WO2001018138A3 - Pressure sensitive adhesives for use with data storage devices - Google Patents

Pressure sensitive adhesives for use with data storage devices Download PDF

Info

Publication number
WO2001018138A3
WO2001018138A3 PCT/US2000/017782 US0017782W WO0118138A3 WO 2001018138 A3 WO2001018138 A3 WO 2001018138A3 US 0017782 W US0017782 W US 0017782W WO 0118138 A3 WO0118138 A3 WO 0118138A3
Authority
WO
WIPO (PCT)
Prior art keywords
styrene
elastomer
cleaner
psa
disclosed
Prior art date
Application number
PCT/US2000/017782
Other languages
French (fr)
Other versions
WO2001018138A2 (en
Inventor
Huimin Yang
Gerald T Downing
Original Assignee
Brady Worldwide Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brady Worldwide Inc filed Critical Brady Worldwide Inc
Priority to KR1020027003177A priority Critical patent/KR20020035869A/en
Priority to JP2001522353A priority patent/JP2003519428A/en
Publication of WO2001018138A2 publication Critical patent/WO2001018138A2/en
Publication of WO2001018138A3 publication Critical patent/WO2001018138A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C09J153/025—Vinyl aromatic monomers and conjugated dienes modified
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
    • C09J109/06—Copolymers with styrene
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B25/00—Apparatus characterised by the shape of record carrier employed but not specific to the method of recording or reproducing, e.g. dictating apparatus; Combinations of such apparatus
    • G11B25/04—Apparatus characterised by the shape of record carrier employed but not specific to the method of recording or reproducing, e.g. dictating apparatus; Combinations of such apparatus using flat record carriers, e.g. disc, card
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials

Abstract

A method is disclosed for making improved, cleaner computer devices by using a cleaner pressure sensitive adhesive (PSA) on the computer device components that contain a PSA. The cleaner PSA comprises at least one hydrogenated styrene-elastomer-styrene block copolymer or the hydrogenated styrene-elastomer-styrene-elastomer block copolymer, and at least one tackifying resin. Hydrogenated styrene-ethylene butylene-styrene or styrene-ethylene propylene-styrene block polymers in combination with certain 'clean' tackifying resins are formulated into a liquid coating, coated and properly dried on an acceptable substrate. The component thus produced is ideally suited to be used in disk drives. The component produced in the manner described, has a much lower total aggregate concentration of materials considered harmful by the industry, compared to most polyacrylate adhesive components of the same design. Also disclosed are computer devices, preferably computer data storage devices, made by the method disclosed.
PCT/US2000/017782 1999-09-10 2000-06-28 Pressure sensitive adhesives for use with data storage devices WO2001018138A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020027003177A KR20020035869A (en) 1999-09-10 2000-06-28 Pressure sensitive adhesives for use with data storage devices
JP2001522353A JP2003519428A (en) 1999-09-10 2000-06-28 Pressure sensitive adhesive for data storage

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US39395799A 1999-09-10 1999-09-10
US09/393,957 1999-09-10

Publications (2)

Publication Number Publication Date
WO2001018138A2 WO2001018138A2 (en) 2001-03-15
WO2001018138A3 true WO2001018138A3 (en) 2002-09-26

Family

ID=23556942

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2000/017782 WO2001018138A2 (en) 1999-09-10 2000-06-28 Pressure sensitive adhesives for use with data storage devices

Country Status (4)

Country Link
JP (1) JP2003519428A (en)
KR (1) KR20020035869A (en)
CN (1) CN1538999A (en)
WO (1) WO2001018138A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7645507B2 (en) * 2005-10-24 2010-01-12 Kraton Polymers U.S. Llc Protective films and pressure sensitive adhesives
BRPI0720155A2 (en) * 2006-12-07 2014-02-04 3M Innovative Properties Co BLOCK COPOLYMER BLENDES AND ACRYLIC ADVISES.
JP6002499B2 (en) * 2012-08-03 2016-10-05 日東電工株式会社 Adhesive sheet and electrical / electronic devices
TWI679259B (en) * 2014-08-11 2019-12-11 德商漢高智慧財產控股公司 Optically clear hot melt adhesives and uses thereof

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4692272A (en) * 1984-10-15 1987-09-08 Stauffer Chemical Company Thermally stable adhesive comprising soluble polyimide resin and epoxy resin
EP0410011A1 (en) * 1988-02-25 1991-01-30 Aica Kogyo Co., Ltd. Holt melt type seal agent for a lamp
JPH0649425A (en) * 1992-06-17 1994-02-22 Minnesota Mining & Mfg Co <3M> Pressure-sensitive adhesive tape for outgas prevention
WO1998000471A1 (en) * 1996-07-03 1998-01-08 H.B. Fuller Licensing & Financing, Inc. Cohesively failing hot melt pressure sensitive adhesive
US5863977A (en) * 1993-10-12 1999-01-26 H. B. Fuller Licensing & Financing, Inc. High molecular weight S-EB-S hot melt adhesive
US5869555A (en) * 1995-11-16 1999-02-09 H. B. Fuller Licensing & Financing Inc. Polymeric composition in pellet form
WO1999020709A1 (en) * 1997-10-23 1999-04-29 H.B. Fuller Licensing & Financing, Inc. Removable grade hot melt pressure sensitive adhesive

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4692272A (en) * 1984-10-15 1987-09-08 Stauffer Chemical Company Thermally stable adhesive comprising soluble polyimide resin and epoxy resin
EP0410011A1 (en) * 1988-02-25 1991-01-30 Aica Kogyo Co., Ltd. Holt melt type seal agent for a lamp
JPH0649425A (en) * 1992-06-17 1994-02-22 Minnesota Mining & Mfg Co <3M> Pressure-sensitive adhesive tape for outgas prevention
US5863977A (en) * 1993-10-12 1999-01-26 H. B. Fuller Licensing & Financing, Inc. High molecular weight S-EB-S hot melt adhesive
US5869555A (en) * 1995-11-16 1999-02-09 H. B. Fuller Licensing & Financing Inc. Polymeric composition in pellet form
US5942569A (en) * 1995-11-16 1999-08-24 H.B. Fuller Licensing & Financing, Inc. Polymeric composition in pellet form
WO1998000471A1 (en) * 1996-07-03 1998-01-08 H.B. Fuller Licensing & Financing, Inc. Cohesively failing hot melt pressure sensitive adhesive
WO1999020709A1 (en) * 1997-10-23 1999-04-29 H.B. Fuller Licensing & Financing, Inc. Removable grade hot melt pressure sensitive adhesive

Also Published As

Publication number Publication date
KR20020035869A (en) 2002-05-15
JP2003519428A (en) 2003-06-17
CN1538999A (en) 2004-10-20
WO2001018138A2 (en) 2001-03-15

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