WO1999062673A1 - Improved polishing pad with reduced moisture absorption - Google Patents

Improved polishing pad with reduced moisture absorption Download PDF

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Publication number
WO1999062673A1
WO1999062673A1 PCT/GB1999/001515 GB9901515W WO9962673A1 WO 1999062673 A1 WO1999062673 A1 WO 1999062673A1 GB 9901515 W GB9901515 W GB 9901515W WO 9962673 A1 WO9962673 A1 WO 9962673A1
Authority
WO
WIPO (PCT)
Prior art keywords
pad
additive
hydrophilic
polishing
polishing pad
Prior art date
Application number
PCT/GB1999/001515
Other languages
French (fr)
Inventor
Brian Lombardo
Rajeev Bajaj
Original Assignee
Scapa Group Plc
Lam Research Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Scapa Group Plc, Lam Research Corporation filed Critical Scapa Group Plc
Priority to JP2000551920A priority Critical patent/JP2002516764A/en
Priority to EP99955238A priority patent/EP1091831A1/en
Priority to AU42724/99A priority patent/AU4272499A/en
Publication of WO1999062673A1 publication Critical patent/WO1999062673A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/22—Rubbers synthetic or natural
    • B24D3/26—Rubbers synthetic or natural for porous or cellular structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

A polishing pad or belt or other device with increased resistance to moisture absorption for improved planarizing effectiveness and consistency. The relatively moisture resistant polishing pad contains additives to improve wetting of the pad surface for good slurry distribution.

Description

IMPROVED POLISHING PAD WITH REDUCED MOISTURE ABSORPTION
Cross Reference To Related Application
This is a complete application of provisional application Serial No. 60/087,742, filed June 2, 1998.
Background of the Invention
The purpose of this invention is to produce a polishing pad or belt or other device with increased resistance to moisture absorption for improved planarizing effectiveness and consistency.
Currently available polishing pads, typically polyurethane foam, are limited in effectiveness and consistency because they readily absorb moisture. In use, polishing pads are in continuous contact with aqueous slurries and cleaning solutions. Moisture absorption affects the performance of polishing pads in the following two ways:
1) Softening, swelling, or loss of rigidity through physical and chemical degradation, resulting in reduced planarizing effectiveness and reduced lifetime of the polishing pad,
2) Gradual changes in pad properties and integrity during use, resulting in unsteady and inconsistent performance.
Previous attempts to make polishing pads with reduced moisture absorption or with increased resistance to degradation have been limited because the pads are too hydrophobic, resulting in poor wetting, inefficient slurry distribution, and reduced removal rates. This invention overcomes that limitation in generally hydrophobic polishing pads through the use of hydrophilic additives.
Summary of the Invention
This invention comprises a relatively moisture resistant polishing pad with additives to improve wetting of the pad surface for good slurry distribution.
Brief Description of the Invention
Although the descriptions of the invention refer to pads, the invention can be in any suitable form or shape, including but not limited to sheets, belts, disks, rollers and bobs.
The polishing pad matrix material can be any polymeric material or any combination of polymeric materials, including thermoplastic and cross-linked materials, that absorbs less than 4% moisture after soaking for 24 hours.
The polishing pad can include a porous structure. The porosity can be achieved by any suitable method, including but not limited to blowing, frothing, and inclusion of filled or unfilled hollow microelements. The pores can be any combination or distribution of size, shape, and quality (open or closed cell) .
The polishing pad can include any type of texturing, formed naturally or by any suitable methods. The texturing can be created during the manufacturing process, or it can be created during use.
The additives suitable for improving wetting and distribution of slurry include any type of hydrophilic additives like surfactants, and relatively polar polymeric materials including but limited to polyurethanes, polyamides, and polyesters. The additives can be liquid, solid, semi-solid, or combinations of solid and liquid. The additives can be reactive cr non-reactive with the other materials in the polishing pad. The additives can be located within the polymer matrix or within the pores of the polishing material. The additives can be any shape, size, or distribution, and can perform additional functions (e.g., hydrophilic hollow beads used to increase wetting and to create porosity) . The additives can remain in place and wear away with the polishing material, or they can pop out or smear to coat, fill in, or otherwise improve the interaction between the pad surface and slurry.

