WO2000017937A2 - Verfahren zum herstellen eines halbleiterbauelements - Google Patents
Verfahren zum herstellen eines halbleiterbauelements Download PDFInfo
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- WO2000017937A2 WO2000017937A2 PCT/DE1999/003081 DE9903081W WO0017937A2 WO 2000017937 A2 WO2000017937 A2 WO 2000017937A2 DE 9903081 W DE9903081 W DE 9903081W WO 0017937 A2 WO0017937 A2 WO 0017937A2
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
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- H01L29/76—Unipolar devices, e.g. field effect transistors
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- H01L29/78—Field effect transistors with field effect produced by an insulated gate
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- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
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- H01L29/063—Reduced surface field [RESURF] pn-junction structures
- H01L29/0634—Multiple reduced surface field (multi-RESURF) structures, e.g. double RESURF, charge compensation, cool, superjunction (SJ), 3D-RESURF, composite buffer (CB) structures
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- H01L29/41725—Source or drain electrodes for field effect devices
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Definitions
- the present invention relates to a method for producing a semiconductor component having a semiconductor body having a blocking pn junction, a first zone of a first conductivity type which is connected to a first electrode and to a zone forming the blocking pn junction of a second to the first Conductivity type of opposite conduction type adjoins, and with a second zone of the first conduction type, which is connected to a second electrode, the side of the zone of the second conduction type facing the second zone forming a first surface and in the area between the first surface and a second Surface that lies between the first surface and the second zone, areas of the first and the second conduction type are interleaved.
- Such semiconductor components are also referred to as compensation components.
- compensation components are, for example, n- or p-channel MOS field-effect transistors, diodes, thyristors, GTOs or other components.
- a field effect transistor also called “transistor” for short
- Compensation components are based on mutual compensation of the charge of n- and p-doped regions in the drift region of the transistor.
- the regions are spatially arranged so that the line integral over the doping long corresponds a vertically extending to the pn junction line in each case below the material-specific breakdown charge ⁇ remains (silicon: 2 ⁇ 10 12 cm "2).
- p- and n-conducting layers can be arranged laterally between a trench covered with a p-conducting layer and a trench covered with an n-type layer can be stacked alternately one above the other (cf. US Pat. No. 4,754,310).
- the doping of the current-carrying region (for n-channel transistors the n-range, for p-channel transistors the p-range) can be significantly increased in compensation components, which results in a significant gain in switch-on resistance RDSon despite the loss of current-carrying surface.
- the blocking capability of the transistor essentially depends on the difference between the two dopings. Since doping of the current-carrying area by at least one order of magnitude is desired in order to reduce the on-resistance, control of the reverse voltage requires a controlled adjustment of the degree of compensation, which can be defined for values in the range ⁇ 10%. With a higher gain in switch-on resistance, the range mentioned becomes even smaller.
- the degree of compensation can be defined by
- a robust semiconductor component is therefore sought, which is distinguished on the one hand by a high avalanche strength and high current carrying capacity before or in the breakthrough, and on the other hand is easy to produce in terms of technological fluctuations in manufacturing processes with readily reproducible properties.
- Such a completely new type of semiconductor component is obtained if the regions of the first and second conductivity types are doped in such a way that charge carriers of the second conductivity type predominate in regions near the first surface and charge carriers of the first conductivity type predominate in regions near the second surface.
- the regions of the second conductivity type preferably do not reach as far as the second zone, so that a weakly doped region of the first conductivity type remains between this second surface and the second zone. But it is possible to let the width of this area go to "zero".
- the weakly doped region provides various advantages, such as increasing the reverse voltage, “soft” course of the field strength, improving the commutation properties of the inverse diode.
- a degree of compensation caused by the doping is varied such that atomic trunks of the second conduction type close to the first surface and atomic trunks of the first conduction near the second surface dominate guys.
