WO1999035547A2 - Power contact for testing a power source - Google Patents

Power contact for testing a power source Download PDF

Info

Publication number
WO1999035547A2
WO1999035547A2 PCT/US1999/000204 US9900204W WO9935547A2 WO 1999035547 A2 WO1999035547 A2 WO 1999035547A2 US 9900204 W US9900204 W US 9900204W WO 9935547 A2 WO9935547 A2 WO 9935547A2
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
power
power pads
plastic chassis
Prior art date
Application number
PCT/US1999/000204
Other languages
French (fr)
Other versions
WO1999035547A3 (en
Inventor
David J. Ayers
Michael Brownell
Original Assignee
Intel Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corporation filed Critical Intel Corporation
Priority to AU23116/99A priority Critical patent/AU2311699A/en
Priority to JP2000527868A priority patent/JP2002501280A/en
Priority to EP99902992A priority patent/EP1046093A4/en
Publication of WO1999035547A2 publication Critical patent/WO1999035547A2/en
Publication of WO1999035547A3 publication Critical patent/WO1999035547A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

Definitions

  • FIG. 1 An example of a current test assembly is illustrated in Figure 1.
  • the illustrated test assembly requires that pins be accessible at the bottom of the processor board to establish contact with a power supply for testing the pins. If alternative architectures are utilized where pins are not accessible at the bottom of the processor boards, current test assemblies must be significantly reworked in order to perform testing of the processor boards.
  • Figure 1 illustrates an example of a current test assembly
  • FIG. 2C illustrates an alternate embodiment of the claimed invention
  • FIG 3 illustrates changes that have to be made to the test assembly of Figure 1 to accommodate testing of the improved power delivery system
  • Figure 4B illustrates a bottom view of a printed circuit board, including a plastic chassis that covers the bottom of the printed circuit board
  • Figure 2A is a schematic view of an improved power delivery system.
  • the three basic elements are a motherboard 11, a power consuming module 13, and a DC to DC power converter 15.
  • Figure 2B illustrates a side view of the arrangement according to one embodiment. Specifically, Figure 2B illustrates schematically (not to scale) the manner in which pads 33 and 35 of the multi-chip module extend into the DC to DC converter contact surfaces 39 and 41.
  • Figure 2C illustrates an alternate embodiment of the claimed invention, with additional pads 50 and 55 extending into the DC to DC converter contact surfaces 60 and 63. Further details of this improved power delivery system can be found in co- pending patent application having Serial No. , filed (Atty docket no: 42390.P4488).
  • pads 33, 35, 50 and 55 are not easily tested utilizing current test assemblies.
  • test assemblies that push down on a circuit board, such as the one illustrated in Figure 1 do not allow pads 33, 35, 50 and 55 to make contact with a test power supply. Instead, new assemblies must be designed that make side contacts with the pads to test the power contacts, while continuing to push down on the circuit board to continue testing of the signals on the pins as in the prior art board architectures.
  • An example of the required new assembly is illustrated in Figure 3. This new assembly would require a reworking of all current test assemblies in order to use them to test the circuit boards having the improved architecture described above. This is clearly an expensive and time consuming solution. As such, an improved test contact is desirable, that allows for the use of currently available test assemblies to test circuit boards having a variety of architectures.

Abstract

An improved test system comprises a printed circuit board (13) and a tested assembly wherein the printed circuit board (13) has a plastic chassis encompassing one surface and a set of power pads (33, 35) may be coupled to conductors on the one surface of the printed circuit board (13) and a second surface of the set of power pads (33, 35) is available for electrical coupling through an opening in the plastic chassis. The test assembly vertically pushes down on the printed circuit board until the second surface of the set of power pads contacts a power source, thus electrically coupling the printed circuit board to the power source (15).

