WO2000009581A3 - Viscosity modifier for thermosetting resin composition - Google Patents

Viscosity modifier for thermosetting resin composition Download PDF

Info

Publication number
WO2000009581A3
WO2000009581A3 PCT/US1999/016984 US9916984W WO0009581A3 WO 2000009581 A3 WO2000009581 A3 WO 2000009581A3 US 9916984 W US9916984 W US 9916984W WO 0009581 A3 WO0009581 A3 WO 0009581A3
Authority
WO
WIPO (PCT)
Prior art keywords
viscosity modifier
resin composition
thermosetting resin
optionally substituted
optionally
Prior art date
Application number
PCT/US1999/016984
Other languages
French (fr)
Other versions
WO2000009581A2 (en
Inventor
Joseph Gan
Original Assignee
Dow Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Chemical Co filed Critical Dow Chemical Co
Priority to JP2000565023A priority Critical patent/JP4824164B2/en
Priority to EP99937530.6A priority patent/EP1144478B1/en
Priority to AU52344/99A priority patent/AU5234499A/en
Publication of WO2000009581A2 publication Critical patent/WO2000009581A2/en
Publication of WO2000009581A3 publication Critical patent/WO2000009581A3/en
Priority to HK02101377.9A priority patent/HK1041894A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/003—Polymeric products of isocyanates or isothiocyanates with epoxy compounds having no active hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)

Abstract

A heat curable thermosetting epoxy resin formulation useful for making prepregs and electrical laminates containing a viscosity modifier, wherein the viscosity modifier is: (a) an optionally substituted polymer of a monovinylidene aromatic monomer, optionally having one or more further unsaturated monomers copolymerized therewith; (b) an optionally substituted polyphenylene oxide; or (c) an oxazolidone ring-containing compound.
PCT/US1999/016984 1998-08-14 1999-07-28 Viscosity modifier for thermosetting resin composition WO2000009581A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2000565023A JP4824164B2 (en) 1998-08-14 1999-07-28 Viscosity modifier for thermosetting resin composition
EP99937530.6A EP1144478B1 (en) 1998-08-14 1999-07-28 Viscosity modifier for thermosetting resin composition
AU52344/99A AU5234499A (en) 1998-08-14 1999-07-28 Viscosity modifier for thermosetting resin composition
HK02101377.9A HK1041894A1 (en) 1998-08-14 2002-02-22 Viscosity modifier for thermosetting resin composition

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB9817799.1 1998-08-14
GB9817799A GB9817799D0 (en) 1998-08-14 1998-08-14 Viscosity modifier for thermosetting resin compositioning

Publications (2)

Publication Number Publication Date
WO2000009581A2 WO2000009581A2 (en) 2000-02-24
WO2000009581A3 true WO2000009581A3 (en) 2001-12-13

Family

ID=10837313

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1999/016984 WO2000009581A2 (en) 1998-08-14 1999-07-28 Viscosity modifier for thermosetting resin composition

Country Status (11)

Country Link
US (2) US6333064B1 (en)
EP (1) EP1144478B1 (en)
JP (1) JP4824164B2 (en)
KR (1) KR100654591B1 (en)
CN (1) CN1144830C (en)
AU (1) AU5234499A (en)
GB (1) GB9817799D0 (en)
HK (1) HK1041894A1 (en)
MY (1) MY122590A (en)
TW (1) TWI237046B (en)
WO (1) WO2000009581A2 (en)