- Electrodes "lateral" transverse field the strength of which depends on the proportion of the lateral charge (line integral perpendicular to the lateral pn junction) relative to the breakthrough charge. This field leads to the separation of electrons and holes and to a reduction in the current-carrying cross-section along the current paths. This fact is of fundamental importance for understanding the processes in the avalanche, the breakthrough characteristic and the saturation range of the characteristic field.
- the maximum breakdown voltage is achieved with an exactly horizontal field distribution. If the acceptors or donors predominate, the breakdown voltage decreases in each case. If the breakdown voltage is therefore plotted as a function of the degree of compensation, the result is a parabolic curve.
- a constant doping in the p- and n-conducting regions or also a locally varying doping with periodic maxima of the same level leads to a comparatively sharp maximum of the "compensation parabola".
- a comparatively high breakdown voltage must be targeted in order to achieve reliable yields and production reliability. The aim must therefore be to make the compensation parabola as flat and wide as possible.
- the drift path i.e. the area of the areas of opposite doping arranged in pairs, cleared of movable charge carriers.
- the positively charged donor hulls and the negatively charged acceptor hulls remain in the spanning space charge zone. You then first determine the course of the field.
- the current flow through the space charge zone causes a change in the electric field when the concentration of the charge carriers associated with the current flow comes into the range of the background doping. Electrons compensate donors, holes acceptors. For the stability of the building So it is very important to elements which doping predominates locally, where charge carriers are generated and how their concentrations occur along their current paths.
- n-doped region also called “column” in the case of a vertical transistor
- High current stability is promoted by predominating the n-doping;
- the channel area with its positive temperature coefficient prevents inhomogeneous current distribution in a cell field, this operating mode is rather uncritical.
- a reduction in the current density can be achieved by partially shading the duct connection (cf. DE 198 08 348 AI).
- the hole current is focused along its path through the transverse electrical field: the current density increases here.
- the longitudinal electrical field is thus initially influenced near the surface.
- Breakdown voltage This situation is stable as long as the field remains well below the critical field strength (for silicon: about 270 kV / cm for a charge carrier concentration of approx. 10 15 cm -3 ).
- the breakthrough is near the surface.
- the holes flow to the source contact and influence the field on the way from where it originated to the p-well.
- the aim must therefore be to bring the breakthrough location as close as possible to the p-well. This can be done, for example, by locally increasing the n-doping.
- the electrons flow through the complete drift zone to the rear and also influence the field along their current path. Stability is achieved when the effect of the electron current outweighs that of the hole current. Since the geometry of the cell arrangement plays an important role here, there is a range of stable and unstable characteristic curves, particularly near the maximum of the compensation parabola.
- the conditions in the Avalanche are very similar to those in the event of a breakthrough.
- the currents are significantly higher and are up to twice the nominal current of the transistor at a nominal current. Since the electrical transverse field always causes the current to be clearly focused, compensation components leave the stability range with a comparatively low current load. Physically, this means that the current-induced field increase has already progressed so far that the breakthrough field strength is locally reached. The longitudinal electrical field can then no longer increase locally, but the curvature of the longitudinal electrical field continues to increase, which results in a drop in the breakdown voltage of the affected cell. In the characteristic curve of a single cell and also in the simulation, this is shown by a negative differential resistance; ie the voltage decreases with increasing current. In a large transistor with several 10,000 cells, this will lead to a very rapid inhomogeneous redistribution of the current. A filament is formed and the transistor melts locally.
- the degree of compensation along the doping regions i.e. in the case of a vertical structure from the top towards the rear of the transistor, it varies so that near the surface the atomic trunks of the second conduction type predominate and near the rear the atomic trunks of the first conduction type.
- the resulting field distribution has a "hump-shaped" course with a maximum at about half the depth.
- the electrons as well as the holes in the breakthrough and in the avalanche thus influence the field distribution.
- Both types of charge have a stabilizing effect because they run from their place of origin into areas in which they compensate for the dominant, excess background doping. There is a continuous range of stability from p-type to n-type levels of compensation.
