WO2000021119A8 - An apparatus for holding a semiconductor wafer - Google Patents

An apparatus for holding a semiconductor wafer

Info

Publication number
WO2000021119A8
WO2000021119A8 PCT/US1999/021554 US9921554W WO0021119A8 WO 2000021119 A8 WO2000021119 A8 WO 2000021119A8 US 9921554 W US9921554 W US 9921554W WO 0021119 A8 WO0021119 A8 WO 0021119A8
Authority
WO
WIPO (PCT)
Prior art keywords
wafers
wafer
holding
teeth
tooth
Prior art date
Application number
PCT/US1999/021554
Other languages
French (fr)
Other versions
WO2000021119A1 (en
Inventor
Larry S Wingo
Original Assignee
Union Oil Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Union Oil Co filed Critical Union Oil Co
Priority to AU58233/99A priority Critical patent/AU5823399A/en
Publication of WO2000021119A1 publication Critical patent/WO2000021119A1/en
Publication of WO2000021119A8 publication Critical patent/WO2000021119A8/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S206/00—Special receptacle or package
    • Y10S206/832—Semiconductor wafer boat
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S269/00—Work holders
    • Y10S269/902—Work holder member with v-shaped notch or groove
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S269/00—Work holders
    • Y10S269/904—Work holder for positioning elements of building in installed location
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S269/00—Work holders
    • Y10S269/909—Work holder for specific work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49995—Shaping one-piece blank by removing material
    • Y10T29/49996—Successive distinct removal operations

Abstract

An apparatus for holding a plurality of semi-conductor wafers during heat treatment of the wafers in a furnace comprises a plurality of rails extending essentially vertically between a top and bottom plate. Each rail contains a plurality of teeth arranged such that the space between adjacent teeth can receive a portion of a single semiconductor wafer. Each tooth contains a raised support structure, typically a ledge, located on the top surface of each tooth for supporting the wafer, usually from the edge of the wafer inward to a point located from the center of the wafer a distance equal to between about 25 % and about 75 % of the wafer's radius. Such an apparatus with its relatively long teeth is especially designed to uniformly support larger wafers, i.e., wafers having a nominal diameter greater than about 200 millimeters, such that their own weight does not cause the wafers to sag and thereby produce crystal dislocations or slip when the wafers are heated to high temperatures.
PCT/US1999/021554 1998-10-02 1999-09-17 An apparatus for holding a semiconductor wafer WO2000021119A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU58233/99A AU5823399A (en) 1998-10-02 1999-09-17 An apparatus for holding a semiconductor wafer

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/165,542 US6171400B1 (en) 1998-10-02 1998-10-02 Vertical semiconductor wafer carrier
US09/165,542 1998-10-02

Publications (2)

Publication Number Publication Date
WO2000021119A1 WO2000021119A1 (en) 2000-04-13
WO2000021119A8 true WO2000021119A8 (en) 2000-10-19

Family

ID=22599354

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1999/021554 WO2000021119A1 (en) 1998-10-02 1999-09-17 An apparatus for holding a semiconductor wafer

Country Status (4)

Country Link
US (3) US6171400B1 (en)
AU (1) AU5823399A (en)
TW (1) TW444240B (en)
WO (1) WO2000021119A1 (en)

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US8985050B2 (en) * 2009-11-05 2015-03-24 The Trustees Of Columbia University In The City Of New York Substrate laser oxide removal process followed by electro or immersion plating
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US10811291B2 (en) * 2017-11-08 2020-10-20 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer container and method for holding wafer
CN108423406B (en) * 2018-03-12 2020-08-07 惠科股份有限公司 Bottom frame of substrate bearing device, substrate bearing device and substrate conveying mechanism
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Also Published As

Publication number Publication date
US6357604B1 (en) 2002-03-19
TW444240B (en) 2001-07-01
AU5823399A (en) 2000-04-26
WO2000021119A1 (en) 2000-04-13
US6171400B1 (en) 2001-01-09
US6532642B1 (en) 2003-03-18

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