WO2001009980A3 - Controlled compliance fine pitch interconnect - Google Patents

Controlled compliance fine pitch interconnect Download PDF

Info

Publication number
WO2001009980A3
WO2001009980A3 PCT/US2000/020748 US0020748W WO0109980A3 WO 2001009980 A3 WO2001009980 A3 WO 2001009980A3 US 0020748 W US0020748 W US 0020748W WO 0109980 A3 WO0109980 A3 WO 0109980A3
Authority
WO
WIPO (PCT)
Prior art keywords
electrical contacts
circuit
electrical
housing
circuit member
Prior art date
Application number
PCT/US2000/020748
Other languages
French (fr)
Other versions
WO2001009980A2 (en
Inventor
James J Rathburn
Original Assignee
Gryphics Inc
James J Rathburn
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gryphics Inc, James J Rathburn filed Critical Gryphics Inc
Priority to US10/031,422 priority Critical patent/US6830460B1/en
Priority to EP00955283A priority patent/EP1204988A2/en
Priority to AU67509/00A priority patent/AU6750900A/en
Priority to JP2001514505A priority patent/JP2003506833A/en
Publication of WO2001009980A2 publication Critical patent/WO2001009980A2/en
Publication of WO2001009980A3 publication Critical patent/WO2001009980A3/en
Priority to US10/992,482 priority patent/US7160119B2/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733Geometry aspects
    • G01R1/06738Geometry aspects related to tip portion
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/51Fixed connections for rigid printed circuits or like structures
    • H01R12/52Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/523Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board

Abstract

A method and apparatus for achieving a very fine pitch interconnect between a flexible circuit member and another circuit member with extremely co-planar electrical contacts that have a large range of compliance. An electrical interconnect assembly that can be used as a die-level test probe, a wafer probe, and a printed circuit probe is also disclosed. The second circuit member can be a printed circuit board, another flexible circuit, a bare-die device, an integrated circuit device, an organic or inorganic substrate, a rigid circuit and virtually any other type of electrical component. A plurality of electrical contacts are arranged in a housing. The electrical contacts may be arranged randomly or in a one or two-dimensional array. The housing acts as a receptacle to individually locate and generally align the electrical contacts, while preventing adjacent contacts from touching. The first ends of the electrical contacts are electrically coupled to a flexible circuit member. The electrical contacts are free to move along a central axis within the housing. The second ends of the electrical contacts are free to electrically couple with one or more second circuit members without the use of solder.
PCT/US2000/020748 1999-08-02 2000-07-31 Controlled compliance fine pitch interconnect WO2001009980A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US10/031,422 US6830460B1 (en) 1999-08-02 2000-07-31 Controlled compliance fine pitch interconnect
EP00955283A EP1204988A2 (en) 1999-08-02 2000-07-31 Controlled compliance fine pitch interconnect
AU67509/00A AU6750900A (en) 1999-08-02 2000-07-31 Controlled compliance fine pitch interconnect
JP2001514505A JP2003506833A (en) 1999-08-02 2000-07-31 Fine pitch wiring with controlled compliance
US10/992,482 US7160119B2 (en) 1999-08-02 2004-11-17 Controlled compliance fine pitch electrical interconnect

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14682599P 1999-08-02 1999-08-02
US60/146,825 1999-08-02

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US10031422 A-371-Of-International 2000-07-31
US10/992,482 Division US7160119B2 (en) 1999-08-02 2004-11-17 Controlled compliance fine pitch electrical interconnect

Publications (2)

Publication Number Publication Date
WO2001009980A2 WO2001009980A2 (en) 2001-02-08
WO2001009980A3 true WO2001009980A3 (en) 2001-08-30

Family

ID=22519150

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2000/020748 WO2001009980A2 (en) 1999-08-02 2000-07-31 Controlled compliance fine pitch interconnect

Country Status (4)