- the size of this modification The degree of compensation also determines the limits of the stability range. This makes the manufacturing window freely selectable.
- the degree of compensation e.g. in the direction of "n-load" the electrical field increases in the upper area of the drift path, but at the same time decreases in the lower area (vice versa in the case of variation in the direction of p-load), the breakdown voltage varies only relatively as a function of the degree of compensation little. This makes the compensation parabola preferably flat and wide.
- the vertical variation of the degree of compensation can take place by varying the doping in the p-region or by varying the doping in the n-region or by varying the doping in both regions.
- the variation of the doping along the columns can have a constant slope or take place in several stages. In principle, however, the variation increases monotonically from a p-type compensation level to an n-type compensation level.
- the limits of stability are reached on the n-load side when the field runs horizontally near the surface over a noticeable area of the drift path.
- the stability limit is reached when the field runs horizontally near the bottom of the compensating column area over a noticeable area of the drift distance.
- lateral transistors can be seen, for example, in the smart power sector or in microelectronics;
- Vertical transistors are mainly produced in line electronics.
- the vertical modification of the degree of compensation is very easy to implement, since only the implantation dose has to be changed in the individual epitaxial planes.
- the "real" compensation dose is then implanted in the middle epitaxial layer, including e.g. 10% less each, e.g. each 10% more.
- the epitaxial doping can also be changed.
- the greater controllable spread makes it possible to reduce the manufacturing costs.
- the number of necessary Epitaxial layers can be reduced, and the openings for the compensation implantation can be reduced as a result of the higher scatter of the implanted dose due to the greater relative scatter of the lacquer size and, at the same time, extended post-diffusion for the diffusion of the individual p-regions to form the "column".
- FIG. 16 shows a section through a novel n-channel MOS transistor with an n + -conducting silicon semiconductor substrate 1, a drain electrode 2, a first n-conductive layer 13, a second layer 3 with n-conductive regions 4 and p-type regions 5, p-type zones 6, n-type zones 7, gate electrodes 8 made of, for example, polycrystalline silicon or metal, which are embedded in an insulating layer 9 made of, for example, silicon dioxide, and a source metallization 10 made of, for example Aluminum.
- the p-type regions 5 do not reach the n + -type semiconductor substrate.
- the charge of the p-regions 5 is variable, while the charge of the n-regions 4 is constant in each case. It is here as in the previous exemplary embodiments but it is also possible that the charge of the p-type regions 5 is constant and the charge of the n-type regions is varied. It is also possible to make the charge variable in both areas 4 and 5.
- This object is achieved according to the invention in a method of the type mentioned at the outset in that the regions of the first and the second conductivity type are formed by doping trenches and filling them in such a way that charge carriers of the second conductivity type and in the region in the vicinity of the first surface Charge carriers of the first conductivity type predominate near the second surface.
- the method according to the invention is preferably applied to a semiconductor body made of silicon.
- a semiconductor body made of silicon is also possible to apply the invention to other semiconducting materials, such as compound semiconductors, silicon carbide, etc.
- the etching of the trenches can be set by a suitable choice of process parameters in such a way that the trenches have a defined side wall inclination, so that, for example, trenches are formed which have a smaller cross-sectional area with increasing depth.
- the required n-doping with, for example, phosphorus for the current-carrying path can then take place either via the background doping of the semiconductor body or via a sidewall doping of the trench that is constant over the entire depth of the trench.
- Such sidewall doping can be achieved through occupancy processes, doping from the gas phase, plasma doping or by applying epitaxially deposited, doped layers in the trenches.
- the trench is then partially or completely closed with homogeneously epitaxially grown semiconductor material, for example silicon, of the p-type.
- semiconductor material for example silicon
- the vertical course of the doping via the geometry of the trench, which can be done on the one hand by the profile of the trench wall and / or on the other hand by the floor plan of the trenches.
