WO1999056509A1 - Flip chip devices with flexible conductive adhesive - Google Patents
Flip chip devices with flexible conductive adhesive Download PDFInfo
- Publication number
- WO1999056509A1 WO1999056509A1 PCT/US1999/008787 US9908787W WO9956509A1 WO 1999056509 A1 WO1999056509 A1 WO 1999056509A1 US 9908787 W US9908787 W US 9908787W WO 9956509 A1 WO9956509 A1 WO 9956509A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- contact pads
- conductive adhesive
- flexible conductive
- flexible
- Prior art date
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- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP99921432A EP1090535A4 (en) | 1998-04-24 | 1999-04-22 | Flip chip devices with flexible conductive adhesive |
JP2000546558A JP2003527736A (en) | 1998-04-24 | 1999-04-22 | Flip chip device using flexible conductive adhesive |
KR1020007011636A KR20010088292A (en) | 1998-04-24 | 1999-04-22 | Flip chip devices with flexible conductive adhesive |
Applications Claiming Priority (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US8288598P | 1998-04-24 | 1998-04-24 | |
US60/082,885 | 1998-04-24 | ||
US8332698P | 1998-04-28 | 1998-04-28 | |
US60/083,326 | 1998-04-28 | ||
US9214798P | 1998-07-09 | 1998-07-09 | |
US60/092,147 | 1998-07-09 | ||
US09/166,633 | 1998-10-05 | ||
US09/166,633 US6108210A (en) | 1998-04-24 | 1998-10-05 | Flip chip devices with flexible conductive adhesive |
US09/276,259 US6297564B1 (en) | 1998-04-24 | 1999-03-25 | Electronic devices employing adhesive interconnections including plated particles |
US09/276,259 | 1999-03-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO1999056509A1 true WO1999056509A1 (en) | 1999-11-04 |
WO1999056509A9 WO1999056509A9 (en) | 2000-03-16 |
Family
ID=27536312
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1999/008787 WO1999056509A1 (en) | 1998-04-24 | 1999-04-22 | Flip chip devices with flexible conductive adhesive |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1090535A4 (en) |
JP (1) | JP2003527736A (en) |
KR (1) | KR20010088292A (en) |
CN (1) | CN1298626A (en) |
WO (1) | WO1999056509A1 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003001585A1 (en) * | 2001-06-20 | 2003-01-03 | International Business Machines Corporation | Extension of fatigue life for c4 solder ball in a chip to substrate connection |
EP1328015A2 (en) * | 2002-01-11 | 2003-07-16 | Hesse & Knipps GmbH | Method of bonding a flip chip |
US7793413B2 (en) | 2005-09-30 | 2010-09-14 | Panasonic Corporation | Method of mounting electronic components |
US8110749B2 (en) | 2008-05-30 | 2012-02-07 | Fujitsu Limited | Printed wiring board |
US8119925B2 (en) | 2008-05-30 | 2012-02-21 | Fujitsu Limited | Core substrate and printed wiring board |
US8152953B2 (en) | 2008-05-30 | 2012-04-10 | Fujitsu Limited | Method of making printed wiring board and method of making printed circuit board unit |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007506274A (en) * | 2003-09-16 | 2007-03-15 | コニンクリユケ フィリップス エレクトロニクス エヌ.ブイ. | Method for manufacturing electronic device and electronic device |
DE102005027652A1 (en) * | 2005-06-15 | 2006-12-21 | Robert Bosch Gmbh | Electrically conductive, mechanically flexible connection between electrical or electronic components |
JP4939861B2 (en) * | 2006-07-14 | 2012-05-30 | パナソニック株式会社 | Circuit board and portable terminal |
DE102017001097A1 (en) * | 2017-02-07 | 2018-08-09 | Gentherm Gmbh | Electrically conductive foil |
US10601148B2 (en) * | 2017-10-23 | 2020-03-24 | Illinois Tool Works Inc. | High wattage solderless flexible connector for printed conductors |
