WO2000029129A1 - Method for treating a material surface designed to receive a coating - Google Patents

Method for treating a material surface designed to receive a coating Download PDF

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Publication number
WO2000029129A1
WO2000029129A1 PCT/FR1999/002821 FR9902821W WO0029129A1 WO 2000029129 A1 WO2000029129 A1 WO 2000029129A1 FR 9902821 W FR9902821 W FR 9902821W WO 0029129 A1 WO0029129 A1 WO 0029129A1
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WO
WIPO (PCT)
Prior art keywords
substrate
coating
cracks
micron
ceramic
Prior art date
Application number
PCT/FR1999/002821
Other languages
French (fr)
Inventor
Sébastien HEDACQ
François BORIT
Vincent Guipont
Michel Jeandin
Original Assignee
Armines
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Publication date
Application filed by Armines filed Critical Armines
Publication of WO2000029129A1 publication Critical patent/WO2000029129A1/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B05D3/0218—Pretreatment, e.g. heating the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/08—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by flames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/14—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by electrical means
    • B05D3/141—Plasma treatment
    • B05D3/142—Pretreatment
    • B05D3/144—Pretreatment of polymeric substrates

Definitions

  • the field of the invention is that of surface treatments of organic substrates. It relates to a method and a device for preparing the surface of an organic substrate intended to receive a coating, in particular metallic or ceramic. It relates more particularly to coatings deposited by thermal spraying.
  • the invention has applications in the automotive and aerospace industry.
  • the method according to the invention makes it possible to develop new methods of manufacture of production tools, such as injection molds, based on the use of rapid prototyping techniques and thermal spraying.
  • the method according to the invention contributes to the development of anti-erosion coatings deposited by thermal spraying on composite parts organic matrix.
  • the production of metallic or ceramic deposits on organic substrates is of industrial interest (protective barriers, improvement of surface properties).
  • the adhesion properties vis-à-organic materials ⁇ is metallic or ceramic coatings are generally low for several reasons: nature of the chemical bonds substrate / coating (type Van Der Waals interaction or hydrogen bonding), low surface energy, weak physico-chemical reactivity, existence of a surface layer of pollution, poor mechanical properties.
  • Various solutions have been proposed to promote the adhesion of a deposit. Some consist in increasing the surface roughness of the substrate (D.
  • the present invention provides a new solution to the problem posed.
  • the method according to the invention comprises the step of controllably crack the surface of said substrate. Thus, the mechanical anchoring of the coating is promoted.
  • the heat input is achieved by at least the following equipment: a heat treatment furnace, a programmable oven, a plasma spray torch, a flame, a laser.
  • the present invention also relates to a device for preparing the surface of an organic substrate intended to receive a coating, in particular metallic or ceramic.
  • the device according to the invention comprises means for controlled cracking of the surface of said substrate
  • the mechanical anchoring of the coating is promoted.
  • the controlled cracking means comprise means for providing heat to the surface of said substrate.
  • said heat input is produced by at least one of the following heating means: a heat treatment oven, a programmable oven, a plasma projection torch, a flame, a laser.
  • the invention also relates to an organic substrate intended to receive a coating, in particular metallic or ceramic. Said substrate is characterized by the presence of cracks caused by the process or the device which have just been described.
  • the invention also relates to an organic substrate coated with a deposit. especially metallic or ceramic. Said substrate and coated with a deposit, if characterized by the fact that the deposit is anchored in cracks in the surface of the substrate caused by the process or the device which have just been described.
  • FIGS. 2a and 2b represent cross-sectional views of a substrate before and after heat treatment.
  • FIG. 3 represents a top view of the surface of a substrate, after heat treatment
  • FIG. 4 which represents a sectional view of the substrate / deposition interface
  • FIG. 5 represents a sectional view of an alternative embodiment of a device implementing a heat input by plasma torch
  • FIG. 1 represents the diagram of the main phases of the process.
  • Step A is carried out a heat input (2) to the surface (la) of an organic substrate (1) for receiving a re ⁇ underframe (4). especially metallic.
  • Step B This thermal contribution has the effect of cracking (3a, 3b, 3c. 3d. 3e, 3f) in a controlled manner the surface (la) of said substrate (1).
  • Step C is projected on the thus cracked surface of the particles 4a, 4b, 4c, including metal particles in the molten state.
  • the molten metal enters the cracks (3a, 3b. 3c, 3d, 3e. 3f. 6, 9. 10). After solidification, the particles anchor the coating to the surface of the coating 1.
  • FIG. 2a shows sectional views of a substrate (1) before and after heat treatment.