Country Link
EP (1) EP1204988A2 (en)
JP (1) JP2003506833A (en)
AU (1) AU6750900A (en)
WO (1) WO2001009980A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7900347B2 (en) 2000-01-20 2011-03-08 Cascade Microtech, Inc. Method of making a compliant interconnect assembly

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6409521B1 (en) 1997-05-06 2002-06-25 Gryphics, Inc. Multi-mode compliant connector and replaceable chip module utilizing the same
DE60016563T2 (en) 1999-02-02 2005-05-12 Gryphics, Inc., Plymouth CONNECTORS WITH LOW OR LOW MOUNTING POWER FOR PCB AND ELECTRICAL DEVICES
US6830460B1 (en) 1999-08-02 2004-12-14 Gryphics, Inc. Controlled compliance fine pitch interconnect
JP2003315361A (en) * 2002-04-26 2003-11-06 Japan Electronic Materials Corp Manufacturing method of probe, mask for manufacturing probe and probe
EP1642364A1 (en) 2003-07-07 2006-04-05 Gryphics, Inc. Normally closed zero insertion force connector
DE102004027886A1 (en) * 2004-05-28 2005-12-22 Feinmetall Gmbh Test device for electrical testing of a test specimen and method for producing a test device
JP4838658B2 (en) * 2006-08-01 2011-12-14 日本電産リード株式会社 Substrate inspection jig and electrode structure of substrate inspection jig
JP2010145381A (en) * 2008-12-22 2010-07-01 Nippon Mektron Ltd Substrate inspection apparatus, and method of manufacturing inspection jig
JP2013002976A (en) * 2011-06-17 2013-01-07 Hioki Ee Corp Probe unit, circuit board inspection device and probe unit manufacturing method
KR20140020627A (en) * 2012-08-10 2014-02-19 삼성전기주식회사 Method of manufacturing for electric inspection jig

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4118090A (en) * 1977-05-23 1978-10-03 Luigi Giovanni Del Mei Electrical contact devices
EP0310302A2 (en) * 1987-09-25 1989-04-05 Minnesota Mining And Manufacturing Company Multipurpose socket
US5252916A (en) * 1992-01-27 1993-10-12 Everett Charles Technologies, Inc. Pneumatic test fixture with springless test probes
US5299090A (en) * 1993-06-29 1994-03-29 At&T Bell Laboratories Pin-fin heat sink
US5410260A (en) * 1992-11-09 1995-04-25 Nhk Spring Co., Ltd. Coil spring-pressed needle contact probe
US5412329A (en) * 1991-11-18 1995-05-02 Tokyo Electron Yamanashi Limited Probe card
US5521519A (en) * 1992-07-30 1996-05-28 International Business Machines Corporation Spring probe with piloted and headed contact and method of tip formation
US5637539A (en) * 1996-01-16 1997-06-10 Cornell Research Foundation, Inc. Vacuum microelectronic devices with multiple planar electrodes
US5723347A (en) * 1993-09-30 1998-03-03 International Business Machines Corp. Semi-conductor chip test probe and process for manufacturing the probe
WO1998013695A1 (en) * 1996-09-26 1998-04-02 Primeyield Systems, Inc. Grid array package test contactor

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61118977A (en) * 1984-11-13 1986-06-06 シチズン時計株式会社 Multi-electrode connector construction
JP3400051B2 (en) * 1993-11-10 2003-04-28 ザ ウィタカー コーポレーション Anisotropic conductive film, method of manufacturing the same, and connector using the same
JP2602623B2 (en) * 1993-12-17 1997-04-23 山一電機株式会社 IC socket
JPH0973934A (en) * 1995-09-01 1997-03-18 Whitaker Corp:The Connector
JP3640268B2 (en) * 1995-10-06 2005-04-20 ザ ウィタカー コーポレーション Connector and connector manufacturing method
JP4040206B2 (en) * 1999-04-28 2008-01-30 信越ポリマー株式会社 Electrical connector

