WO2000061498A3 - System for electrochemically processing a workpiece - Google Patents

System for electrochemically processing a workpiece Download PDF

Info

Publication number
WO2000061498A3
WO2000061498A3 PCT/US2000/010120 US0010120W WO0061498A3 WO 2000061498 A3 WO2000061498 A3 WO 2000061498A3 US 0010120 W US0010120 W US 0010120W WO 0061498 A3 WO0061498 A3 WO 0061498A3
Authority
WO
WIPO (PCT)
Prior art keywords
anodes
fluid flow
flow chamber
reactor
processing
Prior art date
Application number
PCT/US2000/010120
Other languages
French (fr)
Other versions
WO2000061498A2 (en
Inventor
Gregory J Wilson
Kyle M Hanson
Paul R Mchugh
Original Assignee
Semitool Inc
Gregory J Wilson
Kyle M Hanson
Paul R Mchugh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to EP00922221A priority Critical patent/EP1192298A4/en
Priority to JP2000610779A priority patent/JP4219562B2/en
Application filed by Semitool Inc, Gregory J Wilson, Kyle M Hanson, Paul R Mchugh filed Critical Semitool Inc
Publication of WO2000061498A2 publication Critical patent/WO2000061498A2/en
Priority to US09/732,513 priority patent/US6565729B2/en
Publication of WO2000061498A3 publication Critical patent/WO2000061498A3/en
Priority to US09/804,697 priority patent/US6660137B2/en
Priority to US09/849,505 priority patent/US7020537B2/en
Priority to US09/866,463 priority patent/US7160421B2/en
Priority to US09/866,391 priority patent/US7189318B2/en
Priority to US09/872,151 priority patent/US7264698B2/en
Priority to US09/875,365 priority patent/US6916412B2/en
Priority to US09/882,293 priority patent/US6921467B2/en
Priority to US10/377,397 priority patent/US7115196B2/en
Priority to US10/715,700 priority patent/US20040099533A1/en
Priority to US10/817,659 priority patent/US20040188259A1/en
Priority to US10/861,899 priority patent/US7585398B2/en
Priority to US10/970,809 priority patent/US20050084987A1/en
Priority to US10/975,843 priority patent/US20050109629A1/en
Priority to US10/975,551 priority patent/US20050167265A1/en
Priority to US10/975,266 priority patent/US20050224340A1/en
Priority to US10/975,154 priority patent/US7566386B2/en
Priority to US10/975,738 priority patent/US20050109625A1/en
Priority to US10/975,202 priority patent/US20050109633A1/en
Priority to US11/038,455 priority patent/US20060000716A1/en
Priority to US11/053,050 priority patent/US7332066B2/en
Priority to US11/081,030 priority patent/US20050155864A1/en
Priority to US11/096,428 priority patent/US20080217165A9/en
Priority to US11/096,495 priority patent/US20080217166A9/en
Priority to US11/096,477 priority patent/US7438788B2/en
Priority to US11/096,630 priority patent/US20080217167A9/en
Priority to US11/096,965 priority patent/US20050205409A1/en
Priority to US11/096,493 priority patent/US20050211551A1/en
Priority to US11/097,671 priority patent/US20050189227A1/en
Priority to US11/096,972 priority patent/US20050167273A1/en
Priority to US11/097,508 priority patent/US20050183959A1/en
Priority to US11/097,068 priority patent/US20050167274A1/en
Priority to US11/111,672 priority patent/US20060037855A1/en
Priority to US11/392,477 priority patent/US20070034516A1/en
Priority to US11/414,145 priority patent/US8236159B2/en
Priority to US11/416,659 priority patent/US8123926B2/en
Priority to US11/543,270 priority patent/US20100116671A1/en
Priority to US11/639,733 priority patent/US20070089991A1/en
Priority to US11/739,553 priority patent/US20070221502A1/en
Priority to US13/406,387 priority patent/US8852417B2/en
Priority to US13/559,494 priority patent/US8961771B2/en
Priority to US14/176,881 priority patent/US20140209472A1/en
Priority to US14/507,692 priority patent/US9234293B2/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S204/00—Chemistry: electrical and wave energy
    • Y10S204/07—Current distribution within the bath

