WO2000013220A1 - Nanoporous silica via combined stream deposition - Google Patents
Nanoporous silica via combined stream deposition Download PDFInfo
- Publication number
- WO2000013220A1 WO2000013220A1 PCT/US1999/018333 US9918333W WO0013220A1 WO 2000013220 A1 WO2000013220 A1 WO 2000013220A1 US 9918333 W US9918333 W US 9918333W WO 0013220 A1 WO0013220 A1 WO 0013220A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- stream
- composition
- water
- film
- substrate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02203—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being porous
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02205—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition
- H01L21/02208—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si
- H01L21/02214—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and oxygen
- H01L21/02216—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and oxygen the compound being a molecule comprising at least one silicon-oxygen bond and the compound having hydrogen or an organic group attached to the silicon or oxygen, e.g. a siloxane
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
- H01L21/02337—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to a gas or vapour
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
- H01L21/02343—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to a liquid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/314—Inorganic layers
- H01L21/316—Inorganic layers composed of oxides or glassy oxides or oxide based glass
- H01L21/31695—Deposition of porous oxides or porous glassy oxides or oxide based porous glass
Definitions
- the present invention offers a solution to this problem. It has been unexpectedly found that the deposition of a combined composition stream of an alkoxysilane composition plus water or a base catalyst or both water and a base catalyst onto a surface of a substrate immediately after their combining results in a more uniform film.
- the alkoxysilane composition and optional base containing catalyst composition can form a combined composition stream which is exposed to water, such as water vapor, to produce a film.
- the components of the combined composition stream first contact each other in the space above the substrate such that the combined stream is unbounded at the point of confluence of the individual streams.
- a pumping apparatus 4 where two separate components of a combined composition stream 9 are held in separate tanks 1 and 2 respectively, until they are to be reacted with each other.
- Tanks 1 and 2 hold an alkoxysilane composition and water, and have separate discharge tubes 5 and 6 for discharging the alkoxysilane composition and water.
- the alkoxysilane composition and water are separately discharged from the apparatus 4 through the tubes 5 and 6 and are combined together to form a combined composition stream 9 which is deposited onto a surface of a substrate 8.
- the pumping apparatus 4 contains an alkoxysilane composition and a base containing catalyst composition in separate tanks 1 and 2, as seen in Figure 2.
- a dual syringe pump as seen in Figure 2 was used for deposition using 5 ml and 20 ml syringes.
- the precursor was in the larger syringe and catalyst in the smaller.
- 1 ml of precursor and 0.346 ml of catalyst were simultaneously deposited at a rate of 10 ml/min and met at a 90° angle to form one stream onto the substrate.
- the wafer was spinning at 100 ⁇ m during deposition, then at 2500 ⁇ m for 30 sec.
- the film was placed in a wafer carrier cartridge in the cleanroom ambient humidity that was set at 35%>. The film was aged for 8 minutes.
- a precursor is synthesized by adding 104.0 mL of tetraethoxysilane, 47.0 mL of triethylene glycol monomethyl ether, 8.4 mL of deionized water, and 0.34 mL of IN nitric acid together in a round bottom flask. The solution is allowed to mix vigorously then heated to -80 °C and refluxed for 1.5 hours to form a solution. After the solution is allowed to cool, it is diluted 21.6%) by weight with ethanol to reduce the viscosity.
- the catalyst used is monoethanolamine. It is diluted 8.75% by weight in ethanol.
- a syringe pump as seen in Figure 3 is used for deposition using 5 ml and 20 ml syringes.
- the precursor is in the larger syringe and catalyst and water in the smaller syringes.
- 1 ml of precursor, 0.346 ml of catalyst, and 0.173 ml of deionized water are simultaneously deposited at a rate of 10 ml/min and met at a 90° angle to form one stream onto the substrate.
- the wafer is spun at 2500 ⁇ m for 30 seconds after deposition.
- the film is placed in a wafer carrier cartridge in the cleanroom ambient humidity that is set at 35%.
- the film is aged for 15 min.
