WO2000073905A3 - Test interface for electronic circuits - Google Patents

Test interface for electronic circuits Download PDF

Info

Publication number
WO2000073905A3
WO2000073905A3 PCT/US2000/014768 US0014768W WO0073905A3 WO 2000073905 A3 WO2000073905 A3 WO 2000073905A3 US 0014768 W US0014768 W US 0014768W WO 0073905 A3 WO0073905 A3 WO 0073905A3
Authority
WO
WIPO (PCT)
Prior art keywords
parallel interface
interconnecting
structures
massively parallel
assemblies
Prior art date
Application number
PCT/US2000/014768
Other languages
French (fr)
Other versions
WO2000073905A2 (en
Inventor
Fu Chiung Chong
Sammy Mok
Original Assignee
Nanonexus Inc
Fu Chiung Chong
Sammy Mok
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to EP00936397A priority Critical patent/EP1183604A2/en
Priority to JP2001500957A priority patent/JP2003501819A/en
Priority to KR1020017015187A priority patent/KR20020028159A/en
Priority to AU51718/00A priority patent/AU5171800A/en
Priority to US09/979,551 priority patent/US6812718B1/en
Application filed by Nanonexus Inc, Fu Chiung Chong, Sammy Mok filed Critical Nanonexus Inc
Publication of WO2000073905A2 publication Critical patent/WO2000073905A2/en
Publication of WO2000073905A3 publication Critical patent/WO2000073905A3/en
Priority to US10/918,511 priority patent/US7009412B2/en
Priority to US11/327,728 priority patent/US7138818B2/en
Priority to US11/555,603 priority patent/US7403029B2/en
Priority to US11/692,138 priority patent/US20070245553A1/en
Priority to US12/175,393 priority patent/US7772860B2/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers

Abstract

Several embodiments of massively parallel interface structures are disclosed, which may be used in a wide variety of permanent or temporary applications, such as for interconnecting integrated circuits (ICs) to test and burn-in equipment, for interconnecting modules within electronic devices, for interconnecting computers and other peripheral devices within a network, or for interconnecting other electronic circuitry. Preferred embodiments of the massively parallel interface structures provide massively parallel integrated circuit test assemblies. The massively parallel interface structures preferably use one or more substrates to establish connections between one or more integrated circuits on a semiconductor wafer, and one or more test modules. One or more layers on the intermediate substrates preferably include MEMS and/or thin-film fabricated spring probes. The parallel interface assemblies provide tight signal pad pitch and compliance, and preferably enable the parallel testing or burn-in of multiple ICs, using commercial wafer probing equipment. In some preferred embodiments, the parallel interface assembly structures include separable standard electrical connector components, which reduces assembly manufacturing cost and manufacturing time. These structures and assemblies enable high speed testing in wafer form.
PCT/US2000/014768 1999-05-27 2000-05-26 Test interface for electronic circuits WO2000073905A2 (en)

Priority Applications (10)

Application Number Priority Date Filing Date Title
EP00936397A EP1183604A2 (en) 1999-05-27 2000-05-26 Test interface for electronic circuirts
JP2001500957A JP2003501819A (en) 1999-05-27 2000-05-26 Massively parallel processing interface for electronic circuits
KR1020017015187A KR20020028159A (en) 1999-05-27 2000-05-26 Massively parallel interface for electronic circuit
AU51718/00A AU5171800A (en) 1999-05-27 2000-05-26 Massively parallel interface for electronic circuit
US09/979,551 US6812718B1 (en) 1999-05-27 2000-05-26 Massively parallel interface for electronic circuits
US10/918,511 US7009412B2 (en) 1999-05-27 2004-08-12 Massively parallel interface for electronic circuit
US11/327,728 US7138818B2 (en) 1999-05-27 2006-01-05 Massively parallel interface for electronic circuit
US11/555,603 US7403029B2 (en) 1999-05-27 2006-11-01 Massively parallel interface for electronic circuit
US11/692,138 US20070245553A1 (en) 1999-05-27 2007-03-27 Fine pitch microfabricated spring contact structure & method
US12/175,393 US7772860B2 (en) 1999-05-27 2008-07-17 Massively parallel interface for electronic circuit

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13663799P 1999-05-27 1999-05-27
US60/136,637 1999-05-27

