WO2001013685A1 - Stamped grid - Google Patents

Stamped grid Download PDF

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Publication number
WO2001013685A1
WO2001013685A1 PCT/DE2000/002687 DE0002687W WO0113685A1 WO 2001013685 A1 WO2001013685 A1 WO 2001013685A1 DE 0002687 W DE0002687 W DE 0002687W WO 0113685 A1 WO0113685 A1 WO 0113685A1
Authority
WO
WIPO (PCT)
Prior art keywords
lead frame
additional material
contact surface
sensor
welded
Prior art date
Application number
PCT/DE2000/002687
Other languages
German (de)
French (fr)
Inventor
Klaus Bauer
Josef Brem
Ronald Henzinger
Markus Molin
Jörg SCHINDLER
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO2001013685A1 publication Critical patent/WO2001013685A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10757—Bent leads
    • H05K2201/10765—Leads folded back, i.e. bent with an angle of 180 deg
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Definitions

  • the invention relates to a leadframe through which metallic conductor tracks are formed for connecting electrical components.
  • the components can be individual components or completely integrated circuits.
  • a lead frame is known for example from DE 44 30 798 AI.
  • the known leadframe forms electrical conductor tracks and consists of a base material to which an additional material is applied in predetermined areas, for example in the area of connecting pins.
  • bond connection If integrated circuits are contacted on such a lead frame, this is usually done by means of a so-called bond connection. Since a relatively expensive metal, e.g. Aluminum, is required, the lead frame in the area where the bond connections are to be made with the additional material, e.g. Aluminum, plated.
  • the additional material that is suitable for bonding has the disadvantage that it is unsuitable for attaching welded joints. However, it may be necessary that welded connections must also be made in the area of the lead frame plated with the additional material.
  • the object of the invention is to develop the known lead frame so that welded connections can be formed at any point on the lead frame.
  • FIG. 1 shows a lead frame
  • FIG. 2 shows a section through the lead frame according to FIG. 1 along a line II-II ',
  • FIG. 3 shows a first view of a sensor device
  • FIG. 4 shows a second view of a sensor device
  • FIG. 5 shows a section through the sensor device according to FIG. 2 along a line VV ⁇ ,
  • a lead frame 20 ( Figure 1) is made of a plate
  • the additional material is selected so that it is suitable for producing bond connections.
  • the additional material is applied to the base material in the form of a plate and, for example, welded to it or permanently connected in some other way.
  • the base material is preferably made of a copper alloy.
  • the additional material is preferably formed from an aluminum alloy.
  • the lead frame is produced by punching the base material and the additional material. Conductor tracks 22, 23, 24, 25 are formed by the leadframe 20, the area 21 being clad, for example, with the additional material, so that an integrated circuit can be electrically contacted in this area by means of bonded connections.
  • a contact surface 26, 27 is formed by U-shaped bending of the lead frame.
  • the lead frame is bent in a U-shape in such a way that the side of the lead frame provided with the additional material is on the concave side (28, 28a) of the U-shaped region.
  • the contact surface is preferably formed on the side of the lead frame on which the additional material is attached when the lead frame is not bent.
  • An integrated circuit which is designed, for example, as a user-specific IC (ASIC) with a micromechanical sensor element, as well as a further component can be attached to the lead frame on one side.
  • the further component can be welded to the contact surface 26, 27 with its connecting elements by a welded connection.
  • the contact surface 26, 27 is advantageously designed for point contacting of a connection element. This enables a high quality welded joint.
  • the lead frame according to the invention enables a simple and extremely compact arrangement of components which are connected to the lead frame by means of bond connections and other components which are connected to the lead frame by means of welded connections.
  • the lead frame is preferably arranged in a sensor device.
  • the sensor device (FIG. 3) comprises a housing part 1 which is formed in one piece with a plug part 2. Furthermore, a chamber 4, in which a sensor is arranged, is formed in the housing part 1.
  • the sensor comprises a sensor element 7 and a signal processing unit 6
  • the sensor is preferably designed as a micromechanical semiconductor sensor and, in the preferred embodiment, is a pressure sensor.
  • the signal processing unit 6 comprises a circuit arrangement for generating an output signal as a function of a measurement signal from the sensor element 7. Furthermore, the signal processing unit 6 includes storage means for storing a characteristic curve in which values of the output signal are plotted as a function of the measurement signal. The storage means preferably also store correction values for correcting the measurement signal or the output signal.
  • the signal processing unit can be designed, for example, as a user-specific ACE (Asic).
  • the signal processing unit is electrically conductively connected to contacts of the plug part, which on the one hand can be contacted with a power supply and on the other hand can be contacted for transmitting the output signal of the signal processing unit 6.