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU53975/99A AU5397599A (en) | 1998-08-27 | 1999-08-13 | Nanoporous silica via combined stream deposition |
EP99939736A EP1110239A1 (en) | 1998-08-27 | 1999-08-13 | Nanoporous silica via combined stream deposition |
KR1020017002574A KR20010073059A (en) | 1998-08-27 | 1999-08-13 | Nanoporous silica via combined stream deposition |
JP2000568112A JP2002524848A (en) | 1998-08-27 | 1999-08-13 | Nanoporous silica by combined flow deposition |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/140,855 | 1998-08-27 | ||
US09/140,855 US6037275A (en) | 1998-08-27 | 1998-08-27 | Nanoporous silica via combined stream deposition |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2000013220A1 true WO2000013220A1 (en) | 2000-03-09 |
Family
ID=22493101
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1999/018333 WO2000013220A1 (en) | 1998-08-27 | 1999-08-13 | Nanoporous silica via combined stream deposition |
Country Status (8)
Country | Link |
---|---|
US (1) | US6037275A (en) |
EP (1) | EP1110239A1 (en) |
JP (1) | JP2002524848A (en) |
KR (1) | KR20010073059A (en) |
CN (1) | CN1146963C (en) |
AU (1) | AU5397599A (en) |
TW (1) | TW483068B (en) |
WO (1) | WO2000013220A1 (en) |
Cited By (3)
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WO2003088343A1 (en) * | 2002-04-10 | 2003-10-23 | Honeywell International, Inc. | New porogens for porous silica dielectric for integral circuit applications |
WO2003088344A1 (en) * | 2002-04-10 | 2003-10-23 | Honeywell International, Inc. | Low metal porous silica dielectric for integral circuit applications |
JP2004511896A (en) * | 2000-06-23 | 2004-04-15 | ハネウェル・インターナショナル・インコーポレーテッド | Method for restoring hydrophobicity in dielectric films and materials |
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US6248168B1 (en) * | 1997-12-15 | 2001-06-19 | Tokyo Electron Limited | Spin coating apparatus including aging unit and solvent replacement unit |
US6395651B1 (en) * | 1998-07-07 | 2002-05-28 | Alliedsignal | Simplified process for producing nanoporous silica |
US6318124B1 (en) * | 1999-08-23 | 2001-11-20 | Alliedsignal Inc. | Nanoporous silica treated with siloxane polymers for ULSI applications |
US6589889B2 (en) * | 1999-09-09 | 2003-07-08 | Alliedsignal Inc. | Contact planarization using nanoporous silica materials |
US6875687B1 (en) | 1999-10-18 | 2005-04-05 | Applied Materials, Inc. | Capping layer for extreme low dielectric constant films |
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US7265062B2 (en) * | 2000-04-04 | 2007-09-04 | Applied Materials, Inc. | Ionic additives for extreme low dielectric constant chemical formulations |
US6576568B2 (en) | 2000-04-04 | 2003-06-10 | Applied Materials, Inc. | Ionic additives for extreme low dielectric constant chemical formulations |
US6495479B1 (en) * | 2000-05-05 | 2002-12-17 | Honeywell International, Inc. | Simplified method to produce nanoporous silicon-based films |
US8042771B2 (en) | 2007-05-25 | 2011-10-25 | Karl F. Milde, Jr. | Method and apparatus for treating fuel to temporarily reduce its combustibility |
US7222821B2 (en) * | 2001-11-21 | 2007-05-29 | Matos Jeffrey A | Method and apparatus for treating fuel to temporarily reduce its combustibility |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2124727A5 (en) * | 1971-01-27 | 1972-09-22 | Marini Officine Meccanic | |
FR2221189A1 (en) * | 1973-03-14 | 1974-10-11 | Wilkinson Sword Ltd | Application of gels to surfaces - by co-spraying two, independently stored, gel forming liqs. onto a substrate |
JPH05243140A (en) * | 1992-02-27 | 1993-09-21 | Fujitsu Ltd | Spin-coating device and method thereof |
US5736425A (en) * | 1995-11-16 | 1998-04-07 | Texas Instruments Incorporated | Glycol-based method for forming a thin-film nanoporous dielectric |
