019134A3 (en) | 2001-09-07 |
Family
ID=27221189
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DK2000/000491 WO2001019134A2 (en) | 1999-09-06 | 2000-09-06 | Silicon-based sensor system |
Country Status (10)
Country | Link |
---|---|
EP (1) | EP1214864B1 (en) |
JP (2) | JP4459498B2 (en) |
CN (1) | CN1203726C (en) |
AT (1) | ATE242587T1 (en) |
AU (1) | AU6984100A (en) |
CA (1) | CA2383740C (en) |
DE (1) | DE60003199T2 (en) |
DK (1) | DK1214864T3 (en) |
PL (1) | PL209935B1 (en) |
WO (1) | WO2001019134A2 (en) |
Cited By (9)
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WO2003095357A2 (en) * | 2002-05-08 | 2003-11-20 | The Regents Of The University Of Michigan | On-wafer packaging for rf-mems |
US7142682B2 (en) | 2002-12-20 | 2006-11-28 | Sonion Mems A/S | Silicon-based transducer for use in hearing instruments and listening devices |
US7342263B2 (en) | 2004-03-15 | 2008-03-11 | Sanyo Electric Co., Ltd. | Circuit device |
US7466835B2 (en) | 2003-03-18 | 2008-12-16 | Sonion A/S | Miniature microphone with balanced termination |
US7907744B2 (en) | 2004-11-04 | 2011-03-15 | Omron Corporation | Capacitive vibration sensor and method for manufacturing same |
JP2012156896A (en) * | 2011-01-27 | 2012-08-16 | Rohm Co Ltd | Capacitance type mems sensor |
US9287218B2 (en) | 2010-10-08 | 2016-03-15 | Universal Scientific Industrial (Shanghai) Co., Ltd. | Chip level EMI shielding structure and manufacture method thereof |
US9363595B2 (en) | 2011-06-24 | 2016-06-07 | Funai Electric Co., Ltd. | Microphone unit, and sound input device provided with same |
US10136226B2 (en) | 2012-12-18 | 2018-11-20 | Tdk Corporation | Top-port MEMS microphone and method of manufacturing the same |
Families Citing this family (41)
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US6859542B2 (en) | 2001-05-31 | 2005-02-22 | Sonion Lyngby A/S | Method of providing a hydrophobic layer and a condenser microphone having such a layer |
JP2004356708A (en) * | 2003-05-27 | 2004-12-16 | Hosiden Corp | Sound detection mechanism and manufacturing method thereof |
CN100515119C (en) * | 2003-08-12 | 2009-07-15 | 中国科学院声学研究所 | Chip for silicon micro capacitor microphone and its preparation method |
CN100499877C (en) * | 2003-12-17 | 2009-06-10 | 中国科学院声学研究所 | Chip having high sensitivity for silicon micro-capacitor microphone and preparation method thereof |
DE102004011203B4 (en) * | 2004-03-04 | 2010-09-16 | Robert Bosch Gmbh | Method for mounting semiconductor chips and corresponding semiconductor chip arrangement |
DE102005008512B4 (en) | 2005-02-24 | 2016-06-23 | Epcos Ag | Electrical module with a MEMS microphone |
DE102005008511B4 (en) | 2005-02-24 | 2019-09-12 | Tdk Corporation | MEMS microphone |
DE102005053765B4 (en) | 2005-11-10 | 2016-04-14 | Epcos Ag | MEMS package and method of manufacture |
DE102005053767B4 (en) | 2005-11-10 | 2014-10-30 | Epcos Ag | MEMS microphone, method of manufacture and method of installation |
DE102005056759A1 (en) * | 2005-11-29 | 2007-05-31 | Robert Bosch Gmbh | Micromechanical structure for use as e.g. microphone, has counter units forming respective sides of structure, where counter units have respective electrodes, and closed diaphragm is arranged between counter units |
CN101005718B (en) * | 2006-01-16 | 2011-04-20 | 财团法人工业技术研究院 | Micro acoustic sensor and its producing method |
JP4771290B2 (en) * | 2006-07-19 | 2011-09-14 | ヤマハ株式会社 | Manufacturing method of pressure sensor |
DE112007003083B4 (en) * | 2006-12-22 | 2019-05-09 | Tdk Corp. | Microphone assembly with underfill with low coefficient of thermal expansion |
JP4893380B2 (en) * | 2007-03-09 | 2012-03-07 | ヤマハ株式会社 | Condenser microphone device |
US7557417B2 (en) | 2007-02-21 | 2009-07-07 | Infineon Technologies Ag | Module comprising a semiconductor chip comprising a movable element |
