WO1999010901A2 - A decoupling capacitor - Google Patents
A decoupling capacitor Download PDFInfo
- Publication number
- WO1999010901A2 WO1999010901A2 PCT/SE1998/001429 SE9801429W WO9910901A2 WO 1999010901 A2 WO1999010901 A2 WO 1999010901A2 SE 9801429 W SE9801429 W SE 9801429W WO 9910901 A2 WO9910901 A2 WO 9910901A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- capacitor
- plate
- decoupling
- decoupling capacitor
- chip
- Prior art date
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 46
- 239000004020 conductor Substances 0.000 claims description 2
- 239000003989 dielectric material Substances 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/35—Feed-through capacitors or anti-noise capacitors
Definitions
- the invention relates generally to decoupling capacitors and more specifically to decoupling capacitors for radio frequency applications.
- a small capacitor may e.g. be placed on the chip to decouple AC components of the highest frequencies, while a somewhat larger capacitor may be placed on the chip module close to the chip to decouple AC components of lower frequencies, and at least one further, larger capacitor may be placed on the circuit board close to the chip module to decouple AC components of the lowest frequencies.
- the object of the invention is to bring about a decoupling capacitor which enables decoupling of a wide range of radio frequency AC components.
- decoupling capacitor according to the invention has progressive capacitance values from one connection point to the other.
- a single decoupling capacitor can be used to decouple a wide range of radio frequency AC components.
- Fig. 1 is a partial cross-sectional view of a chip module comprising an embodiment of a decoupling capacitor in accordance with the invention
- Figs. 2a - 2c are views along line A-A in Fig. 1 of different embodiments of one of the plates of the decoupling capacitor according to the invention.
- Fig. 1 is a partial cross-sectional view of a chip module having a decoupling capacitor in accordance with the invention.
- the chip module in Fig. 1 comprises a ground plane 1, a layer 2 of dielectric material on the ground plane 1, and a chip 3 located in a recess in the dielectric layer
- a capacitor plate 4 in accordance with the invention is embedded in the dielectric layer 2 at a distance from the ground plane 1, forming a decoupling capacitor with the latter.
- the capacitor plate 4 in the embodiment in Fig. 1 has two connecting terminals 5 and 6 extending from the plate 4 to the top of the dielectric layer 2.
- the connecting terminal 5 is bonded to a terminal (not shown) on the chip 3 by means of a bonding wire 7, while the connecting terminal 6 is connected to a conductor or connecting pad 8 on the dielectric layer 2.
- Figs. 2a-2c three different embodiments of the capacitor plate embedded in the dielectric layer 2 are shown. Common to the embodiments shown in Figs. 2a-2c is that the capacitor plates are tapered in the direction towards the connecting terminal 5 bonded to the chip 3 via the bonding wire 7.
- a capacitor plate 4' having a triangular form is shown
- Fig. 2b shows a capacitor plate 4" having a fan shape
- Fig. 2c shows a capacitor plate 4"' having stepped sides.
- the other plate of the capacitor does not necessarily have to be a ground plane in a chip module, but the capacitor may be a discrete component having one or both plates tapered.
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU84703/98A AU8470398A (en) | 1997-08-22 | 1998-07-31 | A decoupling capacitor |
DE69831966T DE69831966T2 (en) | 1997-08-22 | 1998-07-31 | ENTKUPPLUNGSKONDENSATOR |
EP98935459A EP1021812B1 (en) | 1997-08-22 | 1998-07-31 | A decoupling capacitor |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9703036-5 | 1997-08-22 | ||
SE9703036A SE511824C2 (en) | 1997-08-22 | 1997-08-22 | Relaxation capacitor and chip module |
Publications (2)
Publication Number | Publication Date |
---|---|
WO1999010901A2 true WO1999010901A2 (en) | 1999-03-04 |
WO1999010901A3 WO1999010901A3 (en) | 1999-05-20 |
Family
ID=20408011
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/SE1998/001429 WO1999010901A2 (en) | 1997-08-22 | 1998-07-31 | A decoupling capacitor |
Country Status (6)
Country | Link |
---|---|
US (1) | US6038122A (en) |
EP (1) | EP1021812B1 (en) |