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TW593404B (en) * 2001-03-14 2004-06-21 Akzo Nobel Nv Powder coated rotor, stator or field coil and powder coating composition
JP4102112B2 (en) * 2002-06-06 2008-06-18 株式会社東芝 Semiconductor device and manufacturing method thereof
US20040101689A1 (en) * 2002-11-26 2004-05-27 Ludovic Valette Hardener composition for epoxy resins
US20060177666A1 (en) * 2005-02-08 2006-08-10 Masanao Kawabe Curable resin compositions
TW200641037A (en) * 2005-04-07 2006-12-01 Asahi Kasei Chemicals Corp Epoxy resin composition
WO2006132900A1 (en) * 2005-06-07 2006-12-14 Albemarle Corporation Flame retardant composition exhibiting superior thermal stability and flame retarding properties and use thereof
US7378455B2 (en) * 2005-06-30 2008-05-27 General Electric Company Molding composition and method, and molded article
US7429800B2 (en) * 2005-06-30 2008-09-30 Sabic Innovative Plastics Ip B.V. Molding composition and method, and molded article
US20070004871A1 (en) * 2005-06-30 2007-01-04 Qiwei Lu Curable composition and method
US20070066698A1 (en) * 2005-09-20 2007-03-22 Yang Wenliang P Dual cure compositions, methods of curing thereof and articles therefrom
US20070066710A1 (en) * 2005-09-21 2007-03-22 Peters Edward N Method for electrical insulation and insulated electrical conductor
US20080071036A1 (en) * 2006-09-15 2008-03-20 Delsman Erik R Cured poly(arylene ether) composition, method, and article
US20080071035A1 (en) * 2006-09-15 2008-03-20 Delsman Erik R Curable poly(arylene ether) composition and method
US7655278B2 (en) * 2007-01-30 2010-02-02 Sabic Innovative Plastics Ip B.V. Composite-forming method, composites formed thereby, and printed circuit boards incorporating them
WO2008102853A1 (en) * 2007-02-23 2008-08-28 Panasonic Electric Works Co., Ltd. Epoxy resin composition, prepreg, laminates and printed wiring boards
US7678673B2 (en) * 2007-08-01 2010-03-16 International Business Machines Corporation Strengthening of a structure by infiltration
US8337163B2 (en) * 2007-12-05 2012-12-25 General Electric Company Fiber composite half-product with integrated elements, manufacturing method therefor and use thereof
US8079820B2 (en) * 2008-12-18 2011-12-20 General Electric Company Blade module, a modular rotor blade and a method for assembling a modular rotor blade
EP2445949B1 (en) * 2009-06-22 2015-03-25 Dow Global Technologies LLC Hardener composition for epoxy resins
KR100985998B1 (en) * 2009-09-29 2010-10-06 백대현 Lightweight pallet
KR20120115247A (en) * 2009-11-06 2012-10-17 다우 글로벌 테크놀로지스 엘엘씨 Storage stable epoxy resin compositions for electrical laminates
CN105713179A (en) * 2009-11-12 2016-06-29 陶氏环球技术有限责任公司 Polyoxazolidone Resins
US20120040106A1 (en) 2010-08-16 2012-02-16 Stefan Simmerer Apparatus for impregnating a fiber material with a resin and methods for forming a fiber-reinforced plastic part
EP2955006B1 (en) * 2011-06-03 2018-11-14 Cytec Technology Corp. Method of using a resin coated radius fillers
US20120138223A1 (en) 2011-09-29 2012-06-07 General Electric Company Uv-ir combination curing system and method of use for wind blade manufacture and repair
TWI496804B (en) * 2011-12-06 2015-08-21 Taiwan Union Technology Corp Epoxy resin composition, and prepreg and printed circuit laminate using the same
CN109021501A (en) * 2012-06-26 2018-12-18 陶氏环球技术有限责任公司 Insulating composite material for power transmission and dispatching
CN103937163A (en) * 2014-05-08 2014-07-23 新誉集团有限公司 Viscosity-controllable rapid hand lay-up epoxy resin system and preparation method thereof

Citations (7)

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Publication number Priority date Publication date Assignee Title
EP0296450A1 (en) * 1987-06-24 1988-12-28 Dsm N.V. Oxazolidone group-containing epoxy resins
US4912172A (en) * 1987-09-03 1990-03-27 General Electric Company Compositions comprising polyphenylene ethers, polyepoxides and aluminum or zinc diketone salt
US4920164A (en) * 1987-07-20 1990-04-24 Mitsubishi Gas Chemical Company, Inc. Epoxy resin composition
US5308565A (en) * 1993-02-05 1994-05-03 General Electric Company Method of preparing modified polyphenylene oxide resin systems for electrical laminates having improved solderability and solvent resistance
US5449737A (en) * 1994-02-11 1995-09-12 Ciba-Geigy Corporation Urethane modified epoxy resin compositions
US5545697A (en) * 1994-02-14 1996-08-13 Ciba-Geigy Corporation Urethane modified epoxy resin compositions
WO1998018845A1 (en) * 1996-10-29 1998-05-07 Akzo Nobel N.V. Copolymer of styrene and maleic anhydride comprising an epoxy resin composition and a co-cross-linking agent

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EP0296450A1 (en) * 1987-06-24 1988-12-28 Dsm N.V. Oxazolidone group-containing epoxy resins
US4920164A (en) * 1987-07-20 1990-04-24 Mitsubishi Gas Chemical Company, Inc. Epoxy resin composition
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US5308565A (en) * 1993-02-05 1994-05-03 General Electric Company Method of preparing modified polyphenylene oxide resin systems for electrical laminates having improved solderability and solvent resistance
US5449737A (en) * 1994-02-11 1995-09-12 Ciba-Geigy Corporation Urethane modified epoxy resin compositions
US5545697A (en) * 1994-02-14 1996-08-13 Ciba-Geigy Corporation Urethane modified epoxy resin compositions
WO1998018845A1 (en) * 1996-10-29 1998-05-07 Akzo Nobel N.V. Copolymer of styrene and maleic anhydride comprising an epoxy resin composition and a co-cross-linking agent

Also Published As

Publication number Publication date
WO2000009581A2 (en) 2000-02-24
US20020076482A1 (en) 2002-06-20
KR20010079646A (en) 2001-08-22
CN1144830C (en) 2004-04-07
EP1144478A3 (en) 2002-03-13
MY122590A (en) 2006-04-29
GB9817799D0 (en) 1998-10-14
EP1144478B1 (en) 2016-12-21
JP4824164B2 (en) 2011-11-30
EP1144478A2 (en) 2001-10-17
HK1041894A1 (en) 2002-07-26
US6333064B1 (en) 2001-12-25
JP2002527529A (en) 2002-08-27
CN1315974A (en) 2001-10-03
AU5234499A (en) 2000-03-06
KR100654591B1 (en) 2006-12-07
TWI237046B (en) 2005-08-01

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