DE102007008518A1 (en) * | 2007-02-21 | 2008-08-28 | Infineon Technologies Ag | Semiconductor module for micro-electro-mechanical system, has semiconductor chip having movable unit and active main surface that is turned towards carrier, where another chip is attached at former chip, and cavity is formed between chips |
US8767983B2 (en) * | 2007-06-01 | 2014-07-01 | Infineon Technologies Ag | Module including a micro-electro-mechanical microphone |
JP2009081624A (en) * | 2007-09-26 | 2009-04-16 | Rohm Co Ltd | Semiconductor sensor device |
TWI336770B (en) * | 2007-11-05 | 2011-02-01 | Ind Tech Res Inst | Sensor |
TWI365525B (en) * | 2007-12-24 | 2012-06-01 | Ind Tech Res Inst | An ultra thin package for a sensor chip of a micro electro mechanical system |
EP2094028B8 (en) * | 2008-02-22 | 2017-03-29 | TDK Corporation | Miniature microphone assembly with solder sealing ring |
CN102187685B (en) * | 2008-10-14 | 2015-03-11 | 美商楼氏电子有限公司 | Microphone having multiple transducer elements |
KR20120014591A (en) * | 2009-05-18 | 2012-02-17 | 노우레스 일렉트로닉스, 엘엘시 | Microphone having reduced vibration sensitivity |
KR101609270B1 (en) | 2009-08-12 | 2016-04-06 | 삼성전자주식회사 | Piezoelectric micro speaker and method of manufacturing the same |
DE102009047592B4 (en) * | 2009-12-07 | 2019-06-19 | Robert Bosch Gmbh | Process for producing a silicon intermediate carrier |
IT1397976B1 (en) * | 2009-12-23 | 2013-02-04 | St Microelectronics Rousset | MICROELETTROMECHANICAL TRANSDUCER AND RELATIVE ASSEMBLY PROCEDURE. |
JP2013093637A (en) * | 2010-02-24 | 2013-05-16 | Panasonic Corp | Semiconductor device and manufacturing method of the same |
CN102456669B (en) * | 2010-10-25 | 2015-07-22 | 环旭电子股份有限公司 | Chip-grade electromagnetic interference shielding structure and manufacturing method thereof |
CN102726065B (en) * | 2010-12-30 | 2014-06-04 | 歌尔声学股份有限公司 | A MEMS microphone and method for packaging the same |
DE102011086722A1 (en) * | 2011-11-21 | 2013-05-23 | Robert Bosch Gmbh | Micromechanical functional device, in particular speaker device, and corresponding manufacturing method |
US20130147040A1 (en) * | 2011-12-09 | 2013-06-13 | Robert Bosch Gmbh | Mems chip scale package |
DE102012203373A1 (en) * | 2012-03-05 | 2013-09-05 | Robert Bosch Gmbh | Micromechanical sound transducer arrangement and a corresponding manufacturing method |
US20140090485A1 (en) * | 2012-10-02 | 2014-04-03 | Robert Bosch Gmbh | MEMS Pressure Sensor Assembly |
US20140312439A1 (en) * | 2013-04-19 | 2014-10-23 | Infineon Technologies Ag | Microphone Module and Method of Manufacturing Thereof |
ITTO20130350A1 (en) | 2013-04-30 | 2014-10-31 | St Microelectronics Srl | SLICE ASSEMBLY OF A MEMS SENSOR DEVICE AND RELATIVE MEMS SENSOR DEVICE |
US9264832B2 (en) | 2013-10-30 | 2016-02-16 | Solid State System Co., Ltd. | Microelectromechanical system (MEMS) microphone with protection film and MEMS microphonechips at wafer level |
GB2538177B (en) * | 2014-06-10 | 2017-09-13 | Cirrus Logic Int Semiconductor Ltd | Packaging for MEMS transducers |
EP3195358A4 (en) * | 2014-09-17 | 2018-04-25 | Intel Corporation | DIE WITH INTEGRATED MICROPHONE DEVICE USING THROUGH-SILICON VIAS (TSVs) |
CN104780490A (en) * | 2015-04-20 | 2015-07-15 | 歌尔声学股份有限公司 | MEMS microphone packaging structure and manufacturing method thereof |
TWI660466B (en) * | 2017-04-26 | 2019-05-21 | 矽品精密工業股份有限公司 | Package structure and method of manufacture thereof |
CN111711903B (en) * | 2020-06-24 | 2021-10-01 | 歌尔微电子有限公司 | Miniature microphone dust keeper and MEMS microphone |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4533795A (en) * | 1983-07-07 | 1985-08-06 | American Telephone And Telegraph | Integrated electroacoustic transducer |
US5490220A (en) * | 1992-03-18 | 1996-02-06 | Knowles Electronics, Inc. | Solid state condenser and microphone devices |
US5856914A (en) * | 1996-07-29 | 1999-01-05 | National Semiconductor Corporation | Micro-electronic assembly including a flip-chip mounted micro-device and method |