  • at least one contact element 8 (three contact elements in FIG. 1) is provided, which are guided through the chamber 4 to a groove 12.
  • the contact element 8 is electrically conductively connected to the signal processing unit 6, preferably via bond connections.
  • the contact element 8 is part of the lead frame 20.
  • the groove 12 is formed in the housing part 1 and comprises the chamber 4.
  • a potting compound 11 is applied to the sensor element 7 and the signal processing unit 6 and is made, for example, of silicone gel.
  • the potting compound protects the sensor element 7 and the signal processing unit against a chemically aggressive working medium to which the sensor device may be exposed.
  • the potting compound 11 also protects against mechanical damage.
  • the sensor element 7 and the signal processing unit 6 are encapsulated with the potting compound 11 in such a way that the at least one contact element 8 in the region of the chamber 4 and the electrical contact to the signal processing unit produced by bonding wires are also encapsulated by the potting compound 11.
  • a contact area 9 is formed in the groove 12 in the contact element 8, which is suitable for contacting needle adapters of a calibration device.
  • the sensor device also has a cover 16 (see FIGS. 2-5) which is introduced into the groove 12.
  • the cover 16 is inserted into the groove 12 after the sensor has been calibrated.
  • a sealing compound 14 is inserted into the groove 12. brings that isolates the contact area 9 and is simultaneously formed as a seal for the lid 16. This ensures that the contact area 9 can no longer be electrically contacted after the sealing compound 14 has been introduced and is simultaneously protected against corrosion. This can ensure that no disturbing signals are transmitted via the contact element 8 during operation of the sensor device, which could contribute to falsification of the stored calibration data.
  • the sealing compound 12 also contributes to the fact that the housing part 1 and the cover 16 are tightly connected to one another.
  • the cover is preferably designed as a nozzle with an opening to the working medium, which is, for example, the air in a collector of an internal combustion engine.
  • the arrangement described ensures that the chamber 4 communicates only with the working medium. It is advantageous if the sealing compound 14 is designed as a sealing adhesive and the cover 16 is glued into the groove. As a result, an additional mechanical fastening of the cover 16 to the housing part 1 can be omitted.
  • the working medium is the medium m which the respective measured quantity is to be recorded. In the case of a sensor device designed as an intake manifold pressure sensor, this is the air in the collector of the intake tract of the internal combustion engine.
  • the sensor device has an electrical component which is designed as a temperature sensor.
  • the temperature sensor has a temperature sensor element 29 which has connection elements 30, 31 which are freely guided in an area and are subsequently guided in a support element 32.
  • the support element 32 has support feet 35, 36 which are introduced into a further groove 43, 44.
  • Deformable plastic noses are preferably formed in the further groove 43, 44 to mechanically fix the support feet 35, 36 m serve the further groove 43, 44.
  • the further groove 43, 44 is preferably connected to the groove 12, so that the sealing compound 14 also penetrates into the further groove 43, 44. If the sealing compound is preferably designed as a sealing adhesive compound, simple mechanical fixing of the support element is thus ensured.
  • FIG. 6 shows a manufacturing step in the manufacture of the sensor device according to FIG. 3.
  • the support element 32 has a splash guard wall 33 from which one of the connection elements 30, 31 is led out.
  • the temperature sensor is placed on the lead frame in such a way that the connection elements 30, 31 come into contact with the contact surfaces 26, 27 of the lead frame 20.
  • the connecting element 30 is permanently connected to the contact surface 26 in an electrically conductive manner by producing a welded connection.
  • the sensor element 7 and the signal processing unit 6 are arranged and, if appropriate, already encapsulated with the sealing compound 11.
  • a welding device has a welding electrode 41 and a welding wall 40.
  • the welding wall 40 is brought into contact with the splash protection wall 33 for welding, as shown in FIG. 6, and subsequently or at the same time the welding electrode 41 is connected to the connecting element 30 and / or the contact surface 26 in Brought in contact.
  • hot particles can jump off the contact surface 26 or the connecting element 30.
  • the splash guard wall 33 and the welding wall 40 cooperating with it reliably prevent the hot particles from jumping onto the sensor element 7 or the signal processing unit 6 or the sealing compound 11. This will damage the sensor element or the signal processing unit reliably prevented.
  • the splash guard 33 is preferably made of plastic.

Abstract

The invention relates to a stamped grid (20) by which electric tracks (22, 23, 24, 25) are configured. Said grid is produced from a base material on one side of which an additional material that is suitable for bonding is applied in defined zones (21). A contact surface (26, 27) is formed by U bending a zone of the stamped grid (20), the side of the stamped grid (20) that is provided with the additional material being on the concave side (28, 28a) of the U-bent zone.

