WO2001009980A3 - Controlled compliance fine pitch interconnect - Google Patents
Controlled compliance fine pitch interconnect Download PDFInfo
- Publication number
- WO2001009980A3 WO2001009980A3 PCT/US2000/020748 US0020748W WO0109980A3 WO 2001009980 A3 WO2001009980 A3 WO 2001009980A3 US 0020748 W US0020748 W US 0020748W WO 0109980 A3 WO0109980 A3 WO 0109980A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electrical contacts
- circuit
- electrical
- housing
- circuit member
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
- H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
- H01R12/523—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board
Abstract
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/031,422 US6830460B1 (en) | 1999-08-02 | 2000-07-31 | Controlled compliance fine pitch interconnect |
EP00955283A EP1204988A2 (en) | 1999-08-02 | 2000-07-31 | Controlled compliance fine pitch interconnect |
AU67509/00A AU6750900A (en) | 1999-08-02 | 2000-07-31 | Controlled compliance fine pitch interconnect |
JP2001514505A JP2003506833A (en) | 1999-08-02 | 2000-07-31 | Fine pitch wiring with controlled compliance |
US10/992,482 US7160119B2 (en) | 1999-08-02 | 2004-11-17 | Controlled compliance fine pitch electrical interconnect |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14682599P | 1999-08-02 | 1999-08-02 | |
US60/146,825 | 1999-08-02 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10031422 A-371-Of-International | 2000-07-31 | ||
US10/992,482 Division US7160119B2 (en) | 1999-08-02 | 2004-11-17 | Controlled compliance fine pitch electrical interconnect |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2001009980A2 WO2001009980A2 (en) | 2001-02-08 |
WO2001009980A3 true WO2001009980A3 (en) | 2001-08-30 |
Family
ID=22519150
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2000/020748 WO2001009980A2 (en) | 1999-08-02 | 2000-07-31 | Controlled compliance fine pitch interconnect |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1204988A2 (en) |
JP (1) | JP2003506833A (en) |
AU (1) | AU6750900A (en) |
WO (1) | WO2001009980A2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7900347B2 (en) | 2000-01-20 | 2011-03-08 | Cascade Microtech, Inc. | Method of making a compliant interconnect assembly |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6409521B1 (en) | 1997-05-06 | 2002-06-25 | Gryphics, Inc. | Multi-mode compliant connector and replaceable chip module utilizing the same |
DE60016563T2 (en) | 1999-02-02 | 2005-05-12 | Gryphics, Inc., Plymouth | CONNECTORS WITH LOW OR LOW MOUNTING POWER FOR PCB AND ELECTRICAL DEVICES |
US6830460B1 (en) | 1999-08-02 | 2004-12-14 | Gryphics, Inc. | Controlled compliance fine pitch interconnect |
JP2003315361A (en) * | 2002-04-26 | 2003-11-06 | Japan Electronic Materials Corp | Manufacturing method of probe, mask for manufacturing probe and probe |
EP1642364A1 (en) | 2003-07-07 | 2006-04-05 | Gryphics, Inc. | Normally closed zero insertion force connector |
DE102004027886A1 (en) * | 2004-05-28 | 2005-12-22 | Feinmetall Gmbh | Test device for electrical testing of a test specimen and method for producing a test device |
JP4838658B2 (en) * | 2006-08-01 | 2011-12-14 | 日本電産リード株式会社 | Substrate inspection jig and electrode structure of substrate inspection jig |
JP2010145381A (en) * | 2008-12-22 | 2010-07-01 | Nippon Mektron Ltd | Substrate inspection apparatus, and method of manufacturing inspection jig |
JP2013002976A (en) * | 2011-06-17 | 2013-01-07 | Hioki Ee Corp | Probe unit, circuit board inspection device and probe unit manufacturing method |
KR20140020627A (en) * | 2012-08-10 | 2014-02-19 | 삼성전기주식회사 | Method of manufacturing for electric inspection jig |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4118090A (en) * | 1977-05-23 | 1978-10-03 | Luigi Giovanni Del Mei | Electrical contact devices |