- the ratio of the effective doping is proportional to the trench diameter, while in the case of circular or columnar trenches the trench opening at the top or bottom edge is square in accordance with the circular area.
- a sidewall doping of the p-conduction type can also be used instead of an epitaxial filling.
- a trench etch with a strictly vertical sidewall profile is easier to achieve than a trench with a tapered cross-section.
- a defined graded tapering of the trench profile into the depth of the trench can be achieved with the aid of one or more spacer or spacer etching steps.
- a first trench estimate is started here to a certain depth.
- a sidewall spacer is then formed in the usual way, for example by oxide deposition and anisotropic etching back. Then one closes further trench estimation, these steps possibly having to be repeated several times. Finally the mask and the spacer are removed.
- a gradation of a p-type doping with increasing trench depth by a trench etching interrupted several times.
- One possibility is to carry out the side wall doping after reaching a certain partial depth of the trench estimate, so that an increased doping dose results in the upper parts of the trench by adding the respective partial doping.
- This method can also be combined, for example, with an ion implantation after each partial etching step, for example by diffusing the dose implanted in the bottom of the trench directly after the implantation step, the portion of the dose diffused laterally in this way not being removed by the next trench partial etching step. Finally, the individual p-type regions obtained in this way are connected by diffusion.
- the ion implantation takes place at a small angle with respect to the depth of the trench, there is also a certain doping in the side walls of the trench.
- the decrease in the doping with the depth of the trench can easily be carried out by specifically setting the implantation dose in each level.
- a multi-step side wall doping of the trenches can also be achieved in that, following a continuous deep trench etching, the trench with a material of sufficiently low viscosity , such as photoresist, is partially refilled. This filling of photoresist can then be gradually removed again by simple etching processes with each step between the exposed part of the side wall of the trench is doped. This results in an increased doping concentration in the upper parts of the trench by adding the respective partial doses of the individual doping.
- the process just explained above can be modified such that the trench is additionally filled with an insulating layer, for example silicon dioxide, which has been deposited by a CVD process, and in stages is etched back.
- an insulating layer for example silicon dioxide
- the sidewall doping of the trench from the gas phase can be adjusted by suitable selection of the process parameters in such a way that the dopant becomes depleted towards the trench bottom, as is desired, for example, for p-doping.
- etching medium for example hydrochloric acid
- a suitable combination of rotation, tilt angle and energy of the dopant ions, using the ion scattering on the trench side walls enables a doping dose that decreases with depth to be achieved.
- defects can lead to anisotropic diffusion behavior in the crystal. This property can be used for a targeted deep diffusion of, for example, p-type columns along the defects, the diffusion gradient automatically resulting in a lowering of the doping concentration with increasing depth of the defects.
- the defects can be generated, for example, with an extreme high-energy implantation over a large area in the semiconductor body, whereupon a masked introduction of, for example, p-type dopant with subsequent deep diffusion takes place. The defects are then to be healed.
- a shift in the degree of compensation towards p-dominance towards the surface of the semiconductor body can also be achieved by a flat n-conducting background doping of the semiconductor body whose doping concentration decreases towards the surface of the semiconductor body.
- Another possibility is to diffuse an n-dopant from the back of the semiconductor body, whereby the semiconductor body should be relatively thin under certain circumstances to make long diffusion times that are otherwise necessary manageable.
- a typical phenomenon in plasma-assisted anisotropic trench estimates, particularly in the case of high aspect ratios of trenches, is the decrease in the trench depth with the measure of
- Trench opening for a given etching time There are various possibilities for using this phenomenon for the realization of vertically graded p-doping profiles.
- a central trench can thus be etched with full target depth, with immediately adjacent “satellites”
- Trenches have a reduced diameter. If necessary, multiple gradations can also be achieved in this way.
- the central trench is then, for example, provided with a homogeneous n-doping, while the satellite trenches are masked. All trenches are then equipped with p-type doping.