  • An electrolytic deposition of nickel 5, 7 was carried out on the surface of the organic substrate 1 in order to facilitate the observation of the cracks 6.
  • FIG. 2b after heat treatment, we notes the occurrence of cracks 6.
  • FIG. 3 shows a top view of the surface of a substrate, after heat treatment.
  • the surface of the substrate 1 has a regular network of cracks 10 having a depth between 20 and 100 microns and whose mean spacing is approximately 250 microns.
  • This network of cracks made it possible to anchor deposit 8 of AISI 316 stainless steel (American standard) represented in FIG. 4.
  • This deposit penetrated cracks 9. It is anchored in the substrate 1.
  • the choice of particle size projected powders depends on the characteristics of the cracks. In the case of deposition of steel AISI 316, the size of the powders was - 106 + 45 microns (according to the conventional notation).
  • the substrate 1 is a composite of a thermosetting resin matrix reinforced with glass balls (this product is marketed by the company 3D Laser).
  • the substrate was produced, in a manner known per se, by stereolithography of MVA 200 resin and sold by the company Laser 3D.
  • the heat input was created by flame treatment by means of a plasma spray torch. It has been observed that the following parameters have an influence on the formation of cracks: temperature of the substrate, nature of the plasma gas, treatment distance, treatment duration, atmosphere.
  • the heat treatment by plasma torch (a few minutes) is suitable for massive and simple-shaped parts.
  • the heat treatment in an oven is slow (several hours), it is suitable for the case of parts with complex shapes.
  • FIG. 5 represents a sectional view of an alternative embodiment of a device 29 using a heat input by plasma torch.
  • the torch 32 is supported by an articulated arm 31, within a sealed enclosure 30 provided with a porthole 40.
  • the torch with a rated power of 55 kilowatts is supplied with electrical energy by a power cable 42 and gas (argon, hydrogen, helium, nitrogen) through a pipe 41.
  • the flow rate of the torch 32 is approximately 60 1 / min.
  • the organic substrate is mounted. vis-à-vis the torch, on a vertical support 33 or on a horizontal support, in particular a turntable 34.
  • the interior of the sealed enclosure 30 at wall cooled by water circulation 35 can be fed in a neutral gas such as argon or helium.
  • the immediate environment 36 of the part to be coated can be cooled by recirculating the atmosphere of the chamber or by supplying gas (air, argon, ...) optionally partially liquefied.
  • a filter 39 makes it possible to filter the gases contained in the enclosure before discharging them.
  • a vacuum pump 37 makes it possible to create a vacuum within the sealed chamber 30. Valves are used to control the inlet and outlet of fluids and their flow will now be described in Figures 6a to 6c that represent stages of embodiment of a mold of injection achieved by applying the method according to the invention.
  • counterforms 20a and 20b are produced by stereolithography in mold resin (FIG. 6a). Heat treatment is applied according to the invention against the Platforms 20a and 20b in order to crack their surface.
  • Two matrix shells 21a and 21b are thus obtained (fig. 6b).
  • the shells 21a and 21b are then mounted in a box 25, 24 filled with resin 22.
  • a supply nozzle makes it possible to introduce the material to be molded between the two shells 21a and 21b.
  • Two pipes 26a and 26b formed at the bottom ensure good filling of the mold.

Abstract

The invention concerns a method for preparing the surface of an organic substrate (1) designed to receive a coating (4), in particular metallic or ceramic. The invention is characterised in that it comprises a step which consists in controlled cracking (3a, 3b, 3c, 3d, 3e, 3f) of said substrate (1) surface (1a) by heat treatment (2), so as to enhance the mechanical bond of the coating (4).

Description

Procédé de traitement de surface d'un matériau destiné à recevoir un revêtementMethod for surface treatment of a material intended to receive a coating
Le domaine de l'invention est celui des traitements de surfaces de substrats organiques. Elle concerne un procédé et un dispositif de préparation de la surface d'un substrat organique destiné à recevoir un revêtement, notamment métallique ou céramique. Elle concerne plus particulièrement les revêtements déposés par projection thermique.The field of the invention is that of surface treatments of organic substrates. It relates to a method and a device for preparing the surface of an organic substrate intended to receive a coating, in particular metallic or ceramic. It relates more particularly to coatings deposited by thermal spraying.