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US09979551 A-371-Of-International 2000-05-26
US10/918,511 Division US7009412B2 (en) 1999-05-27 2004-08-12 Massively parallel interface for electronic circuit

Publications (2)

Publication Number Publication Date
WO2000073905A2 WO2000073905A2 (en) 2000-12-07
WO2000073905A3 true WO2000073905A3 (en) 2001-09-07

Family

ID=22473706

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2000/014768 WO2000073905A2 (en) 1999-05-27 2000-05-26 Test interface for electronic circuits

Country Status (5)

Country Link
EP (1) EP1183604A2 (en)
JP (1) JP2003501819A (en)
KR (1) KR20020028159A (en)
AU (1) AU5171800A (en)
WO (1) WO2000073905A2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7355420B2 (en) 2001-08-21 2008-04-08 Cascade Microtech, Inc. Membrane probing system
US7420381B2 (en) 2004-09-13 2008-09-02 Cascade Microtech, Inc. Double sided probing structures
US9429638B2 (en) 2008-11-21 2016-08-30 Cascade Microtech, Inc. Method of replacing an existing contact of a wafer probing assembly

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5914613A (en) 1996-08-08 1999-06-22 Cascade Microtech, Inc. Membrane probing system with local contact scrub
WO2001098793A2 (en) * 2000-06-20 2001-12-27 Nanonexus, Inc. Systems for testing integraged circuits during burn-in
US6812718B1 (en) 1999-05-27 2004-11-02 Nanonexus, Inc. Massively parallel interface for electronic circuits
US6578264B1 (en) * 1999-06-04 2003-06-17 Cascade Microtech, Inc. Method for constructing a membrane probe using a depression
US6358103B1 (en) * 1999-08-02 2002-03-19 Swenco Products, Inc. No-crimp electrical connector side-by-side type
US6621280B1 (en) * 2000-06-27 2003-09-16 Agere Systems Inc. Method of testing an integrated circuit
US7102367B2 (en) 2002-07-23 2006-09-05 Fujitsu Limited Probe card and testing method of semiconductor chip, capacitor and manufacturing method thereof
US6835589B2 (en) * 2002-11-14 2004-12-28 International Business Machines Corporation Three-dimensional integrated CMOS-MEMS device and process for making the same
US7057404B2 (en) * 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
JP4727948B2 (en) 2004-05-24 2011-07-20 東京エレクトロン株式会社 Multilayer substrate used for probe card
US7375542B2 (en) 2004-06-30 2008-05-20 Teradyne, Inc. Automated test equipment with DIB mounted three dimensional tester electronics bricks
KR100689023B1 (en) * 2005-06-29 2007-03-02 주식회사 크라또 Probe unit and method for fabricating thereof
US7782072B2 (en) * 2006-09-27 2010-08-24 Formfactor, Inc. Single support structure probe group with staggered mounting pattern
DE102006059429A1 (en) * 2006-12-15 2008-06-26 Atg Luther & Maelzer Gmbh Module for a test device for testing printed circuit boards
WO2008126173A1 (en) * 2007-03-13 2008-10-23 Advantest Corporation Tcp handling device
JP5258395B2 (en) * 2008-06-03 2013-08-07 株式会社日本マイクロニクス Probing device
US8441808B2 (en) * 2010-09-22 2013-05-14 Palo Alto Research Center Incorporated Interposer with microspring contacts
JP6563317B2 (en) * 2015-11-25 2019-08-21 新光電気工業株式会社 Probe guide plate, manufacturing method thereof, and probe apparatus
US10514391B2 (en) * 2016-08-22 2019-12-24 Kla-Tencor Corporation Resistivity probe having movable needle bodies
CN107237859A (en) * 2017-07-24 2017-10-10 江苏方正环测设备有限公司 A kind of bump testing machine damping
KR102133675B1 (en) * 2019-07-03 2020-07-13 주식회사 새한마이크로텍 Test socket
KR102164378B1 (en) * 2019-07-17 2020-10-12 윌테크놀러지(주) Probe card having board type space transformer
JP2021076486A (en) * 2019-11-11 2021-05-20 株式会社日本マイクロニクス Electrical connection device
DE112020000048T5 (en) 2019-12-18 2022-06-02 Advantest Corporation AUTOMATED TEST EQUIPMENT FOR TESTING ONE OR MORE TEST OBJECTS AND METHOD OF OPERATING AN AUTOMATED TEST EQUIPMENT
KR102501995B1 (en) 2019-12-18 2023-02-20 주식회사 아도반테스토 Automated test equipment for testing one or more DUTs and methods of operating the automated test equipment
KR102075484B1 (en) * 2019-12-30 2020-02-10 윤찬 Socket for testing semiconductor
KR102554635B1 (en) * 2021-04-12 2023-07-13 (주)이즈미디어 Socket opening device for camera module inspection
CN115236360B (en) * 2022-09-21 2022-11-22 百信信息技术有限公司 Improved multipurpose test special vehicle

