WO1999040611A3 - Wafer cleaning method and system - Google Patents

Wafer cleaning method and system Download PDF

Info

Publication number
WO1999040611A3
WO1999040611A3 PCT/US1999/001155 US9901155W WO9940611A3 WO 1999040611 A3 WO1999040611 A3 WO 1999040611A3 US 9901155 W US9901155 W US 9901155W WO 9940611 A3 WO9940611 A3 WO 9940611A3
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
brushes
tank
process liquid
cleaning method
Prior art date
Application number
PCT/US1999/001155
Other languages
French (fr)
Other versions
WO1999040611A2 (en
Inventor
Alejandro Garcia
Brent Krick
Anthony Nichtawitz
Daniel Nordeen
Josh Oen
Kenneth Smith
Vincent Suro
Daniel Wolf
Original Assignee
Silikinetic Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Silikinetic Technology Inc filed Critical Silikinetic Technology Inc
Priority to AU23284/99A priority Critical patent/AU2328499A/en
Publication of WO1999040611A2 publication Critical patent/WO1999040611A2/en
Publication of WO1999040611A3 publication Critical patent/WO1999040611A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes

Abstract

A wafer cleaning apparatus provides two opposed brushes for brushing a vertically disposed wafer in a tank which can contain a process liquid. A pressure controller adaptively controls the pressure exerted by the brushes on the wafer to compensate for brush wear. Rim driving wheels engage the wafer periphery for rotating the wafer. The tank can be filled with a process liquid through which me gasonic waves provided by a transducer can propagate and impinge upon the wafer thereby enhancing the cleaning of the wafer or the brushes.
PCT/US1999/001155 1998-02-04 1999-01-20 Wafer cleaning method and system WO1999040611A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU23284/99A AU2328499A (en) 1998-02-04 1999-01-20 Wafer cleaning method and system

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US7363798P 1998-02-04 1998-02-04
US60/073,637 1998-02-04
US09/113,703 US6070284A (en) 1998-02-04 1998-07-10 Wafer cleaning method and system
US09/113,703 1998-07-10

Publications (2)

Publication Number Publication Date
WO1999040611A2 WO1999040611A2 (en) 1999-08-12
WO1999040611A3 true WO1999040611A3 (en) 2000-03-16

Family

ID=26754716

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1999/001155 WO1999040611A2 (en) 1998-02-04 1999-01-20 Wafer cleaning method and system

Country Status (3)

Country Link
US (2) US6070284A (en)
AU (1) AU2328499A (en)
WO (1) WO1999040611A2 (en)

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US20070240734A1 (en) * 2006-04-14 2007-10-18 Ching-Wen Teng Method of cleaning post-cmp wafer
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US9279435B2 (en) 2008-02-25 2016-03-08 University of Washington through its Center for Communication Vibration-driven droplet transport devices
US8505145B2 (en) * 2008-06-06 2013-08-13 Aion Co., Ltd. Central core for a cleaning sponge roller
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TWM362051U (en) * 2009-02-26 2009-08-01 Tung An Dev Ltd Structure for cleaning
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JP2016174077A (en) * 2015-03-17 2016-09-29 株式会社東芝 Substrate cleaning device and substrate cleaning method
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TWI630668B (en) * 2016-10-05 2018-07-21 亞亞科技股份有限公司 Wafer inspection equipment cleaning device
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Also Published As

Publication number Publication date
US6070284A (en) 2000-06-06
US6308369B1 (en) 2001-10-30
AU2328499A (en) 1999-08-23
WO1999040611A2 (en) 1999-08-12

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