L'invention trouve des applications dans l'industrie automobile et aéronautique. Dans l'industrie automobile, le procédé selon l'invention permet de développer de nouvelles méthodes de fabrication d'outils de production, comme les moules d'injection, fondées sur l'utilisation de techniques de prototypage rapide et de projection thermique. En aéronautique, le procédé selon l'invention contribue au développement de revêtements anti-érosion déposés par projection thermique sur des pièces composites à matrice organique. La réalisation de dépôts métalliques ou céramiques sur des substrats organiques présente un intérêt industriel (barrières de protection, amélioration des propriétés de surface). L'une des difficultés rencontrées au cours de l'élaboration concerne Taccrochage des premières couches de revêtement sur le substrat. Les propriétés d'adhérence des matériaux organiques vis-à-\ is de revêtements métalliques ou céramiques sont généralement faibles pour différentes raisons : nature des liaisons chimiques substrat/revêtement (interaction de type Van Der Waals ou liaison Hydrogène), faible énergie de surface, faible réactivité physico-chimique, existence d'une couche superficielle de pollution, faibles propriétés mécaniques. Différentes solutions ont été proposées pour favoriser l'adhérence d'un dépôt. Certaines consistent à augmenter la rugosité superficielle du substrat (D.The invention has applications in the automotive and aerospace industry. In the automotive industry, the method according to the invention makes it possible to develop new methods of manufacture of production tools, such as injection molds, based on the use of rapid prototyping techniques and thermal spraying. Aviation, the method according to the invention contributes to the development of anti-erosion coatings deposited by thermal spraying on composite parts organic matrix. The production of metallic or ceramic deposits on organic substrates is of industrial interest (protective barriers, improvement of surface properties). One of the difficulties encountered during the development concerns of Taccrochage first coating layers on the substrate. The adhesion properties vis-à-organic materials \ is metallic or ceramic coatings are generally low for several reasons: nature of the chemical bonds substrate / coating (type Van Der Waals interaction or hydrogen bonding), low surface energy, weak physico-chemical reactivity, existence of a surface layer of pollution, poor mechanical properties. Various solutions have been proposed to promote the adhesion of a deposit. Some consist in increasing the surface roughness of the substrate (D.
FAYEULLE. J.P. HENON, R. MORIBIOLI. brevet français FR 87 073272 ; R. W. SMITH. D. BITTNER, E. LUGSCHEIDER. R. MATHESIUS, "Thermal Spray Coatings for Protection of Polymeric Composite Aircraft Components". Proceedings of the 7th National Thermal Sprav Conférence, Boston. Massachussetts. USA, 20-24 juin, 1994. C.C. Berndt et al. eds., ASM International. Materials Park, OH. USA. ( 1994)67. ; P. LUCCHESE, M. JEANDIN. A. DE LAVERNHE, G. SURDON, "Expérimental Approach to Adhésion Between a Plasma-Sprayed Alumina Coating and a Polymeric Substrate". Proceedings of the 9th National Thermal Spray Conférence,FAYEULLE. JP HENON, R. MORIBIOLI. French patent FR 87 073272; RW SMITH. D. BITTNER, E. LUGSCHEIDER. R. MATHESIUS, "Thermal Spray Coatings for Protection of Polymeric Composite Aircraft Components " . Proceedings of the 7th National Thermal Sprav Conférence, Boston. Massachussetts. USA, June 20-24, 1994. CC Berndt et al. eds., ASM International. Materials Park, OH. USA. (1994) 67. ; P. LUCCHESE, M. JEANDIN. A. DE LAVERNHE, G. SURDON, "Experimental Approach to Adhesion Between a Plasma-Sprayed Alumina Coating and a Polymeric Substrate " . Proceedings of the 9th National Thermal Spray Conférence,
Cincinnnati. Ohio, USA, 7- 1 1 October, 1996, C.C. Berndt et al. eds., ASM International. Materials Park, OH. USA, (1996)239.).Cincinnnati. Ohio, USA, October 7-11, 1996, C.C. Berndt et al. eds., ASM International. Materials Park, OH. USA, (1996) 239.).
La présente invention apporte une nouvelle solution au problème posé. Le procédé selon l'invention comprend l'étape de fissurer de manière maîtrisée la surface dudit substrat. Ainsi, l'ancrage mécanique du revêtement est favorisé.The present invention provides a new solution to the problem posed. The method according to the invention comprises the step of controllably crack the surface of said substrate. Thus, the mechanical anchoring of the coating is promoted.