Abstract

A reactor for electrochemically processing at least one surface of a microelectronic workpiece is set forth. The reactor comprises a reactor head including a workpiece support that has one or more electrical contacts positioned to make electrical contact with the microelectronic workpiece. The reactor also includes a processing container (610) having a plurality of nozzles (530) angularly disposed in a sidewall of a principal fluid flow chamber at a level within the principal fluid flow chamber below a surface of a bath of processing fluid normally contained therein during electrochemical processing. A plurality of anodes (785) are disposed at different elevations in the principal fluid flow chamber so as to place them at different distances from a microelectronic workpiece under process without an intermediate diffuser between the plurality of anodes and the microelectronic workpiece under process. One or more of the plurality of anodes may be in close proximity to the workpiece under process. Still further, one or more of the plurality of anodes may be a virtual anode. The present invention also relates to multi-level anode configurations within a principal fluid flow chamber and methods of using the same.
PCT/US2000/010120 1996-07-15 2000-04-13 System for electrochemically processing a workpiece WO2000061498A2 (en)

Priority Applications (45)

Application Number Priority Date Filing Date Title
EP00922221A EP1192298A4 (en) 1999-04-13 2000-04-13 System for electrochemically processing a workpiece
JP2000610779A JP4219562B2 (en) 1999-04-13 2000-04-13 System for electrochemical processing of workpieces
US09/732,513 US6565729B2 (en) 1998-03-20 2000-12-07 Method for electrochemically depositing metal on a semiconductor workpiece
US09/804,697 US6660137B2 (en) 1999-04-13 2001-03-12 System for electrochemically processing a workpiece
US09/849,505 US7020537B2 (en) 1999-04-13 2001-05-04 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US09/866,463 US7160421B2 (en) 1999-04-13 2001-05-24 Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US09/866,391 US7189318B2 (en) 1999-04-13 2001-05-24 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US09/872,151 US7264698B2 (en) 1999-04-13 2001-05-31 Apparatus and methods for electrochemical processing of microelectronic workpieces
US09/875,365 US6916412B2 (en) 1999-04-13 2001-06-05 Adaptable electrochemical processing chamber
US09/882,293 US6921467B2 (en) 1996-07-15 2001-06-15 Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces
US10/377,397 US7115196B2 (en) 1998-03-20 2003-02-27 Apparatus and method for electrochemically depositing metal on a semiconductor workpiece
US10/715,700 US20040099533A1 (en) 1999-04-13 2003-11-18 System for electrochemically processing a workpiece
US10/817,659 US20040188259A1 (en) 1999-04-13 2004-04-02 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US10/861,899 US7585398B2 (en) 1999-04-13 2004-06-03 Chambers, systems, and methods for electrochemically processing microfeature workpieces
US10/970,809 US20050084987A1 (en) 1999-07-12 2004-10-20 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US10/975,843 US20050109629A1 (en) 1999-04-13 2004-10-28 System for electrochemically processing a workpiece
US10/975,551 US20050167265A1 (en) 1999-04-13 2004-10-28 System for electrochemically processing a workpiece
US10/975,266 US20050224340A1 (en) 1999-04-13 2004-10-28 System for electrochemically processing a workpiece
US10/975,154 US7566386B2 (en) 1999-04-13 2004-10-28 System for electrochemically processing a workpiece
US10/975,738 US20050109625A1 (en) 1999-04-13 2004-10-28 System for electrochemically processing a workpiece
US10/975,202 US20050109633A1 (en) 1999-04-13 2004-10-28 System for electrochemically processing a workpiece
US11/038,455 US20060000716A1 (en) 1999-04-13 2005-01-18 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US11/053,050 US7332066B2 (en) 1998-03-20 2005-02-07 Apparatus and method for electrochemically depositing metal on a semiconductor workpiece
US11/081,030 US20050155864A1 (en) 1999-04-13 2005-03-10 Adaptable electrochemical processing chamber
US11/096,493 US20050211551A1 (en) 1999-04-13 2005-03-29 Apparatus and methods for electrochemical processing of microelectronic workpieces
US11/096,428 US20080217165A9 (en) 1999-04-13 2005-03-29 Apparatus and methods for electrochemical processing of microelectronic workpieces
US11/096,965 US20050205409A1 (en) 1999-04-13 2005-03-29 Apparatus and methods for electrochemical processing of microelectronic workpieces
US11/096,495 US20080217166A9 (en) 1999-04-13 2005-03-29 Apparatus and methods for electrochemical processsing of microelectronic workpieces
US11/096,477 US7438788B2 (en) 1999-04-13 2005-03-29 Apparatus and methods for electrochemical processing of microelectronic workpieces
US11/096,630 US20080217167A9 (en) 1999-04-13 2005-03-29 Apparatus and methods for electrochemical processing of microelectronic workpieces
US11/097,671 US20050189227A1 (en) 1999-04-13 2005-03-31 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US11/096,972 US20050167273A1 (en) 1999-04-13 2005-03-31 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US11/097,508 US20050183959A1 (en) 2000-04-13 2005-03-31 Tuning electrodes used in a reactor for electrochemically processing a microelectric workpiece
US11/097,068 US20050167274A1 (en) 1999-04-13 2005-03-31 Tuning electrodes used in a reactor for electrochemically processing a microelectronics workpiece
US11/111,672 US20060037855A1 (en) 1996-07-15 2005-04-20 Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces
US11/392,477 US20070034516A1 (en) 1999-04-13 2006-03-28 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US11/414,145 US8236159B2 (en) 1999-04-13 2006-04-28 Electrolytic process using cation permeable barrier
US11/416,659 US8123926B2 (en) 1999-04-13 2006-05-03 Electrolytic copper process using anion permeable barrier
US11/543,270 US20100116671A1 (en) 1998-03-20 2006-10-03 Apparatus and method for electrochemically depositing metal on a semiconductor workpiece
US11/639,733 US20070089991A1 (en) 1999-04-13 2006-12-14 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US11/739,553 US20070221502A1 (en) 1999-04-13 2007-04-24 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US13/406,387 US8852417B2 (en) 1999-04-13 2012-02-27 Electrolytic process using anion permeable barrier
US13/559,494 US8961771B2 (en) 1999-04-13 2012-07-26 Electrolytic process using cation permeable barrier
US14/176,881 US20140209472A1 (en) 1999-04-13 2014-02-10 Electrolytic process using cation permeable barrier
US14/507,692 US9234293B2 (en) 1999-04-13 2014-10-06 Electrolytic copper process using anion permeable barrier