Claims

We Claim:
1. A relatively moisture resistant polishing pad providing sufficient wetting of a pad surface for good slurry distribution comprising a polymeric matrix material and a hydrophilic or relatively polar polymeric additive.
2. The pad of claim 1 wherein the pad is in the form or shape of a sheet, belt, disk, roller or bob.
3. The pad of claim 1 wherein the polymeric material is thermoplastic or cross-linked material, that absorbs less than 4% moisture after soaking for 24 hours.
4. The pad of claim 1 wherein the pad is porous having open or closed cells.
5. The pad of claim 1 wherein the pad is textured.
6. The pad of claim 1 wherein the hydrophilic additive is a hydrophilic surfactant.
7. The pad of claim 1 wherein relatively polar polymeric additive is a polyurethane, polyamide or polyester.
8. The pad of claim 1 wherein the additive is liquid, solid, semi-solid, or a combination of solid and liquid.
9. The pad of claim 1 wherein the additive is reactive or non-reactive with the other materials in the pad.
10. The pad of claim 1 wherein the additive is located within the polymer matrix.
11. The pad of claim 4 wherein the additive is located within the pores of the pad.
12. The pad of claim 1 wherein the additive is a hydrophilic hollow bead used to increase wetting and to create porosity.
13. The pad of claim 1 wherein the additive remains in place or wears away with polishing, or pops out or smears to coat, fill in, or otherwise improve the interaction between the pad surface and a polishing slurry.
PCT/GB1999/001515 1998-06-02 1999-06-01 Improved polishing pad with reduced moisture absorption WO1999062673A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2000551920A JP2002516764A (en) 1998-06-02 1999-06-01 Improved polishing pad with reduced moisture absorption
EP99955238A EP1091831A1 (en) 1998-06-02 1999-06-01 Improved polishing pad with reduced moisture absorption
AU42724/99A AU4272499A (en) 1998-06-02 1999-06-01 Improved polishing pad with reduced moisture absorption

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US8774298P 1998-06-02 1998-06-02
US60/087,742 1998-06-02

Publications (1)

Publication Number Publication Date
WO1999062673A1 true WO1999062673A1 (en) 1999-12-09

Family

ID=22206976

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB1999/001515 WO1999062673A1 (en) 1998-06-02 1999-06-01 Improved polishing pad with reduced moisture absorption

Country Status (6)

Country Link
EP (1) EP1091831A1 (en)
JP (1) JP2002516764A (en)
KR (1) KR100563172B1 (en)
AU (1) AU4272499A (en)
TW (1) TW449528B (en)
WO (1) WO1999062673A1 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002043922A1 (en) * 2000-11-29 2002-06-06 Psiloquest, Inc. Crosslinked polyethylene polishing pad for chemical-mechnical polishing, polishing apparatus and polishing method
US6575823B1 (en) 2001-03-06 2003-06-10 Psiloquest Inc. Polishing pad and method for in situ delivery of chemical mechanical polishing slurry modifiers and applications thereof
US6579604B2 (en) 2000-11-29 2003-06-17 Psiloquest Inc. Method of altering and preserving the surface properties of a polishing pad and specific applications therefor
US6596388B1 (en) 2000-11-29 2003-07-22 Psiloquest Method of introducing organic and inorganic grafted compounds throughout a thermoplastic polishing pad using a supercritical fluid and applications therefor
US6688956B1 (en) 2000-11-29 2004-02-10 Psiloquest Inc. Substrate polishing device and method
US6764574B1 (en) 2001-03-06 2004-07-20 Psiloquest Polishing pad composition and method of use
US6838169B2 (en) 2002-09-11 2005-01-04 Psiloquest, Inc. Polishing pad resistant to delamination
US6846225B2 (en) 2000-11-29 2005-01-25 Psiloquest, Inc. Selective chemical-mechanical polishing properties of a cross-linked polymer and specific applications therefor
US7059946B1 (en) 2000-11-29 2006-06-13 Psiloquest Inc. Compacted polishing pads for improved chemical mechanical polishing longevity