AU (1) | AU8470398A (en) |
DE (1) | DE69831966T2 (en) |
SE (1) | SE511824C2 (en) |
WO (1) | WO1999010901A2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100721728B1 (en) * | 1999-03-25 | 2007-05-28 | 미네소타 마이닝 앤드 매뉴팩춰링 캄파니 | Method of producing substrate for plasma display panel and mold used in the method |
WO2017112397A1 (en) * | 2015-12-21 | 2017-06-29 | Qualcomm Incorporated | Mim capacitor and method of making the same |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3585796B2 (en) * | 1999-12-17 | 2004-11-04 | 新光電気工業株式会社 | Multilayer wiring board manufacturing method and semiconductor device |
DE10035584A1 (en) | 2000-07-21 | 2002-01-31 | Philips Corp Intellectual Pty | mobile device |
US6757152B2 (en) | 2001-09-05 | 2004-06-29 | Avx Corporation | Cascade capacitor |
US7154735B2 (en) | 2002-05-24 | 2006-12-26 | Koninklijke Philips Electronics N.V. | Decoupling module for decoupling high-frequency signals from a power supply line |
US8669828B1 (en) | 2010-10-21 | 2014-03-11 | Altera Corporation | Decoupling capacitor control circuitry |
US8767404B2 (en) | 2011-07-01 | 2014-07-01 | Altera Corporation | Decoupling capacitor circuitry |
US20140192621A1 (en) * | 2013-01-07 | 2014-07-10 | Baker Hughes Incorporated | Apparatus and method for communication between downhole components |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3531531A1 (en) * | 1985-09-04 | 1987-03-12 | Bosch Gmbh Robert | HIGH-FREQUENCY THROUGH-OUT FILTER |
US5422782A (en) * | 1992-11-24 | 1995-06-06 | Circuit Components Inc. | Multiple resonant frequency decoupling capacitor |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3999012A (en) * | 1975-07-07 | 1976-12-21 | Ibm Corporation | Graphic entry tablet with improved addressing |
US4047240A (en) * | 1976-06-01 | 1977-09-06 | Victor Insetta | Multiple electrode capacitor assembly |
DE69022332T2 (en) * | 1989-08-04 | 1996-05-02 | Matsushita Electric Ind Co Ltd | Adaptation network for high-frequency transistor. |
US5027253A (en) * | 1990-04-09 | 1991-06-25 | Ibm Corporation | Printed circuit boards and cards having buried thin film capacitors and processing techniques for fabricating said boards and cards |
US5068707A (en) * | 1990-05-02 | 1991-11-26 | Nec Electronics Inc. | DRAM memory cell with tapered capacitor electrodes |
US5764106A (en) * | 1993-12-09 | 1998-06-09 | Northern Telecom Limited | Gain-controlled amplifier and automatic gain control amplifier using GCLBT |
JPH0846136A (en) * | 1994-07-26 | 1996-02-16 | Fujitsu Ltd | Semiconductor device |
-
1997
- 1997-08-22 SE SE9703036A patent/SE511824C2/en not_active IP Right Cessation
-
1998
- 1998-07-31 WO PCT/SE1998/001429 patent/WO1999010901A2/en active IP Right Grant
- 1998-07-31 EP EP98935459A patent/EP1021812B1/en not_active Expired - Lifetime
- 1998-07-31 AU AU84703/98A patent/AU8470398A/en not_active Abandoned
- 1998-07-31 DE DE69831966T patent/DE69831966T2/en not_active Expired - Lifetime
- 1998-08-21 US US09/137,682 patent/US6038122A/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3531531A1 (en) * | 1985-09-04 | 1987-03-12 | Bosch Gmbh Robert | HIGH-FREQUENCY THROUGH-OUT FILTER |
US5422782A (en) * | 1992-11-24 | 1995-06-06 | Circuit Components Inc. | Multiple resonant frequency decoupling capacitor |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100721728B1 (en) * | 1999-03-25 | 2007-05-28 | 미네소타 마이닝 앤드 매뉴팩춰링 캄파니 | Method of producing substrate for plasma display panel and mold used in the method |
WO2017112397A1 (en) * | 2015-12-21 | 2017-06-29 | Qualcomm Incorporated | Mim capacitor and method of making the same |
US9875848B2 (en) | 2015-12-21 | 2018-01-23 | Qualcomm Incorporated | MIM capacitor and method of making the same |
CN108369936A (en) * | 2015-12-21 | 2018-08-03 | 高通股份有限公司 | MIM capacitor and its manufacturing method |
CN108369936B (en) * | 2015-12-21 | 2019-12-17 | 高通股份有限公司 | MIM capacitor and method for manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
EP1021812A2 (en) | 2000-07-26 |
WO1999010901A3 (en) | 1999-05-20 |
DE69831966T2 (en) | 2006-07-06 |
DE69831966D1 (en) | 2005-11-24 |
AU8470398A (en) | 1999-03-16 |
SE9703036L (en) | 1999-02-23 |
SE9703036D0 (en) | 1997-08-22 |
SE511824C2 (en) | 1999-12-06 |
EP1021812B1 (en) | 2005-10-19 |
US6038122A (en) | 2000-03-14 |
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