- the n-doping can also be present homogeneously as background doping in the semiconductor body. Since the doped areas of a compensation component are completely cleared by movable charge carriers in the event of a lock, the lateral spatial separation of the trenches does not play a major role. On average, there remains an excess of p-charge carriers to the depth specified by the neighboring trenches.
- p- and n-type "columns" can also be spatially separated, so that, for example, the central one Trench can be used as an n-doped electron path, while step-by-step p-compensation is achieved with the satellite trenches, which are gradually reduced in diameter and thus also reduced in depth.
- the larger, controllable scattering according to the invention also makes it possible to raise the necessary narrow requirements for the manufacturing tolerances with regard to the etching dimension of the trench etching, dose of the various side wall doping or fillings, etc., to the extent that a producible semiconductor component is produced.
- the respective constant counter-doping can optionally be present as a homogeneous background doping of the semiconductor body or via trench side wall doping before the oxide side wall spacer is generated. consequences.
- the electron and hole current paths are thus separated vertically by an insulator, but this is insignificant for the basic functionality of the compensation component.
- those methods in which the net-o-p-load to the surface of the semiconductor body is achieved by varying the p-doping with constant n-doping are to be preferred to those methods which either exclusively or additionally have a vertical gradient in the Have n-doping, since the on-resistance is increased in the latter.
- 1 to 3 are sectional views for explaining various methods for trench estimation with a defined sidewall inclination
- FIG. 12 shows a sectional view to explain a method in which a varying side wall profile is generated by ion implantation
- FIG. 13 is a sectional view for explaining a method with a variable background doping of the semiconductor body
- 14a to 14c are sectional views for explaining a method in which trenches of different cross sections are combined
- 15a to 15d are sectional views for explaining a method in which a trench with a vertical side wall and a filling with selective epitaxy are used, and 16 shows a section through a semiconductor component produced by the method according to the invention.
- the trench 11 shows a trench 11 in an n-type semiconductor region 4, this trench 11 being filled epitaxially by semiconductor material, so that a p-type region 6 is formed.
- the trench 11 has a structure tapering downwards towards its bottom, i.e. it becomes narrower as the depth increases.
- the arrangement shown in FIG. 1 can be used for n-type compensation components.
- the n-doping of the current-carrying path required for these components is determined via the background doping, i.e. the doping of region 4 in the silicon semiconductor body is achieved.
- FIG. 2 shows another exemplary embodiment in which the trench 11 is provided with a side wall doping in its wall surfaces, so that the n-type region 4 is formed by the side walls of the trench 11 in an i-conducting semiconductor body 1.
- the structure shown in FIG. 2 can be formed by coating process, doping from the gas phases, plasma doping or by epitaxial deposition of a corresponding layer.
- the p-type regions 5 are formed by epitaxial growth of silicon.
- the desired gradient the compensation from p-load to n-load achieved with increasing depth of the trench 11.
- the vertical course of the doping concentration can thus be set via the geometry of the trench 11, which is done on the one hand by the profile of the trench wall (see FIG. 2) and on the other hand by the floor plan of the trench 11.
- the ratio of the effective doping is proportional to the diameter of the trench 11, while in the case of circular or columnar trench 11 the trench opening at the top or bottom edge is squared in accordance with the circular area.
- n-type sidewall doping in the case of circular trenches 11 and a homogeneous p-conducting background doping instead of an epitaxial filling of the trenches 11, so that a trench widening with increasing depth causes a transition from p-load to n-load takes place (see. Fig. 3).
- FIGS. 4a to 4d show a method in which a trench etching with a vertical sidewall inclination and a stepwise spacer is carried out.
- a trench etching with a strictly vertical side wall profile is easier to achieve than an oblique side wall profile, as is used in the methods according to FIGS. 1 to 3.
- a defined gradual tapering of the trench profile downwards can be achieved with the aid of one or more spacer etching steps.
- a first trench 14 is introduced into an n-conducting semiconductor body up to a certain partial depth (cf. FIG. 4a).
