WO2000055388A3 - Method and apparatus for arc deposition - Google Patents

Method and apparatus for arc deposition Download PDF

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Publication number
WO2000055388A3
WO2000055388A3 PCT/US2000/003028 US0003028W WO0055388A3 WO 2000055388 A3 WO2000055388 A3 WO 2000055388A3 US 0003028 W US0003028 W US 0003028W WO 0055388 A3 WO0055388 A3 WO 0055388A3
Authority
WO
WIPO (PCT)
Prior art keywords
reactant
plasma
substrate
depositing
coating
Prior art date
Application number
PCT/US2000/003028
Other languages
French (fr)
Other versions
WO2000055388A2 (en
Inventor
Charles Dominic Iacovangelo
Keith Milton Borst
Elihu Calvin Jerabek
Patrick Peter Marzano
Barry Lee-Mean Yang
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Priority to DE60007287T priority Critical patent/DE60007287T2/en
Priority to EP00907176A priority patent/EP1161574B1/en
Priority to JP2000605803A priority patent/JP4733273B2/en
Priority to AT00907176T priority patent/ATE256763T1/en
Publication of WO2000055388A2 publication Critical patent/WO2000055388A2/en
Publication of WO2000055388A3 publication Critical patent/WO2000055388A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/228—Gas flow assisted PVD deposition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/513—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using plasma jets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32422—Arrangement for selecting ions or species in the plasma

Abstract

A method and apparatus for depositing a coating on a substrate. A method of coating a substrate comprises evaporating a first reactant (12); introducing the evaporated reactant into a plasma; and depositing the first reactant on a surface of the substrate (20). This method is used to deposit an electrically conductive, ultraviolet filter coating at high rate on a glass or polycarbonate substrate (20). An apparatus (4) for depositing a UV filter coating on a polymeric substrate comprises a plasma generator (10) having an anode (19) and a cathode (13) to form a plasma, and a first inlet (12) for introducing a first reactant into the plasma, the first reactant comprising an evaporated material that is deposited on the substrate (20) by the plasma (50). Optionally, an injection nozzle (18) can be utilized to provide a controlled delivery of the first reactant into the plasma (50).
PCT/US2000/003028 1999-03-17 2000-02-04 Method and apparatus for arc deposition WO2000055388A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE60007287T DE60007287T2 (en) 1999-03-17 2000-02-04 METHOD AND DEVICE FOR COATING BY ARCH DISCHARGE
EP00907176A EP1161574B1 (en) 1999-03-17 2000-02-04 Method and apparatus for arc deposition
JP2000605803A JP4733273B2 (en) 1999-03-17 2000-02-04 Arc deposition method and apparatus
AT00907176T ATE256763T1 (en) 1999-03-17 2000-02-04 METHOD AND DEVICE FOR COATING BY ARC DISCHARGE

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/271,655 1999-03-17
US09/271,655 US6365016B1 (en) 1999-03-17 1999-03-17 Method and apparatus for arc plasma deposition with evaporation of reagents

Publications (2)

Publication Number Publication Date
WO2000055388A2 WO2000055388A2 (en) 2000-09-21
WO2000055388A3 true WO2000055388A3 (en) 2001-06-28

Family

ID=23036497

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2000/003028 WO2000055388A2 (en) 1999-03-17 2000-02-04 Method and apparatus for arc deposition

Country Status (6)

Country Link
US (1) US6365016B1 (en)
EP (1) EP1161574B1 (en)
JP (1) JP4733273B2 (en)
AT (1) ATE256763T1 (en)
DE (1) DE60007287T2 (en)
WO (1) WO2000055388A2 (en)

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Also Published As

Publication number Publication date
US6365016B1 (en) 2002-04-02
ATE256763T1 (en) 2004-01-15
DE60007287T2 (en) 2004-10-21
DE60007287D1 (en) 2004-01-29
EP1161574A1 (en) 2001-12-12
JP2003518553A (en) 2003-06-10
JP4733273B2 (en) 2011-07-27
WO2000055388A2 (en) 2000-09-21
EP1161574B1 (en) 2003-12-17

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