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4118090A (en) * 1977-05-23 1978-10-03 Luigi Giovanni Del Mei Electrical contact devices
EP0310302A2 (en) * 1987-09-25 1989-04-05 Minnesota Mining And Manufacturing Company Multipurpose socket
US5412329A (en) * 1991-11-18 1995-05-02 Tokyo Electron Yamanashi Limited Probe card
US5252916A (en) * 1992-01-27 1993-10-12 Everett Charles Technologies, Inc. Pneumatic test fixture with springless test probes
US5521519A (en) * 1992-07-30 1996-05-28 International Business Machines Corporation Spring probe with piloted and headed contact and method of tip formation
US5410260A (en) * 1992-11-09 1995-04-25 Nhk Spring Co., Ltd. Coil spring-pressed needle contact probe
US5299090A (en) * 1993-06-29 1994-03-29 At&T Bell Laboratories Pin-fin heat sink
US5723347A (en) * 1993-09-30 1998-03-03 International Business Machines Corp. Semi-conductor chip test probe and process for manufacturing the probe
US5637539A (en) * 1996-01-16 1997-06-10 Cornell Research Foundation, Inc. Vacuum microelectronic devices with multiple planar electrodes
WO1998013695A1 (en) * 1996-09-26 1998-04-02 Primeyield Systems, Inc. Grid array package test contactor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7900347B2 (en) 2000-01-20 2011-03-08 Cascade Microtech, Inc. Method of making a compliant interconnect assembly

Also Published As

Publication number Publication date
WO2001009980A2 (en) 2001-02-08
AU6750900A (en) 2001-02-19
EP1204988A2 (en) 2002-05-15
JP2003506833A (en) 2003-02-18

Similar Documents

Publication Publication Date Title
US3963986A (en) Programmable interface contactor structure
EP0498530B1 (en) Electrical interconnect contact system
US5069629A (en) Electrical interconnect contact system
EP0962776A3 (en) Probe card suitable for inspection of multi-pin devices
KR950010190A (en) Electronic card and connector assembly for use with it
EP1408338A3 (en) Method for making a probe card with multiple contact tips for testing integrated circuits
EP2023386A3 (en) Probe card for testing semiconductor device, and semiconductor device test method
EP0294939A3 (en) Multiple lead probe for integrated circuits in wafer form
WO2001054232A3 (en) Flexible compliant interconnect assembly
MY138633A (en) Mounting apparatus for ball grid array device
TW200605253A (en) Method of manufacturing semiconductor integrated circuit and probe card
SG146414A1 (en) Semiconductor device test apparatus
ES2021640B3 (en) DEVICE FOR ELECTRONIC CONTROL OF CONDUCTOR BOARDS WITH CONTACT POINTS IN A MODULE (1/20 TO 1/10 INCHES) EXTREMELY THIN
KR20020096892A (en) Socket for electricparts
CA2122508A1 (en) Apparatus for interconnecting electrical contacts
WO2001009980A3 (en) Controlled compliance fine pitch interconnect
WO2002075330A3 (en) Universal test interface between a device under test and a test head
EP0304868A3 (en) Multiple lead probe for integrated circuits in wafer form
CA2042047A1 (en) A function unit
EP1503217A3 (en) Electronic component test apparatus
CA2488832A1 (en) Multi-socket board for open/short tester
US4714879A (en) Holding and testing device for electronic modules within flat carriers
US4973256A (en) Device under test interface board and test electronic card interconnection in semiconductor test system
MY115457A (en) Structure of ic device interface unit
EP1309039A3 (en) Ball grid array socket

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CR CU CZ DE DK DM DZ EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
AK Designated states

Kind code of ref document: A3

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CR CU CZ DE DK DM DZ EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A3

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG

WWE Wipo information: entry into national phase

Ref document number: 10031422

Country of ref document: US

WWE Wipo information: entry into national phase

Ref document number: 2000955283

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 2000955283

Country of ref document: EP

REG Reference to national code

Ref country code: DE

Ref legal event code: 8642