Description

Beschreibungdescription
Stanzgitterlead frame
Die Erfindung betrifft ein Stanzgitter, durch das metallische Leiterbahnen zum Verbinden von elektrischen Bauelementen ausgebildet sind. Bei den Bauelementen kann es sich um einzelne Bauelemente handeln oder um vollständige integrierte Schaltungen.The invention relates to a leadframe through which metallic conductor tracks are formed for connecting electrical components. The components can be individual components or completely integrated circuits.
Ein Stanzgitter ist beispielsweise aus der DE 44 30 798 AI bekannt. Das bekannte Stanzgitter bildet elektrische Leiterbahnen aus und besteht aus einem Grundmaterial, auf das in vorgegebenen Bereichen, so zum Beispiel im Bereich von An- schlußstiften, ein Zusatzmaterial aufgebracht ist.A lead frame is known for example from DE 44 30 798 AI. The known leadframe forms electrical conductor tracks and consists of a base material to which an additional material is applied in predetermined areas, for example in the area of connecting pins.
Werden auf einem derartigen Stanzgitter integrierte Schaltkreise kontaktiert, so geschieht das üblicherweise mittels einer sogenannten Bond-Verbindung. Da zum Bonden ein relativ teures Metall, z.B. Aluminium, benötigt wird, wird das Stanzgitter im Bereich, in dem die Bondverbindungen erfolgen sollen, mit dem Zusatzmaterial, z.B. Aluminium, plattiert. Das Zusatzmaterial, das zum Bonden geeignet ist, hat den Nachteil, daß es ungeeignet ist zum Anbringen von Schweißverbin- düngen. Es kann jedoch notwendig sein, daß im Bereich des mit dem Zusatzmaterial plattierten Stanzgitters auch Schweißverbindungen angebracht werden müssen.If integrated circuits are contacted on such a lead frame, this is usually done by means of a so-called bond connection. Since a relatively expensive metal, e.g. Aluminum, is required, the lead frame in the area where the bond connections are to be made with the additional material, e.g. Aluminum, plated. The additional material that is suitable for bonding has the disadvantage that it is unsuitable for attaching welded joints. However, it may be necessary that welded connections must also be made in the area of the lead frame plated with the additional material.
Die Aufgabe der Erfindung ist es, das bekannte Stanzgitter so weiter zu bilden, daß Schweißverbindungen an beliebiger Stelle des Stanzgitters ausgebildet werden können.The object of the invention is to develop the known lead frame so that welded connections can be formed at any point on the lead frame.
Die Aufgabe wird erfindungsgemäß gelöst durch die Merkmale des unabhängigen Patentanspruchs 1. Vorteilhafte Ausgestal- tungen der Erfindung sind in den Unteransprüchen gekennzeichnet . Ausfuhrungsbeispiele der Erfindung sind anhand der schematischen Zeichnungen naher erläutert. Es zeigen:The object is achieved according to the invention by the features of independent patent claim 1. Advantageous refinements of the invention are characterized in the subclaims. Exemplary embodiments of the invention are explained in more detail with reference to the schematic drawings. Show it:
Figur 1 ein Stanzgitter, Figur 2 einen Schnitt durch das Stanzgitter gemäß Figur 1 entlang einer Linie II-II',1 shows a lead frame, FIG. 2 shows a section through the lead frame according to FIG. 1 along a line II-II ',
Figur 3 eine erste Ansicht einer Sensoreinrichtung,FIG. 3 shows a first view of a sensor device,
Figur 4 eine zweite Ansicht einer Sensoreinrichtung,FIG. 4 shows a second view of a sensor device,
Figur 5 einen Schnitt durch die Sensoreinrichtung gemäß Fi- gur 2 entlang einer Linie V-Vλ,FIG. 5 shows a section through the sensor device according to FIG. 2 along a line VV λ ,
Elemente gleicher Konstruktion und Funktion sind figurenuber- greifend mit den gleichen Bezugszeichen versehen.Elements of the same construction and function are provided with the same reference symbols in all figures.
Ein Stanzgitter 20 (Figur 1) ist aus einem plattenformigenA lead frame 20 (Figure 1) is made of a plate