- a sidewall spacer is then produced in the usual way, for example by deposition of silicon dioxide and anisotropic etching back (cf. FIG. 4b). This is followed by a further trench etching, in which the trench 14 covered with the side wall spacer 15 is "deepened” at its bottom, so that a trench 16 is formed (cf. FIG. 4c).
- these steps can be repeated several times with a side wall covering and a deepening of the trench.
- this trench 17 can be treated in the manner explained with reference to FIGS. 1 and 2:
- the trench 17 is filled, for example, epitaxially with p-conducting silicon, so that a p-conducting region 5 is formed, the width of which progresses in steps from above decreases below.
- An additional possibility consists in introducing an n-side wall doping already after the step in FIG. 4c, which is then masked in the upper part of the trench 16 by the side wall spacer 15.
- n-side wall doping already after the step in FIG. 4c, which is then masked in the upper part of the trench 16 by the side wall spacer 15.
- n- and / or p-side wall doping after removal of the side wall spacer 5, a net excess of p-charge carriers in the upper trench part can be achieved.
- a gradation of the p-doping with increasing trench depth can also be achieved by a trench etching interrupted several times become. This is possible by, for example, performing the sidewall doping after reaching a certain partial depth of the trench estimate.
- FIG. 5a in which, after etching a trench 14, sidewall doping is carried out to produce a p-type region 5.
- the trench 1-4 is deepened further, and then another side wall doping follows, in which the doping overlaps in the upper trench part and causes an increased doping concentration there (cf. FIG. 5b).
- This procedure can also be used, for example, in the case of an ion implantation after each partial etching step (cf. FIG. 6a): after the trench 14 has been introduced, an ion implantation is carried out (cf. arrows 18), so that a p-conducting region at the bottom of the trench 14 arises. The trench 14 is then deepened in a further etching step and a new ion implantation follows (cf. FIG. 6b). In this way, p-type regions 5 are formed at the edge and at the bottom of the trench 14, which are finally connected to one another by diffusion.
- This connection can be supported by performing the ion implantation at a small angle to the depth direction of the trench 14, at which a certain dose of the implanted ions also reaches the side walls of the trench 14.
- the decrease in the net p concentration with the depth of the trench 14 can be achieved simply by the targeted setting of the ion implantation dose in each level of the floor of the respective trench.
- the 5a, 5b, 6a, 6b, multi-step sidewall doping of the examples in FIGS. 5a, 5b, 6a, 6b can also be achieved in that after a continuous deep trench etching (cf. is filled (see FIG.
- the photoresist 19 is then removed in stages by simple etching processes, and after each removal of the photoresist 19, the part of the side wall of the trench 14 which is then exposed in each case is doped with p-dopant, for example boron (see FIG. 7c), which ultimately results in multiple Doping results in an increased wall dose in the upper parts due to the addition of the respective partial doses (see FIG. 7d).
- p-dopant for example boron
- the exemplary embodiment explained with reference to FIGS. 7a to 7d can also be modified such that the trench 14 is filled with silicon dioxide, for example by CVD (chemical vapor deposition) and then gradually etched back.
- silicon dioxide is therefore used.
- the following procedure can alternatively be followed: Before the photoresist 19 is introduced into the trench 14, the trench 14 is first lined with a silicon dioxide layer 20, what can be done by a thermal process (see Fig. 8a). Photoresist 19 is then introduced and etched back (see FIG. 8b), and the exposed part of the oxide layer 20 is removed (see FIG. 8c), which can be done by etching. Then the remaining photoresist 19 is then removed, so that any lower part of the trench 14 to be fixed as desired is replaced by the remaining part Silicon dioxide layer 20 is masked against doping. In this way, a graded doping profile with p-dopant can be obtained, the doping amount of which decreases from top to bottom.
