WO2000076725A1 - Optical view port for chemical mechanical planarization endpoint detection - Google Patents
Optical view port for chemical mechanical planarization endpoint detection Download PDFInfo
- Publication number
- WO2000076725A1 WO2000076725A1 PCT/US2000/016026 US0016026W WO0076725A1 WO 2000076725 A1 WO2000076725 A1 WO 2000076725A1 US 0016026 W US0016026 W US 0016026W WO 0076725 A1 WO0076725 A1 WO 0076725A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- platen
- optical
- recess
- window
- polishing pad
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/12—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with apertures for inspecting the surface to be abraded
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU54807/00A AU5480700A (en) | 1999-06-11 | 2000-06-10 | Optical view port for chemical mechanical planarization endpoint detection |
JP2001503030A JP2003501845A (en) | 1999-06-11 | 2000-06-10 | Optical viewport for endpoint detection of chemical mechanical planarization |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/330,472 US6146242A (en) | 1999-06-11 | 1999-06-11 | Optical view port for chemical mechanical planarization endpoint detection |
US09/330,472 | 1999-06-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2000076725A1 true WO2000076725A1 (en) | 2000-12-21 |
Family
ID=23289935
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2000/016026 WO2000076725A1 (en) | 1999-06-11 | 2000-06-10 | Optical view port for chemical mechanical planarization endpoint detection |
Country Status (6)
Country | Link |
---|---|
US (2) | US6146242A (en) |
JP (1) | JP2003501845A (en) |
KR (1) | KR100642027B1 (en) |
AU (1) | AU5480700A (en) |
TW (1) | TW442362B (en) |
WO (1) | WO2000076725A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1641597A1 (en) * | 2003-05-16 | 2006-04-05 | Ebara Corporation | Substrate polishing apparatus |
Families Citing this family (72)
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US6395130B1 (en) * | 1998-06-08 | 2002-05-28 | Speedfam-Ipec Corporation | Hydrophobic optical endpoint light pipes for chemical mechanical polishing |
US6390019B1 (en) | 1998-06-11 | 2002-05-21 | Applied Materials, Inc. | Chamber having improved process monitoring window |
WO2000060650A1 (en) * | 1999-03-31 | 2000-10-12 | Nikon Corporation | Polishing body, polisher, method for adjusting polisher, method for measuring thickness of polished film or end point of polishing, method for producing semiconductor device |
US6726528B2 (en) * | 2002-05-14 | 2004-04-27 | Strasbaugh | Polishing pad with optical sensor |
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US6290572B1 (en) | 2000-03-23 | 2001-09-18 | Micron Technology, Inc. | Devices and methods for in-situ control of mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies |
US6592817B1 (en) * | 2000-03-31 | 2003-07-15 | Applied Materials, Inc. | Monitoring an effluent from a chamber |
US8485862B2 (en) * | 2000-05-19 | 2013-07-16 | Applied Materials, Inc. | Polishing pad for endpoint detection and related methods |
US6485354B1 (en) * | 2000-06-09 | 2002-11-26 | Strasbaugh | Polishing pad with built-in optical sensor |
WO2002026445A1 (en) | 2000-09-29 | 2002-04-04 | Strasbaugh, Inc. | Polishing pad with built-in optical sensor |
EP1324858A1 (en) | 2000-10-06 | 2003-07-09 | Cabot Microelectronics Corporation | Polishing pad comprising a filled translucent region |
US6623331B2 (en) * | 2001-02-16 | 2003-09-23 | Cabot Microelectronics Corporation | Polishing disk with end-point detection port |
WO2002070200A1 (en) | 2001-03-01 | 2002-09-12 | Cabot Microelectronics Corporation | Method for manufacturing a polishing pad having a compressed translucent region |
US6586337B2 (en) * | 2001-11-09 | 2003-07-01 | Speedfam-Ipec Corporation | Method and apparatus for endpoint detection during chemical mechanical polishing |