Grundmaterial hergestellt, auf das m vorgegebenen Bereichen (21) einseitig ein Zusatzmaterial aufgebracht ist. Das Zu- satzmaterial ist so gewählt, daß es zum Herstellen von Bond- verbindungen geeignet ist. Das Zusatzmaterial ist plattenfor- mig auf das Grundmaterial aufgebracht und mit diesem beispielsweise verschweißt oder auf andere Art und Weise dauerhaft verbunden. Das Grundmaterial ist vorzugsweise aus einer Kupfer-Legierung ausgebildet. Das Zusatzmaterial ist vorzugsweise aus einer Aluminium-Legierung ausgebildet.Base material produced, on the m predetermined areas (21) an additional material is applied on one side. The additional material is selected so that it is suitable for producing bond connections. The additional material is applied to the base material in the form of a plate and, for example, welded to it or permanently connected in some other way. The base material is preferably made of a copper alloy. The additional material is preferably formed from an aluminum alloy.
Durch Stanzen des Grundmaterials und des Zusatzmatenals wird das Stanzgitter hergestellt. Durch das Stanzgitter 20 sind Leiterbahnen 22, 23, 24, 25 ausgebildet, wobei der Bereich 21 beispielsweise mit dem Zusatzmaterial plattiert ist, so daß m diesem Bereich ein integrierter Schaltkreis durch Bondver- bmdungen elektrisch kontaktiert werden kann.The lead frame is produced by punching the base material and the additional material. Conductor tracks 22, 23, 24, 25 are formed by the leadframe 20, the area 21 being clad, for example, with the additional material, so that an integrated circuit can be electrically contacted in this area by means of bonded connections.
Durch U-formiges Biegen des Stanzgitters wird, wie in Figur 2 dargestellt, eine Kontaktflache 26, 27 gebildet. Dabei wird das Stanzgitter derart U-formig gebogen, daß die mit dem Zusatzmaterial versehene Seite des Stanzgitters auf der konkaven Seite (28, 28a) des U-formig gebogenen Bereichs ist. Die Kontaktflache ist dabei bevorzugt auf der Seite des Stanzgitters ausgebildet, auf der im unverbogenen Zustand des Stanzgitters das Zusatzmaterial angebracht ist. So können einseitig auf das Stanzgitter sowohl ein integrierter Schaltkreis, der beispielsweise als anwenderspezifischer IC (ASIC) mit einem mikromechanischen Sensorelement ausgebildet ist, als auch ein weiteres Bauelement angebracht werden. Das weitere Bauelement kann durch eine Schweißverbindung auf die Kontaktflache 26, 27 mit seinen Anschlußelementen geschweißt werden.As shown in FIG. 2, a contact surface 26, 27 is formed by U-shaped bending of the lead frame. The lead frame is bent in a U-shape in such a way that the side of the lead frame provided with the additional material is on the concave side (28, 28a) of the U-shaped region. The The contact surface is preferably formed on the side of the lead frame on which the additional material is attached when the lead frame is not bent. An integrated circuit, which is designed, for example, as a user-specific IC (ASIC) with a micromechanical sensor element, as well as a further component can be attached to the lead frame on one side. The further component can be welded to the contact surface 26, 27 with its connecting elements by a welded connection.
Durch das U-formige Biegen des Bereiches ist die Kontaktflache 26, 27 vorteilhaft zur Punkt-Kontaktierung eines Anschlußelementes ausgebildet. Dadurch ist eine hochwertige Schweißverbindung möglich. Das erfindungsgemaße Stanzgitter ermöglicht eine einfache und äußerst kompakte Anordnung von Bauelementen, die mittels Bondverbindungen mit dem Stanzgitter verbunden werden und anderen Bauelementen, die mittels Schweißverbindungen mit dem Stanzgitter verbunden werden.Due to the U-shaped bending of the area, the contact surface 26, 27 is advantageously designed for point contacting of a connection element. This enables a high quality welded joint. The lead frame according to the invention enables a simple and extremely compact arrangement of components which are connected to the lead frame by means of bond connections and other components which are connected to the lead frame by means of welded connections.
Bevorzugt ist das Stanzgitter in einer Sensoreinrichtung angeordnet. Die Sensoreinrichtung (Figur 3) umfaßt ein Gehauseteil 1, das emstuckig mit einem Steckerteil 2 ausgebildet ist. Ferner ist in dem Gehauseteil 1 eine Kammer 4 ausgebildet, m der ein Sensor angeordnet ist. Der Sensor umfaßt ein Sensorelement 7 und eine Signalverarbeitungseinheit 6. DerThe lead frame is preferably arranged in a sensor device. The sensor device (FIG. 3) comprises a housing part 1 which is formed in one piece with a plug part 2. Furthermore, a chamber 4, in which a sensor is arranged, is formed in the housing part 1. The sensor comprises a sensor element 7 and a signal processing unit 6