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US12905599P 1999-04-13 1999-04-13
US60/129,055 1999-04-13
US14376999P 1999-07-12 1999-07-12
US60/143,769 1999-07-12
US18216000P 2000-02-14 2000-02-14
US60/182,160 2000-02-14

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US09/604,198 Continuation-In-Part US6342137B1 (en) 1996-07-15 2000-06-27 Lift and rotate assembly for use in a workpiece processing station and a method of attaching the same

Related Child Applications (13)

Application Number Title Priority Date Filing Date
US09/045,245 Continuation US6197181B1 (en) 1998-03-20 1998-03-20 Apparatus and method for electrolytically depositing a metal on a microelectronic workpiece
US09804697 A-371-Of-International 2000-04-13
US09/618,707 Continuation US6654122B1 (en) 1996-07-15 2000-07-18 Semiconductor processing apparatus having lift and tilt mechanism
US09/732,513 Continuation US6565729B2 (en) 1998-03-20 2000-12-07 Method for electrochemically depositing metal on a semiconductor workpiece
US09/732,513 Continuation-In-Part US6565729B2 (en) 1998-03-20 2000-12-07 Method for electrochemically depositing metal on a semiconductor workpiece
US09/804,697 Continuation US6660137B2 (en) 1996-07-15 2001-03-12 System for electrochemically processing a workpiece
US09/849,505 Continuation-In-Part US7020537B2 (en) 1999-04-13 2001-05-04 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US09/866,463 Continuation-In-Part US7160421B2 (en) 1999-04-13 2001-05-24 Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US09/866,391 Continuation-In-Part US7189318B2 (en) 1999-04-13 2001-05-24 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US09/872,151 Continuation-In-Part US7264698B2 (en) 1999-04-13 2001-05-31 Apparatus and methods for electrochemical processing of microelectronic workpieces
US09/886,391 Continuation-In-Part US6391875B2 (en) 1998-01-21 2001-06-22 Pharmaceutically active morpholinol
US10/377,397 Continuation US7115196B2 (en) 1998-03-20 2003-02-27 Apparatus and method for electrochemically depositing metal on a semiconductor workpiece
US11/392,477 Continuation-In-Part US20070034516A1 (en) 1999-04-13 2006-03-28 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece

Publications (2)

Publication Number Publication Date
WO2000061498A2 WO2000061498A2 (en) 2000-10-19
WO2000061498A3 true WO2000061498A3 (en) 2001-01-25

Family

ID=27383837

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/US2000/010120 WO2000061498A2 (en) 1996-07-15 2000-04-13 System for electrochemically processing a workpiece
PCT/US2000/010210 WO2000061837A1 (en) 1999-04-13 2000-04-13 Workpiece processor having processing chamber with improved processing fluid flow

Family Applications After (1)

Application Number Title Priority Date Filing Date
PCT/US2000/010210 WO2000061837A1 (en) 1999-04-13 2000-04-13 Workpiece processor having processing chamber with improved processing fluid flow

Country Status (7)

Country Link
US (10) US6569297B2 (en)
EP (2) EP1194613A4 (en)
JP (2) JP4219562B2 (en)
KR (2) KR100695660B1 (en)
CN (2) CN1296524C (en)
TW (2) TWI226387B (en)
WO (2) WO2000061498A2 (en)

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