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008221367A (en) * 2007-03-09 2008-09-25 Toyo Tire & Rubber Co Ltd Polishing pad
KR101225436B1 (en) 2011-01-27 2013-01-22 삼성전자주식회사 Polishing pad and manufacturing method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4613345A (en) * 1985-08-12 1986-09-23 International Business Machines Corporation Fixed abrasive polishing media
US4728552A (en) * 1984-07-06 1988-03-01 Rodel, Inc. Substrate containing fibers of predetermined orientation and process of making the same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62156365A (en) * 1985-12-27 1987-07-11 Kanebo Ltd Production of suede-like sheet material
JPH0288229A (en) * 1988-09-26 1990-03-28 Rodeele Nitta Kk Laminate and support of abrasive member in which the laminate is used and abrasive cloth
JPH074769B2 (en) * 1991-10-11 1995-01-25 ロデール・ニッタ株式会社 Polishing cloth
JP3354744B2 (en) * 1995-04-25 2002-12-09 ニッタ株式会社 Polishing cloth and method for attaching and detaching the polishing cloth to and from a polishing machine surface plate
JPH09248756A (en) * 1996-03-08 1997-09-22 Chiyoda Kk Polishing cloth
JPH10550A (en) * 1996-06-11 1998-01-06 Toshiba Mach Co Ltd Abrasive cloth dressing method and its device
JPH10146754A (en) * 1996-11-14 1998-06-02 Hitachi Chem Co Ltd Polishing template material

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4728552A (en) * 1984-07-06 1988-03-01 Rodel, Inc. Substrate containing fibers of predetermined orientation and process of making the same
US4613345A (en) * 1985-08-12 1986-09-23 International Business Machines Corporation Fixed abrasive polishing media

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002043922A1 (en) * 2000-11-29 2002-06-06 Psiloquest, Inc. Crosslinked polyethylene polishing pad for chemical-mechnical polishing, polishing apparatus and polishing method
US6579604B2 (en) 2000-11-29 2003-06-17 Psiloquest Inc. Method of altering and preserving the surface properties of a polishing pad and specific applications therefor
US6596388B1 (en) 2000-11-29 2003-07-22 Psiloquest Method of introducing organic and inorganic grafted compounds throughout a thermoplastic polishing pad using a supercritical fluid and applications therefor
US6688956B1 (en) 2000-11-29 2004-02-10 Psiloquest Inc. Substrate polishing device and method
US6846225B2 (en) 2000-11-29 2005-01-25 Psiloquest, Inc. Selective chemical-mechanical polishing properties of a cross-linked polymer and specific applications therefor
US7059946B1 (en) 2000-11-29 2006-06-13 Psiloquest Inc. Compacted polishing pads for improved chemical mechanical polishing longevity
US6575823B1 (en) 2001-03-06 2003-06-10 Psiloquest Inc. Polishing pad and method for in situ delivery of chemical mechanical polishing slurry modifiers and applications thereof
US6764574B1 (en) 2001-03-06 2004-07-20 Psiloquest Polishing pad composition and method of use
US6838169B2 (en) 2002-09-11 2005-01-04 Psiloquest, Inc. Polishing pad resistant to delamination

Also Published As

Publication number Publication date
TW449528B (en) 2001-08-11
AU4272499A (en) 1999-12-20
KR100563172B1 (en) 2006-03-27
JP2002516764A (en) 2002-06-11
KR20010071381A (en) 2001-07-28
EP1091831A1 (en) 2001-04-18

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