EP0310302A2 (en) * | 1987-09-25 | 1989-04-05 | Minnesota Mining And Manufacturing Company | Multipurpose socket |
US5252916A (en) * | 1992-01-27 | 1993-10-12 | Everett Charles Technologies, Inc. | Pneumatic test fixture with springless test probes |
US5299090A (en) * | 1993-06-29 | 1994-03-29 | At&T Bell Laboratories | Pin-fin heat sink |
US5410260A (en) * | 1992-11-09 | 1995-04-25 | Nhk Spring Co., Ltd. | Coil spring-pressed needle contact probe |
US5412329A (en) * | 1991-11-18 | 1995-05-02 | Tokyo Electron Yamanashi Limited | Probe card |
US5521519A (en) * | 1992-07-30 | 1996-05-28 | International Business Machines Corporation | Spring probe with piloted and headed contact and method of tip formation |
US5637539A (en) * | 1996-01-16 | 1997-06-10 | Cornell Research Foundation, Inc. | Vacuum microelectronic devices with multiple planar electrodes |
US5723347A (en) * | 1993-09-30 | 1998-03-03 | International Business Machines Corp. | Semi-conductor chip test probe and process for manufacturing the probe |
WO1998013695A1 (en) * | 1996-09-26 | 1998-04-02 | Primeyield Systems, Inc. | Grid array package test contactor |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61118977A (en) * | 1984-11-13 | 1986-06-06 | シチズン時計株式会社 | Multi-electrode connector construction |
JP3400051B2 (en) * | 1993-11-10 | 2003-04-28 | ザ ウィタカー コーポレーション | Anisotropic conductive film, method of manufacturing the same, and connector using the same |
JP2602623B2 (en) * | 1993-12-17 | 1997-04-23 | 山一電機株式会社 | IC socket |
JPH0973934A (en) * | 1995-09-01 | 1997-03-18 | Whitaker Corp:The | Connector |
JP3640268B2 (en) * | 1995-10-06 | 2005-04-20 | ザ ウィタカー コーポレーション | Connector and connector manufacturing method |
JP4040206B2 (en) * | 1999-04-28 | 2008-01-30 | 信越ポリマー株式会社 | Electrical connector |
-
2000
- 2000-07-31 EP EP00955283A patent/EP1204988A2/en not_active Withdrawn
- 2000-07-31 JP JP2001514505A patent/JP2003506833A/en active Pending
- 2000-07-31 AU AU67509/00A patent/AU6750900A/en not_active Abandoned
- 2000-07-31 WO PCT/US2000/020748 patent/WO2001009980A2/en active Application Filing
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4118090A (en) * | 1977-05-23 | 1978-10-03 | Luigi Giovanni Del Mei | Electrical contact devices |
EP0310302A2 (en) * | 1987-09-25 | 1989-04-05 | Minnesota Mining And Manufacturing Company | Multipurpose socket |
US5412329A (en) * | 1991-11-18 | 1995-05-02 | Tokyo Electron Yamanashi Limited | Probe card |
US5252916A (en) * | 1992-01-27 | 1993-10-12 | Everett Charles Technologies, Inc. | Pneumatic test fixture with springless test probes |
US5521519A (en) * | 1992-07-30 | 1996-05-28 | International Business Machines Corporation | Spring probe with piloted and headed contact and method of tip formation |
US5410260A (en) * | 1992-11-09 | 1995-04-25 | Nhk Spring Co., Ltd. | Coil spring-pressed needle contact probe |
US5299090A (en) * | 1993-06-29 | 1994-03-29 | At&T Bell Laboratories | Pin-fin heat sink |
US5723347A (en) * | 1993-09-30 | 1998-03-03 | International Business Machines Corp. | Semi-conductor chip test probe and process for manufacturing the probe |
US5637539A (en) * | 1996-01-16 | 1997-06-10 | Cornell Research Foundation, Inc. | Vacuum microelectronic devices with multiple planar electrodes |
WO1998013695A1 (en) * | 1996-09-26 | 1998-04-02 | Primeyield Systems, Inc. | Grid array package test contactor |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7900347B2 (en) | 2000-01-20 | 2011-03-08 | Cascade Microtech, Inc. | Method of making a compliant interconnect assembly |
Also Published As
Publication number | Publication date |
---|---|
WO2001009980A2 (en) | 2001-02-08 |
AU6750900A (en) | 2001-02-19 |
EP1204988A2 (en) | 2002-05-15 |
JP2003506833A (en) | 2003-02-18 |
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