De préférence, pour fissurer de manière maîtrisée la surface dudit substrat, on procède à un apport thermique. Avantageusement, l'apport thermique est réalisé par l'un au moins des équipements suivants : un four de traitement thermique, une étuve programmable, une torche de projection à plasma, une flamme, un laser. La présente invention concerne également un dispositif pour préparer la surface d'un substrat organique destiné à recevoir un revêtement, notamment métallique ou céramique. Le dispositif selon l'invention comprend des moyens de fissuration maîtrisée de la surface dudit substrat Ainsi, l'ancrage mécanique du revêtement est favorisé. De préférence, les moyens de fissuration maîtrisée comprennent des moyens d'apport thermique sur la surface dudit substrat. Avantageusement, ledit apport thermique est réalisé par l'un au moins des moyens de chauffage suivants : un four de traitement thermique, une étuve programmable, une torche de projection à plasma, une flamme, un laser. L'invention concerne également un substrat organique destiné à recevoir un revêtement, notamment métallique ou céramique. Ledit substrat se caractérise par la présence de fissures provoquées par le procédé ou le dispositif qui viennent d'être décrits.Preferably, in order to crack the surface of said substrate in a controlled manner, heat is applied. Advantageously, the heat input is achieved by at least the following equipment: a heat treatment furnace, a programmable oven, a plasma spray torch, a flame, a laser. The present invention also relates to a device for preparing the surface of an organic substrate intended to receive a coating, in particular metallic or ceramic. The device according to the invention comprises means for controlled cracking of the surface of said substrate Thus, the mechanical anchoring of the coating is promoted. Preferably, the controlled cracking means comprise means for providing heat to the surface of said substrate. Advantageously, said heat input is produced by at least one of the following heating means: a heat treatment oven, a programmable oven, a plasma projection torch, a flame, a laser. The invention also relates to an organic substrate intended to receive a coating, in particular metallic or ceramic. Said substrate is characterized by the presence of cracks caused by the process or the device which have just been described.
L'invention concerne également, un substrat organique revêtu d'un dépôt. notamment métallique ou céramique. Ledit substrat, ainsi revêtu d'un dépôt, se caractérise par le fait que le dépôt est ancré dans des fissures de la surface du substrat provoquées par le procédé ou le dispositif qui viennent d'être décrits. D'autres caractéristiques et avantages de l'invention apparaîtront à la lecture de la description de variantes de réalisation de l'invention, données à titre d'exemple indicatif et non limitatif, et de :The invention also relates to an organic substrate coated with a deposit. especially metallic or ceramic. Said substrate and coated with a deposit, if characterized by the fact that the deposit is anchored in cracks in the surface of the substrate caused by the process or the device which have just been described. Other features and advantages of the invention will become apparent from reading the description of embodiments of the invention, given as indicative and non-limiting example, and:
- la figure 1 qui représente le schéma des phases principales du procédé.- Figure 1 which shows the diagram of the main phases of the process.
- les figures 2a et 2b qui représentent des vues en coupe d'un substrat avant et après traitement thermique.- Figures 2a and 2b represent cross-sectional views of a substrate before and after heat treatment.
- la figure 3 qui représente une vue de dessus de la surface d'un substrat, après traitement thermique,- Figure 3 represents a top view of the surface of a substrate, after heat treatment,
- la figure 4 qui représente une vue en coupe de l'interface substrat/dépôt,FIG. 4 which represents a sectional view of the substrate / deposition interface,
- la figure 5 qui représente une vue en coupe d'une variante de réalisation d'un dispositif mettant en oeuvre un apport thermique par torche à plasma,- Figure 5 represents a sectional view of an alternative embodiment of a device implementing a heat input by plasma torch,
- les figures 6a à 6c qui représentent les étapes de réalisation d'un moule d'injection réalisé en appliquant le procédé selon l'invention.- Figures 6a to 6c which show the steps for producing a mold of injection achieved by applying the method according to the invention.
On va maintenant décrire la figure 1 qui représente le schéma des phases principales du procédé.We will now describe FIG. 1 which represents the diagram of the main phases of the process.
Etape A :On procède à un apport thermique (2) à la surface (la) d'un substrat organique ( 1 ) destiné à recevoir un re\ êtement (4). notamment métallique. Etape B : Cet apport thermique a pour effet de fissurer (3a, 3b, 3c. 3d. 3e, 3f) de manière maîtrisée la surface ( la) dudit substrat (1).Step A: is carried out a heat input (2) to the surface (la) of an organic substrate (1) for receiving a re \ underframe (4). especially metallic. Step B: This thermal contribution has the effect of cracking (3a, 3b, 3c. 3d. 3e, 3f) in a controlled manner the surface (la) of said substrate (1).