- the sidewall doping of the trench 14 from the gas phase can be adjusted by a suitable choice of the process parameters in such a way that the doping material becomes depleted towards the trench bottom, as is desired for the p-doping.
- n-type epitaxial deposition in which an etching medium, for example hydrochloric acid, is also added during the deposition itself. If the deposition rate outweighs the etching rate, a profile is obtained in which there is an increased n-doping in the direction of the trench bottom (cf. FIG. 11).
- an etching medium for example hydrochloric acid
- a suitable combination of rotation, tilt angle and energy of the dopant ions, using the ion scattering on the side walls of the trench 14, allows a dose that decreases with the depth to be achieved (cf. FIG. 12).
- the aspect ratio of the trench is high, it may be necessary to work with a successive combination of tilting angles, including an implantation at an angle of 0 °.
- Such a procedure is indicated schematically in FIG. 12 with a tilt angle ⁇ of the ion implantation 18.
- the lower doping with increasing trench depth arises from the fact that the intensity of the “reflected” ion beams decreases towards the depth of the trench 14, so that an increasingly weaker dose is obtained there.
- Certain types of defects can lead to anisotropic diffusion behavior in the silicon compound semiconductor or silicon carbide crystal of a semiconductor body. This property can be exploited for a targeted deep diffusion of, for example, p-type columns along the defects, the diffusion gradient automatically resulting in a lowering of the concentration with increasing depth.
- the defects can be generated, for example, with an areal surface in the semiconductor body 1 using an extreme high-energy implantation, whereupon the masked introduction of the p-type dopant, for example boron, with subsequent deep diffusion takes place. It is of course important that the defects can then be healed.
- the p-type dopant for example boron
- a shift in the degree of compensation towards p-load to the surface of the semiconductor body 1 can also be achieved by a flat n-background doping whose concentration decreases towards the surface. This can be done, for example, by using a base material with several epitaxial layers 23, 24, 25 with different n-doping (see FIG. 13) or by graduated doping during the deposition. For example, in FIG. 13, layer 23 is more heavily doped than layer 24, and layer 24 is again more heavily doped than layer 25.
- Another possibility is to diffuse an n-dopant from the back of the semiconductor body, in which case the semiconductor body must be made relatively thin in order to avoid long diffusion times, if necessary.
- Etching step etched both a central trench 28 with a full target depth and immediately adjacent satellite trenches 26 with a reduced diameter.
- the trench 28 is provided with an n-type region 4 in the i-type semiconductor body 1.
- the trenches 25, 26 are then filled with p-conducting semiconductor material, in particular silicon.
- FIG. 14c Another possibility is shown in FIG. 14c: here the central trench 28 is provided with a homogeneous n-doping, so that there is an n-conducting region 4, while the satellite trenches 26 have a p-doping and p- form conductive areas 5.
- n-doping homogeneously as background doping.
- the doped areas of a compensation component are completely cleared of movable charge carriers in the event of blocking.
- the lateral spatial separation of the trenches 25, 26 therefore does not play a major role. What remains in the spatial mean is a p-excess to the depth specified by the neighboring trench.
- the p- and n- "columns" can also be spatially separated, as shown in the example in FIG. 14c: the central trench 28 is used as an n-doped electron path, while the diameter is reduced and in order to a step-by-step p compensation is also achieved in the depth-reduced satellite trenches 26.
- the trench 14 can be filled with monocrystalline silicon 27 using the “selective epitaxy” method, but this can be achieved by the oxide covering of the side wall grows starting from the trench bottom (see Fig. 15c).
- the respective constant counter-doping can optionally be used as a homogeneous background doping of the semiconductor body 1 may be present or else be carried out via a trench side wall doping before the generation of the spacer 15.
- the electron or hole current paths are thus separated vertically by an insulator (cf. FIG. 15d), but this is irrelevant for the basic functionality of the compensation component. ⁇
- the regions 4, 5 of the semiconductor component shown in FIG. 16 have been described above.