Sensor ist vorzugsweise als mikromechanischer Halbleitersen- sor ausgebildet und ist in der bevorzugten Ausfuhrungsform ein Drucksensor.The sensor is preferably designed as a micromechanical semiconductor sensor and, in the preferred embodiment, is a pressure sensor.
Die Signalverarbeitungseinheit 6 umfaßt eine Schaltungsanordnung zum Erzeugen eines Ausgangssignales abhangig von einem Meßsignal des Sensorelements 7. Ferner umfaßt die Signalverarbeitungseinheit 6 Speichermittel zum Abspeichern einer Kennlinie, in der Werte des Ausgangssignals abhangig von dem Meßsignal aufgetragen sind. Bevorzugt speichern die Speicher- mittel auch Korrekturwerte zum Korrigieren des Meßsignals oder des Ausgangssignals. Die Signalverarbeitungseinheit kann beispielsweise als ein anwenderspezifischer ACE (Asic) ausgebildet sein. Die Signalverarbeitungseinheit ist elektrisch leitend mit Kontakten des Steckerteils verbunden, die einerseits mit einer Stromversorgung kontaktierbar sind und andererseits zum Übertragen des Ausgangssignals der Signalverarbeitungseinheit 6 kontaktierbar sind. Ferner ist mindestens ein Kontaktelement 8 (in Figur 1 drei Kontaktelemente) vorgesehen, die durch die Kammer 4 hin zu einer Nut 12 geführt sind. Das Kontaktelement 8 ist elektrisch leitend mit der Signalverarbeitungseinheit 6 verbunden, bevorzugt über Bondverbindungen. Das Kontaktelement 8 ist Bestandteil des Stanzgitters 20.The signal processing unit 6 comprises a circuit arrangement for generating an output signal as a function of a measurement signal from the sensor element 7. Furthermore, the signal processing unit 6 includes storage means for storing a characteristic curve in which values of the output signal are plotted as a function of the measurement signal. The storage means preferably also store correction values for correcting the measurement signal or the output signal. The signal processing unit can be designed, for example, as a user-specific ACE (Asic). The signal processing unit is electrically conductively connected to contacts of the plug part, which on the one hand can be contacted with a power supply and on the other hand can be contacted for transmitting the output signal of the signal processing unit 6. Furthermore, at least one contact element 8 (three contact elements in FIG. 1) is provided, which are guided through the chamber 4 to a groove 12. The contact element 8 is electrically conductively connected to the signal processing unit 6, preferably via bond connections. The contact element 8 is part of the lead frame 20.
Die Nut 12 ist in dem Gehäuseteil 1 ausgebildet und umfaßt die Kammer 4. Auf das Sensorelement 7 und die Signalverarbeitungseinheit 6 ist eine Vergußmasse 11 aufgebracht, die beispielsweise aus Silicongel ausgebildet ist. Die Vergußmasse schützt das Sensorelement 7 und die Signalverarbeitungsein- heit gegenüber einem chemisch aggressiven Arbeitsmedium, dem die Sensoreinrichtung gegebenenfalls ausgesetzt ist. Ferner schützt die Vergußmasse 11 auch gegenüber mechanischen Beschädigungen. Das Sensorelement 7 und die Signalverarbeitungseinheit 6 sind dabei so mit der Vergußmasse 11 vergoßen, daß das mindestens eine Kontaktelement 8 im Bereich der Kammer 4 und die durch Bonddrähte hergestellte elektrische Kon- taktierung zur Signalverarbeitungseinheit ebenfalls von der Vergußmasse 11- umspritzt sind.The groove 12 is formed in the housing part 1 and comprises the chamber 4. A potting compound 11 is applied to the sensor element 7 and the signal processing unit 6 and is made, for example, of silicone gel. The potting compound protects the sensor element 7 and the signal processing unit against a chemically aggressive working medium to which the sensor device may be exposed. The potting compound 11 also protects against mechanical damage. The sensor element 7 and the signal processing unit 6 are encapsulated with the potting compound 11 in such a way that the at least one contact element 8 in the region of the chamber 4 and the electrical contact to the signal processing unit produced by bonding wires are also encapsulated by the potting compound 11.