Etape C : On projette sur la surface la ainsi fissurée des particules 4a, 4b, 4c, notamment des particules métalliques à l'état fondu. Le métal en fusion pénètre dans les fissures (3a, 3b. 3c, 3d, 3e. 3f. 6, 9. 10). Après solidification les particules ancrent le revêtement à la surface la du revêtement 1.Step C is projected on the thus cracked surface of the particles 4a, 4b, 4c, including metal particles in the molten state. The molten metal enters the cracks (3a, 3b. 3c, 3d, 3e. 3f. 6, 9. 10). After solidification, the particles anchor the coating to the surface of the coating 1.
On va maintenant décrire les figures 2a et 2b qui représentent des vues en coupe d'un substrat (1) avant et après traitement thermique. Un dépôt électrolytique de nickel 5, 7 a été réalisé à la surface du substrat organique 1 afin de faciliter l'observation des fissures 6. Sur la figure 2b, après traitement thermique, on constate l'apparition de fissures 6.We will now describe Figures 2a and 2b which show sectional views of a substrate (1) before and after heat treatment. An electrolytic deposition of nickel 5, 7 was carried out on the surface of the organic substrate 1 in order to facilitate the observation of the cracks 6. In FIG. 2b, after heat treatment, we notes the occurrence of cracks 6.
On va maintenant décrire la figure 3 qui représente une vue de dessus de la surface d'un substrat, après traitement thermique. La surface la du substrat 1 présente un réseau régulier de fissures 10 dont la profondeur est comprise entre 20 et 100 μm et dont l'espacement moyen est d'environ 250 μm. Ce réseau de fissures a permis l'ancrage du dépôt 8 d'acier inoxydable AISI 316 (norme américaine) représenté sur la figure 4. Ce dépôt a pénétré les fissures 9. Il est ancré dans le substrat 1. Le choix de la granulométrie des poudres projetées dépend des caractéristiques des fissures. Dans le cas du dépôt d'acier AISI 316, la granulométrie des poudres était de - 106 + 45 μm (selon la notation conventionnelle).Will now be described Figure 3 which shows a top view of the surface of a substrate, after heat treatment. The surface of the substrate 1 has a regular network of cracks 10 having a depth between 20 and 100 microns and whose mean spacing is approximately 250 microns. This network of cracks made it possible to anchor deposit 8 of AISI 316 stainless steel (American standard) represented in FIG. 4. This deposit penetrated cracks 9. It is anchored in the substrate 1. The choice of particle size projected powders depends on the characteristics of the cracks. In the case of deposition of steel AISI 316, the size of the powders was - 106 + 45 microns (according to the conventional notation).
Dans le cas des variantes de réalisation représentées sur les figures 2a. 2b. 3 et 4, le substrat 1 est un composite constitué d'une matrice en résine thermodurcissable chargée en billes de verre (ce produit est commercialisé par la société Laser 3D). Le substrat a été réalisé, de manière connue en soi, par stéréolithographie de résine MVA 200 et commercialisé par la société Laser 3D. L'apport thermique a été réalisé par flammage au moyen d'une torche de projection à plasma. Il a été constaté que les paramètres suivants ont une influence sur la formation des fissures : température du substrat, nature du gaz du plasma, distance de traitement, durée du traitement, atmosphère. Lors de la réalisation des fissures représentées sur les figures 2b, 3 et 4 les conditions opératoires étaient les suivantes :In the case of alternative embodiments shown in Figures 2a. 2b. 3 and 4, the substrate 1 is a composite of a thermosetting resin matrix reinforced with glass balls (this product is marketed by the company 3D Laser). The substrate was produced, in a manner known per se, by stereolithography of MVA 200 resin and sold by the company Laser 3D. The heat input was created by flame treatment by means of a plasma spray torch. It has been observed that the following parameters have an influence on the formation of cracks: temperature of the substrate, nature of the plasma gas, treatment distance, treatment duration, atmosphere. When the cracks shown in Figures 2b, 3 and 4 were produced, the operating conditions were as follows:
- température du substrat : 215°C- substrate temperature: 215 ° C
- nature du gaz du plasma : argon + hydrogène + hélium- nature of the plasma gas: argon + hydrogen + helium
- distance de traitement : 150 mm - durée du traitement : 15 min- treatment distance: 150 mm - treatment time: 15 min
- atmosphère : air- atmosphere: air
Le traitement thermique par torche à plasma (quelques minutes) est adapté au cas des pièces massives et de forme simple.The heat treatment by plasma torch (a few minutes) is suitable for massive and simple-shaped parts.