US5870482A (en) * | 1997-02-25 | 1999-02-09 | Knowles Electronics, Inc. | Miniature silicon condenser microphone |
US5889872A (en) * | 1996-07-02 | 1999-03-30 | Motorola, Inc. | Capacitive microphone and method therefor |
-
2000
- 2000-09-06 WO PCT/DK2000/000491 patent/WO2001019134A2/en active IP Right Grant
- 2000-09-06 JP JP2001522196A patent/JP4459498B2/en not_active Expired - Fee Related
- 2000-09-06 AU AU69841/00A patent/AU6984100A/en not_active Abandoned
- 2000-09-06 CN CNB008153809A patent/CN1203726C/en not_active Expired - Lifetime
- 2000-09-06 PL PL354095A patent/PL209935B1/en unknown
- 2000-09-06 EP EP00958265A patent/EP1214864B1/en not_active Expired - Lifetime
- 2000-09-06 AT AT00958265T patent/ATE242587T1/en active
- 2000-09-06 DE DE60003199T patent/DE60003199T2/en not_active Expired - Lifetime
- 2000-09-06 CA CA002383740A patent/CA2383740C/en not_active Expired - Fee Related
- 2000-09-06 DK DK00958265T patent/DK1214864T3/en active
-
2006
- 2006-10-04 JP JP2006273173A patent/JP4303742B2/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4533795A (en) * | 1983-07-07 | 1985-08-06 | American Telephone And Telegraph | Integrated electroacoustic transducer |
US5490220A (en) * | 1992-03-18 | 1996-02-06 | Knowles Electronics, Inc. | Solid state condenser and microphone devices |
US5889872A (en) * | 1996-07-02 | 1999-03-30 | Motorola, Inc. | Capacitive microphone and method therefor |
US5856914A (en) * | 1996-07-29 | 1999-01-05 | National Semiconductor Corporation | Micro-electronic assembly including a flip-chip mounted micro-device and method |
US5870482A (en) * | 1997-02-25 | 1999-02-09 | Knowles Electronics, Inc. | Miniature silicon condenser microphone |
Non-Patent Citations (1)
Title |
---|
KRISTIANSEN L: "Forste Silicium-baserede Mikro-mikrofon" NYHEDSMAGASINET ELEKTRONIK & DATA, no. 3, 1998, pages 4-8, XP002901441 * |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003095357A2 (en) * | 2002-05-08 | 2003-11-20 | The Regents Of The University Of Michigan | On-wafer packaging for rf-mems |
WO2003095357A3 (en) * | 2002-05-08 | 2004-12-02 | Univ Michigan | On-wafer packaging for rf-mems |
US7142682B2 (en) | 2002-12-20 | 2006-11-28 | Sonion Mems A/S | Silicon-based transducer for use in hearing instruments and listening devices |
US7792315B2 (en) | 2002-12-20 | 2010-09-07 | Epcos Ag | Silicon-based transducer for use in hearing instruments and listening devices |
US7466835B2 (en) | 2003-03-18 | 2008-12-16 | Sonion A/S | Miniature microphone with balanced termination |
US7342263B2 (en) | 2004-03-15 | 2008-03-11 | Sanyo Electric Co., Ltd. | Circuit device |
US7907744B2 (en) | 2004-11-04 | 2011-03-15 | Omron Corporation | Capacitive vibration sensor and method for manufacturing same |
US9287218B2 (en) | 2010-10-08 | 2016-03-15 | Universal Scientific Industrial (Shanghai) Co., Ltd. | Chip level EMI shielding structure and manufacture method thereof |
JP2012156896A (en) * | 2011-01-27 | 2012-08-16 | Rohm Co Ltd | Capacitance type mems sensor |
US9363595B2 (en) | 2011-06-24 | 2016-06-07 | Funai Electric Co., Ltd. | Microphone unit, and sound input device provided with same |
US10136226B2 (en) | 2012-12-18 | 2018-11-20 | Tdk Corporation | Top-port MEMS microphone and method of manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
CN1387741A (en) | 2002-12-25 |
CN1203726C (en) | 2005-05-25 |
EP1214864A2 (en) | 2002-06-19 |
JP4459498B2 (en) | 2010-04-28 |
DE60003199T2 (en) | 2004-07-01 |
JP2007028671A (en) | 2007-02-01 |
CA2383740C (en) | 2005-04-05 |
JP4303742B2 (en) | 2009-07-29 |
CA2383740A1 (en) | 2001-03-15 |
AU6984100A (en) | 2001-04-10 |
JP2003508998A (en) | 2003-03-04 |
DE60003199D1 (en) | 2003-07-10 |
DK1214864T3 (en) | 2003-08-25 |
EP1214864B1 (en) | 2003-06-04 |
PL354095A1 (en) | 2003-12-29 |
WO2001019134A3 (en) | 2001-09-07 |
PL209935B1 (en) | 2011-11-30 |
ATE242587T1 (en) | 2003-06-15 |
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