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3630548A1 (en) * 1986-09-08 1988-03-10 Mania Gmbh DEVICE FOR ELECTRONICALLY CHECKING CIRCUITS WITH CONTACT POINTS IN 1/20 INCH GRID
US4924589A (en) * 1988-05-16 1990-05-15 Leedy Glenn J Method of making and testing an integrated circuit
EP0369112A1 (en) * 1988-11-12 1990-05-23 MANIA GmbH & Co. Adapter for electronic test devices for printed-circuit boards and the like
US5144228A (en) * 1991-04-23 1992-09-01 International Business Machines Corporation Probe interface assembly
EP0623826A1 (en) * 1993-04-29 1994-11-09 Hughes Aircraft Company Membrane connector with stretch induced micro scrub
WO1996015458A1 (en) * 1994-11-15 1996-05-23 Formfactor, Inc. Probe card assembly and kit, and methods of using same
US5600257A (en) * 1995-08-09 1997-02-04 International Business Machines Corporation Semiconductor wafer test and burn-in
US5828226A (en) * 1996-11-06 1998-10-27 Cerprobe Corporation Probe card assembly for high density integrated circuits
US5848685A (en) * 1995-06-07 1998-12-15 Xerox Corporation Photolithographically patterned spring contact

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59187144U (en) * 1983-05-31 1984-12-12 株式会社東芝 Test equipment for semiconductor devices
JPH06151532A (en) * 1992-11-13 1994-05-31 Tokyo Electron Yamanashi Kk Prober
JP2995134B2 (en) * 1993-09-24 1999-12-27 東京エレクトロン株式会社 Probe device

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3630548A1 (en) * 1986-09-08 1988-03-10 Mania Gmbh DEVICE FOR ELECTRONICALLY CHECKING CIRCUITS WITH CONTACT POINTS IN 1/20 INCH GRID
US4924589A (en) * 1988-05-16 1990-05-15 Leedy Glenn J Method of making and testing an integrated circuit
EP0369112A1 (en) * 1988-11-12 1990-05-23 MANIA GmbH & Co. Adapter for electronic test devices for printed-circuit boards and the like
US5144228A (en) * 1991-04-23 1992-09-01 International Business Machines Corporation Probe interface assembly
EP0623826A1 (en) * 1993-04-29 1994-11-09 Hughes Aircraft Company Membrane connector with stretch induced micro scrub
WO1996015458A1 (en) * 1994-11-15 1996-05-23 Formfactor, Inc. Probe card assembly and kit, and methods of using same
US5848685A (en) * 1995-06-07 1998-12-15 Xerox Corporation Photolithographically patterned spring contact
US5600257A (en) * 1995-08-09 1997-02-04 International Business Machines Corporation Semiconductor wafer test and burn-in
US5828226A (en) * 1996-11-06 1998-10-27 Cerprobe Corporation Probe card assembly for high density integrated circuits

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7355420B2 (en) 2001-08-21 2008-04-08 Cascade Microtech, Inc. Membrane probing system
US7420381B2 (en) 2004-09-13 2008-09-02 Cascade Microtech, Inc. Double sided probing structures
US8013623B2 (en) 2004-09-13 2011-09-06 Cascade Microtech, Inc. Double sided probing structures
US9429638B2 (en) 2008-11-21 2016-08-30 Cascade Microtech, Inc. Method of replacing an existing contact of a wafer probing assembly

Also Published As

Publication number Publication date
EP1183604A2 (en) 2002-03-06
WO2000073905A2 (en) 2000-12-07
AU5171800A (en) 2000-12-18
KR20020028159A (en) 2002-04-16
JP2003501819A (en) 2003-01-14

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