WO1999010566A3 - Process chamber and method for depositing and/or removing material on a substrate - Google Patents

Process chamber and method for depositing and/or removing material on a substrate Download PDF

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Publication number
WO1999010566A3
WO1999010566A3 PCT/US1998/016174 US9816174W WO9910566A3 WO 1999010566 A3 WO1999010566 A3 WO 1999010566A3 US 9816174 W US9816174 W US 9816174W WO 9910566 A3 WO9910566 A3 WO 9910566A3
Authority
WO
WIPO (PCT)
Prior art keywords
sleeve
wafer
electrolyte
support
depositing
Prior art date
Application number
PCT/US1998/016174
Other languages
French (fr)
Other versions
WO1999010566A2 (en
Inventor
Ting H Chiu
William H Holtkamp
Wen C Ko
Kenneth J Lowery
Peter Cho
Original Assignee
Cutek Research Inc
Ting H Chiu
William H Holtkamp
Wen C Ko
Kenneth J Lowery
Peter Cho
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cutek Research Inc, Ting H Chiu, William H Holtkamp, Wen C Ko, Kenneth J Lowery, Peter Cho filed Critical Cutek Research Inc
Priority to JP2000507868A priority Critical patent/JP3274457B2/en
Priority to DE69823556T priority patent/DE69823556T2/en
Priority to EP98938314A priority patent/EP1051544B1/en
Priority to AU86864/98A priority patent/AU8686498A/en
Publication of WO1999010566A2 publication Critical patent/WO1999010566A2/en
Publication of WO1999010566A3 publication Critical patent/WO1999010566A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Abstract

A processing chamber for depositing and/or removing material onto/from a semiconductor wafer when the wafer is subjected to an electrolyte and in an electric field. A hollow sleeve is utilized to form a containment chamber for holding the electrolyte. A wafer residing on a support is moved vertically upward to engage the sleeve to form an enclosing floor for the containment chamber. One electrode is disposed within the containment chamber while the opposite electrode is comprised of several electrodes distributed around the circumference of the wafer. The electrodes are also protected from the electrolyte when the support is raised and engaged to the sleeve. In one embodiment, the support and the sleeve are stationary during processing, while in another embodiment, both are rotated or oscillated during processing.
PCT/US1998/016174 1997-08-22 1998-08-03 Process chamber and method for depositing and/or removing material on a substrate WO1999010566A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2000507868A JP3274457B2 (en) 1997-08-22 1998-08-03 Processing chamber and method for depositing and / or removing material from a substrate
DE69823556T DE69823556T2 (en) 1997-08-22 1998-08-03 PROCESS CHAMBER AND METHOD FOR CUTTING MATERIAL ON A SUBSTRATE AND / OR REMOVING MATERIAL FROM A SUBSTRATE
EP98938314A EP1051544B1 (en) 1997-08-22 1998-08-03 Process chamber and method for depositing and/or removing material on a substrate
AU86864/98A AU8686498A (en) 1997-08-22 1998-08-03 Process chamber and method for depositing and/or removing material on a substrate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/916,564 US6017437A (en) 1997-08-22 1997-08-22 Process chamber and method for depositing and/or removing material on a substrate
US08/916,564 1997-08-22

Publications (2)

Publication Number Publication Date
WO1999010566A2 WO1999010566A2 (en) 1999-03-04
WO1999010566A3 true WO1999010566A3 (en) 1999-05-06

Family

ID=25437473

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1998/016174 WO1999010566A2 (en) 1997-08-22 1998-08-03 Process chamber and method for depositing and/or removing material on a substrate

Country Status (8)

Country Link
US (3) US6017437A (en)
EP (1) EP1051544B1 (en)
JP (1) JP3274457B2 (en)
KR (1) KR100375869B1 (en)
AU (1) AU8686498A (en)
DE (1) DE69823556T2 (en)
TW (1) TW457572B (en)
WO (1) WO1999010566A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9435049B2 (en) 2013-11-20 2016-09-06 Lam Research Corporation Alkaline pretreatment for electroplating

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DE69823556T2 (en) 2005-04-14
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US6017437A (en) 2000-01-25
US6077412A (en) 2000-06-20
DE69823556D1 (en) 2004-06-03
EP1051544B1 (en) 2004-04-28
JP3274457B2 (en) 2002-04-15
AU8686498A (en) 1999-03-16
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US6179982B1 (en) 2001-01-30
WO1999010566A2 (en) 1999-03-04

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