WO2000021715A3 - Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head - Google Patents

Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head Download PDF

Info

Publication number
WO2000021715A3
WO2000021715A3 PCT/US1999/023362 US9923362W WO0021715A3 WO 2000021715 A3 WO2000021715 A3 WO 2000021715A3 US 9923362 W US9923362 W US 9923362W WO 0021715 A3 WO0021715 A3 WO 0021715A3
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
wafer carrier
cavity
carrier membrane
rigid plate
Prior art date
Application number
PCT/US1999/023362
Other languages
French (fr)
Other versions
WO2000021715A2 (en
Inventor
Fred E Mitchel
John A Adams
Thomas Frederick A Bibby
Original Assignee
Speedfam Ipec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Speedfam Ipec Corp filed Critical Speedfam Ipec Corp
Priority to EP99950247A priority Critical patent/EP1133378A2/en
Priority to JP2000575662A priority patent/JP2002527894A/en
Publication of WO2000021715A2 publication Critical patent/WO2000021715A2/en
Publication of WO2000021715A3 publication Critical patent/WO2000021715A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings

Abstract

A carrier head for a semiconductor wafer polishing apparatus includes a rigid plate which has a major surface with a plurality of open fluid channels. A flexible wafer carrier membrane has a perforated wafer contact section for contacting the semiconductor wafer, and a bellows extending around the wafer contact section. A retaining member is secured to the rigid plate with a flange on the bellows sandwiched between the plate's major surface and the retaining ring, thereby defining a cavity between the wafer carrier membrane and the rigid plate. A fluid conduit is coupled to the rigid plate allowing a source of vacuum and a source of pressurized fluid alternately to be connected to the cavity. An additional wafer carrier membrane is internally located with respect to the cavity formed by the wafer carrier membrane, and forms another cavity with respect to the rigid plate. Another fluid conduit is connected to the internal wafer carrier membrane's cavity, which is selectively pressurized to make the internal wafer carrier membrane contact the wafer contact section.
PCT/US1999/023362 1998-10-09 1999-10-07 Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head WO2000021715A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP99950247A EP1133378A2 (en) 1998-10-09 1999-10-07 Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head
JP2000575662A JP2002527894A (en) 1998-10-09 1999-10-07 Semiconductor wafer polishing apparatus with variable polishing pressure carrier head

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/169,333 1998-10-09
US09/169,333 US6056632A (en) 1997-02-13 1998-10-09 Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head

Publications (2)

Publication Number Publication Date
WO2000021715A2 WO2000021715A2 (en) 2000-04-20
WO2000021715A3 true WO2000021715A3 (en) 2000-07-06

Family

ID=22615234

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1999/023362 WO2000021715A2 (en) 1998-10-09 1999-10-07 Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head

Country Status (6)

Country Link
US (1) US6056632A (en)
EP (1) EP1133378A2 (en)
JP (1) JP2002527894A (en)
KR (1) KR100385373B1 (en)
TW (1) TW416890B (en)
WO (1) WO2000021715A2 (en)

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Also Published As

Publication number Publication date
TW416890B (en) 2001-01-01
KR100385373B1 (en) 2003-05-27
EP1133378A2 (en) 2001-09-19
US6056632A (en) 2000-05-02
JP2002527894A (en) 2002-08-27
WO2000021715A2 (en) 2000-04-20
KR20020018641A (en) 2002-03-08

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