WO1999012190A3 - Sealed capsule opening and unloading system - Google Patents

Sealed capsule opening and unloading system Download PDF

Info

Publication number
WO1999012190A3
WO1999012190A3 PCT/US1998/018394 US9818394W WO9912190A3 WO 1999012190 A3 WO1999012190 A3 WO 1999012190A3 US 9818394 W US9818394 W US 9818394W WO 9912190 A3 WO9912190 A3 WO 9912190A3
Authority
WO
WIPO (PCT)
Prior art keywords
capsule
door
load
unloading system
opening mechanism
Prior art date
Application number
PCT/US1998/018394
Other languages
French (fr)
Other versions
WO1999012190A2 (en
Inventor
George E Niemirowski
John M Harrell
P V Pateh
Original Assignee
Novus Corp
George E Niemirowski
John M Harrell
P V Pateh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Novus Corp, George E Niemirowski, John M Harrell, P V Pateh filed Critical Novus Corp
Publication of WO1999012190A2 publication Critical patent/WO1999012190A2/en
Publication of WO1999012190A3 publication Critical patent/WO1999012190A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover

Abstract

A system is provided for transferring a semiconductor wafer (111) supported in a sealed capsule (106) from a first stored position to a second working position using an opening mechanism having a load door (114). The capsule (106) is positioned adjacent the load door (114) to form a sealed environment between the capsule (106) and the opening mechanism. The load door (114) is then locked to the capsule door (126). Next, the load door (114) and the capsule door (126) are moved a predetermined distance while retaining the sealed environment between the opening mechanism and the capsule (106). Thereafter, the capsule (106) is purged with a gas. The load door (114) and the capsule door (126) are then moved a further distance to open the capsule (106), allowing the semiconductor wafer (111) to be retrieved.
PCT/US1998/018394 1997-09-03 1998-09-03 Sealed capsule opening and unloading system WO1999012190A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US5631797P 1997-09-03 1997-09-03
US60/056,317 1997-09-03

Publications (2)

Publication Number Publication Date
WO1999012190A2 WO1999012190A2 (en) 1999-03-11
WO1999012190A3 true WO1999012190A3 (en) 2001-12-20

Family

ID=22003617

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1998/018394 WO1999012190A2 (en) 1997-09-03 1998-09-03 Sealed capsule opening and unloading system

Country Status (1)

Country Link
WO (1) WO1999012190A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6042324A (en) * 1999-03-26 2000-03-28 Asm America, Inc. Multi-stage single-drive FOUP door system

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5433574A (en) * 1992-05-21 1995-07-18 Shinko Electric Co., Ltd. Gas purge unit for a portable container
US5607276A (en) * 1995-07-06 1997-03-04 Brooks Automation, Inc. Batchloader for substrate carrier on load lock
US5730573A (en) * 1994-02-22 1998-03-24 Tdk Corporation Clean transfer method and apparatus therefor
US6158946A (en) * 1996-04-24 2000-12-12 Tokyo Electron Limited Positioning apparatus for substrates to be processed

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5433574A (en) * 1992-05-21 1995-07-18 Shinko Electric Co., Ltd. Gas purge unit for a portable container
US5730573A (en) * 1994-02-22 1998-03-24 Tdk Corporation Clean transfer method and apparatus therefor
US5607276A (en) * 1995-07-06 1997-03-04 Brooks Automation, Inc. Batchloader for substrate carrier on load lock
US6158946A (en) * 1996-04-24 2000-12-12 Tokyo Electron Limited Positioning apparatus for substrates to be processed

Also Published As

Publication number Publication date
WO1999012190A2 (en) 1999-03-11

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