US5753305A (en) * | 1995-11-16 | 1998-05-19 | Texas Instruments Incorporated | Rapid aging technique for aerogel thin films |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4510176A (en) * | 1983-09-26 | 1985-04-09 | At&T Bell Laboratories | Removal of coating from periphery of a semiconductor wafer |
JPS63136528A (en) * | 1986-11-27 | 1988-06-08 | Mitsubishi Electric Corp | Applicator for treatment liquid |
US5094884A (en) * | 1990-04-24 | 1992-03-10 | Machine Technology, Inc. | Method and apparatus for applying a layer of a fluid material on a semiconductor wafer |
US5186745A (en) * | 1991-02-04 | 1993-02-16 | Motorola, Inc. | Teos based spin-on-glass and processes for making and using the same |
US5315724A (en) * | 1992-07-29 | 1994-05-31 | Mark Trujillo | Combination fire tool |
SG130022A1 (en) * | 1993-03-25 | 2007-03-20 | Tokyo Electron Ltd | Method of forming coating film and apparatus therefor |
US5646071A (en) * | 1995-01-19 | 1997-07-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Equipment and method for applying a liquid layer |
EP0775669B1 (en) * | 1995-11-16 | 2001-05-02 | Texas Instruments Incorporated | Low volatility solvent-based precursors for nanoporous aerogels |
-
1998
- 1998-08-27 US US09/140,855 patent/US6037275A/en not_active Expired - Fee Related
-
1999
- 1999-08-13 WO PCT/US1999/018333 patent/WO2000013220A1/en not_active Application Discontinuation
- 1999-08-13 EP EP99939736A patent/EP1110239A1/en not_active Withdrawn
- 1999-08-13 CN CNB998127620A patent/CN1146963C/en not_active Expired - Fee Related
- 1999-08-13 KR KR1020017002574A patent/KR20010073059A/en active IP Right Grant
- 1999-08-13 AU AU53975/99A patent/AU5397599A/en not_active Abandoned
- 1999-08-13 JP JP2000568112A patent/JP2002524848A/en not_active Withdrawn
- 1999-08-17 TW TW088114035A patent/TW483068B/en not_active IP Right Cessation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2124727A5 (en) * | 1971-01-27 | 1972-09-22 | Marini Officine Meccanic | |
FR2221189A1 (en) * | 1973-03-14 | 1974-10-11 | Wilkinson Sword Ltd | Application of gels to surfaces - by co-spraying two, independently stored, gel forming liqs. onto a substrate |
JPH05243140A (en) * | 1992-02-27 | 1993-09-21 | Fujitsu Ltd | Spin-coating device and method thereof |
US5736425A (en) * | 1995-11-16 | 1998-04-07 | Texas Instruments Incorporated | Glycol-based method for forming a thin-film nanoporous dielectric |
US5753305A (en) * | 1995-11-16 | 1998-05-19 | Texas Instruments Incorporated | Rapid aging technique for aerogel thin films |
Non-Patent Citations (1)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 017, no. 702 (E - 1482) 21 December 1993 (1993-12-21) * |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004511896A (en) * | 2000-06-23 | 2004-04-15 | ハネウェル・インターナショナル・インコーポレーテッド | Method for restoring hydrophobicity in dielectric films and materials |
WO2003088343A1 (en) * | 2002-04-10 | 2003-10-23 | Honeywell International, Inc. | New porogens for porous silica dielectric for integral circuit applications |
WO2003088344A1 (en) * | 2002-04-10 | 2003-10-23 | Honeywell International, Inc. | Low metal porous silica dielectric for integral circuit applications |
US7381442B2 (en) | 2002-04-10 | 2008-06-03 | Honeywell International Inc. | Porogens for porous silica dielectric for integral circuit applications |
US7381441B2 (en) | 2002-04-10 | 2008-06-03 | Honeywell International Inc. | Low metal porous silica dielectric for integral circuit applications |
Also Published As
Publication number | Publication date |
---|---|
JP2002524848A (en) | 2002-08-06 |
AU5397599A (en) | 2000-03-21 |
CN1325541A (en) | 2001-12-05 |
EP1110239A1 (en) | 2001-06-27 |
KR20010073059A (en) | 2001-07-31 |
TW483068B (en) | 2002-04-11 |
CN1146963C (en) | 2004-04-21 |
US6037275A (en) | 2000-03-14 |
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