Description

AN IMPROVED POWER CONTACT FOR TESTING A POWER DELIVERY SYSTEM
FIELD OF THE INVENTION
This invention relates to an improved power contact for testing a power delivery system. Specifically, the present invention discloses an improved contact for testing a power delivery system where only one dimensional pushing is required to establish the contact.
BACKGROUND OF THE INVENTION
In a typical computer system, a large printed circuit board known as a motherboard is provided. The motherboard contains a certain number of basic components including connectors for daughterboards which can be plugged in to provide different capabilities for the computer. The daughterboards may provide, for example, an interface to disk drives, CD- ROMs and modems.
In order to test the printed circuit boards (both motherboards and daughterboards), current test assemblies push down on the board to establish contacts with power supplies. An example of a current test assembly is illustrated in Figure 1. The illustrated test assembly requires that pins be accessible at the bottom of the processor board to establish contact with a power supply for testing the pins. If alternative architectures are utilized where pins are not accessible at the bottom of the processor boards, current test assemblies must be significantly reworked in order to perform testing of the processor boards.
SUMMARY OF THE INVENTION
The present invention discloses an improved test system. The test system comprises a printed circuit board and a test assembly wherein the printed circuit board has a plastic chassis encompassing one surface and a set of power pads mounted thereon. A first surface of the set of power pads may be coupled to conductors on the one surface of the printed circuit board and a second surface of the set of power pads is available for electrical coupling through an opening in the plastic chassis. The test assembly vertically pushes down on the printed circuit board until the second surface of the set of power pads contacts a power source, thus electrically coupling the printed circuit board to the power source.
Other features and advantages of the present invention will be apparent from the accompanying drawings and from the detailed description.
BRIEF DESCRIPTION OF THE DRAWINGS
The present invention is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which like reference numerals refer to similar elements and in which:
Figure 1 illustrates an example of a current test assembly
Figure 2A illustrates a schematic view of an improved power delivery system
Figure 2B illustrates schematically the manner in which the pads of the multi-chip module extend into the dc to dc converter contact surfaces
Figure 2C illustrates an alternate embodiment of the claimed invention
Figure 3 illustrates changes that have to be made to the test assembly of Figure 1 to accommodate testing of the improved power delivery system
Figure 4A illustrates a side view of a printed circuit board, together with a test assembly and a test socket
Figure 4B illustrates a bottom view of a printed circuit board, including a plastic chassis that covers the bottom of the printed circuit board
DETAILED DESCRIPTION OF THE INVENTION An improved contact for testing a power delivery system where only one dimensional pushing is required to establish the contact is disclosed. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. It will be apparent to one of ordinary skill in the art, however, that these specific details need not be used to practice the present invention. In other instances, well known structures, interfaces and processes have not been shown in detail in order not to unnecessarily obscure the present invention.
Figure 2A is a schematic view of an improved power delivery system. The three basic elements are a motherboard 11, a power consuming module 13, and a DC to DC power converter 15. Figure 2B illustrates a side view of the arrangement according to one embodiment. Specifically, Figure 2B illustrates schematically (not to scale) the manner in which pads 33 and 35 of the multi-chip module extend into the DC to DC converter contact surfaces 39 and 41. Figure 2C illustrates an alternate embodiment of the claimed invention, with additional pads 50 and 55 extending into the DC to DC converter contact surfaces 60 and 63. Further details of this improved power delivery system can be found in co- pending patent application having Serial No. , filed (Atty docket no: 42390.P4488).
According to these embodiments, pads 33, 35, 50 and 55 are not easily tested utilizing current test assemblies. Specifically, test assemblies that push down on a circuit board, such as the one illustrated in Figure 1, do not allow pads 33, 35, 50 and 55 to make contact with a test power supply. Instead, new assemblies must be designed that make side contacts with the pads to test the power contacts, while continuing to push down on the circuit board to continue testing of the signals on the pins as in the prior art board architectures. An example of the required new assembly is illustrated in Figure 3. This new assembly would require a reworking of all current test assemblies in order to use them to test the circuit boards having the improved architecture described above. This is clearly an expensive and time consuming solution. As such, an improved test contact is desirable, that allows for the use of currently available test assemblies to test circuit boards having a variety of architectures.
Figures 4A-B illustrate an improved system for testing circuit boards having the improved architecture described above. Figure 4A shows a side view of a printed circuit board, together with a test assembly and a test socket. Figure 4B is a bottom view of a printed circuit board, including a plastic chassis that covers the bottom of the printed circuit board. According to this embodiment, portions of the plastic chassis covering the bottom surface of the printed circuit board are removed, thus creating an opening that enables the illustrated power pads to be accessible. The power pads electrically couple to the test socket's power contacts through the opening, thus allowing the power pad contacts to be tested.
According to this embodiment, currently available test assemblies may continue to be utilized. Specifically, as illustrated in Figure 4, with the power pads placed at the bottom of the printed circuit boards, current test mechanisms or assemblies may continue pushing down on printed circuit boards in order to establish contacts with a power source. In contrast with the prior art method of establishing contacts with pins, however, according to the presently claimed invention, contacts are made with power pads instead. According to one embodiment, these power pads are designed to enable improved electrical characteristics, such as low inductance. Significantly improved (i.e., lower) inductance may be achieved by closely spacing power pads of opposite polarity. Although the improved test system is described above for use with circuit boards having the architecture described above, the improved test system requiring only one dimensional pushing may also be utilized with other circuit board architectures.
Thus, an improved contact for testing a power delivery system where only one dimensional pushing is required to establish the contact is disclosed. The specific arrangements and methods described herein, are merely illustrative of the principles of the present invention. Numerous modifications in form and detail may be made by those of ordinary skill in the art without departing from the scope of the invention. Although this invention has been shown in relation to a particular preferred embodiment, it should not be considered so limited. Rather, the present invention is limited only by the scope of the appended claims.