CN110534540B (en) * | 2018-05-25 | 2021-12-10 | 群创光电股份有限公司 | Electronic device and method for manufacturing the same |
CN110071050B (en) * | 2019-04-24 | 2021-09-24 | 深圳第三代半导体研究院 | Chip interconnection structure and preparation method thereof |
JP7226415B2 (en) * | 2020-03-18 | 2023-02-21 | カシオ計算機株式会社 | display device and clock |
EP3882721A1 (en) | 2020-03-18 | 2021-09-22 | Casio Computer Co., Ltd. | Display device and timepiece |
CN113690149A (en) * | 2020-05-16 | 2021-11-23 | 佛山市国星光电股份有限公司 | Chip bonding structure, method and equipment |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4005472A (en) * | 1975-05-19 | 1977-01-25 | National Semiconductor Corporation | Method for gold plating of metallic layers on semiconductive devices |
US5237130A (en) * | 1989-12-18 | 1993-08-17 | Epoxy Technology, Inc. | Flip chip technology using electrically conductive polymers and dielectrics |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5087314A (en) * | 1986-03-31 | 1992-02-11 | Harris Corporation | Electroconductive adhesive |
US5436503A (en) * | 1992-11-18 | 1995-07-25 | Matsushita Electronics Corporation | Semiconductor device and method of manufacturing the same |
US5667884A (en) * | 1993-04-12 | 1997-09-16 | Bolger; Justin C. | Area bonding conductive adhesive preforms |
KR0181615B1 (en) * | 1995-01-30 | 1999-04-15 | 모리시다 요이치 | Semiconductor unit package, semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging |
-
1999
- 1999-04-22 WO PCT/US1999/008787 patent/WO1999056509A1/en not_active Application Discontinuation
- 1999-04-22 KR KR1020007011636A patent/KR20010088292A/en not_active Application Discontinuation
- 1999-04-22 JP JP2000546558A patent/JP2003527736A/en not_active Withdrawn
- 1999-04-22 CN CN99805435A patent/CN1298626A/en active Pending
- 1999-04-22 EP EP99921432A patent/EP1090535A4/en not_active Withdrawn
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4005472A (en) * | 1975-05-19 | 1977-01-25 | National Semiconductor Corporation | Method for gold plating of metallic layers on semiconductive devices |
US5237130A (en) * | 1989-12-18 | 1993-08-17 | Epoxy Technology, Inc. | Flip chip technology using electrically conductive polymers and dielectrics |
Non-Patent Citations (1)
Title |
---|
See also references of EP1090535A4 * |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003001585A1 (en) * | 2001-06-20 | 2003-01-03 | International Business Machines Corporation | Extension of fatigue life for c4 solder ball in a chip to substrate connection |
EP1328015A2 (en) * | 2002-01-11 | 2003-07-16 | Hesse & Knipps GmbH | Method of bonding a flip chip |
EP1328015A3 (en) * | 2002-01-11 | 2003-12-03 | Hesse & Knipps GmbH | Method of bonding a flip chip |
US6946745B2 (en) | 2002-01-11 | 2005-09-20 | Hesse & Knipps Gmbh | Method and components for flip-chip bonding |
SG117430A1 (en) * | 2002-01-11 | 2005-12-29 | Hesse & Knipps Gmbh | Method for flip-chip bonding |
US7793413B2 (en) | 2005-09-30 | 2010-09-14 | Panasonic Corporation | Method of mounting electronic components |
US8110749B2 (en) | 2008-05-30 | 2012-02-07 | Fujitsu Limited | Printed wiring board |
US8119925B2 (en) | 2008-05-30 | 2012-02-21 | Fujitsu Limited | Core substrate and printed wiring board |
US8152953B2 (en) | 2008-05-30 | 2012-04-10 | Fujitsu Limited | Method of making printed wiring board and method of making printed circuit board unit |
Also Published As
Publication number | Publication date |
---|---|
EP1090535A1 (en) | 2001-04-11 |
JP2003527736A (en) | 2003-09-16 |
CN1298626A (en) | 2001-06-06 |
WO1999056509A9 (en) | 2000-03-16 |
EP1090535A4 (en) | 2003-09-24 |
KR20010088292A (en) | 2001-09-26 |
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