In der Nut 12 ist bei dem Kontaktelement 8 ein Kontaktbereich 9 ausgebildet, der zum Kontaktieren von Nadeladaptern einer Kalibriervorrichtung geeignet ist.A contact area 9 is formed in the groove 12 in the contact element 8, which is suitable for contacting needle adapters of a calibration device.
Die Sensoreinrichtung weist ferner einen Deckel 16 (siehe Fi- gur 2 - 5) auf, der in die Nut 12 eingebracht ist. Der Deckel 16 wird nach dem Kalibrieren des Sensors in die Nut 12 eingebracht. Davor wird eine Dichtmasse 14 in die Nut 12 einge- bracht, die den Kontaktbereich 9 isoliert und gleichzeitig als Dichtung für den Deckel 16 ausgebildet ist. Somit ist gewahrleistet, daß der Kontaktbereich 9 nach dem Einbringen der Dichtmasse 14 nicht mehr elektrisch kontaktierbar ist und gleichzeitig vor Korrosion geschützt ist. Dadurch kann sichergestellt werden, daß wahrend des Betriebes der Sensoreinrichtung keine störenden Signale über das Kontaktelement 8 übertragen werden, die zu einer Verfälschung der gespeicherten Kalibrierdaten beitragen konnte.The sensor device also has a cover 16 (see FIGS. 2-5) which is introduced into the groove 12. The cover 16 is inserted into the groove 12 after the sensor has been calibrated. Before that, a sealing compound 14 is inserted into the groove 12. brings that isolates the contact area 9 and is simultaneously formed as a seal for the lid 16. This ensures that the contact area 9 can no longer be electrically contacted after the sealing compound 14 has been introduced and is simultaneously protected against corrosion. This can ensure that no disturbing signals are transmitted via the contact element 8 during operation of the sensor device, which could contribute to falsification of the stored calibration data.
Die Dichtmasse 12 tragt gleichzeitig dazu bei, daß das Gehauseteil 1 und der Deckel 16 dicht miteinander verbunden sind. Der Deckel ist vorzugsweise als Stutzen mit einer Öffnung hin zu dem Arbeitsmedium ausgebildet, das beispielsweise die Luft m einem Sammler einer Brennkraftmaschine ist.The sealing compound 12 also contributes to the fact that the housing part 1 and the cover 16 are tightly connected to one another. The cover is preferably designed as a nozzle with an opening to the working medium, which is, for example, the air in a collector of an internal combustion engine.
Durch die beschriebene Anordnung ist gewährleistet, daß die Kammer 4 nur mit dem Arbeitsmedium kommuniziert. Vorteilhaft ist, wenn die Dichtmasse 14 als Dicht-Klebemasse ausgebildet ist und der Deckel 16 in die Nut eingeklebt ist. Dadurch kann eine sonst zusatzliche mechanische Befestigung des Deckels 16 an dem Gehauseteil 1 entfallen. Das Arbeitsmedium ist das Medium m dem die jeweilige Meßgroße erfaßt werden soll. Bei einer als Saugrohrdrucksensor ausgebildeten Sensoreinrichtung ist dies die Luft im Sammler des Ansaugtraktes der Brennkraftmaschine .The arrangement described ensures that the chamber 4 communicates only with the working medium. It is advantageous if the sealing compound 14 is designed as a sealing adhesive and the cover 16 is glued into the groove. As a result, an additional mechanical fastening of the cover 16 to the housing part 1 can be omitted. The working medium is the medium m which the respective measured quantity is to be recorded. In the case of a sensor device designed as an intake manifold pressure sensor, this is the air in the collector of the intake tract of the internal combustion engine.
In einer komfortableren Ausfuhrungsform der Erfindung (Figur 5) weist die Sensoreinrichtung ein elektrisches Bauelement auf, das ausgebildet ist als Temperatursensor. Der Temperatursensor weist ein Temperatur-Sensorelement 29 auf, das über Anschlußelemente 30, 31 verfugt, die in einem Bereich frei gefuhrt sind und anschließend m einem Stutzelement 32 gefuhrt sind. Das Stutzelement 32 weist Stutzfuße 35, 36 auf, die in eine weitere Nut 43, 44 eingebracht sind. In der weiteren Nut 43, 44 sind vorzugsweise verformbare Kunststoffnasen ausgebildet, die der mechanischen Fixierung der Stutzfuße 35, 36 m der weiteren Nut 43, 44 dienen. Bevorzugt ist