WO1999025904A8 - Electric potential shaping apparatus for holding a semiconductor wafer during electroplating - Google Patents

Electric potential shaping apparatus for holding a semiconductor wafer during electroplating

Info

Publication number
WO1999025904A8
WO1999025904A8 PCT/US1998/022825 US9822825W WO9925904A8 WO 1999025904 A8 WO1999025904 A8 WO 1999025904A8 US 9822825 W US9822825 W US 9822825W WO 9925904 A8 WO9925904 A8 WO 9925904A8
Authority
WO
WIPO (PCT)
Prior art keywords
holding
semiconductor wafer
electric potential
wafer during
shaping apparatus
Prior art date
Application number
PCT/US1998/022825
Other languages
French (fr)
Other versions
WO1999025904A1 (en
WO1999025904A9 (en
Inventor
Steve Taatjes
Jonathan Reid
Evan Patton
Jingbin Feng
John Owen Dukovic
Robert J Contolini
Original Assignee
Novellus Systems Inc
Steve Taatjes
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Novellus Systems Inc, Steve Taatjes filed Critical Novellus Systems Inc
Publication of WO1999025904A1 publication Critical patent/WO1999025904A1/en
Publication of WO1999025904A8 publication Critical patent/WO1999025904A8/en
Publication of WO1999025904A9 publication Critical patent/WO1999025904A9/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Abstract

Apparatus for treating the surface of a substrate, the apparatus comprising a clamshell (32) mounted on a rotatable spindle (40). The clamshell comprises a cone (34), a cup (36) and a flange (48). The flange (48) has apertures (50) which are adjacent the substrate or wafer (38) allowing gas bubbles entrapped on the substrate surface to readily escape.
PCT/US1998/022825 1997-11-13 1998-10-26 Electric potential shaping apparatus for holding a semiconductor wafer during electroplating WO1999025904A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/970,120 US6159354A (en) 1997-11-13 1997-11-13 Electric potential shaping method for electroplating
US08/970,120 1997-11-13

Publications (3)

Publication Number Publication Date
WO1999025904A1 WO1999025904A1 (en) 1999-05-27
WO1999025904A8 true WO1999025904A8 (en) 1999-08-12
WO1999025904A9 WO1999025904A9 (en) 1999-09-16

Family

ID=25516469

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1998/022825 WO1999025904A1 (en) 1997-11-13 1998-10-26 Electric potential shaping apparatus for holding a semiconductor wafer during electroplating

Country Status (2)

Country Link
US (2) US6159354A (en)
WO (1) WO1999025904A1 (en)

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US6159354A (en) 2000-12-12

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