WO2000007220A3 - Wet processing methods for the manufacture of electronic components using ozonated process fluids - Google Patents

Wet processing methods for the manufacture of electronic components using ozonated process fluids Download PDF

Info

Publication number
WO2000007220A3
WO2000007220A3 PCT/US1999/016954 US9916954W WO0007220A3 WO 2000007220 A3 WO2000007220 A3 WO 2000007220A3 US 9916954 W US9916954 W US 9916954W WO 0007220 A3 WO0007220 A3 WO 0007220A3
Authority
WO
WIPO (PCT)
Prior art keywords
electronic components
wet processing
ozonated process
manufacture
process fluids
Prior art date
Application number
PCT/US1999/016954
Other languages
French (fr)
Other versions
WO2000007220A2 (en
Inventor
Jennifer Ware Parker
Steven Verhaverbeke
Original Assignee
Cfmt Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cfmt Inc filed Critical Cfmt Inc
Priority to AU52331/99A priority Critical patent/AU5233199A/en
Priority to JP2000562934A priority patent/JP2003533865A/en
Publication of WO2000007220A2 publication Critical patent/WO2000007220A2/en
Publication of WO2000007220A3 publication Critical patent/WO2000007220A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
    • B08B2203/005—Details of cleaning machines or methods involving the use or presence of liquid or steam the liquid being ozonated

Abstract

The present invention is directed to methods of wet processing electronic components using ozonated process fluids. In the methods of the present invention, the electronic components are contacted with a wetting solution, and contacted with an ozonated process fluid containing gaseous ozone. The contacting of the electronic components with an ozonated process fluid is performed in the presence of a base. The methods of the present invention are particularly useful for removing organic materials from surfaces of electronic components.
PCT/US1999/016954 1998-07-29 1999-07-26 Wet processing methods for the manufacture of electronic components using ozonated process fluids WO2000007220A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU52331/99A AU5233199A (en) 1998-07-29 1999-07-26 Wet processing methods for the manufacture of electronic components using ozonated process fluids
JP2000562934A JP2003533865A (en) 1998-07-29 1999-07-26 Method of wet processing an electronic component using an ozone-containing process fluid in the manufacture of the electronic component

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US9454598P 1998-07-29 1998-07-29
US60/094,545 1998-07-29
US36020699A 1999-07-23 1999-07-23
US09/360,206 1999-07-23

Publications (2)

Publication Number Publication Date
WO2000007220A2 WO2000007220A2 (en) 2000-02-10
WO2000007220A3 true WO2000007220A3 (en) 2007-11-22

Family

ID=26789010

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1999/016954 WO2000007220A2 (en) 1998-07-29 1999-07-26 Wet processing methods for the manufacture of electronic components using ozonated process fluids

Country Status (4)

Country Link
JP (1) JP2003533865A (en)
AU (1) AU5233199A (en)
TW (1) TW404853B (en)
WO (1) WO2000007220A2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002050634A (en) 2000-04-28 2002-02-15 Semiconductor Energy Lab Co Ltd Method for manufacturing semiconductor device
US6794229B2 (en) 2000-04-28 2004-09-21 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method for semiconductor device
WO2002027775A1 (en) * 2000-09-28 2002-04-04 Mitsubishi Denki Kabushiki Kaisha Method and apparatus for treating wafer
JP4015823B2 (en) 2001-05-14 2007-11-28 株式会社東芝 Alkali developer manufacturing method, alkali developer, pattern forming method, resist film peeling method, and chemical solution coating apparatus
ATE480868T1 (en) 2004-03-22 2010-09-15 Rena Sondermaschinen Gmbh METHOD FOR TREATING SUBSTRATE SURFACES
US8071486B2 (en) * 2005-07-18 2011-12-06 Teledyne Dalsa Semiconductor Inc. Method for removing residues formed during the manufacture of MEMS devices
JP2010226089A (en) * 2009-01-14 2010-10-07 Rohm & Haas Electronic Materials Llc Method of cleaning semiconductor wafers
JP7341850B2 (en) * 2019-10-25 2023-09-11 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing method and substrate processing apparatus

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57204132A (en) * 1981-06-10 1982-12-14 Fujitsu Ltd Washing method for silicon wafer
JPH0199221A (en) * 1987-10-12 1989-04-18 Nec Corp Cleaning method for semiconductor substrate
US5181985A (en) * 1988-06-01 1993-01-26 Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoffe Mbh Process for the wet-chemical surface treatment of semiconductor wafers
US5464480A (en) * 1993-07-16 1995-11-07 Legacy Systems, Inc. Process and apparatus for the treatment of semiconductor wafers in a fluid
US5484549A (en) * 1993-08-30 1996-01-16 Ecolab Inc. Potentiated aqueous ozone cleaning composition for removal of a contaminating soil from a surface
JPH08124888A (en) * 1994-10-19 1996-05-17 Mitsubishi Gas Chem Co Inc Method for cleaning semiconductor substrate with ozone
US5853491A (en) * 1994-06-27 1998-12-29 Siemens Aktiengesellschaft Method for reducing metal contamination of silicon wafers during semiconductor manufacturing

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57204132A (en) * 1981-06-10 1982-12-14 Fujitsu Ltd Washing method for silicon wafer
JPH0199221A (en) * 1987-10-12 1989-04-18 Nec Corp Cleaning method for semiconductor substrate
US5181985A (en) * 1988-06-01 1993-01-26 Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoffe Mbh Process for the wet-chemical surface treatment of semiconductor wafers
US5464480A (en) * 1993-07-16 1995-11-07 Legacy Systems, Inc. Process and apparatus for the treatment of semiconductor wafers in a fluid
US5484549A (en) * 1993-08-30 1996-01-16 Ecolab Inc. Potentiated aqueous ozone cleaning composition for removal of a contaminating soil from a surface
US5853491A (en) * 1994-06-27 1998-12-29 Siemens Aktiengesellschaft Method for reducing metal contamination of silicon wafers during semiconductor manufacturing
JPH08124888A (en) * 1994-10-19 1996-05-17 Mitsubishi Gas Chem Co Inc Method for cleaning semiconductor substrate with ozone

Also Published As

Publication number Publication date
AU5233199A (en) 2000-02-21
TW404853B (en) 2000-09-11
JP2003533865A (en) 2003-11-11
WO2000007220A2 (en) 2000-02-10

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