- the remaining parts of this semiconductor component, in particular the first zone of the first conductivity type, the zone of the second conductivity type and the second zone of the first conductivity type, and the electrodes connected to these zones, are produced in a conventional manner, which is achieved by appropriate diffusion ion implantation epitaxy and Metallization steps can happen.
- What is essential to the present invention is therefore the generation of the regions of the first and the second conduction type in such a way that charge carriers of the second conduction type predominate in areas near a first surface and charge carriers of the first conduction type predominate in areas near a second surface, as is the case with all exemplary embodiments 1 to 15 is the case.
Abstract
Description
Claims
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JP2000571503A JP4005312B2 (ja) | 1998-09-24 | 1999-09-24 | 半導体構成素子の製造方法 |
EP99955799A EP1110244A1 (de) | 1998-09-24 | 1999-09-24 | Verfahren zum herstellen eines halbleiterbauelements |
KR1020017003803A KR20010075354A (ko) | 1998-09-24 | 1999-09-24 | 반도체 소자를 제조하기 위한 방법 |
US09/817,594 US6649459B2 (en) | 1998-09-24 | 2001-03-26 | Method for manufacturing a semiconductor component |
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DE19843959A DE19843959B4 (de) | 1998-09-24 | 1998-09-24 | Verfahren zum Herstellen eines Halbleiterbauelements mit einem sperrenden pn-Übergang |
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WO2001018869A2 (de) * | 1999-09-09 | 2001-03-15 | Infineon Technologies Ag | Halbleiterbauelement für hohe sperrspannungen bei gleichzeitig niedrigem einschaltwiderstand und verfahren zu dessen herstellung |
WO2001018869A3 (de) * | 1999-09-09 | 2001-08-02 | Jeno Tihanyi | Halbleiterbauelement für hohe sperrspannungen bei gleichzeitig niedrigem einschaltwiderstand und verfahren zu dessen herstellung |
US6762455B2 (en) | 1999-09-09 | 2004-07-13 | Infineon Technologies Ag | Semiconductor component for high reverse voltages in conjunction with a low on resistance and method for fabricating a semiconductor component |
JP2002134748A (ja) * | 2000-10-20 | 2002-05-10 | Fuji Electric Co Ltd | 超接合半導体素子 |
JP2005505921A (ja) * | 2001-10-04 | 2005-02-24 | ゼネラル セミコンダクター,インク. | フローティングアイランド電圧維持層を有する半導体パワーデバイス |
JP2005514794A (ja) * | 2001-12-31 | 2005-05-19 | ジェネラル・セミコンダクター・インコーポレーテッド | ドープカラムを含む高電圧電力mosfet |
JP2005514786A (ja) * | 2001-12-31 | 2005-05-19 | ジェネラル・セミコンダクター・インコーポレーテッド | 迅速な拡散によって形成されるドープカラムを含む電圧維持領域を有する高電圧電力mosfetを製造する方法 |
KR100990294B1 (ko) * | 2001-12-31 | 2010-10-26 | 제네랄 세미콘덕터 인코포레이티드 | 도핑된 칼럼들을 포함하는 고전압 전력 mosfet |
JP4833517B2 (ja) * | 2001-12-31 | 2011-12-07 | ジェネラル・セミコンダクター・インコーポレーテッド | 迅速な拡散によって形成されるドープカラムを含む電圧維持領域を有する高電圧電力mosfetを製造する方法 |
Also Published As
Publication number | Publication date |
---|---|
DE19843959B4 (de) | 2004-02-12 |
JP4005312B2 (ja) | 2007-11-07 |
WO2000017937A3 (de) | 2000-12-28 |
US20010053568A1 (en) | 2001-12-20 |
EP1110244A1 (de) | 2001-06-27 |
US6649459B2 (en) | 2003-11-18 |
JP2002525877A (ja) | 2002-08-13 |
DE19843959A1 (de) | 2000-04-06 |
KR20010075354A (ko) | 2001-08-09 |
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