Des fissures, permettant un ancrage d'un dépôt d'acier AISI 316. ont également été obtenues en utilisant une étuve programmable. Les conditions opératoires étaient les suivantes :Cracks, enabling anchoring of a deposit of AISI 316 steel also obtained using a programmable oven. The operating conditions were as follows:
- vitesse de montée en température : 3°C7min- temperature rise speed: 3 ° C7min
- température : 175 °C - temps de maintien : lh- temperature: 175 ° C - holding time: lh
Le traitement thermique en étuve est lent (plusieurs heures), il est adapté au cas des pièces de formes complexes.The heat treatment in an oven is slow (several hours), it is suitable for the case of parts with complex shapes.
Dispositif (29) pour préparer la surface ( la) d'un substrat organique (1) destiné à recevoir un revêtement (4. 6. 21a, 21b), notamment métallique ou céramique : ledit dispositif comprenantDevice (29) to prepare the surface (la) of an organic substrate (1) for receiving a coating (4. 6. 21a, 21b), in particular metallic or ceramic: said device comprising
- des moyens de fissuration (2) maîtrisée de la surface dudit substrat, de sorte que l'ancrage mécanique du revêtement est favorisée.- cracking means (2) under control of the surface of said substrate, so that the mechanical anchoring of the coating is promoted.
On va maintenant décrire la figure 5 qui représente une vue en coupe d'une variante de réalisation d'un dispositif 29 mettant en oeuvre un apport thermique par torche à plasma. La torche 32 est supportée par un bras articulé 31 , à l'intérieur d'un enceinte 30 étanche munie d'un hublot 40. La torche, d'une puissance nominale de 55 kW est alimentée en énergie électrique par un câble d'alimentation 42 et en gaz (argon, hydrogène, hélium, azote) par une tubulure 41. Le débit de la torche 32 est d'environ 60 1/min. Le substrat organique est monté. en vis-à-vis de la torche, sur un support vertical 33 ou sur un support horizontal, notamment une table tournante 34. L'intérieur de l'enceinte étanche 30, à paroi refroidie par circulation d'eau 35, peut être alimentée en gaz neutre tel que l'argon ou l'hélium. L'environnement immédiat 36 de la pièce à revêtir peut être refroidi par recirculation de l'atmosphère de l'enceinte ou par apport de gaz (air, argon, ...) éventuellement partiellement liquéfié. Un filtre 39 permet de filtrer les gaz contenus dans l'enceinte avant de les évacuer. Une pompe à vide 37 permet de faire le vide à l'intérieur de l'enceinte étanche 30. Des vannes permettent de contrôler l'entrée et la sortie des fluides ainsi que leur débit On va maintenant décrire les figures 6a à 6c qui représentent les étapes de réalisation d'un moule d'injection réalisé en appliquant le procédé selon l'invention. Pour réaliser le moule représenté sur la figure 6c. on réalise par stéréolithographie les contre-formes 20a et 20b en résine du moule (fig. 6a). On applique le traitement thermique selon l'invention aux contre -formes 20a et 20b de manière à fissurer leur surface. Puis, par projection par torche à plasma de poudre métallique, on recouvre les surfaces fissurées. On obtient ainsi deux coques matrices 21a et 21b (fig. 6b). Les coques 21a et 21b sont ensuite montées dans un caisson 25, 24 rempli de résine 22. Une tuyère d'alimentation permet d'introduire la matière à mouler entre les deux coques 21a et 21b. Deux tubulures 26a et 26b ménagées à la partie inférieure assure un bon remplissage du moule.Will now be described in Figure 5 which represents a sectional view of an alternative embodiment of a device 29 using a heat input by plasma torch. The torch 32 is supported by an articulated arm 31, within a sealed enclosure 30 provided with a porthole 40. The torch, with a rated power of 55 kilowatts is supplied with electrical energy by a power cable 42 and gas (argon, hydrogen, helium, nitrogen) through a pipe 41. the flow rate of the torch 32 is approximately 60 1 / min. The organic substrate is mounted. vis-à-vis the torch, on a vertical support 33 or on a horizontal support, in particular a turntable 34. The interior of the sealed enclosure 30 at wall cooled by water circulation 35, can be fed in a neutral gas such as argon or helium. The immediate environment 36 of the part to be coated can be cooled by recirculating the atmosphere of the chamber or by supplying gas (air, argon, ...) optionally partially liquefied. A filter 39 makes it possible to filter the gases contained in the enclosure before discharging them. A vacuum pump 37 makes it possible to create a vacuum within the sealed chamber 30. Valves are used to control the inlet and outlet of fluids and their flow will now be described in Figures 6a to 6c that represent stages of embodiment of a mold of injection achieved by applying the method according to the invention. To make the mold shown in Figure 6c. counterforms 20a and 20b are produced by stereolithography in mold resin (FIG. 6a). Heat treatment is applied according to the invention against the Platforms 20a and 20b in order to crack their surface. Then, by projection with a metal powder plasma torch, the cracked surfaces are covered. Two matrix shells 21a and 21b are thus obtained (fig. 6b). The shells 21a and 21b are then mounted in a box 25, 24 filled with resin 22. A supply nozzle makes it possible to introduce the material to be molded between the two shells 21a and 21b. Two pipes 26a and 26b formed at the bottom ensure good filling of the mold.