die weitere Nut 43, 44 mit der Nut 12 verbunden, so daß die Dichtmasse 14 ebenfalls in die weitere Nut 43, 44 eindringt. Ist die Dichtmasse bevorzugt als Dicht-Klebemasse ausgebil- det, so ist damit eine einfache mechanische Fixierung des Stutzelements gewahrleistet.In a more convenient embodiment of the invention (FIG. 5), the sensor device has an electrical component which is designed as a temperature sensor. The temperature sensor has a temperature sensor element 29 which has connection elements 30, 31 which are freely guided in an area and are subsequently guided in a support element 32. The support element 32 has support feet 35, 36 which are introduced into a further groove 43, 44. Deformable plastic noses are preferably formed in the further groove 43, 44 to mechanically fix the support feet 35, 36 m serve the further groove 43, 44. The further groove 43, 44 is preferably connected to the groove 12, so that the sealing compound 14 also penetrates into the further groove 43, 44. If the sealing compound is preferably designed as a sealing adhesive compound, simple mechanical fixing of the support element is thus ensured.
Figur 6 stellt einen Fertigungsschritt beim Herstellen der Sensoreinrichtung gemäß Figur 3 dar. Das Stutzelement 32 weist dabei eine Spritzschutzwand 33 auf, aus der eines der Anschlußelemente 30, 31 herausgeführt ist.FIG. 6 shows a manufacturing step in the manufacture of the sensor device according to FIG. 3. The support element 32 has a splash guard wall 33 from which one of the connection elements 30, 31 is led out.
Der Temperatursensor wird auf das Stanzgitter so aufgesetzt, daß die Anschlußelemente 30, 31 zur Anlage mit den Kontakt- flachen 26, 27 des Stanzgitters 20 kommen. Das Anschlußelement 30 wird durch Herstellen einer Schweißverbindung elektrisch leitend mit der Kontaktflache 26 dauerhaft verbunden.The temperature sensor is placed on the lead frame in such a way that the connection elements 30, 31 come into contact with the contact surfaces 26, 27 of the lead frame 20. The connecting element 30 is permanently connected to the contact surface 26 in an electrically conductive manner by producing a welded connection.
Jenseits der Spritzschutzwand 33, gesehen von der Seite der Kontaktflache 26, ist das Sensorelement 7 und die Signalverarbeitungseinheit 6 angeordnet und gegebenenfalls bereits mit der Vergußmasse 11 umspritzt.Beyond the splash guard wall 33, seen from the side of the contact surface 26, the sensor element 7 and the signal processing unit 6 are arranged and, if appropriate, already encapsulated with the sealing compound 11.
Eine Schweißvorrichtung hat eine Schweißelektrode 41 und eine Schweißwand 40. Die Schweißwand 40 wird zum Schweißen, wie m Figur 6 dargestellt, mit der Spritzschutzwand 33 in Kontakt gebracht und anschließend oder gleichzeitig wird die Schweißelektrode 41 mit dem Anschlußelement 30 und/oder der Kontaktflache 26 in Kontakt gebracht. Bei dem anschließenden Schweißvorgang können heiße Partikel von der Kontaktflache 26 oder dem Anschlußelement 30 abspringen. Durch die Spritzschutzwand 33 und die mit ihr zusammenwirkende Schweißwand 40 wird jedoch zuverlässig ein überspringen der heißen Partikel auf das Sensorelement 7 oder die Signalverarbeitungseinheit 6 oder die Vergußmasse 11 verhindert. Dadurch wird eine Beschädigung des Sensorelements oder der Signalverarbeitungseinheit zuverlässig verhindert. Die Spritzschutzwand 33 ist vorzugsweise aus Kunststoff ausgebildet. A welding device has a welding electrode 41 and a welding wall 40. The welding wall 40 is brought into contact with the splash protection wall 33 for welding, as shown in FIG. 6, and subsequently or at the same time the welding electrode 41 is connected to the connecting element 30 and / or the contact surface 26 in Brought in contact. During the subsequent welding process, hot particles can jump off the contact surface 26 or the connecting element 30. The splash guard wall 33 and the welding wall 40 cooperating with it reliably prevent the hot particles from jumping onto the sensor element 7 or the signal processing unit 6 or the sealing compound 11. This will damage the sensor element or the signal processing unit reliably prevented. The splash guard 33 is preferably made of plastic.