US6780085B2 (en) * | 2001-11-23 | 2004-08-24 | Stephan H. Wolf | Fiber optical sensor embedded into the polishing pad for in-situ, real-time, monitoring of thin films during the chemical mechanical planarization process |
US7074110B1 (en) | 2001-11-23 | 2006-07-11 | Stephan H Wolf | Optical coupler hub for chemical-mechanical-planarization polishing pads with an integrated optical waveguide |
US6599765B1 (en) * | 2001-12-12 | 2003-07-29 | Lam Research Corporation | Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection |
US6878039B2 (en) * | 2002-01-28 | 2005-04-12 | Speedfam-Ipec Corporation | Polishing pad window for a chemical-mechanical polishing tool |
US7001242B2 (en) * | 2002-02-06 | 2006-02-21 | Applied Materials, Inc. | Method and apparatus of eddy current monitoring for chemical mechanical polishing |
US20030181136A1 (en) * | 2002-03-22 | 2003-09-25 | Billett Bruce H. | CMP pad platen with viewport |
US6688945B2 (en) * | 2002-03-25 | 2004-02-10 | Macronix International Co. Ltd. | CMP endpoint detection system |
US6937915B1 (en) * | 2002-03-28 | 2005-08-30 | Lam Research Corporation | Apparatus and methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control |
US7018268B2 (en) * | 2002-04-09 | 2006-03-28 | Strasbaugh | Protection of work piece during surface processing |
US6696005B2 (en) | 2002-05-13 | 2004-02-24 | Strasbaugh | Method for making a polishing pad with built-in optical sensor |
US20040171339A1 (en) * | 2002-10-28 | 2004-09-02 | Cabot Microelectronics Corporation | Microporous polishing pads |
US20050276967A1 (en) * | 2002-05-23 | 2005-12-15 | Cabot Microelectronics Corporation | Surface textured microporous polishing pads |
US6913517B2 (en) * | 2002-05-23 | 2005-07-05 | Cabot Microelectronics Corporation | Microporous polishing pads |
US6887791B2 (en) * | 2002-06-06 | 2005-05-03 | Cadence Design Systems, Inc. | Optimization methods for on-chip interconnect geometries suitable for ultra deep sub-micron processes |
US7040957B2 (en) * | 2002-08-14 | 2006-05-09 | Novellus Systems Inc. | Platen and manifold for polishing workpieces |
US7311862B2 (en) * | 2002-10-28 | 2007-12-25 | Cabot Microelectronics Corporation | Method for manufacturing microporous CMP materials having controlled pore size |
US7267607B2 (en) * | 2002-10-28 | 2007-09-11 | Cabot Microelectronics Corporation | Transparent microporous materials for CMP |
US7435165B2 (en) | 2002-10-28 | 2008-10-14 | Cabot Microelectronics Corporation | Transparent microporous materials for CMP |
US7921802B2 (en) * | 2002-12-09 | 2011-04-12 | Nxp B.V. | System and method for suppression of wafer temperature drift in cold-wall CVD systems |
US6832947B2 (en) * | 2003-02-10 | 2004-12-21 | Cabot Microelectronics Corporation | CMP pad with composite transparent window |
US6960120B2 (en) | 2003-02-10 | 2005-11-01 | Cabot Microelectronics Corporation | CMP pad with composite transparent window |
US6991514B1 (en) | 2003-02-21 | 2006-01-31 | Verity Instruments, Inc. | Optical closed-loop control system for a CMP apparatus and method of manufacture thereof |
US6913514B2 (en) * | 2003-03-14 | 2005-07-05 | Ebara Technologies, Inc. | Chemical mechanical polishing endpoint detection system and method |
US7704125B2 (en) | 2003-03-24 | 2010-04-27 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
AU2004225931A1 (en) | 2003-03-25 | 2004-10-14 | Neopad Technologies Corporation | Chip customized polish pads for chemical mechanical planarization (CMP) |
US9278424B2 (en) | 2003-03-25 | 2016-03-08 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
US8864859B2 (en) | 2003-03-25 | 2014-10-21 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
US7195539B2 (en) * | 2003-09-19 | 2007-03-27 | Cabot Microelectronics Coporation | Polishing pad with recessed window |
US7204639B1 (en) * | 2003-09-26 | 2007-04-17 | Lam Research Corporation | Method and apparatus for thin metal film thickness measurement |
US7235154B2 (en) * | 2004-01-08 | 2007-06-26 | Strasbaugh | Devices and methods for optical endpoint detection during semiconductor wafer polishing |