On obtient ainsi une pièce moulée 27. A molded part 27 is thus obtained.

Claims

Revendications claims
1. Procédé de préparation de la surface d'un substrat organique (1, 20a, 20b) destiné à recevoir un revêtement (4), notamment métallique (8) ou céramique ; ledit procédé comprenant l'étape1. Method for preparing the surface of an organic substrate (1, 20a, 20b) intended to receive a coating (4), in particular metallic (8) or ceramic; said method comprising the step
- de fissurer (3a, 3b, 3c, 3d, 3e, 3f, 6, 9, 10) de manière maîtrisée la surface (la) dudit substrat (1, 20a, 20b), de sorte que l'ancrage mécanique du revêtement (4, 7, 8, 21a, 21b) est favorisé. - to crack (3a, 3b, 3c, 3d, 3e, 3f, 6, 9, 10) in a controlled manner the surface (la) of said substrate (1, 20a, 20b), so that the mechanical anchoring of the coating ( 4, 7, 8, 21a, 21b) is favored.
2. Procédé selon la revendication 1 tel que pour fissurer (3a, 3b, 3c, 3d, 3e,2. Method according to claim 1 such as for cracking (3a, 3b, 3c, 3d, 3e,
3f, 6, 9, 10) de manière maîtrisée la surface (la) dudit substrat (1)3f, 6, 9, 10) in a controlled manner the surface (la) of said substrate (1)
- on produit un réseau de fissures ayant des profondeurs comprises entre 20 et 100 μm (microns) et un espacement moyen d'environ 250 μm (microns). - a network of cracks is produced having depths between 20 and 100 μm (microns) and an average spacing of approximately 250 μm (microns).
3. Procédé selon lune quelconque des revendications 1 ou 2 tel que pour fissurer (3a, 3b, 3c, 3d, 3e, 3f, 6, 9, 10) de manière maîtrisée la surface (la) dudit substrat (1)3. Method according to any of claims 1 or 2 such as for cracking (3a, 3b, 3c, 3d, 3e, 3f, 6, 9, 10) in a controlled manner the surface (la) of said substrate (1)
- on procède à un apport thermique (2, 32) à la surface (la) dudit substrat (1, 20a, 20b). - We carry out a thermal contribution (2, 32) to the surface (la) of said substrate (1, 20a, 20b).
4. Procédé selon la revendication 3 tel que ledit apport thermique (2) est réalisé par l'un au moins des équipements (29) suivants :4. Method according to claim 3 such that said heat input (2) is produced by at least one of the following pieces of equipment (29):
- un four de traitement thermique,- a heat treatment oven,
- une étuve programmable,- a programmable oven,
- une torche de projection à plasma (29, 32), - une flamme,- a plasma projection torch (29, 32), - a flame,
- un laser.- a laser.
5. Dispositif (29) pour préparer la surface (la) d'un substrat organique (1) destiné à recevoir un revêtement (4, 6, 21a, 21b), notamment métallique ou céramique ; ledit dispositif comprenant5. Device (29) for preparing the surface (la) of an organic substrate (1) intended to receive a coating (4, 6, 21a, 21b), in particular metallic or ceramic; said device comprising
- des moyens de fissuration (2) maîtrisée de la surface dudit substrat, de sorte que l'ancrage mécanique du revêtement est favorisé.- Controlled cracking means (2) of the surface of said substrate, so that the mechanical anchoring of the coating is favored.
6. Dispositif selon la revendication 5 tel que les moyens de fissuration maîtrisée produisent un réseau de fissures ayant des profondeurs comprises entre 20 et 100 μm (micron) et un espacement moyen d'environ 250 μm (micron).6. Device according to claim 5 such that the controlled cracking means produce a network of cracks having depths between 20 and 100 μm (micron) and an average spacing of approximately 250 μm (micron).
7. Dispositif selon l'une quelconque des revendications 5 ou 6 tel que les moyens de fissuration maîtrisée comprennent - des moyens d'apport thermique (2, 32) sur la surface (la) dudit substrat (1).7. Device according to any one of claims 5 or 6 such that the controlled cracking means comprise - heat supply means (2, 32) on the surface (la) of said substrate (1).