Claims

CLAIMSWhat is claimed is:
1. An improved test system, comprising: a printed circuit board having a plastic chassis encompassing one surface, said printed circuit board having a set of power pads mounted thereon, a first surface of said set of power pads being coupled to conductors on said one surface of said printed circuit board, a second surface of said set of power pads being available for electrical coupling through an opening in said plastic chassis; a test assembly for vertically pushing down on said printed circuit board until said second surface of said set of power pads contacts a power source, thus electrically coupling said printed circuit board to said power source.
2. A printed circuit board having improved test contacts, said printed circuit board comprising; an upper surface; a lower surface; a plastic chassis encompassing said lower surface, said plastic chassis having at least one opening therethrough; a set of power pads mounted on said lower surface of said printed circuit board, said set of power pads being visible through said at least one opening in said plastic chassis , wherein said set of power pads are adapted to electrically couple to a power source for testing said printed circuit board.
3. An improved test system, comprising: a printed circuit board having improved test contacts, said printed circuit board including; an upper surface; a lower surface; a plastic chassis encompassing said lower surface, said plastic chassis having at least one opening therethrough; a set of power pads mounted on said lower surface of said printed circuit board, said set of power pads being visible through said at least one opening in said plastic chassis; a test assembly for vertically pushing down on said printed circuit board until said set of power pads are electrically coupled to a power source for testing said printed circuit board.
4. An improved method for testing a printed circuit board comprising the steps of: creating an opening in a plastic chassis encompassing one surface of the printed circuit board, said printed circuit board having a set of power pads mounted thereon, a first surface of said set of power pads being coupled to conductors on said one surface of said printed circuit board, a second surface of said set of power pads being available for electrical coupling through the opening in said plastic chassis; vertically pushing down on said printed circuit board until said second surface of said set of power pads contacts a power source to electrically couple said printed circuit board to said power source.
5. An improved method for testing a printed circuit board, the method comprising the steps of: creating an opening in a plastic chassis encompassing one surface of the printed circuit board, the printed circuit board also including an upper surface, a lower surface and a set of power pads mounted on said lower surface, said set of power pads being visible through said at least one opening in said plastic chassis; and vertically pushing down on said printed circuit board until said set of power pads are coupled to a power source for testing said printed circuit board.
PCT/US1999/000204 1998-01-12 1999-01-05 Power contact for testing a power source WO1999035547A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
AU23116/99A AU2311699A (en) 1998-01-12 1999-01-05 An improved power contact for testing a power delivery system
JP2000527868A JP2002501280A (en) 1998-01-12 1999-01-05 Improved power contacts for testing power delivery systems
EP99902992A EP1046093A4 (en) 1998-01-12 1999-01-05 An improved power contact for testing a power delivery system

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US560998A 1998-01-12 1998-01-12
US09/005,609 1998-01-12

Publications (2)

Publication Number Publication Date
WO1999035547A2 true WO1999035547A2 (en) 1999-07-15
WO1999035547A3 WO1999035547A3 (en) 1999-09-30

Family

ID=21716741

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1999/000204 WO1999035547A2 (en) 1998-01-12 1999-01-05 Power contact for testing a power source

Country Status (5)

Country Link
EP (1) EP1046093A4 (en)
JP (1) JP2002501280A (en)
CN (1) CN1296568A (en)
AU (1) AU2311699A (en)
WO (1) WO1999035547A2 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4099120A (en) * 1976-04-19 1978-07-04 Akin Aksu Probe head for testing printed circuit boards
US4160207A (en) * 1977-06-27 1979-07-03 Haines Fred E Printed circuit board tester with removable head
US4352061A (en) * 1979-05-24 1982-09-28 Fairchild Camera & Instrument Corp. Universal test fixture employing interchangeable wired personalizers

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2344239B2 (en) * 1973-09-01 1977-11-03 Luther, Erich, 3050 Wunstorf; Maelzer, Fritz; Maelzer, Martin; 7910 Reutti Post Neu-Ulm; Türkkan, Tamer, 3011 Laatzen CONTACT DEVICE FOR CONNECTING A PRINTED CIRCUIT TO A TESTING DEVICE
US4164704A (en) * 1976-11-01 1979-08-14 Metropolitan Circuits, Inc. Plural probe circuit card fixture using a vacuum collapsed membrane to hold the card against the probes
US4636723A (en) * 1986-03-21 1987-01-13 Coffin Harry S Testing device for printed circuit boards
EP0305951B1 (en) * 1987-08-31 1994-02-02 Everett/Charles Contact Products Inc. Testing of integrated circuit devices on loaded printed circuit boards
US5153504A (en) * 1991-04-23 1992-10-06 International Business Machines Corporation Pneumatically actuated hold down gate
US5686833A (en) * 1995-07-31 1997-11-11 Spinner; Howard D. Load board enhanced for differential pressure retention in an IC test head
FR2741953A1 (en) * 1995-12-05 1997-06-06 Vaucher Christophe Contacting method for testing printed circuit tracks

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4099120A (en) * 1976-04-19 1978-07-04 Akin Aksu Probe head for testing printed circuit boards
US4160207A (en) * 1977-06-27 1979-07-03 Haines Fred E Printed circuit board tester with removable head
US4352061A (en) * 1979-05-24 1982-09-28 Fairchild Camera & Instrument Corp. Universal test fixture employing interchangeable wired personalizers

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1046093A2 *

Also Published As

Publication number Publication date
JP2002501280A (en) 2002-01-15
AU2311699A (en) 1999-07-26
EP1046093A2 (en) 2000-10-25
EP1046093A4 (en) 2001-01-31
CN1296568A (en) 2001-05-23
WO1999035547A3 (en) 1999-09-30

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