WO1999053531A3 - Post-cmp wet-hf cleaning station - Google Patents

Post-cmp wet-hf cleaning station Download PDF

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Publication number
WO1999053531A3
WO1999053531A3 PCT/US1999/002483 US9902483W WO9953531A3 WO 1999053531 A3 WO1999053531 A3 WO 1999053531A3 US 9902483 W US9902483 W US 9902483W WO 9953531 A3 WO9953531 A3 WO 9953531A3
Authority
WO
WIPO (PCT)
Prior art keywords
workpiece
cleaning station
post
cleaning
cmp
Prior art date
Application number
PCT/US1999/002483
Other languages
French (fr)
Other versions
WO1999053531A2 (en
Inventor
Anand Gupta
Chris Karlsrud
Periya Gopalan
Daniel R Trojan
Jeffrey B Cunnane
Jon R Macernie
Original Assignee
Speedfam Ipec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/058,647 external-priority patent/US6125861A/en
Application filed by Speedfam Ipec Corp filed Critical Speedfam Ipec Corp
Publication of WO1999053531A2 publication Critical patent/WO1999053531A2/en
Publication of WO1999053531A3 publication Critical patent/WO1999053531A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes

Abstract

The present invention provides an apparatus for cleaning semiconductor workpieces following a Chemical Mechanical Planarization ('CMP') procedure. Initially, a workpiece is scrubbed to remove some of the slurry material and other contaminants on the surfaces of the workpiece. Next, the workpiece is transported into a chemical-etch cleaning station wherein the workpiece is positioned horizontally such that both the upper and lower surfaces are substantially exposed. The workpiece then is immersed in a cleaning solution which is moved around the various surfaces of the workpiece. The workpiece is immersed in the cleaning solution for a sufficient length of time to remove an appropriate layer of oxide, thereby removing contaminants and smoothing micro scrathes from the surfaces of the workpiece.
PCT/US1999/002483 1998-04-10 1999-02-08 Post-cmp wet-hf cleaning station WO1999053531A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/058,647 1998-04-10
US09/058,647 US6125861A (en) 1998-02-09 1998-04-10 Post-CMP wet-HF cleaning station

Publications (2)

Publication Number Publication Date
WO1999053531A2 WO1999053531A2 (en) 1999-10-21
WO1999053531A3 true WO1999053531A3 (en) 2000-03-09

Family

ID=22018078

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1999/002483 WO1999053531A2 (en) 1998-04-10 1999-02-08 Post-cmp wet-hf cleaning station

Country Status (2)

Country Link
TW (1) TW424272B (en)
WO (1) WO1999053531A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100163078A1 (en) * 2008-12-31 2010-07-01 Taiwan Semiconductor Manufacturing Co., Ltd. Spinner and method of cleaning substrate using the spinner
DE102013100040A1 (en) 2013-01-03 2014-07-03 E-Lead Electronic Co., Ltd. Method for guiding reverse parking aid for motor car, involves computing park path for car by detector unit, and parking motor car on park surface based on overlapping of park path until mark of reverse park path expires completely

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5292373A (en) * 1991-07-10 1994-03-08 Matsushita Electric Industrial Co., Ltd. Apparatus and process for washing wafers
US5442828A (en) * 1992-11-30 1995-08-22 Ontrak Systems, Inc. Double-sided wafer scrubber with a wet submersing silicon wafer indexer
US5487398A (en) * 1993-06-22 1996-01-30 Tadahiro Ohmi Rotary cleaning method with chemical solutions and rotary cleaning apparatus with chemical solutions
US5500081A (en) * 1990-05-15 1996-03-19 Bergman; Eric J. Dynamic semiconductor wafer processing using homogeneous chemical vapors
US5518552A (en) * 1992-05-28 1996-05-21 Tokyo Electron Limited Method for scrubbing and cleaning substrate
JPH08187660A (en) * 1994-12-28 1996-07-23 Ebara Corp Polishing device
US5571367A (en) * 1994-03-30 1996-11-05 Kabushiki Kaisha Toshiba Apparatus for subjecting a semiconductor substrate to a washing process
US5609719A (en) * 1994-11-03 1997-03-11 Texas Instruments Incorporated Method for performing chemical mechanical polish (CMP) of a wafer
WO1997013590A1 (en) * 1995-10-13 1997-04-17 Ontrak Systems, Inc. Method and apparatus for chemical delivery through the brush
US5655954A (en) * 1994-11-29 1997-08-12 Toshiba Kikai Kabushiki Kaisha Polishing apparatus
WO1998001892A1 (en) * 1996-07-08 1998-01-15 Speedfam Corporation Methods and apparatus for cleaning, rinsing, and drying wafers
US5885138A (en) * 1993-09-21 1999-03-23 Ebara Corporation Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5500081A (en) * 1990-05-15 1996-03-19 Bergman; Eric J. Dynamic semiconductor wafer processing using homogeneous chemical vapors
US5292373A (en) * 1991-07-10 1994-03-08 Matsushita Electric Industrial Co., Ltd. Apparatus and process for washing wafers
US5518552A (en) * 1992-05-28 1996-05-21 Tokyo Electron Limited Method for scrubbing and cleaning substrate
US5442828A (en) * 1992-11-30 1995-08-22 Ontrak Systems, Inc. Double-sided wafer scrubber with a wet submersing silicon wafer indexer
US5487398A (en) * 1993-06-22 1996-01-30 Tadahiro Ohmi Rotary cleaning method with chemical solutions and rotary cleaning apparatus with chemical solutions
US5885138A (en) * 1993-09-21 1999-03-23 Ebara Corporation Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device
US5571367A (en) * 1994-03-30 1996-11-05 Kabushiki Kaisha Toshiba Apparatus for subjecting a semiconductor substrate to a washing process
US5609719A (en) * 1994-11-03 1997-03-11 Texas Instruments Incorporated Method for performing chemical mechanical polish (CMP) of a wafer
US5655954A (en) * 1994-11-29 1997-08-12 Toshiba Kikai Kabushiki Kaisha Polishing apparatus
JPH08187660A (en) * 1994-12-28 1996-07-23 Ebara Corp Polishing device
WO1997013590A1 (en) * 1995-10-13 1997-04-17 Ontrak Systems, Inc. Method and apparatus for chemical delivery through the brush
WO1998001892A1 (en) * 1996-07-08 1998-01-15 Speedfam Corporation Methods and apparatus for cleaning, rinsing, and drying wafers

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1996, no. 11 29 November 1996 (1996-11-29) *

Also Published As

Publication number Publication date
TW424272B (en) 2001-03-01
WO1999053531A2 (en) 1999-10-21

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