Claims

Patentansprüche claims
1. Stanzgitter, durch das elektrische Leiterbahnen (22,23,24, 25) ausgebildet sind und das ein Grundmaterial hat, auf das in vorgegebenen Bereichen (21) einseitig ein Zusatzmaterial aufgebracht ist, das zum Bonden geeignet ist, dadurch gekennzeichnet, daß eine Kontaktflache (26,27) gebildet wird durch U-formiges Biegen eines Bereichs des Stanzgitters, wobei die mit dem Zusatzmaterial versehene Seite des Stanzgitters auf der konkaven Seite (28,28a) des U-formig gebogenen Bereichs1. Punching grid, through which electrical conductor tracks (22, 23, 24, 25) are formed and which has a base material, to which an additional material is applied on one side in predetermined areas (21) and is suitable for bonding, characterized in that a Contact surface (26, 27) is formed by U-shaped bending of a region of the lead frame, the side of the lead frame provided with the additional material being on the concave side (28, 28 a) of the U-shaped region
2. Stanzgitter nach Anspruch 1, dadurch gekennzeichnet, daß die Kontaktflache (26,27) auf der Seite des Stanzgitters aus- gebildet ist, auf der im unverbogenenen Zustand des Stanzgitters das Zusatzmaterial angebracht ist.2. lead frame according to claim 1, characterized in that the contact surface (26, 27) is formed on the side of the lead frame on which the additional material is attached in the unbent state of the lead frame.
3. Stanzgitter nach einem der vorstehenden Ansprüche, dadurch gekennzeichnet, daß das Zusatzmaterial eine Aluminium - Legierung ist.3. Punching grid according to one of the preceding claims, characterized in that the additional material is an aluminum alloy.
4. Stanzgitter nach einem der vorstehenden Ansprüche, dadurch gekennzeichnet, daß das das Grundmaterial eine Kupfer- Legierung ist.4. Punching grid according to one of the preceding claims, characterized in that the base material is a copper alloy.
5. Vorrichtung mit einem Stanzgitter nach einem der vorstehenden Ansprüche, dadurch gekennzeichnet, dass sie ein Bauelement mit einem Anschlusselement (30,31) aufweist, das in einem Teilbereich in einem Stutzelement (32) gefuhrt ist und das auf die Kontaktflache (26,27) geschweißt ist, wobei das Stutzelement (32) mindestens eine Spritzschutzwand (33) umfaßt, die derart mit einer Schweißvorrichtung zusammenwirkt, daß beim Anschweißen des Anschlußelementes (30,31) auf die Kontaktflache (26,27) ein Überspringen von Partikeln auf e n Element verhindert wird, das auf dem Stanzgitter angeordnet 5. Device with a lead frame according to one of the preceding claims, characterized in that it has a component with a connecting element (30,31) which is guided in a partial area in a support element (32) and on the contact surface (26,27 ) is welded, the support element (32) comprising at least one splash protection wall (33) which interacts with a welding device in such a way that when the connecting element (30, 31) is welded onto the contact surface (26, 27), particles jump over onto the element is prevented, which is arranged on the lead frame
PCT/DE2000/002687 1999-08-17 2000-08-10 Stamped grid WO2001013685A1 (en)

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Application Number Priority Date Filing Date Title
DE19938867.9 1999-08-17
DE1999138867 DE19938867C1 (en) 1999-08-17 1999-08-17 Blanking grid for forming metal conductor paths to electrical component of fully integrated circuits

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WO2001013685A1 true WO2001013685A1 (en) 2001-02-22

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Citations (8)

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US3810300A (en) * 1969-05-20 1974-05-14 Ferranti Ltd Electrical circuit assemblies
GB2073622A (en) * 1980-04-16 1981-10-21 Telemecanique Electrique Applying contacts to conductors
EP0058761A2 (en) * 1981-02-19 1982-09-01 Siemens Aktiengesellschaft Lead frame for resin-encapsulated electrical devices
EP0456887A2 (en) * 1990-05-12 1991-11-21 VDO Adolf Schindling AG Electrical circuit
US5329159A (en) * 1993-08-03 1994-07-12 Motorola, Inc. Semiconductor device employing an aluminum clad leadframe
DE4430798A1 (en) * 1994-08-30 1996-03-07 Siemens Ag Lead frame for connecting electrical components
DE19707709C1 (en) * 1997-02-26 1998-04-16 Siemens Ag Relay modules circuit board e.g. for automobile
US5886404A (en) * 1996-06-18 1999-03-23 Lg Semicon Co., Ltd. Bottom lead semiconductor package having folded leads

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Publication number Priority date Publication date Assignee Title
DE9100998U1 (en) * 1991-01-29 1991-04-18 Siemens Ag, 8000 Muenchen, De
DE4342369C1 (en) * 1993-12-10 1995-06-01 Duerrwaechter E Dr Doduco Hybrid circuit terminal frame
DE4432191C1 (en) * 1994-09-09 1996-01-18 Siemens Ag Process for welding component connections to the contacts of a printed circuit board and assembly manufactured using this process

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3810300A (en) * 1969-05-20 1974-05-14 Ferranti Ltd Electrical circuit assemblies
GB2073622A (en) * 1980-04-16 1981-10-21 Telemecanique Electrique Applying contacts to conductors
EP0058761A2 (en) * 1981-02-19 1982-09-01 Siemens Aktiengesellschaft Lead frame for resin-encapsulated electrical devices
EP0456887A2 (en) * 1990-05-12 1991-11-21 VDO Adolf Schindling AG Electrical circuit
US5329159A (en) * 1993-08-03 1994-07-12 Motorola, Inc. Semiconductor device employing an aluminum clad leadframe
DE4430798A1 (en) * 1994-08-30 1996-03-07 Siemens Ag Lead frame for connecting electrical components
US5886404A (en) * 1996-06-18 1999-03-23 Lg Semicon Co., Ltd. Bottom lead semiconductor package having folded leads
DE19707709C1 (en) * 1997-02-26 1998-04-16 Siemens Ag Relay modules circuit board e.g. for automobile

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