US6955588B1 (en) | 2004-03-31 | 2005-10-18 | Lam Research Corporation | Method of and platen for controlling removal rate characteristics in chemical mechanical planarization |
US20050245171A1 (en) * | 2004-04-28 | 2005-11-03 | Jsr Corporation | Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method for semiconductor wafers |
US20050277841A1 (en) * | 2004-06-10 | 2005-12-15 | Adnan Shennib | Disposable fetal monitor patch |
US20060030781A1 (en) * | 2004-08-05 | 2006-02-09 | Adnan Shennib | Emergency heart sensor patch |
US20060030782A1 (en) * | 2004-08-05 | 2006-02-09 | Adnan Shennib | Heart disease detection patch |
US8075372B2 (en) * | 2004-09-01 | 2011-12-13 | Cabot Microelectronics Corporation | Polishing pad with microporous regions |
WO2006089291A1 (en) * | 2005-02-18 | 2006-08-24 | Neopad Technologies Corporation | Use of phosphorescent materials for two-dimensional wafer mapping in a chemical mechanical polishing |
TWI385050B (en) | 2005-02-18 | 2013-02-11 | Nexplanar Corp | Customized polishing pads for cmp and methods of fabrication and use thereof |
US7169016B2 (en) * | 2005-05-10 | 2007-01-30 | Nikon Corporation | Chemical mechanical polishing end point detection apparatus and method |
US8688189B2 (en) * | 2005-05-17 | 2014-04-01 | Adnan Shennib | Programmable ECG sensor patch |
US7226339B2 (en) * | 2005-08-22 | 2007-06-05 | Applied Materials, Inc. | Spectrum based endpointing for chemical mechanical polishing |
KR101521414B1 (en) * | 2005-08-22 | 2015-05-19 | 어플라이드 머티어리얼스, 인코포레이티드 | Apparatus and methods for spectrum based monitoring of chemical mechanical polishing |
US20070191728A1 (en) * | 2006-02-10 | 2007-08-16 | Adnan Shennib | Intrapartum monitor patch |
US20070255184A1 (en) * | 2006-02-10 | 2007-11-01 | Adnan Shennib | Disposable labor detection patch |
US8562389B2 (en) * | 2007-06-08 | 2013-10-22 | Applied Materials, Inc. | Thin polishing pad with window and molding process |
US8225683B2 (en) * | 2007-09-28 | 2012-07-24 | Lam Research Corporation | Wafer bow metrology arrangements and methods thereof |
US7967661B2 (en) * | 2008-06-19 | 2011-06-28 | Micron Technology, Inc. | Systems and pads for planarizing microelectronic workpieces and associated methods of use and manufacture |
TWM347669U (en) * | 2008-06-19 | 2008-12-21 | Bestac Advanced Material Co Ltd | Polishing pad and polishing device |
KR101592623B1 (en) | 2008-12-10 | 2016-02-11 | 램 리써치 코포레이션 | Immersive oxidation and etching process for cleaning silicon electrodes |
US8157614B2 (en) * | 2009-04-30 | 2012-04-17 | Applied Materials, Inc. | Method of making and apparatus having windowless polishing pad and protected fiber |
US9017140B2 (en) | 2010-01-13 | 2015-04-28 | Nexplanar Corporation | CMP pad with local area transparency |
US9156124B2 (en) | 2010-07-08 | 2015-10-13 | Nexplanar Corporation | Soft polishing pad for polishing a semiconductor substrate |
US9156125B2 (en) * | 2012-04-11 | 2015-10-13 | Cabot Microelectronics Corporation | Polishing pad with light-stable light-transmitting region |
US10213894B2 (en) * | 2016-02-26 | 2019-02-26 | Applied Materials, Inc. | Method of placing window in thin polishing pad |
US11670490B2 (en) * | 2017-09-29 | 2023-06-06 | Taiwan Semiconductor Manufacturing Co., Ltd. | Integrated circuit fabrication system with adjustable gas injector |
JP7197999B2 (en) | 2018-05-11 | 2022-12-28 | キオクシア株式会社 | polishing equipment and polishing pads |
KR102580487B1 (en) * | 2018-06-18 | 2023-09-21 | 주식회사 케이씨텍 | Pad monitoring apparatus and pad monotirng system, pad monitoring method |
KR102091419B1 (en) * | 2018-07-19 | 2020-03-20 | 주식회사 케이씨텍 | System of polishing substrate with light transmitting layer |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03234467A (en) * | 1990-02-05 | 1991-10-18 | Canon Inc | Polishing method of metal mold mounting surface of stamper and polishing machine therefor |