8. Dispositif selon la revendication 7 tel que ledit apport thermique est réalisé par l'un au moins des moyens de chauffage suivants:8. Device according to claim 7 such that said heat input is produced by at least one of the following heating means:
- un four de traitement thermique, - une étuve programmable,- a heat treatment oven, - a programmable oven,
- une torche de projection à plasma (32),- a plasma projection torch (32),
- une flamme,- A flame,
- un laser.- a laser.
9. Substrat organique (1, 20a, 20b) destiné à recevoir un revêtement (4, 7, 8, 21a, 21b) notamment métallique (8) ou céramique ; ledit substrat (1) présentant des fissures (3a, 3b, 3c, 3d, 3e, 3f, 6, 9, 10) provoquées par le procédé ou le dispositif selon l'une quelconque des revendications là 6.9. Organic substrate (1, 20a, 20b) intended to receive a coating (4, 7, 8, 21a, 21b) in particular metallic (8) or ceramic; said substrate (1) having cracks (3a, 3b, 3c, 3d, 3e, 3f, 6, 9, 10) caused by the method or the device according to any one of claims 1 to 6.
10. Substrat organique selon la revendication 9 ; ledit substrat présentant un réseau de fissures ayant des profondeurs comprises entre 20 et 100 μm (micron) et un espacement moyen d'environ 250 μm (micron).10. Organic substrate according to claim 9; said substrate having a network of cracks having depths between 20 and 100 μm (micron) and an average spacing of approximately 250 μm (micron).
11. Substrat organique revêtu d'un dépôt, notamment métallique ou céramique ; ledit dépôt étant ancré dans des fissures (3a, 3b, 3c, 3d, 3e, 3f, 6, 9, 10) de la surface (la) dudit substrat (1) provoquées par le procédé ou le dispositif selon l'une quelconque des revendications là 6. 11. Organic substrate coated with a deposit, in particular metallic or ceramic; said deposit being anchored in cracks (3a, 3b, 3c, 3d, 3e, 3f, 6, 9, 10) of the surface (la) of said substrate (1) caused by the method or the device according to any one of claims there 6.
12. Substrat organique selon la revendication 11 ; ledit dépôt étant ancré dans un réseau de fissures ayant des profondeurs comprises entre 20 et 100 μm (micron) et un espacement moyen d'environ 250 μm (micron). 12. An organic substrate according to claim 11; said deposit being anchored in a network of cracks having depths between 20 and 100 μm (micron) and an average spacing of approximately 250 μm (micron).
PCT/FR1999/002821 1998-11-17 1999-11-17 Method for treating a material surface designed to receive a coating WO2000029129A1 (en)

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CN100415491C (en) * 2001-04-17 2008-09-03 Fts系统有限公司 Method and apparatus with redundancies for treating substrate plastic parts to accept paint without using adhesion promoters
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US7846043B2 (en) 2002-03-14 2010-12-07 Acushnet Company High performance golf ball having a reduced-distance
US7901302B2 (en) 2002-03-14 2011-03-08 Acushnet Company High performance golf ball having a reduced-distance
US8333669B2 (en) 2002-03-14 2012-12-18 Acushnet Company High performance golf ball having a reduced-distance
US7815527B2 (en) 2002-03-14 2010-10-19 Acushnet Company High performance golf ball having a reduced-distance
US7815528B2 (en) 2002-03-14 2010-10-19 Acushnet Company High performance golf ball having a reduced-distance
US8292758B2 (en) 2002-03-14 2012-10-23 Acushnet Company High performance golf ball having a reduced-distance
US7878928B2 (en) 2002-03-14 2011-02-01 Acushnet Company High performance golf ball having a reduced-distance
US7481723B2 (en) 2002-03-14 2009-01-27 Acushnet Company High performance golf ball having a reduced-distance
US7909711B2 (en) 2002-03-14 2011-03-22 Acushnet Company High performance golf ball having a reduced-distance
US7938745B2 (en) 2002-03-14 2011-05-10 Acushnet Company High performance golf ball having a reduced-distance
US8066588B2 (en) 2002-03-14 2011-11-29 Acushnet Company High performance golf ball having a reduced-distance
US8152656B2 (en) 2002-03-14 2012-04-10 Acushnet Company High performance golf ball having a reduced-distance
US7144338B2 (en) 2002-05-29 2006-12-05 Acushnet Company Golf ball with varying land surfaces
US7547746B2 (en) 2005-06-09 2009-06-16 Acushnet Company Golf ball containing centipede polymers

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