WO1999065061A3 - A portable laser cleaning device for semiconductor packaging machines - Google Patents
A portable laser cleaning device for semiconductor packaging machines Download PDFInfo
- Publication number
- WO1999065061A3 WO1999065061A3 PCT/SG1999/000053 SG9900053W WO9965061A3 WO 1999065061 A3 WO1999065061 A3 WO 1999065061A3 SG 9900053 W SG9900053 W SG 9900053W WO 9965061 A3 WO9965061 A3 WO 9965061A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- cleaning device
- semiconductor packaging
- portable laser
- laser cleaning
- packaging machines
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
- B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/035—Aligning the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/70—Maintenance
- B29C33/72—Cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4835—Cleaning, e.g. removing of solder
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning In General (AREA)
Abstract
A portable laser cleaning device which can be steered next to any semiconductor encapsulating tool having multiple moulds in one or more presses. The cleaning device basically includes a base, laser generator, optical pipe, and cleaning head. The laser generator fixedly rests on the base which is firmly attached to the encapsulating tool. The optical pipe is fixed within the encapsulating tool and delivers a beam of laser to the cleaning head. The cleaning head moves on a rail and precisely delivers the beam onto the surface of the mould to remove substantially all of the surface contaminants associated with semiconductor packaging.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG9801257-8 | 1998-06-08 | ||
SG9801257 | 1998-06-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO1999065061A2 WO1999065061A2 (en) | 1999-12-16 |
WO1999065061A3 true WO1999065061A3 (en) | 2000-01-27 |
Family
ID=20430019
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/SG1999/000053 WO1999065061A2 (en) | 1998-06-08 | 1999-06-03 | A portable laser cleaning device for semiconductor packaging machines |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO1999065061A2 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG96648A1 (en) | 2001-10-01 | 2003-06-16 | Inst Data Storage | Method and apparatus for deflashing of integrated circuit packages |
SG143180A1 (en) | 2006-11-22 | 2008-06-27 | Apic Yamada Corporaton | Resin molding machine and method of resin molding |
TWI719764B (en) * | 2019-12-17 | 2021-02-21 | 鈦昇科技股份有限公司 | Mold cleaning machine |
CN114762858B (en) * | 2021-05-24 | 2023-05-12 | 北京劲吾新能源科技有限公司 | Method for removing color photovoltaic module ink and application thereof |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0297506A2 (en) * | 1987-07-02 | 1989-01-04 | Ibm Deutschland Gmbh | Removal of particles from solid-state surfaces by laser bombardement |
US5023434A (en) * | 1988-07-23 | 1991-06-11 | R. Stahl Fordertechnik Gmbh | Position indicating apparatus for transporters on tracks |
US5373140A (en) * | 1993-03-16 | 1994-12-13 | Vernay Laboratories, Inc. | System for cleaning molding equipment using a laser |
US5643367A (en) * | 1993-10-26 | 1997-07-01 | Saint Gobain Emballage | Method and device for cleaning solid elements |
EP0792731A2 (en) * | 1996-03-01 | 1997-09-03 | PIRELLI COORDINAMENTO PNEUMATICI S.p.A. | Method and apparatus for cleaning vulcanization moulds for elastomer material articles |
-
1999
- 1999-06-03 WO PCT/SG1999/000053 patent/WO1999065061A2/en active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0297506A2 (en) * | 1987-07-02 | 1989-01-04 | Ibm Deutschland Gmbh | Removal of particles from solid-state surfaces by laser bombardement |
US5023434A (en) * | 1988-07-23 | 1991-06-11 | R. Stahl Fordertechnik Gmbh | Position indicating apparatus for transporters on tracks |
US5373140A (en) * | 1993-03-16 | 1994-12-13 | Vernay Laboratories, Inc. | System for cleaning molding equipment using a laser |
US5643367A (en) * | 1993-10-26 | 1997-07-01 | Saint Gobain Emballage | Method and device for cleaning solid elements |
EP0792731A2 (en) * | 1996-03-01 | 1997-09-03 | PIRELLI COORDINAMENTO PNEUMATICI S.p.A. | Method and apparatus for cleaning vulcanization moulds for elastomer material articles |
Also Published As
Publication number | Publication date |
---|---|
WO1999065061A2 (en) | 1999-12-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE59712994D1 (en) | High-speed lathe for producing optically active surfaces | |
AU3007897A (en) | High fluence diode laser device and method for the fabrication and use thereof | |
EP0623956A3 (en) | A semiconductor device having no die supporting surface and method for making the same. | |
DE69902371T2 (en) | CUTTING TOOL WITH NOZZLE | |
EP1491309A4 (en) | Parting method for fragile material substrate and parting device using the method | |
SG78282A1 (en) | A method for removing surface contaminants on moulds used in semiconductor packaging tools | |
DE50000975D1 (en) | METHOD FOR GRINDING CONVEX TREADS AND EXTERNAL DIAMETERS ON WAVE-SHAPED WORKPIECES IN A CLAMPING UP AND GRINDING MACHINE FOR IMPLEMENTING THE METHOD | |
WO1999065061A3 (en) | A portable laser cleaning device for semiconductor packaging machines | |
ATE327857T1 (en) | MACHINE TOOL WITH PALLET CHANGE MODULE | |
GB2370651B (en) | Laser robot for workpiece machining and method for workpiece machining with a laser robot | |
AU1546601A (en) | Method for surface patterning using a focused laser | |
DE29607203U1 (en) | Device for grinding an end face, in particular an annular surface, on the edge of a workpiece bore | |
EP0701309A3 (en) | Semiconductor laser diode | |
SG77617A1 (en) | A system for removing surface contaminants on moulds used in semiconductor packaging tools | |
DE69636315D1 (en) | Tool for machining a workpiece surface into an elliptical shape | |
IT9067623A0 (en) | TOOL HEAD FOR A GLASS PLATE ENGRAVING MACHINE. | |
DE59100150D1 (en) | DEVICE FOR PRESSING A SUBSTRATE MACHINING TOOL. | |
ES1026374Y (en) | ENGRAVING MACHINE FOR RELIEFS ON THE SKIN SURFACE IN GENERAL. | |
ITRM930247A0 (en) | DEVICE FOR POSITIONING A TOOL OR A PART ON A MACHINE TOOL. | |
ITMI981725A0 (en) | TROLLEY FOR A DEVICE SUITABLE FOR OPERATION WITH PRECISION ON A WORKPIECE IN PARTICULAR FOR A WELDING DEVICE OF | |
ITBO940006V0 (en) | SEPARATOR-APPLICATOR DEVICE FOR THE DETACHMENT AND RE-APPLICATION OF A PORTION OF DIE CUT IN THE FORMING LINES OF INTERMITTENT MOVEMENT PACKAGE. | |
WO2003081290A3 (en) | Technique for packaging an optical module | |
EP0460937A3 (en) | Method for fabricating a semiconductor laser device | |
ATA157297A (en) | DEVICE FOR LASER ENGRAVING | |
DE69414313T2 (en) | Resin coating process for semiconductor laser and photodiode chips |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A2 Designated state(s): CN JP US |
|
AL | Designated countries for regional patents |
Kind code of ref document: A2 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE |
|
AK | Designated states |
Kind code of ref document: A3 Designated state(s): CN JP US |
|
AL | Designated countries for regional patents |
Kind code of ref document: A3 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE |
|
DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
122 | Ep: pct application non-entry in european phase |