US5433651A (en) * | 1993-12-22 | 1995-07-18 | International Business Machines Corporation | In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing |
US5609511A (en) * | 1994-04-14 | 1997-03-11 | Hitachi, Ltd. | Polishing method |
US5700180A (en) * | 1993-08-25 | 1997-12-23 | Micron Technology, Inc. | System for real-time control of semiconductor wafer polishing |
US5838447A (en) * | 1995-07-20 | 1998-11-17 | Ebara Corporation | Polishing apparatus including thickness or flatness detector |
US6068539A (en) * | 1998-03-10 | 2000-05-30 | Lam Research Corporation | Wafer polishing device with movable window |
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US4168262A (en) * | 1978-03-13 | 1979-09-18 | Cornell Research Foundation, Inc. | Anhydride modified microbial protein having reduced nucleic acid levels |
US5310260A (en) * | 1990-04-10 | 1994-05-10 | Luxtron Corporation | Non-contact optical techniques for measuring surface conditions |
GB2257507B (en) * | 1991-06-26 | 1995-03-01 | Digital Equipment Corp | Semiconductor wafer processing with across-wafer critical dimension monitoring using optical endpoint detection |
US5308447A (en) * | 1992-06-09 | 1994-05-03 | Luxtron Corporation | Endpoint and uniformity determinations in material layer processing through monitoring multiple surface regions across the layer |
JP3993888B2 (en) * | 1993-12-28 | 2007-10-17 | ウォレス ティー.ワイ. タング | Method and apparatus for monitoring thin films |
US5893796A (en) * | 1995-03-28 | 1999-04-13 | Applied Materials, Inc. | Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus |
JP3601910B2 (en) * | 1995-07-20 | 2004-12-15 | 株式会社荏原製作所 | Polishing apparatus and method |
US5605760A (en) * | 1995-08-21 | 1997-02-25 | Rodel, Inc. | Polishing pads |
US5663797A (en) * | 1996-05-16 | 1997-09-02 | Micron Technology, Inc. | Method and apparatus for detecting the endpoint in chemical-mechanical polishing of semiconductor wafers |
US6106662A (en) * | 1998-06-08 | 2000-08-22 | Speedfam-Ipec Corporation | Method and apparatus for endpoint detection for chemical mechanical polishing |
-
1999
- 1999-06-11 US US09/330,472 patent/US6146242A/en not_active Expired - Fee Related
-
2000
- 2000-06-09 TW TW089111374A patent/TW442362B/en not_active IP Right Cessation
- 2000-06-10 AU AU54807/00A patent/AU5480700A/en not_active Abandoned
- 2000-06-10 KR KR1020017015632A patent/KR100642027B1/en not_active IP Right Cessation
- 2000-06-10 WO PCT/US2000/016026 patent/WO2000076725A1/en active IP Right Grant
- 2000-06-10 JP JP2001503030A patent/JP2003501845A/en not_active Ceased
- 2000-11-14 US US09/712,825 patent/US6488568B1/en not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03234467A (en) * | 1990-02-05 | 1991-10-18 | Canon Inc | Polishing method of metal mold mounting surface of stamper and polishing machine therefor |
US5700180A (en) * | 1993-08-25 | 1997-12-23 | Micron Technology, Inc. | System for real-time control of semiconductor wafer polishing |
US5433651A (en) * | 1993-12-22 | 1995-07-18 | International Business Machines Corporation | In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing |
US5609511A (en) * | 1994-04-14 | 1997-03-11 | Hitachi, Ltd. | Polishing method |
US5838447A (en) * | 1995-07-20 | 1998-11-17 | Ebara Corporation | Polishing apparatus including thickness or flatness detector |
US6068539A (en) * | 1998-03-10 | 2000-05-30 | Lam Research Corporation | Wafer polishing device with movable window |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1641597A1 (en) * | 2003-05-16 | 2006-04-05 | Ebara Corporation | Substrate polishing apparatus |
EP1641597A4 (en) * | 2003-05-16 | 2007-10-31 | Ebara Corp | Substrate polishing apparatus |
Also Published As
Publication number | Publication date |
---|---|
KR100642027B1 (en) | 2006-11-02 |
KR20020011432A (en) | 2002-02-08 |
JP2003501845A (en) | 2003-01-14 |
US6488568B1 (en) | 2002-12-03 |
US6146242A (en) | 2000-11-14 |
TW442362B (en) | 2001-06-23 |
AU5480700A (en) | 2001-01-02 |
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